JP3338645B2 - Contactor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contactor used for inspecting electrical characteristics of a semiconductor device formed on a semiconductor wafer.

[0002]

2. Description of the Related Art A contactor, for example, inspects electrical characteristics of a large number of semiconductor elements (hereinafter, referred to as "chips") formed on a semiconductor wafer (hereinafter, simply referred to as "wafers") in a wafer state. Is used by attaching it to the probe device. As shown in FIG. 8, the contactor 1 receives a power supply probing pin 1A and a grounding probing pin (not shown) for applying a power supply voltage to a chip (not shown), and receives a chip inspection signal. A signal probing pin (not shown) for outputting, a support 1B made of an insulating member such as ceramics for supporting these probing pins, each probing pin supported by the support 1B, and a pin base. And a printed wiring board 1C having a printed wiring connected to the probing pins. The probing pins and the corresponding electrode pads on the chip surface are brought into contact with each other to perform an electrical characteristic test of the chip.

[0003] When the above-described electrical characteristic inspection is performed, noise is generated in the power supply line. However, since the power supply probing pin 1A and the signal probing pin of the probe card 1 are close to each other via the support 1B, the noise of the power supply probing pin 1A propagates to the signal probing pin and the signal probing pin. , Noise is adversely affected on the inspection result. This phenomenon becomes more remarkable as the inspection speed increases. Therefore, it is necessary to attach a capacitor according to the noise component between the power supply probing pin 1A and the solid earth 1D. Therefore, FIG.
As shown in FIG. 1, a capacitor 1E is conventionally mounted between the power source probing pin 1A on the back surface (the surface opposite to the support 1B) of the printed wiring board 1C and the solid ground 1D. Since the capacitor 1E has a higher noise removing effect as it is closer to the pin to which power is applied, the capacitor 1E has a through-hole portion through which the power probing pin 1A penetrates as close as possible to the pin of the power probing pin 1A. The capacitor 1E is connected to the pin.

[0004]

However, recently, as the chip becomes ultra-miniaturized and its degree of integration is rapidly increased, the pitch between the probing pins of the contactor becomes narrower and the pin density becomes higher. It is difficult to secure a space for mounting 1E.
The capacitor 1E is connected to the pin of the power supply probing pin 1A on the back side of the printed wiring board 1C, and the power supply probing pin 1A is connected from the connection position of the capacitor 1E.
The distance to the A pin is long (for example, 25 mm or more)
Above, the power supply probing pin 1A is extremely thin,
Noise also occurs in this portion, and the noise removing effect of the capacitor 1E is not always sufficient, and it is necessary to obtain a sufficient noise margin in the frequency band due to a phenomenon such as crosstalk between the probing pins with high density and electrostatic induction. There was a problem that it was difficult to perform a stable inspection because it was not possible. In addition, the speed of high-speed inspection has been further increased, and
There is a problem that the margin test becomes more difficult as the frequency becomes higher than 00 MHz or 300 MHz.

[0005] The present invention has been made to solve the above problem, surely pass capacitor Kupu roving terminal such that the probing terminal is limited space to be densified in the vicinity of the tip of the probing terminal The present invention aims to provide a contactor capable of performing a stable inspection by minimizing the influence of noise even in a high-speed inspection and improving a frequency band margin of the high-speed inspection. And

[0006]

According to a first aspect of the present invention, there is provided a contactor for applying a power supply voltage to a semiconductor element formed on a semiconductor wafer, a probing terminal for the power supply, and the semiconductor device. A probing terminal for grounding that can be conducted through, a probing terminal for signal for inputting / outputting a test signal for performing an electrical characteristic test of the semiconductor element, a support for supporting these probing terminals, and the support fixed. is and a wiring board having the wiring connected to each probing terminal, for the power supply
In contactor and a bypass capacitor to remove noise probing terminal, the above bypass capacitor upper
Serial is characterized in that integrally formed as part of the support are incorporated in and the support. In addition,
The contactor according to claim 2 is a contactor according to claim 1.
In the invention, the power supply side conductor of the pass capacitor is
The power supply wiring of the wiring board and the probing terminals for power supply
Connect near the tip and pass capacitor
Of the ground side conductor of the wiring board and the ground
Make sure that the probing terminals are connected
It is a feature. Further, according to claim 3 of the present invention.
The contactor according to claim 2, wherein
The power supply side conductor of the above-mentioned pass capacitor and the above-mentioned
That the wiring to connect the probing terminals for power
It is a feature . Further, according to claim 4 of the present invention.
The contactor according to any one of claims 1 to 3
In the invention described in the claims, the power supply probing terminal
It is characterized by providing a number .

According to a fifth aspect of the present invention, in the contactor according to any one of the first to fourth aspects, a plurality of the pass capacitors are provided in a vertical direction of the support. It is characterized by having.

According to a sixth aspect of the present invention, in the contactor according to any one of the first to fourth aspects, the pass capacitor is divided into a plurality in the circumferential direction of the support. It is characterized by the following. Also book
The contactor according to claim 7 of the present invention provides the contactor according to claim 5 or
The invention according to claim 6, wherein the plurality of path conditions
The capacitance of the sensor differs.
You.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in FIGS. For example, as shown in FIG. 1, the contactor 10 of the present embodiment includes a plurality of (for example, 6 to 7) power supplies for applying a power supply voltage to a plurality of chips (not shown) formed on a wafer. Probing pins 11, a plurality of (for example, 7 to 8) grounding probing pins 12 that can be conducted through the power supply probing pin 11 and the chip, and an inspection signal for inspecting the electrical characteristics of the chip. Multiple input / output lines (for example, several tens)
Signal probing pins 13, a rectangular frame-shaped support 14 for supporting these probing pins 1, the support 14 is fixed and the above-described probing pins 11,
A printed wiring board 15 having a printed wiring connected to each of the printed wiring boards 12 and 13 is provided. Then, the probing pins 11, 12, and 13 project inward from the central openings 14A and 15A of the support 14 and the printed wiring board 14, respectively, and come into contact with the electrode pads (not shown) of the chip at the respective pin ends. Then, the electrical characteristics of a plurality of chips are inspected at the same time. The probing pins 11, 12, and 13 are fixed to grooves (not shown) formed in the support body 14 by an insulating material such as an insulating resin. Through the through-holes (not shown), the printed wirings are connected on the back side of the support 14.

In view of the above, the contactor 10 of the present embodiment
Is configured similarly to the conventional contactor 1, but the contactor 10 of the present embodiment has a
It is characterized in that it is formed as a part of That is, as shown in FIGS.
And an intermediate portion in the vertical direction. The pass capacitor 16 is composed of upper and lower conductor layers 16A and 16B made of a conductive metal such as copper and aluminum, and a dielectric layer 16C interposed between the two conductors 16A and 16B. As shown in FIG. 2, the upper conductor layer 16A is connected to a solid power supply 15B formed along the support 14 on the lower surface of the printed wiring board 15 via an elongated copper-copper conductor 17 and has a power supply for the power supply. It is formed as a conductor. Also,
As shown in FIGS. 1 and 4, the lower conductor layer 16B is formed of a metal such as an elongated copper foil or an aluminum foil on a solid ground 15C formed along the support 14 in an elongated shape on the lower surface of the printed wiring board 15. It is connected via a foil conductor (hereinafter, a metal foil conductor is represented by “copper foil conductor”) 18 and is formed as a conductor on the ground side. So, for convenience,
The upper conductor layer 16A is referred to as a power supply side conductor layer 16A, and the lower conductor layer 16B is referred to as a ground side conductor layer 16B. The dielectric layer 16C may be formed by the same material as the support 14, or may be formed of a material of a different material than the support 14 with reference to the capacitance. As a material of the dielectric layer 16C, for example, tantalum,
Ceramics or the like can be used, and each capacitance can be set by appropriately setting the material and the layer thickness in accordance with the power supply voltage.

As shown in FIGS. 2 and 3, the power-supply-side conductor layer 16A and the support 1
4 A wiring ( coating conductor ) 19A for connecting the power supply probing pin 11 fixed to the lower end is formed vertically along the opening wall surface of the support 14, and the power supply is provided via the power supply side conductor layer 16A and the coating conductor 19A. A power supply voltage is applied from the probing pins 11 to the chip. As shown in FIG. 3, the coated conductor 19A is electrically insulated from the ground-side conductor layer 16B by the insulating material of the support 14 itself.

As shown in FIGS. 4 and 5, the ground-side conductor layer 16B and the grounding probing pin 12 fixed to the lower end of the support 14 are provided on the ground-side conductor layer 16B.
A conductor 19B is formed vertically along the outer peripheral surface of the support 14, and the grounding probing pin 1
2, the ground is taken via the coated conductor 19B and the ground-side conductor layer 16C.

Next, the operation will be described. When a wafer is inspected, the probing pins 11, 12, and 13 of the contactor 10 come into contact with the corresponding electrode pads of a plurality of chips in the wafer, and the power supply voltage is applied to each chip via the power supply probing pins 11. When a test signal is input to the chip via the signal probing pin 13 for input, a signal indicating the test result is output from the electrode pad of the chip via the signal probing pin 13 for output. At this time, even if there is noise in the power line,
When the current including the noise reaches the pass capacitor 16 via the copper conductor 17, the noise is absorbed here,
Emitted efficiently through the wide copper foil conductor 18. On the other hand, the power supply current from which the noise has been removed reaches the pin tip from near the tip of the power supply probing pin 11 (the lower end of the opening of the support 14 ) via the power supply side conductor layer 16A and the coated conductor 19A, respectively. A power supply voltage is applied through the electrode pads of the above. At this time, since the distance from the vicinity of the tip of the power supply probing pin 11 to the chip is extremely short, there is no possibility that noise will be generated during this time, and noise due to crosstalk between the power supply probing pin 11 and the signal probing pin 13 will be reduced. Probing pin 13 for signal
Therefore, a highly reliable and stable inspection can be performed. Therefore, a stable margin test or the like can be reliably performed even in a high frequency band of 200 to 300 MHz or more.

As described above, according to this embodiment,
Since the support 14 for supporting the probing pins includes the pass capacitor 16 as a part thereof, a space unique to the pass capacitor is not required as in the related art, and the arrangement density of the probing pins may be increased. Even
The power supply noise can be removed by attaching the pass capacitor 16 reliably, so that a highly reliable and stable inspection can be performed.

[0015] a view showing another embodiment of FIG. 6 is the invention, the contactor 10A of the present embodiment, the bypass capacitor 26, 36 of the two upper and lower stages as shown in the drawing the support 14
The power supply-side conductor layers 26A and 36A can be applied with different power supply voltages by separating the dielectrics, and are configured according to the above embodiment. . That is, the power supply side conductor layer 26A of the upper pass capacitor 26 is connected to the solid power supply 15B via the copper foil conductor 17A and to the two power supply probing pins 11 via the two coated conductors 19A. Have been. The power supply side conductor layer 36A of the lower pass capacitor 36 is connected to the solid power supply 1 via the copper foil conductor 17B.
5B and three probing pins 11 for power supply via three coated conductors 19C. The two coated conductors 19A are electrically insulated from the lower power supply side conductor layer 36A by the material forming the support 14 as shown in FIG. The ground-side conductor layers 26B and 36B are connected to the solid ground 15C via the copper foil conductors 18A and 18B, and are connected to grounding probing pins via a not-shown coated conductor. The ground-side conductor layers 26B, 36B are connected to the solid ground 15C via the copper foil conductors 18A, 18B, and are connected to the grounding probing pins 12 via the coated conductor (not shown). Accordingly, when there are two types of power supply voltages, when different power supply voltages are applied from the respective power supplies, the respective power supply noises cause the pass capacitors 26,
At 36, the same operation and effect as the above embodiment can be expected.

As a structure for applying two kinds of power supply voltages, the pass capacitor 16 shown in FIGS.
The structure shown in FIG. Each of the pass capacitors 46 and 56 includes a power-side conductor layer 46A, 56A and a ground-side conductor layer 46A.
B, 56B and dielectric layers 46C, 56C. The power-side conductor layers 46A and 56A and the ground-side conductor layers 46B and 56B are electrically insulated from each other by an insulating material forming the support 14. Each of the power supply side conductor layers 46A and 56A is connected to the solid power supply 15B via the copper foil conductors 17A and 17B and to the power supply probing pin 11 via the coating conductors 19A and 19C. . The ground-side conductor layers 46B and 56B are connected to the solid ground 15C via the copper foil conductors 18A and 18B, and are connected to the grounding probing pin 12 via the coated conductor (not shown). Therefore, in this embodiment, the same operation and effect as those of the above embodiments can be expected.

In the above embodiments, the case where the structure of the pass capacitor is changed according to the type of the power supply voltage has been described. However, even when the power supply voltage applied to the plurality of Probing pin 13
A pass capacitor having a different capacitance depending on the location or the like can be used. Of course, each pass capacitor 26, 3
6 or 46, 56 may have the same capacitance. Further, the pass capacitor may have a structure of three or more stages in the upper and lower parts, or may have a structure of three or more in the circumferential direction of the support.

[0018]

According to the present invention, as described above,
According to the invention of claim 7 , the probing end for power supply
The pass capacitor that removes the child noise is the probing end.
Formed integrally as part of the support that supports the child
Because it is incorporated in the serial support, the Kupu Robi <br/> ring probing pin bypass capacitor terminals, such that the probing terminal is limited in space manner densified tip near
It is possible to provide a contactor that can be securely attached to the side and that can perform a stable inspection by suppressing the influence of noise as much as possible in a high-speed inspection to improve a margin of a high-speed inspection frequency band.

[Brief description of the drawings]

FIG. 1 is a view showing an embodiment of a contactor of the present invention,
It is a top view which shows a support body and the probing pin in the state supported by the support body.

FIG. 2 is a sectional view of the contactor shown in FIG. 1 taken along the line II-II.

FIG. 3 is a cross-sectional view of the contactor shown in FIG. 2 taken along the line III-III.

FIG. 4 is a side view of the contactor shown in FIG.

FIG. 5 is a sectional view of the contactor shown in FIG. 4 taken along line VV.

FIG. 6 shows another embodiment of the contactor of the present invention.
FIG.

FIG. 7 is a cross-sectional view corresponding to FIG. 1, showing still another embodiment of the contactor of the present invention.

FIG. 8 is a sectional view showing an example of a conventional contactor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Contactor 11 Probing pin for power supply 12 Probing pin for ground 13 Probing pin for signal 14 Support 15 Printed wiring board 16 Capacitor 17 Copper foil conductor

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/66

Claims (7)

(57) [Claims] 1. A power supply probing terminal for applying a power supply voltage to a semiconductor element formed on a semiconductor wafer, a grounding probing terminal that can be conducted through the power supply probing terminal and the semiconductor element, A signal probing terminal for inputting and outputting a test signal for performing an electrical property test, a support for supporting these probing terminals, and a wiring board having a wire to which the support is fixed and connected to each of the probing terminals; , Power supply
In contactor and a bypass capacitor to remove noise roving terminal, the bypass capacitor is the
Contactors, characterized in that integrally formed as part of is and the support built into the support. 2. The power supply side conductor of the pass capacitor is connected to the power supply side conductor.
The power supply wiring of the wiring board and the probing terminals for power supply
Connect near the tip and pass capacitor
Of the ground side conductor of the wiring board and the ground
2. The contactor according to claim 1, wherein the contactor is connected to the vicinity of the tip of the probing terminal . 3. The pass capacitor on a side surface of the support.
Connect the power supply side conductor to the power supply probing terminal
The contactor according to claim 2 , further comprising a wiring . 4. A plurality of power supply probing terminals are provided.
Contactor according to any one <br/> of claims 1 to 3, characterized in that the 5. A method according to claim 1請, characterized in that the bypass capacitor has a plurality over the vertical direction of the support
Contactor according to any one of Motomeko 4. 6. claims 1 to 4 the bypass capacitor, wherein the was divided into a plurality in the circumferential direction of the support
The contactor according to any one of the preceding claims. 7. The capacitance of the above multiple pass capacitors is
7. The method according to claim 5, wherein
On-board contactor.