JP3048842U - Probing card - Google Patents

Abstract

(57) [Problem] In the case of a conventional probing card 1, since a capacitor 1E is attached to a pin of a power supply probing pin 1A on the back side of a printed wiring board 1C, a power supply from the capacitor 1E is provided. The distance between the probing pin 1A and the tip of the probing pin 1A is long, and the noise absorbing effect of the capacitor 1E is not always sufficient. Therefore, a sufficient margin of the frequency band in the high-speed inspection cannot be secured. SOLUTION: The probing card 10 of the present invention includes a probing pin 11 for power supply and a probing pin 12 for signal, a support 13 for supporting the probing pins 11, 12, a support 13 to which the support 13 is fixed, and each probing. A printed wiring board 14 having printed wiring connected to the pins 11 and 12; a copper plate 15 is provided near the support 13 in a grounded state; It is characterized in that it is connected via a capacitor 16.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a probing card.

[0002]

[Prior art]

 A probing card is used, for example, when conducting electrical characteristic inspections of a large number of semiconductor elements (hereinafter, referred to as “chips”) formed on a semiconductor wafer (hereinafter, simply referred to as “wafers”) in a wafer state. , And used by attaching to a probe device. As shown in FIG. 3, the probing picard 1 includes a power supply probing pin 1A and a grounding probing pin (not shown) for applying a power supply voltage to a chip (not shown), and a chip inspection signal. A signal input / output probing pin (hereinafter, referred to as a “signal probing pin”) (not shown) for inputting / outputting a signal, and, for example, a support 1B made of an insulating member that supports these probing pins. A probing pin supported by the support 1B and a printed wiring board 1C having a printed wiring connected to the respective pins, and each probing pin is brought into contact with an electrode pad on the chip surface corresponding to the probing pin. Inspect the chip for electrical characteristics.

When the above-described electrical characteristic inspection is performed, noise is generated in the power supply line including the power supply probing pin 1A during the inspection. However, since the probing pin 1A for power supply and the probing pin for signal of the probe card 1 are close to each other via the support 1B, noise of the probing pin 1A for power supply propagates to the probing pin for signal and the probing pin for signal. Noise at the time of inspection and adversely affect inspection results. Therefore, it is necessary to attach a capacitor according to the noise component between the power supply probing pin 1A and the ground 1D. Therefore, as shown in FIG. 3, a capacitor 1E is conventionally provided between the pin of the power supply probing pin 1A and the ground 1D on the back surface (the surface on the pin source side of the probing pin) of the printed wiring board 1C. Connecting the capacitor 1E as close as possible to the pin tip is more effective in removing noise, so conventionally, the power supply probing pin 1A is located as close as possible to the power supply probing pin 1A in the power supply line. The capacitor 1E is mounted at the through hole.

[0004]

[Problems to be solved by the invention]

 However, in the case of the conventional probing card 1, since the capacitor 1E is attached to the pin of the power supply probing pin 1A, the distance from the capacitor 1E to the pin tip of the power supply probing pin 1A is long. Since the distance is 25 mm or more, noise may be generated in this portion, and the noise absorbing effect of the capacitor 1E is not always sufficient. In addition, recently, the pitch between the probing pins of the probing card has been narrowed as the chip has become ultra-fine and the degree of integration has been rapidly increased. When noise occurs, noise is generated at the signal probing pins due to the influence of crosstalk (electrostatic induction, electromagnetic induction) between the power supply probing pins 1A and the signal probing pins, and a sufficient frequency band margin is secured. There were issues that could not be achieved. Also, when the operating speed of the chip is increased to 200 MHz or 300 MHz or more, the noise at the probing pin 1A for the power supply becomes more and more pronounced, and the signal current is miniaturized. There was a problem that it became difficult to take each time.

[0005] The present invention has been made to solve the above-described problem, and it is an object of the present invention to provide a probing card capable of minimizing the influence of noise even in high-speed inspection and improving a frequency band margin in high-speed inspection. The purpose is.

[0006]

[Means for Solving the Problems]

 The probing card according to claim 1 of the present invention is a power supply probing terminal for applying a power supply voltage to a semiconductor device formed on a semiconductor wafer, and a signal probing terminal for inspecting electrical characteristics of the semiconductor device. A probing card comprising: a support for supporting the probing terminals; and a wiring board on which the support is fixed and on which electric wiring connected to the probing terminals is formed. , And a conductor is provided in a grounded state in the vicinity of the power supply and the vicinity of the tip of the power supply probing terminal is connected via a capacitor.

[0007] A probing card according to a second aspect of the present invention is the probing card according to the first aspect, wherein the conductor is formed of a copper plate.

[0008]

[Embodiment of the invention]

 Hereinafter, the present invention will be described based on the embodiment shown in FIGS. As shown in FIG. 1, for example, a probing card 10 of the present embodiment includes a plurality of (eg, 6 to 7) chips for applying a power supply voltage to a plurality of chips (not shown) formed on a wafer. A power supply probing pin 11, a plurality of (for example, 7 to 8) grounding probing pins (not shown), and a plurality (for example, thirty or more) of test signal probing pins 12 for inspecting electrical characteristics of a chip. And a rectangular support 13 that cantileverly supports the probing pins 11 and 12, and a printed wiring on which the support 13 is fixed and a printed wiring connected to the probing pins 11 and 12 is formed. A substrate 14 is provided, and each probing pin 11, 12 protrudes inward from a central opening 13 </ b> A of the support 13. ), And the electrical characteristics of the chip are inspected. In these respects, the probing card 10 of the present embodiment is configured similarly to the conventional probing card 1. In FIG. 1, the probing pins 11 and 12 each having a cantilever structure are shown in a state of being protruded line by line from both sides of a central opening 13A of the support 13 in order to simplify the drawing. The probing cards 11 and 12 having different support heights overhang the plurality of rows from both sides of the central opening 13A so that, for example, 16 chips can be inspected at the same time.

Each of the probing pins 11 and 12 is fixed to a support 13 by an insulating resin, and each pin originates in the printed wiring board 14 through a through hole 14 A formed in the printed wiring board 14. The surface opposite to the mounting surface of the support 13 is connected to the printed wiring. On the surface of the printed wiring board 14, a copper plate 15 is provided alongside the support 13 along the side of the support 13. The copper plate 15 has an elongated shape and both ends thereof are bent downward as leg portions 15A. The leg 15A of the copper plate 15 is connected to a land (not shown) of the printed wiring board 14. The copper plate 15 and the power supply probing pin 11 are electrically connected to each other in the vicinity of the support 13 via a capacitor 16, and the capacitor 16 absorbs noise generated in the power supply line. The connection point between the power supply probing pin 11 and the capacitor 16 is located at a distance of, for example, 12 mm from the pin tip. On the other hand, in the case of the conventional probe card 1 in which the capacitor 1E is connected at the pin base of the power supply probing pin 1A, the connection point is located at a distance of, for example, 25 mm from the pin tip. Therefore, in the case of the present embodiment, the distance from the connection point of the capacitor 16 to the pin tip is set to about half of the conventional case. For example, a capacitor having a capacitance of 100 pF, 0.01 μF, and 0.1 μF can be used as the capacitor 16.

[0010] Each of the probing pins is covered with a tubular insulating member (for example, a synthetic resin), and these are electrically insulated from each other by the tubular insulating member. Therefore, as shown in FIG. 2, since the power supply probing pin 11 is covered with the tubular insulating member 11A, the connection point between the power supply probing pin 11 and the capacitor 16 has a tubular shape as shown in FIG. The insulating member 11A has been removed.

Next, the operation will be described. When a wafer is inspected, each probing pin of the probing card 10 comes into contact with the corresponding electrode pad of a plurality of chips in the wafer, and a power supply voltage is applied to each chip via the power supply probing pins 11. Then, when an input signal is input to the chip via the signal probing pin 12 and the electrode pad, an output signal is output via the electrode pad of the chip and another signal probing pin 12. At this time, even if noise occurs in the power supply line, this noise can be absorbed at a position 12 mm from the pin tip of the power supply probing pin 11, and the distance from the noise absorption position to the pin tip is about half of the conventional one. As a result, the noise absorption effect of the capacitor 16 is higher than in the past, so that the propagation of noise to the signal probing pin 12 can be significantly suppressed, and the inspection accuracy of high-speed inspection can be greatly increased. Can be.

As described above, according to the present embodiment, the copper plate 15 is provided near the support 13 in a grounded state, and the copper plate 15 and the power supply probing pin 11 are connected via the capacitor 16 near the tip thereof. As a result, the noise absorption effect of the capacitor 16 is high, the propagation of noise to the signal probing pins 12 is significantly suppressed, and the margin in the frequency band of the high-speed inspection can be improved. As a result, the inspection accuracy of the high-speed inspection is significantly improved. Can be increased.

In the above-described embodiment, the case where the copper plate 15 is provided on the support 13 side of the printed wiring board 14 has been described. However, if the conductor can be grounded to the beta lands of the printed wiring board 14, the copper plate is used. There is no restriction.

[0014]

[Effect of the invention]

 As described above, according to the first and second aspects of the present invention, a probing card capable of minimizing the effect of noise even in a high-speed inspection and improving a frequency band margin of a high-speed inspection. Can be provided.

[Brief description of the drawings]

FIG. 1 is a partial perspective view showing a main part of an embodiment of a probing card of the present invention.

FIG. 2 is an enlarged sectional view showing a connection portion between a capacitor and a power supply probing pin of the probing card shown in FIG. 1;

FIG. 3 is a cross-sectional view showing an example of a conventional probing card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Probing card 11 Probing pin for power supply 12 Probing pin for signal 13 Support 14 Printed wiring board 15 Copper plate (conductor) 16 Capacitor

Claims (2)

[Utility model registration claims] A power supply probing terminal for applying a power supply voltage to a semiconductor element formed on a semiconductor wafer;
A signal probing terminal for inspecting electrical characteristics of the semiconductor element, a support for supporting these probing terminals, and a wiring on which the support is fixed and electrical wiring connected to each of the probing terminals is formed; A probing card comprising a substrate, wherein a conductor is provided in the vicinity of the support in a grounded state, and the conductor and the vicinity of the tip of the power supply probing terminal are connected via a capacitor. 2. The probing card according to claim 1, wherein said conductor is formed of a copper plate.