KR100267214B1 - Method for connecting power line of connector to tester in handler - Google Patents
Method for connecting power line of connector to tester in handler Download PDFInfo
- Publication number
- KR100267214B1 KR100267214B1 KR1019980012642A KR19980012642A KR100267214B1 KR 100267214 B1 KR100267214 B1 KR 100267214B1 KR 1019980012642 A KR1019980012642 A KR 1019980012642A KR 19980012642 A KR19980012642 A KR 19980012642A KR 100267214 B1 KR100267214 B1 KR 100267214B1
- Authority
- KR
- South Korea
- Prior art keywords
- connector
- tester
- substrate
- mounter
- handler
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
본 발명은 제조공정에서 생산완료된 반도체(이하 "소자"라 함)를 순차적으로 이송시켜 소자의 리드를 테스터와 전기적으로 접속시키는 핸들러에서 테스트부에 설치되는 컨넥터(connector)와 테스터사이에 전원을 연결하는 방법에 관한 것으로 와이어의 연결방법을 개선하여 컨넥터 마운터에 보다 많은 컨넥터를 설치하고도 테스터와의 와이어 연결방법이 용이해질 수 있도록 한 것이다.The present invention connects a power supply between a connector and a tester installed in a test unit in a handler which sequentially transfers a semiconductor (hereinafter referred to as an "element") produced in a manufacturing process to electrically connect the lead of the device to the tester. It is related to how to connect the wire to improve the method of connecting more wires to the connector mounter to facilitate the wire connection method with the tester.
이를 위해, 컨넥터 마운터(10)에 고정되는 복수개의 컨넥터(8)에 각각 기판(9)을 수직으로 고정하여 상기 컨넥터에 고정된 기판의 일부가 핸들러의 백커버(6) 후방으로 노출되도록 한 다음 상기 백커버의 후방으로 노출된 기판(9)의 패턴(9b)과 테스터사이에 와이어(7)를 연결하게 되므로 동일면적의 컨넥터 마운터(10)에 보다 많은 개수의 컨넥터(8)를 설치할 수 있게 됨은 물론 컨넥터 마운터(10) 및 장착판(11)에 별도의 패턴을 형성하지 않아도 되므로 컨넥터 어셈블리의 생산원가를 대폭 줄일 수 있게 된다.To this end, the substrate 9 is vertically fixed to each of the plurality of connectors 8 fixed to the connector mounter 10 so that a part of the substrate fixed to the connector is exposed to the back cover 6 of the handler. Since the wire 7 is connected between the pattern 9b of the substrate 9 exposed to the back of the back cover and the tester, a larger number of connectors 8 can be installed in the connector mounter 10 having the same area. Of course, there is no need to form a separate pattern on the connector mounter 10 and the mounting plate 11 can significantly reduce the production cost of the connector assembly.
Description
본 발명은 제조공정에서 생산완료된 반도체(이하 "소자"라 함)를 순차적으로 이송시켜 소자의 리드를 테스터와 전기적으로 접속시키는 핸들러에서 테스트부에 설치되는 컨넥터(connector)와 테스터사이에 전원을 연결하는 방법에 관한 것이다.The present invention connects a power supply between a connector and a tester installed in a test unit in a handler which sequentially transfers a semiconductor (hereinafter referred to as an "element") produced in a manufacturing process to electrically connect the lead of the device to the tester. It is about how to.
일반적으로 생산공정에서 생산 완료된 1개 또는 여러개의 소자를 핸들러의 테스트부로 이송시켜 소자의 리드를 테스트부에 설치된 컨넥터에 전기적으로 접속시키므로서 소자의 특성이 테스터에 의해 판별되는데, 테스트 결과에 따라 소자는 양품과 불량품으로 선별되어 양품의 소자는 출하되고, 불량품은 폐기 처분된다.In general, the characteristics of the device are determined by the tester by transferring one or several devices produced in the production process to the test part of the handler and electrically connecting the device leads to the connectors installed in the test part. Is classified as good or bad, the good device is shipped, and the bad is discarded.
도 1은 종래의 전원 연결방법을 설명하기 위한 컨넥터 어셈블리의 평면도이고 도 2는 도 1의 A - A선 단면도로서, 콘택트 핀(1)이 일체로 몰딩된 복수개의 컨넥터(2)가 수평상태로 위치하는 기판(3)에 각각 고정되어 있어 상기 콘택트 핀이 기판(3)과 전기적으로 통하여지도록 한 다음 상기 기판을 체결부재에 의한 컨넥터 마운터(4)에 고정하도록 되어 있다.FIG. 1 is a plan view of a connector assembly for explaining a conventional power connection method, and FIG. 2 is a cross-sectional view taken along the line A-A of FIG. 1, in which a plurality of connectors 2 integrally molded with contact pins 1 are in a horizontal state. It is fixed to each of the substrate 3 to be positioned so that the contact pin is electrically connected to the substrate 3, and then the substrate is fixed to the connector mounter 4 by the fastening member.
이와 같이 복수개의 컨넥터(2)가 고정된 컨넥터 마운터(4)는 핸들러의 백커버()에 착탈가능하게 설치되는 장착판(5)상에 고정되어 이들이 상호 전기적으로 통하여지게 된다.In this way, the connector mounter 4 to which the plurality of connectors 2 are fixed is fixed on the mounting plate 5 detachably installed on the back cover of the handler so that they are electrically connected to each other.
상기 백커버(6)에 착탈가능하게 설치되는 장착판(5)과 테스터(도시는 생략함)사이에는 컨넥터(2)의 콘택트 핀(1)수와 동일하게 와이어(7)가 연결되므로 테스트시 소자의 리드가 각 컨넥터(2)의 콘택트 핀(1)과 접속됨에 따라 테스터의 신호가 와이어(7)를 통해 소자에 인가된다.Since the wire 7 is connected between the mounting plate 5 detachably installed on the back cover 6 and the tester (not shown) in the same way as the number of contact pins 1 of the connector 2, As the lead of the device is connected with the contact pin 1 of each connector 2, the signal of the tester is applied to the device via the wire 7.
따라서 테스트하고자 하는 복수개의 소자가 테스트 트레이의 캐리어 모듈(도시는 생략함))에 얹혀지거나, 매달려 이송수단에 의해 테스트부로 이송된 다음 컨넥터(2)측으로 수평 또는 수직이동하면 상기 소자의 리드가 콘택트 핀(1)에 전기적으로 접속된다.Therefore, when the plurality of devices to be tested are placed on the carrier module (not shown) of the test tray, or are transferred to the test unit by the hanging transfer means and then moved horizontally or vertically to the connector 2 side, the leads of the devices are contacted. It is electrically connected to the pin 1.
이러한 상태에서 부도체인 사파이어와 같은 누름핀이 소자의 리드를 눌러주면 소자와 테스터가 와이어(7)를 통해 전기적으로 완전히 통하여지게 되므로 테스터에서 생산완료된 소자의 성능을 판단하여 중앙처리장치(CPU)에 그 결과를 알리게 된다.In this state, when the push pin such as sapphire, which is a non-conductor, presses the lead of the device, the device and the tester are completely passed through the wires 7 so that the performance of the device produced by the tester is judged and then sent to the CPU. The result will be announced.
그 후, 테스트완료된 소자가 이송수단에 의해 테스트 트레이의 이송경로상으로 복귀되어 테스트가 완료되면 판정결과에 따라 분류부에서 테스트완료된 소자를 양품과 불량품으로 분류하게 된다.After that, the tested device is returned to the transfer path of the test tray by the transfer means, and when the test is completed, the tester classifies the tested device as good or bad according to the determination result.
그러나 이러한 종래의 전원 연결방법은 컨넥터(2)를 수평상태의 기판(3)에 고정시킨 상태에서 장착판(5)과 전기적으로 접속된 컨넥터 마운터(4)에 고정한 다음, 상기 컨넥터 마운터가 고정된 장착판(5)과 테스터사이에 와이어(7)를 연결하므로 인해 동일면적의 장착판(5)에 많은 양의 컨넥터(2)를 설치할 경우 와이어(7)의 결선에 따른 공간을 확보할 수 없으므로 컨넥터(2)의 설치개수를 제한받는 문제점이 있었다.However, this conventional power connection method is fixed to the connector mounter (4) electrically connected to the mounting plate (5) in a state where the connector (2) is fixed to the substrate (3) in a horizontal state, and then the connector mounter is fixed Since the wire 7 is connected between the mounting plate 5 and the tester, when a large amount of connectors 2 are installed on the mounting plate 5 of the same area, the space according to the wiring of the wire 7 cannot be secured. There was a problem that the number of installation of the connector (2) is limited.
따라서 많은 개수의 소자를 동시에 테스트하고자 할 경우에는 부득이 장착판(5)를 크게 제작할 수 밖에 없으므로 장비가 커지게 된다.Therefore, if you want to test a large number of devices at the same time, because the unavoidable to make the mounting plate 5 large, the equipment becomes large.
본 발명은 종래의 이와 같은 문제점을 해결하기 위해 안출한 것으로서, 와이어의 연결방법을 개선하여 컨넥터 마운터에 보다 많은 컨넥터를 설치하고도 테스터와의 와이어 연결방법이 용이해질 수 있도록 하는데 그 목적이 있다.The present invention has been made to solve such a problem in the prior art, an object of the present invention is to improve the connection method of the wire to facilitate the wire connection method with the tester even if more connectors are installed in the connector mounter.
상기 목적을 달성하기 위한 본 발명의 형태에 따르면, 컨넥터 마운터에 고정되는 복수개의 컨넥터에 각각 기판을 수직으로 고정하여 상기 컨넥터에 고정된 기판의 일부가 핸들러의 백커버 후방으로 노출되도록 한 다음 상기 백커버의 후방으로 노출된 기판의 패턴과 테스터사이에 와이어를 연결함을 특징으로 하는 핸들러의 컨넥터와 테스터의 전원 연결방법이 제공된다.According to an aspect of the present invention for achieving the above object, the substrate is fixed vertically to a plurality of connectors fixed to the connector mounter so that a portion of the substrate fixed to the connector is exposed to the back of the handler's back cover and then the bag A method of connecting a connector to a handler and a power source for connecting the tester is provided, wherein the wire is connected between the pattern of the substrate exposed to the rear of the cover and the tester.
도 1은 종래의 전원 연결방법을 설명하기 위한 컨넥터 어셈블리의 평면도1 is a plan view of a connector assembly for explaining a conventional power connection method
도 2는 도 1의 A - A선 단면도2 is a cross-sectional view taken along the line A-A of FIG.
도 3은 본 발명의 전원 연결방법을 설명하기 위한 컨넥터 어셈블리의 평면도3 is a plan view of a connector assembly for explaining a power connection method of the present invention;
도 4는 도 3의 B - B선 단면도4 is a cross-sectional view taken along the line B-B of FIG.
도면의 주요부분에 대한 부호의 설명Explanation of symbols for main parts of the drawings
8 : 컨넥터 9 : 기판8: Connector 9: Substrate
10 : 컨넥터 마운터 11 : 장착판10: connector mounter 11: mounting plate
이하, 본 발명을 일 실시예로 도시한 도 3 및 도 4를 참고하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to FIGS. 3 and 4 as an embodiment.
도 3은 본 발명의 전원 연결방법을 설명하기 위한 컨넥터 어셈블리의 평면도이고 도 4는 도 3의 B - B선 단면도로서, 본 발명의 특징은 컨넥터(8)와 테스터사이를 전기적으로 연결하는 기판(9)을 컨넥터(8)에 수직으로 설치하여 수직으로 설치된 기판(9)의 패턴(9a)이 백커버(6)의 후방으로 노출되도록 한다는데 있다.3 is a plan view of a connector assembly for explaining the power connection method of the present invention and FIG. 4 is a cross-sectional view taken along the line B-B of FIG. 3, the characteristics of the present invention is a substrate that electrically connects between the connector 8 and the tester ( 9) is installed perpendicular to the connector 8 so that the pattern 9a of the substrate 9 installed vertically is exposed to the rear of the back cover 6.
이에 따라, 복수개의 컨넥터(8)가 고정되는 컨넥터 마운터(10) 및 상기 컨넥터 마운터가 고정되는 장착판(11)에 이들이 상호 전기적으로 통하여지도록 하는 별도의 패턴을 형성할 필요가 없고, 기판(9)이 백커버(6)의 후방으로 노출되도록 구멍(10a)(11a)만을 형성하면 된다.Accordingly, it is not necessary to form a separate pattern to allow them to be electrically connected to each other in the connector mounter 10 to which the plurality of connectors 8 are fixed and the mounting plate 11 to which the connector mount is fixed, and the substrate 9 ) Only need to form holes 10a and 11a to expose the back of the back cover 6.
상기 기판(9)이 수직으로 설치되는 컨넥터(8)는 상기 기판(9)을 하방에 수직으로 결합하여 테스터와 전기적으로 통하여지도록 하면 만족하므로 컨넥터(8)의 형태를 특정하지 않는다.The connector 8 in which the substrate 9 is installed vertically is satisfied if the substrate 9 is vertically coupled downward to be electrically connected to the tester, so that the shape of the connector 8 is not specified.
상기 기판(9)의 패턴(9a)과 전기적으로 접촉하는 콘택트 핀(12)의 구조 또한, 다양한 형태로 적용가능하므로 특별히 한정할 필요가 없다.The structure of the contact pin 12 in electrical contact with the pattern 9a of the substrate 9 can also be applied in various forms, and therefore it is not necessary to specifically limit it.
상기 컨넥터(8)에 결합되는 기판(9)의 상측(콘택트 핀의 접촉부에 접속되는 부위)에는 패턴(9a)이 형성되어 있고 하측에는 테스터와 와이어(7)를 연결하기 위한 복수개의 패턴(9b)이 형성되어 있다.A pattern 9a is formed on the upper side of the substrate 9 coupled to the connector 8 (a portion connected to the contact portion of the contact pin), and a plurality of patterns 9b for connecting the tester and the wire 7 to the lower side. ) Is formed.
이에 따라, 컨넥터 마운터(10)에 많은 개수의 컨넥터(8)를 설치하여 콘택트 핀(12)의 개수가 늘어나더라도 기판(9)이 컨넥터(8)의 하방에 수직방향으로 배치되므로 인해 컨넥터 어셈블리의 크기는 커지지 않는다.Accordingly, even if the number of the contact pins 12 is increased by installing a large number of connectors 8 in the connector mounter 10, the substrate 9 is disposed below the connector 8 in the vertical direction, thereby causing the The size does not grow.
따라서 컨넥터(8)에 기판(9)을 결합하면 와이어(7)를 연결하기 위한 패턴(9b)이 백커버(6)의 후방으로 노출된다.Therefore, when the substrate 9 is coupled to the connector 8, the pattern 9b for connecting the wire 7 is exposed to the rear of the back cover 6.
상기 패턴(9b)을 기판(9)의 양측면에 지그재그로 배치할 경우에는 콘택트 핀(12)의 증가로 인하여 와이어(7)의 수가 늘어나더라도 패턴의 배열에 따른 공간을 충분히 확보할 수 있는 장점을 갖는다.When the pattern 9b is arranged in zigzag on both sides of the substrate 9, even if the number of wires 7 increases due to the increase of the contact pins 12, the space according to the arrangement of the patterns may be sufficiently secured. Have
즉, 도 4와 같이 컨넥터(8)에 기판(9)이 결합된 상태로 상기 컨넥터를 컨넥터 마운터(10)에 설치하면 기판(9)의 양측면에 지그재그로 형성된 패턴(9b)이 기판(9)의 양측면을 통해 백커버(6)의 후방으로 노출되므로 테스터와 와이어(7)를 연결하는 작업이 용이해지게 된다.That is, when the connector is mounted on the connector mounter 10 in a state in which the substrate 9 is coupled to the connector 8 as shown in FIG. 4, the pattern 9b zigzag on both sides of the substrate 9 is formed of the substrate 9. Since the rear side of the back cover 6 is exposed through both sides of the tester and the wire 7 becomes easy to work.
이상에서와 같이 본 발명은 컨넥터(8)에 기판(9)을 수직방향으로 설치하여 백커버(6)의 후방으로 노출된 기판(9)의 패턴(9b)과 테스터사이를 직접 와이어(7)로 연결하게 되고, 이에 따라 동일면적의 컨넥터 마운터(10)에 보다 많은 개수의 컨넥터를 설치할 수 있게 되므로 장비의 콤팩트화가 가능하게 됨은 물론 컨넥터 마운터(10) 및 장착판(11)에 별도의 패턴을 형성하지 않아도 되므로 컨넥터 어셈블리를 보다 저렴한 가격으로 제작가능하게 된다.As described above, according to the present invention, the substrate 9 is installed in the connector 8 in the vertical direction so that the wire 7 is directly connected between the pattern 9b of the substrate 9 exposed to the rear of the back cover 6 and the tester. In this way, a larger number of connectors can be installed in the connector mounter 10 of the same area, thereby enabling compactness of the equipment, as well as providing a separate pattern to the connector mounter 10 and the mounting plate 11. This eliminates the need to form connector connectors, making them more affordable.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980012642A KR100267214B1 (en) | 1998-04-09 | 1998-04-09 | Method for connecting power line of connector to tester in handler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980012642A KR100267214B1 (en) | 1998-04-09 | 1998-04-09 | Method for connecting power line of connector to tester in handler |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990079834A KR19990079834A (en) | 1999-11-05 |
KR100267214B1 true KR100267214B1 (en) | 2000-10-16 |
Family
ID=19536041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980012642A KR100267214B1 (en) | 1998-04-09 | 1998-04-09 | Method for connecting power line of connector to tester in handler |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100267214B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101493045B1 (en) * | 2008-11-07 | 2015-02-16 | 삼성전자주식회사 | Connecting unit for testing semiconductor chip and apparatus for testing semiconductor having the same |
-
1998
- 1998-04-09 KR KR1019980012642A patent/KR100267214B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR19990079834A (en) | 1999-11-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6407566B1 (en) | Test module for multi-chip module simulation testing of integrated circuit packages | |
US5878485A (en) | Method for fabricating a carrier for testing unpackaged semiconductor dice | |
US5205741A (en) | Connector assembly for testing integrated circuit packages | |
JPH10185947A (en) | Probe adapter | |
US20030222282A1 (en) | Direct-connect signaling system | |
JP2005524239A5 (en) | ||
JPH036626B2 (en) | ||
US6179659B1 (en) | Electrical contact device and associated method of manufacture | |
JP3516277B2 (en) | Connector module | |
KR19980071478A (en) | Semiconductor devices | |
KR100267214B1 (en) | Method for connecting power line of connector to tester in handler | |
WO2016167412A1 (en) | Bidirectional conductive socket for testing high-frequency device, bidirectional conductive module for testing high-frequency device, and manufacturing method thereof | |
US5700979A (en) | Flexible strip cable with extension for testing | |
KR200311472Y1 (en) | Board connector for testing semiconductor package | |
KR20000009830U (en) | Printed Circuit Board Inspection Device | |
KR102729509B1 (en) | Connector assembly for test apparatus | |
JP4080607B2 (en) | LED mounting device | |
JP2545263Y2 (en) | IC device burn-in board | |
KR20030068629A (en) | Test board assemble | |
JPH0299875A (en) | Tester for semiconductor device | |
KR100275824B1 (en) | method for mounting substrate on socket assembly in module IC handler | |
JPH07159486A (en) | Integrated circuit testing device | |
KR100190930B1 (en) | The test jig for testing bare die | |
KR0123068Y1 (en) | Connector | |
JP3376959B2 (en) | IC socket |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19980409 |
|
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19980409 Comment text: Request for Examination of Application |
|
PG1501 | Laying open of application | ||
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20000623 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20000703 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20000704 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20030416 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20040413 Start annual number: 5 End annual number: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20050704 Start annual number: 6 End annual number: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20060602 Start annual number: 7 End annual number: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20070604 Start annual number: 8 End annual number: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20080702 Start annual number: 9 End annual number: 9 |
|
FPAY | Annual fee payment |
Payment date: 20090702 Year of fee payment: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20090702 Start annual number: 10 End annual number: 10 |
|
LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |