JP3505908B2 - Conductive wire connection terminal - Google Patents

Conductive wire connection terminal

Info

Publication number
JP3505908B2
JP3505908B2 JP08602696A JP8602696A JP3505908B2 JP 3505908 B2 JP3505908 B2 JP 3505908B2 JP 08602696 A JP08602696 A JP 08602696A JP 8602696 A JP8602696 A JP 8602696A JP 3505908 B2 JP3505908 B2 JP 3505908B2
Authority
JP
Japan
Prior art keywords
case
terminal
pad
pad portion
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP08602696A
Other languages
Japanese (ja)
Other versions
JPH09259956A (en
Inventor
直隆 村上
威倍 加納
修昭 三木
敏弥 森下
直人 小笠原
研 木山
聖治 榊原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aisin AW Co Ltd
Original Assignee
Aisin AW Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aisin AW Co Ltd filed Critical Aisin AW Co Ltd
Priority to JP08602696A priority Critical patent/JP3505908B2/en
Publication of JPH09259956A publication Critical patent/JPH09259956A/en
Application granted granted Critical
Publication of JP3505908B2 publication Critical patent/JP3505908B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 【発明の属する技術分野】 【０００１】 本発明は、導電ワイヤの接続端子に関
し、特に、ワイヤが接続される端子のパッド部のケース
への固定構造に関する。 【０００２】 【従来の技術】 従来、電子制御装置等を構成する回路
基板は、一般に、図８に示すように、コネクタａと一体
化された樹脂製のケースｂ内に収容される。こうした回
路基板ｃとコネクタａとの電気的な接続は、樹脂材料か
らなるケースｂの型成形時に、ケース壁ｄに一体化モー
ルドされ帯板状の複数の端子ｅで行われる。したがっ
て、コネクタａ内に一端を突出させた各端子ｅは、ケー
ス壁ｄを貫通してケースｂ内に導かれ、ケースｂ内にお
いて一面をケース表面に露出させることによりパッド部
ｆを形成させ、その部分で終端する。 【０００３】 そして、基板ｃの各端子部とパッド部ｆ
との電気的接続は、近時、基板の耐熱性を向上させるた
めにセラミックス基板が用いられることから、基板への
孔明けが困難であるため、従来のように基板の孔にワイ
ヤを差し込み、はんだ付けする方法を採ることができな
い。そこで、ワイヤボンディングによる接続が行われ
る。ワイヤボンディングは、アルミ線等の適宜のボンデ
ィングワイヤの末端を高周波振動するボンディングツー
ルでパッド部に押圧しつつ振動を与えることにより、圧
接部の発熱でワイヤを熱溶着させるものである。 【０００４】 【発明が解決しようとする課題】 ところで、樹脂によ
り固定された端子のボンディングパッド部は、図９に示
すように、その部分で上面が解放されており、埋め込み
方向の厚さも薄いため、ケース壁ｄへの十分な固着強度
を保持することが困難である。また、ボンディングパッ
ド部ｆの先端は、ケースｂのパッド支持面で終端させて
あるため、モールド時にパッド部ｆ側の端部を治具で位
置決め支持することができず、パッド部ｆの配設精度を
維持することが困難であり、図１０に誇張して示すよう
に、点線で正規の伸長方向に延びるパッド部ｆ’に対し
て、実線で示すようにばらつきを生じる。 【０００５】 このように、従来技術においては、端子
は、端子がケース壁を貫通する部分で保持されているに
過ぎない。したがって、ワイヤボンディングを行う際、
パッド部ｆにボンディングツールでワイヤｇを押圧して
振動をかけると、パッド部ｆもワイヤｇと一体に振動し
てしまい、その結果、パッド部ｆに対するワイヤｇの溶
着が不十分となってしまう可能性がある。また、溶着後
のボンディングツールの移動時に、ボンディングツール
の引き上げに伴って、ワイヤｇも上方向に引っ張られる
ため、端子のパッド部ｆがケースｂから浮き上がり易
く、それにより位置ずれを生じる場合がある。 【０００６】 そこで、上記パッド部ｆの浮き上がりを
防止する技術として、図１１に示すように、パッド部ｆ
の断面を凸形に形成する提案もある。しかしながら、こ
うした技術は、端子の加工が複雑になるため、比較的大
形の端子には適用可能であっても、板厚が薄く、幅の狭
い小さな端子には適用することができないものであり、
しかも、パッド部ｆの表面で構成されるボンディング面
の下部が広がっているため、ボンディング面の配設ピッ
チを狭くすることが不可能となる。 【０００７】 本発明は、上記課題を解決し、ワイヤと
端子の接続を確実に行える端子の提供と、モールド時の
端子の位置決め精度を向上させることを目的とするとと
もに、多数の端子の密接した配置を可能とすることを目
的とする。 【０００８】 【課題を解決するための手段】 上記の目的を達成する
ため、本発明は、回路基板を収容するケース内とケース
外部とを導通させ、ケース内で回路基板にワイヤを介し
て接続される導電ワイヤ接続端子において、前記端子
は、前記ケースの壁を貫通する貫通部と、ケース内に露
出するパッド部と、該パッド部から延長させて前記ケー
スの壁の内部に埋め込まれる固定部を有し、前記貫通部
と固定部により前記ケースに固着されるとともに、ケー
ス外部におけるコネクタ部内に突出してコネクタの端子
を構成する第１の突出部と、固定部の先端でケースの壁
から突出する第２の突出部を有し、前記端子の固定部の
横幅は、前記パッド部のボンディング面の幅以下とされ
た構成が採られる。 【０００９】 【発明の作用及び効果】 上記請求項１記載の構成によ
れば、端子のパッド部から固定部が延びてケース壁内部
に埋め込まれることにより、端子のパッド部側の先端が
ケースに完全に固着されるので、ワイヤボンディング時
に、ワイヤとパッド部が一体に振動することがなく、ワ
イヤとパッド部とを完全に溶着させることができる。ま
た、端子が第１及び第２の突出部を有しているので、ケ
ースに端子をモールドする際に、１つの端子を２点で保
持することが可能となり、樹脂の注入時の流動圧により
端子が位置ずれすることがなく、モールド後の端子の位
置精度を向上させることができる。更に、相互に隣接す
る端子のパッド部の配置間隔を狭くすることができるの
で、多数の端子を少ない面積内に配置することができ、
ケースを小型化することができる。 【００１０】 【発明の実施の形態】 以下、図面に沿い、本発明の実
施形態を説明する。図１〜図５は、本発明の導電ワイヤ
接続端子を電子制御装置に適用した第１実施形態を示す
もので、図１に断面、図２にカバー５を取り除いた平面
を示すように、端子４は、回路基板（以下、実施形態の
説明において、基板という）１を収容するケース２内と
ケース外部とを導通させ、ケース２内で基板１にワイヤ
３を介して接続されるものとされている。 【００１１】 本発明に従い、端子４は、ケース２の内
部と、ケースの外部すなわちコネクタ部２１とを隔てる
壁２０を貫通する貫通部４０と、ケース２内に露出する
パッド部４２と、パッド部４２から延長させてケース２
の壁２０の内部に埋め込まれる固定部４３を有し、貫通
部４０と固定部４３によりケース２に固着される。パッ
ド部４２は、ケース２に取り付けられた基板１の上面と
面一になるように壁２０から張り出させたパッドベース
部２２にボンディング面を露出させた状態で埋設され、
その端部から垂直下方に折り曲げられて延び、更に水平
に折り曲げられて延びる固定部４３がパッドベース部２
２の下方に埋め込まれている。 【００１２】 この形態では、端子４は、ケース２の外
部すなわちコネクタ部２１内に突出する第１の突出部４
１を有し、固定部４３には、ケース２の壁２０から若干
突出する第２の突出部４４が設けられている。これら第
１及び第２の突出部４１，４４のうち、第１の突出部４
１は、コネクタ部２１内のソケット端子としての本来の
機能を果たすほか、第２の突出部４４と協働して、ケー
ス２のモールド時の位置決め治具のための保持部として
機能する。すなわち、予め銅の薄板等からなる素材をプ
レスで帯状に打ち抜き、その端部を上記のように折り曲
げることで固定部４３を形成し、全体に金メッキを施し
た端子４を型内にセットするときに、上記第１及び第２
の突出部４１，４４をそれぞれ型内の治具で保持する両
端保持状態とすることで、端子４の位置が樹脂の注入時
の流動圧によりずれることがなくなる。そして、この構
成の場合、端子４の横幅は、その全長にわたって一様に
されているため、固定部４３の横幅も、パッド部４２の
横幅と等しくなっている。特に、このように端子を一様
な幅の帯板状に構成した場合、加工が極めて単純化され
る利点が得られる。 【００１３】 図３に端子４のケース内部分を拡大して
詳細に示し、図２に平面上でみた配置を示すように、端
子４は、横方向に多数並列に並べて配置される。そし
て、それらの横幅は、小さなものでは通常１ｍｍ強程
度、各パッド部４２間の間隙は横幅以下に設定される。
したがって、パッド部４２における埋め込み深さは、板
厚分の極めて浅いものとなる。そこで、この形態の場
合、図３に示すように、パッド部４２に隣接する固定部
４３の表面はパッドベース部２２から露出しているが、
それから先の部分がケースの樹脂内にＬ字状に埋没して
抜け止め効果を発揮するようにしているので、パッド部
４２に水平方向の振動が加えられても、パッド部４２は
横ずれすることはない。なお、固定部４３先端の第２の
突出部４４は、ケースの樹脂中から若干突出した形態と
なるが、この突出部４４は、基板１の配置の支障となる
場合には、モールド後にケース壁２０に沿わせるように
折り曲げてもよい。 【００１４】 図４は、上記のように構成したパッド部
４２へのワイヤ３のボンディング状態を示しており、ワ
イヤ３は一端をパッド部４２に熱溶着され、他端を基板
１のプリント端子１２に熱溶着される。このボンディン
グ時に、先にパッド部４２側のワイヤ３の端部を溶着さ
せ、対応する基板側１側のプリント端子１２の方へボン
ディングツールを移動させる場合、該ツールのワイヤガ
イドホルダに挿通されたワイヤ３に引張力がかかるた
め、パッド部４２は、ワイヤ３に引っ張られてパッドベ
ース２２から引き剥がされようとするが、上記の固定部
４３のケース樹脂内への埋め込みによりパッド部４２の
浮き上がりも防止される。 【００１５】 次に、図５は端子４の固定部４３の変形
形態を示す。この場合、固定部４３Ａは、パッド部４２
の側縁から垂直下方に延びる形態とされ、更に、その側
縁からパッド部４２に平行に第２の突出部４４Ａが延在
する形態とされている。こうした構成を採ると、端子４
の形体及び加工は若干複雑になるが、パッド部４２につ
いては、それ自体の剛性が固定部４３Ａにより高められ
るので、ボンディング時のパッド部４２の振動と、ボン
ディンツールを移動させるときのパッド部４２の変形に
よる浮き上がりを一層確実に阻止することができる利点
が得られる。 【００１６】 更に、図６は、上記の変形形態と実質的
に同様の端子を小さなピッチで密に配設する場合の配置
を示しており、互いに隣合う端子４の固定部４３Ａ，４
３Ａ’の上下方向長さを異ならせ、第２の突出部４４
Ａ，４４Ａ’の位置を横一線上に並べる代わりに、面上
に分散させて、モールド時の治具による保持を容易にし
ている。このように、第２の突出部４４Ａ，４４Ａ’を
二次元的に配置することで、図に示すように、第２の突
出部４４Ａ，４４Ａ’の横幅は、必ずしも全てについて
パッド部４２の横幅以下に設定する必要はなくなる。 【００１７】 以上詳記したように、上記いずれの実施
形態においても、端子４のパッド部４２から固定部４３
が延びてケース壁２０内部に埋め込まれることにより、
端子４のパッド部４２側の先端がケース２に完全に固着
されるので、ワイヤボンディング時に、ワイヤ３とパッ
ド部４２が一体に振動することがなく、ワイヤ３とパッ
ド部４２とを完全に溶着させることができる。また、端
子４が第１及び第２の突出部４１，４４を有するので、
ケース２に端子４をモールドする際に、１つずつの端子
４を２点で保持することが可能となり、樹脂の注入時の
流動圧により端子４が位置ずれすることがなく、モール
ド後の端子４の位置精度を向上させることができる。更
に、従来のように、端子断面を凸型にする加工が不要で
あり、しかも、パッド部４２の延長上で端子４を固定す
ることで、パッド幅以上の固定幅を必要としないため、
相互に隣接する端子４のパッド部４２の配置間隔を狭く
することができ、多数の端子４を少ない面積内に配置す
ることで、ケース２を小型化することができる。 【００１８】 以上、本発明を、想定し得る好適な形態
を組み合わせて具体化した実施形態に基づいて説明した
が、本発明は、これらの形態を単独あるいは取捨選択し
て組み合わせて実施することができるものである。ま
た、前記第１実施形態及びその変形形態では、固定部の
第２の突出部をケース内に突出させるものとしたが、第
２の突出部は、ケース外部に突出させることを妨げるも
のではない。Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a connection terminal of a conductive wire, and more particularly to a structure for fixing a pad portion of a terminal to which a wire is connected to a case. 2. Description of the Related Art Conventionally, a circuit board constituting an electronic control unit or the like is generally housed in a resin case b integrated with a connector a as shown in FIG. Such electrical connection between the circuit board c and the connector a is performed by a plurality of strip-shaped terminals e integrally molded with the case wall d when the case b made of a resin material is molded. Therefore, each terminal e, one end of which protrudes into the connector a, penetrates the case wall d and is guided into the case b, thereby exposing one surface to the case surface in the case b to form a pad portion f, Terminate at that point. Then, each terminal portion of the substrate c and the pad portion f
In recent years, since the ceramic substrate is used to improve the heat resistance of the substrate, it is difficult to make a hole in the substrate, so a wire is inserted into the hole of the substrate as in the past, The method of soldering cannot be adopted. Then, connection by wire bonding is performed. In the wire bonding, an appropriate bonding wire such as an aluminum wire is vibrated while being pressed against a pad portion by a bonding tool that vibrates at a high frequency, so that the wire is thermally welded by the heat generated at the press-contact portion. [0004] By the way, as shown in FIG. 9, the bonding pad portion of the terminal fixed by the resin has an open top surface at that portion, and the thickness in the embedding direction is small. It is difficult to maintain sufficient fixing strength to the case wall d. In addition, since the tip of the bonding pad portion f is terminated at the pad supporting surface of the case b, the end portion on the pad portion f side cannot be positioned and supported by a jig during molding, so that the pad portion f is disposed. It is difficult to maintain the accuracy, and as shown in an exaggerated manner in FIG. 10, a variation occurs as shown by a solid line with respect to a pad portion f ′ extending in a normal extension direction by a dotted line. As described above, in the related art, the terminal is merely held at a portion where the terminal penetrates the case wall. Therefore, when performing wire bonding,
When the wire g is pressed against the pad portion f with a bonding tool and vibrated, the pad portion f also vibrates integrally with the wire g, and as a result, the welding of the wire g to the pad portion f becomes insufficient. there is a possibility. In addition, when the bonding tool is moved after welding, the wire g is also pulled upward with the lifting of the bonding tool, so that the pad portion f of the terminal is easily lifted from the case b, which may cause a displacement. . Therefore, as a technique for preventing the floating of the pad portion f, as shown in FIG.
There is also a proposal to form a cross section of a convex shape. However, such a technique makes the processing of the terminal complicated, so that it can be applied to a relatively large terminal but cannot be applied to a small terminal having a small thickness and a small width. ,
In addition, since the lower portion of the bonding surface formed by the surface of the pad portion f is widened, it is impossible to reduce the arrangement pitch of the bonding surface. [0007] The present invention is to solve the above problems, and provides wire and reliably perform terminal connection terminals, when an object to improve the positioning accuracy of the terminal at the time of molding bets
It is another object of the present invention to allow a large number of terminals to be closely arranged . Means for Solving the Problems To achieve the above object, the present invention provides an electrical connection between a case accommodating a circuit board and the outside of the case, and connects the inside of the case to the circuit board via a wire. In the conductive wire connection terminal described above, the terminal includes a penetrating portion penetrating the wall of the case, a pad portion exposed in the case, and a fixing portion extending from the pad portion and embedded in the wall of the case. A first protruding portion fixed to the case by the penetrating portion and the fixing portion and protruding into the connector portion outside the case to form a terminal of the connector; and protruding from a wall of the case at a tip of the fixing portion. have a second protrusion which, in the fixing portion of the terminal
The width is not more than the width of the bonding surface of the pad portion.
Configuration is adopted. According to the configuration of the first aspect, the fixing portion extends from the pad portion of the terminal and is embedded in the case wall, so that the tip of the terminal portion on the pad portion side is attached to the case. Since the wire and the pad portion are completely fixed, the wire and the pad portion do not vibrate integrally during wire bonding, and the wire and the pad portion can be completely welded. In addition, since the terminal has the first and second protrusions, it is possible to hold one terminal at two points when molding the terminal in the case, and the flow pressure at the time of injecting the resin is increased. It is possible to improve the positional accuracy of the terminal after molding without the terminal being displaced. In addition,
The spacing between the pads on the terminals can be reduced.
Therefore, many terminals can be arranged in a small area,
The case can be reduced in size . Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 to 5 show a first embodiment in which a conductive wire connection terminal of the present invention is applied to an electronic control device. As shown in FIG. 1, a cross section is shown, and FIG. Reference numeral 4 designates an electrical connection between the inside of a case 2 for housing a circuit board (hereinafter, referred to as a board in the description of the embodiment) 1 and the outside of the case, and is connected to the board 1 via wires 3 in the case 2. ing. According to the present invention, the terminal 4 includes a through portion 40 penetrating through the wall 20 separating the inside of the case 2 and the outside of the case, that is, the connector portion 21, a pad portion 42 exposed in the case 2, a pad portion Case 2 extended from 42
A fixing portion 43 is embedded in the inside of the wall 20, and is fixed to the case 2 by the penetrating portion 40 and the fixing portion 43. The pad portion 42 is buried in a pad base portion 22 protruding from the wall 20 so as to be flush with the upper surface of the substrate 1 attached to the case 2 with the bonding surface exposed,
The pad base 2 has a fixed portion 43 which is bent vertically downward from the end thereof and further extends horizontally.
2 is embedded below. In this embodiment, the terminal 4 is provided with the first protrusion 4 protruding outside the case 2, that is, inside the connector 21.
1, the fixing portion 43 is provided with a second protrusion 44 slightly protruding from the wall 20 of the case 2. Of the first and second projections 41 and 44, the first projection 4
1 functions not only as a socket terminal in the connector portion 21 but also as a holding portion for a positioning jig at the time of molding the case 2 in cooperation with the second projecting portion 44. That is, when a material made of a thin copper plate or the like is punched in a band shape by a press in advance, and the end portion is bent as described above to form the fixing portion 43, and the gold-plated terminal 4 is set in the mold. In addition, the first and second
The protrusions 41 and 44 are held at both ends by jigs in the mold, so that the position of the terminal 4 does not shift due to the fluid pressure at the time of resin injection. In the case of this configuration, since the width of the terminal 4 is uniform over its entire length, the width of the fixing portion 43 is also equal to the width of the pad portion 42. In particular, when the terminals are formed in a strip shape having a uniform width as described above, there is an advantage that processing is extremely simplified. As shown in FIG. 3 in which the inner portion of the terminal 4 is enlarged and shown in detail, and FIG. 2 shows the arrangement viewed from above, a large number of terminals 4 are arranged in parallel in the horizontal direction. The width of each of them is usually about 1 mm or more, and the gap between the pad portions 42 is set to be equal to or less than the width.
Therefore, the embedding depth in the pad portion 42 is extremely shallow by the plate thickness. Therefore, in the case of this embodiment, as shown in FIG. 3, the surface of the fixing portion 43 adjacent to the pad portion 42 is exposed from the pad base portion 22,
Then, since the leading portion is buried in an L-shape in the resin of the case so as to exhibit a retaining effect, the pad portion 42 may be laterally displaced even when horizontal vibration is applied to the pad portion 42. There is no. The second projecting portion 44 at the tip of the fixing portion 43 has a form slightly projecting from the resin of the case. However, if the projecting portion 44 hinders the arrangement of the substrate 1, the case wall may be formed after molding. It may be folded so as to be along 20. FIG. 4 shows a bonding state of the wire 3 to the pad section 42 configured as described above. One end of the wire 3 is thermally welded to the pad section 42, and the other end of the wire 3 is printed on the printed terminal 12 of the substrate 1. Heat welded. At the time of this bonding, when the end of the wire 3 on the pad portion 42 side is first welded and the bonding tool is moved toward the corresponding printed terminal 12 on the substrate side 1 side, the bonding tool is inserted into the wire guide holder of the tool. Since a tensile force is applied to the wire 3, the pad portion 42 is pulled by the wire 3 and tends to be peeled off from the pad base 22, but the pad portion 42 is lifted by embedding the fixing portion 43 in the case resin. Is also prevented. Next, FIG. 5 shows a modification of the fixing portion 43 of the terminal 4. In this case, the fixing portion 43A is
And a second protrusion 44A extending from the side edge in parallel with the pad portion 42. With such a configuration, the terminal 4
However, the rigidity of the pad portion 42 itself is enhanced by the fixing portion 43A, so that the vibration of the pad portion 42 at the time of bonding and the pad portion at the time of moving the bonding tool are performed. The advantage is obtained that the floating due to the deformation of 42 can be more reliably prevented. FIG. 6 shows an arrangement in which terminals substantially similar to those in the above-described modified embodiment are densely arranged at a small pitch, and the fixing portions 43 A, 4 of the terminals 4 adjacent to each other are shown.
3A ′, the length of the second protrusion 44
Instead of arranging the positions of A and 44A 'on a horizontal line, they are dispersed on the surface to facilitate holding by a jig during molding. Thus, by arranging the second protrusions 44A and 44A 'two-dimensionally, as shown in the drawing, the width of the second protrusions 44A and 44A' is not necessarily the same as the width of the pad 42 for all of them. There is no need to set below. As described above in detail, in any of the above embodiments, the pad portion 42 of the terminal 4
Is extended and embedded inside the case wall 20,
Since the tip of the terminal 4 on the pad portion 42 side is completely fixed to the case 2, the wire 3 and the pad portion 42 do not vibrate integrally during wire bonding, and the wire 3 and the pad portion 42 are completely welded. Can be done. Further, since the terminal 4 has a first and second projecting portions 41 and 44,
When the terminals 4 are molded in the case 2, each terminal 4 can be held at two points, and the terminals 4 are not displaced by the fluid pressure at the time of injecting the resin. 4 can improve the positional accuracy. Further, unlike the related art, it is not necessary to make the terminal cross section convex, and since the terminal 4 is fixed on the extension of the pad portion 42, a fixed width larger than the pad width is not required.
The spacing between the pad portions 42 of the terminals 4 adjacent to each other can be reduced, and the case 2 can be downsized by arranging a large number of terminals 4 within a small area. As described above, the present invention has been described based on the embodiments embodied by combining possible suitable forms. However, the present invention may be implemented by combining these forms alone or by selecting and combining them. You can do it. In the first embodiment and its modifications, the second projecting portion of the fixing portion projects into the case. However, the second projecting portion does not prevent the projecting portion from projecting outside the case. .

【図面の簡単な説明】 【図１】 本発明の第１実施形態に係る端子を適用した
電子制御装置の断面図である。 【図２】 上記電子制御装置のカバーを取り外した平面
図である。 【図３】 上記端子のパッド部と固定部を拡大して示す
斜視図である。 【図４】 上記端子と回路基板の接続態様を示す拡大斜
視図である。 【図５】 上記端子の変形形態を示す部分拡大斜視図で
ある。 【図６】 上記端子の密接配置形態を示す部分拡大斜視
図である。 【図７】 従来の端子を適用した電子制御装置の断面図
である。 【図８】 上記従来の端子のパッド部を示す部分拡大斜
視図である。 【図９】 上記従来の端子のパッド部を誇張して示す部
分平面図である。 【図１０】 従来の端子のパッド部の改良例を示す部分
拡大斜視図である。 【符号の説明】 １ 回路基板 ２ ケース ３ ワイヤ ４ 端子 ２０ 壁 ４０ 貫通部 ４１ 第１の突出部 ４２ パッド部 ４３，４３Ａ，４３Ａ’，４３Ｂ 固定部 ４４，４４Ａ，４４Ａ’ 第２の突出部BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of an electronic control device to which a terminal according to a first embodiment of the present invention is applied. FIG. 2 is a plan view of the electronic control device with a cover removed. FIG. 3 is an enlarged perspective view showing a pad portion and a fixing portion of the terminal. FIG. 4 is an enlarged perspective view showing a connection mode between the terminal and a circuit board. FIG. 5 is a partially enlarged perspective view showing a modification of the terminal. FIG. 6 is a partially enlarged perspective view showing a close arrangement of the terminals. FIG. 7 is a sectional view of an electronic control device to which a conventional terminal is applied. FIG. 8 is a partially enlarged perspective view showing a pad portion of the conventional terminal. FIG. 9 is a partial plan view showing a pad portion of the conventional terminal in an exaggerated manner. FIG. 10 is a partially enlarged perspective view showing an improved example of a pad portion of a conventional terminal. [Description of Reference Numerals] 1 circuit board 2 case 3 wire 4 terminal 20 wall 40 penetrating part 41 first protruding part 42 pad part 43, 43A, 43A ', 43B fixing part 44, 44A, 44A' second protruding part

フロントページの続き (72)発明者 森下 敏弥 愛知県安城市藤井町高根10番地 アイシ ン・エィ・ダブリュ株式会社内 (72)発明者 小笠原 直人 愛知県安城市藤井町高根10番地 アイシ ン・エィ・ダブリュ株式会社内 (72)発明者 木山 研 愛知県安城市藤井町高根10番地 アイシ ン・エィ・ダブリュ株式会社内 (72)発明者 榊原 聖治 愛知県安城市藤井町高根10番地 アイシ ン・エィ・ダブリュ株式会社内 (56)参考文献 特開 平４−354356（ＪＰ，Ａ) 特開 平４−354357（ＪＰ，Ａ) 特開 平５−234630（ＪＰ，Ａ) 実開 平２−26270（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01R 9/09 H05K 5/06 H01L 21/60 301 Continued on the front page (72) Inventor Toshiya Morishita 10 Takane, Fujii-machi, Anjo, Aichi Prefecture Inside Aisin AW Co., Ltd. (72) Naoto Ogasawara 10, Takane, Fujii-cho, Anjo, Aichi Aisin Ai Within K.K. (72) Inventor Ken Kiyama 10th Takane, Fujii-machi, Anjo, Aichi Prefecture Aisin A.K.K.Seiji Sakakibara 10th Takane, Fujii-cho, Anjo, Aichi Aisin A. (56) References JP-A-4-354356 (JP, A) JP-A-4-354357 (JP, A) JP-A-5-234630 (JP, A) JP-A-2-26270 (JP) , U) (58) Fields investigated (Int. Cl. 7 , DB name) H01R 9/09 H05K 5/06 H01L 21/60 301

Claims (1)

(57)【特許請求の範囲】 【請求項１】 回路基板を収容するケース内とケース外
部とを導通させ、ケース内で回路基板にワイヤを介して
接続される導電ワイヤ接続端子において、 前記端子は、前記ケースの壁を貫通する貫通部と、ケー
ス内に露出するパッド部と、該パッド部から延長させて
前記ケースの壁の内部に埋め込まれる固定部を有し、前
記貫通部と固定部により前記ケースに固着されるととも
に、ケース外部におけるコネクタ部内に突出してコネク
タの端子を構成する第１の突出部と、固定部の先端でケ
ースの壁から突出する第２の突出部を有し、前記端子の
固定部の横幅は、前記パッド部のボンディング面の横幅
以下とされたことを特徴とする導電ワイヤ接続端子。(57) [Claim 1] A conductive wire connection terminal connected between a case accommodating a circuit board and the outside of the case and connected to the circuit board via a wire in the case, wherein the terminal Has a penetrating portion penetrating through the wall of the case, a pad portion exposed in the case, and a fixing portion extending from the pad portion and embedded in the inside of the case wall, wherein the penetrating portion and the fixing portion wherein together is fixed to the case, possess a first projecting portion constituting the connector portion connector of the terminal projects into the outside of the case, the second protrusion protruding from the case wall at the tip of the fixing portion by, Of the terminal
The width of the fixed part is the width of the bonding surface of the pad part.
A conductive wire connection terminal characterized by the following .
JP08602696A 1996-03-15 1996-03-15 Conductive wire connection terminal Expired - Fee Related JP3505908B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP08602696A JP3505908B2 (en) 1996-03-15 1996-03-15 Conductive wire connection terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08602696A JP3505908B2 (en) 1996-03-15 1996-03-15 Conductive wire connection terminal

Publications (2)

Publication Number Publication Date
JPH09259956A JPH09259956A (en) 1997-10-03
JP3505908B2 true JP3505908B2 (en) 2004-03-15

Family

ID=13875156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP08602696A Expired - Fee Related JP3505908B2 (en) 1996-03-15 1996-03-15 Conductive wire connection terminal

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Country Link
JP (1) JP3505908B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3472702B2 (en) * 1998-04-08 2003-12-02 矢崎総業株式会社 Molding method of connector-integrated case and mold structure used in this molding method
JPH11297450A (en) * 1998-04-08 1999-10-29 Nippon Abs Ltd Terminal bonding surface protecting method, and housing for electronic device
JP2000208181A (en) * 1999-01-08 2000-07-28 Aisin Aw Co Ltd Electronic component and its manufacturing device
JP3681922B2 (en) * 1999-06-03 2005-08-10 三菱電機株式会社 Drawer terminal, power semiconductor device case, and power semiconductor device
JP2003297497A (en) * 2002-04-08 2003-10-17 Hitachi Ltd Electronic control device
JP4141789B2 (en) * 2002-10-11 2008-08-27 三菱電機株式会社 Power semiconductor device
JP6841199B2 (en) * 2017-09-29 2021-03-10 三菱電機株式会社 Semiconductor device
JP7190985B2 (en) * 2019-08-05 2022-12-16 三菱電機株式会社 semiconductor equipment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0226270U (en) * 1988-08-05 1990-02-21
JP2765277B2 (en) * 1991-05-31 1998-06-11 株式会社デンソー Electronic equipment
JP2765278B2 (en) * 1991-05-31 1998-06-11 株式会社デンソー Electronic device manufacturing method
JPH05234630A (en) * 1992-02-25 1993-09-10 Matsushita Electric Ind Co Ltd Electronic circuit unit

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