JP4079857B2 - Manufacturing method of connection device - Google Patents

Description

  The present invention relates to a method of manufacturing a connection device that is an IC socket to which, for example, an IC (integrated circuit) or the like is mounted. In particular, the spiral contact mounted in the connection device is suitable for a three-dimensional shape having a predetermined height. It is related with the manufacturing method of the connection apparatus which can be shape | molded and can reduce the settling rate of a spiral contactor.

  The semiconductor inspection apparatus described in Patent Document 1 electrically temporarily connects a semiconductor to an external circuit board or the like. A large number of spherical contacts arranged in a lattice shape or a matrix shape are provided on the back side of the semiconductor, and a large number of concave portions are provided on an insulating substrate opposite to the spherical contacts, and spiral contacts are provided in the concave portions. Opposed.

When the back side of the semiconductor is pressed toward the insulating substrate, the spiral contact contacts the outer surface of the spherical contact so that the spiral contact wraps spirally. The electrical connection between the two is ensured.
JP 2002-175859 A Japanese Patent Application No. 2002-167999

  By the way, the spiral contact 2 in this patent document 1 is a planar form, and solid forming is not given.

  However, it is preferable that the spiral contact is three-dimensionally formed to some extent, because the electrical connection with the spherical contact can be made good and reliable.

For example, the three-dimensional forming can be realized by the following method.
FIG. 16 is a plan view of the spiral contact 50. As shown in FIG. 17, the spiral contact 50 is first formed in a planar manner, and a base 50 b of the spiral contact 50 is joined to a base 52 via an adhesive 51. The base 52 is provided with a hole 52 a at a position facing the spiral contact 50.

  As shown in FIG. 17, a protrusion adjusting member 70 is passed through the hole 52 a from below the spiral contact 50, and the protrusion adjusting member 70 contacts the contact piece 50 a for each turn of the spiral contact 50. As shown in FIG. 18, each contact piece 50a protrudes upward. Then, the protrusion adjusting member 70 is removed.

  However, the following problems occur in the spiral contactor 20 subjected to the three-dimensional forming process shown in FIGS.

  First, the spiral contact 50 is usually provided in a plurality of connection devices instead of one. In the three-dimensional forming method shown in FIGS. 17 to 18, the spiral contacts 50 are individually three-dimensionally formed, so that the height dimension of each spiral contact 50 tends to vary.

  Next, even when the height dimension H1 of the spiral contactor 50 is adjusted to a predetermined height by the protrusion adjusting member 70 in the step of FIG. 18, if the protrusion adjusting member 70 is removed, The height of the spiral contact 50 is reduced from H1 to H2 (FIG. 19).

  Therefore, at the stage of FIG. 18, the height dimension H1 of the spiral contact 50 must be increased more than necessary while taking into account the later springback amount. However, at this time, a strong stress is applied to the spiral contact 50, and the contact pieces 50a of the spiral contact 50 are easily broken.

  Further, due to the spring back described above, if the height of the spiral contact 50 is not adjusted many times by using the protrusion adjusting member 70, after the protrusion adjusting member 70 is removed, The height dimension H2 could not be maintained at a required height, and the three-dimensional forming process of the spiral contactor 50 took time and the work was complicated.

  Further, the semiconductor inspection apparatus described in Patent Document 1 is used for a test such as a high-temperature operation confirmation called a burn-in test, for example. In such a case, the spiral contactor that has been three-dimensionally molded at a high heating temperature. 50 sag, and it was easy to return to a state close to the planar shape shown in FIG.

  Accordingly, the present invention is to solve the above-described conventional problems, and in particular, by performing heat treatment after three-dimensionally forming a spiral contact, it is possible to form a three-dimensional shape with a predetermined height and reduce the sag rate. It aims at providing the manufacturing method of a connection device.

The present invention includes a base and a plurality of spiral-shaped elastic contacts provided on the base, and a plurality of external connection portions provided on the electronic component are in contact with the spiral-shaped elastic contacts, respectively. In the manufacturing method of the connecting device,
The base, the elastic contact, and the base of the spiral elastic contact in a planar shape are joined to the base and the tip of the elastic contact is opposed to a through hole formed in the base. Forming a stacked structure, and
A jig is passed through the through hole of the base from the side opposite to where the elastic contact is provided to press the elastic contact, and the tip of the elastic contact is separated from the base. A step of forming a three-dimensional shape;
And a step of performing heat treatment to relieve the stress of the elastic contacts of the three-dimensional shape by heating the resilient contacts while maintaining the press by pre Kichi tool,
When the jig is removed after the heat treatment, the elastic contact maintains its three-dimensional shape with its tip portion separated from the base by a predetermined height and is elastically deformable. is there.
In the present invention, the elastic contactor is pressed at the front end portion of the jig using the jig provided with the protruding portion whose width gradually increases from the front end side toward the rear end side.
Moreover, in this invention, it is preferable to press the said front part of the said spiral shaped elastic contactor with the said jig | tool. Thereby, the said elastic contact can be appropriately formed in the mountain shape which protrudes in the position where the center vicinity is the highest.

By the heat treatment step in the present invention, since the crystalline state changes in the metal elements constituting the elastic contact piece, the crystal state is stabilized while maintaining the three-dimensional shape, the stress is also alleviated, the elastic contact piece While being able to form appropriately in the solid | 3D shape of predetermined height, the sag rate of the said elastic contactor can be reduced conventionally also by the repeated use of the said connection apparatus.

In the present invention, three-dimensionally shaped by using a jig with the elastic contacts, after performing the heat treatment step, removing the jig. That subjected to the heat treatment in the state that installing the jig. Since the elastic contact which is three-dimensionally shaped by jig relaxation remains the heat treatment is performed by stress of the condition is achieved, the height when it is three-dimensionally shaped by a jig, without upcoming fart too , A three-dimensional shape having a predetermined height can be formed.

In the present invention, after performing the heat treatment step, applying a second heat treatment step and long heating time at a higher heating temperature than the thermal processing step, the elastic by repeated use of the pre-Symbol connecting device The rate of contact sag can be reduced more effectively than before.

In the present invention, the second heat treatment step may be performed after the jig is removed.

Moreover, in this invention, it is preferable to set the heating temperature of a said 2nd heat processing process to a temperature higher than the environmental temperature of the actual use of the said connection apparatus. Thus even when exposed to the environmental temperature of actual use of the connection device, the amount of sag of the elastic contact piece can appropriately suppress a long period of time the resilient contacts in the three-dimensional shape having a predetermined height dimension can be maintained. In the present invention, it is preferable to set the heating temperature in the second heat treatment step to a temperature higher than the heating temperature in the burn-in test.

  In the present invention, it is preferable that the heating temperature of the second heat treatment step is 170 to 200 ° C. and the heating time is 20 to 200 hours.

In the present invention, the heating temperature of the heat treatment step, between 100 to 200 ° C., it is preferable to set the heating time and for 30 minutes to 12 hours.
Moreover, in this invention, it is preferable to set the heating temperature of the said heat processing process to the temperature higher than the environmental temperature of the actual use of the said connection apparatus. Moreover, it is preferable to set the heating temperature of the heat treatment step to a temperature higher than the heating temperature in the burn-in test. Moreover, it is preferable that the heating temperature of the said heat processing process shall be between 170 degreeC-200 degreeC, and heating time shall be between 20 hours-200 hours.

Further, in the present invention, it is preferable that the respective elastic contacts are simultaneously three-dimensionally formed using the jig because variation in the height dimension of each elastic contact can be suppressed.

The present invention is particularly effective when the elastic contactor is formed by a foil body or plating, or a laminated structure of a foil body and a plating layer. The elastic contact formed by plating or foil is a very small structure, so it is very difficult to adjust the height with only a jig for three-dimensional molding of the elastic contact. The elastic contact made of plated or foil body is in an amorphous state or partially crystallized state, so even if it is three-dimensionally molded, the crystal state is likely to change fluidly due to various factors in the actual use environment. This is because plastic deformation is likely to occur.

  In the present invention, after the spiral contact is three-dimensionally formed, a heat treatment process is performed, so that the crystal state of the metal element constituting the spiral contact changes, the crystal state is stabilized while maintaining the three-dimensional shape, and the stress is also reduced. Therefore, the spiral contact can be appropriately formed into a three-dimensional shape having a predetermined height, and the rate of sag of the spiral contact can be reduced by repeated use of the connecting device.

  1 is a perspective view showing an inspection apparatus used in a test for confirming the operation of an electronic component, and FIG. 2 is a sectional view taken along line 2-2 of FIG. is there.

  As shown in FIG. 1, the inspection apparatus 10 includes a base 11 and a lid 12 that is rotatably supported via a hinge 13 provided on one edge of the base 11. ing. The base 11 and the lid body 12 are formed of an insulating resin material or the like, and a loading region 11A that is concave in the Z2 direction is formed at the center of the base 11. An electronic component 1 such as a semiconductor can be mounted in the loading area 11A. A locked portion 14 is formed on the other edge of the base 11.

  As shown in FIG. 2, this inspection apparatus 10 is an inspection object in which a large number of spherical contacts (external connection parts) 1a are arranged in a matrix (lattice or grid) on the lower surface of the electronic component 1. It is what.

  As shown in FIG. 2, the loading area 11 </ b> A has a predetermined diameter, and a plurality of recesses (through holes) 11 a penetrating from the front surface of the loading area 11 </ b> A to the back surface of the base 11 have a spherical shape of the electronic component 1. It is provided corresponding to the contact 1a.

  A plurality of spiral contacts 20 in which contacts are formed in a spiral shape are provided on the upper surface of the recess 11a (the surface of the loading region 11A).

  FIG. 3 is a perspective view of the spiral contact 20. As shown in FIG. 3, a plurality of the spiral contacts 20 are formed on the base 11 with predetermined intervals in the X direction and the Y direction shown in the figure.

  As shown in FIG. 3, each spiral contact 20 has a base 21 fixed to the edge of the open end above the recess 11a, and the winding start end 22 of the spiral contact 20 is provided on the base 21 side. It has been. A winding end 23 extending spirally from the winding start end 22 is positioned at the center of the recess 11a.

  A conductive portion (not shown) is formed on the inner wall surface of the concave portion 11a, and the upper end of the conductive portion and the base portion 21 of the spiral contactor 20 are connected by a conductive adhesive or the like. The opening end below the recess 11a is closed by a connection terminal 18 connected to the conducting portion.

  As shown in FIG. 2, a printed circuit board 29 having a plurality of wiring patterns and other circuit components is provided below the base 11, and the base 11 is fixed on the printed board 29. . The surface of the printed circuit board 29 is provided with a counter electrode 28 facing the connection terminal 18 provided on the bottom surface of the base 11, and the connection terminals 18 come into contact with the counter electrodes 28, respectively. The electronic component 1 and the printed circuit board 29 are electrically connected via the inspection apparatus 10.

  On the other hand, at the center position of the inner surface of the lid 12 of the inspection apparatus 10, a convex pressing portion 12a that presses the electronic component 1 downward in the figure is provided so as to face the loading area 11A. Further, a lock portion 15 is formed at a position on the opposite side to the hinge portion 13.

  Between the inner surface of the lid body 12 and the pressing portion 12a, a biasing member made of a coil spring or the like that biases the pressing portion 12a away from the inner surface of the lid body 12 is provided (not shown). . Accordingly, when the electronic component 1 is mounted in the recess 11a and the lid 12 is closed and locked, the electronic component 1 can be elastically pressed in the direction approaching the surface of the loading region 11A (Z2 direction). ing.

  The size of the loading area 11A of the base 11 is substantially the same as the outer shape of the electronic component 1, and when the electronic component 1 is mounted on the loading area 11A and the lid 12 is locked, the electronic component 1 side Each spherical contact 1a and each spiral contact 20 on the inspection apparatus 10 side can be positioned accurately in correspondence with each other.

  When the lock part 15 of the lid 12 is locked to the locked part 14 of the base 11, the electronic component 1 is pressed downward in the figure by the pressing part 12 a, so that each spherical contact 1 a becomes each spiral contact 20. Is pushed downward in the recess 11a (downward in the figure). At the same time, the outer shape of the spiral contact 20 is deformed so as to be expanded from the winding end 23 toward the winding start end 22 (outward from the center of the spiral), and is wound so as to embrace the outer surface of the spherical contact 1a. Each spherical contact 1a and each spiral contact 20 are connected.

  Each spiral contact 20 shown in FIG. 3 is three-dimensionally formed into a mountain shape so that the vicinity of the winding end 23 protrudes highest.

  The spiral contact 20 in the present invention is manufactured by the following method. FIG. 4 to FIG. 9 are process diagrams showing a manufacturing method (first manufacturing method) of the spiral contact 20 according to the present invention.

  Reference numeral 30 shown in FIG. 4 is a substrate, and the substrate 30 may be either an insulating substrate or a conductive substrate.

  In the step shown in FIG. 4, a resist layer 31 is applied on the substrate 30 by, for example, spin coating, and a pattern 31a having the shape of the spiral contact 20 shown in FIG. 6 is formed by exposure and development.

  Next, the contact pieces 20a and the base 21 constituting the spiral contact 20 are formed by plating in the pattern 31a.

  Here, the contact piece 20a and the base portion 21 may be formed by plating with a single layer, or a plurality of layers made of different materials may be stacked and formed by plating. For example, the contact piece 20a and the base portion 21 are formed by multilayer plating of Cu and Ni or Ni and Au.

  4, when an insulating substrate is used as the substrate 30, it is necessary to form a plating base layer on the substrate 30 by a sputtering method or the like before applying the resist layer 31. When a conductive substrate is used as the substrate 30, it is not necessary to form the plating base layer.

  Next, in the step shown in FIG. 5, the resist layer 31 is first removed with a chemical. Next, the base portions 21 of the spiral contacts 20 are connected by the joining member 32. The joining member 32 is provided with a hole 32 a that is slightly larger than the spiral contact 20. The hole 32 a is aligned with the spiral contact 20, and the base 21 of the spiral contact 20 is aligned. The joining member 32 is stuck on the top. The joining member 32 is made of, for example, polyimide. Then, the substrate 30 is removed.

  When each spiral contact 20 is viewed from directly above at the time of FIG. 5, the shape is as shown in FIG. The spiral contact 20 formed in the steps shown in FIGS. 4 and 5 is formed in a plane, and all the contact pieces 20a constituting the spiral contact 20 have substantially the same height.

  Next, in the step shown in FIG. 7, the spiral contacts 20 connected by the joining member 32 are joined to the base 11 via the anisotropic conductive adhesive 33. The base 11 is provided with a concave portion 11 a at a position facing the spiral contact 20, and the spiral contact 20 and the concave portion 11 a are aligned so that each spiral contact 20 is attached to the base 11. Join.

  In the process of FIG. 8, the fixing member 35 is provided on the joining member 32 that connects the bases 21 of the spiral contacts 20, and the base 11 is formed during the three-dimensional molding of the spiral contact 20 performed in this process. The base 11 is fixed by the fixing member 35 so as not to rattle.

  The fixing member 35 is provided with a hole 35a at a position where the spiral contact 20 is formed, so that the fixing member 35 does not get in the way when the spiral contact 20 is three-dimensionally formed. It has become.

  As long as the fixing member 35 is not provided at least on each contact piece 20a constituting the spiral contact 20, it may be provided at a position other than the joining member 32.

  Next, as shown in FIG. 8, the protrusion adjusting member 36 is passed through the recess 11 a provided in the base 11, and the protrusion adjusting member 36 is pushed upward.

  By the way, the protrusion adjusting member 36 according to the present invention is composed of a base 36a and a protrusion 36b protruding upward from the base 36a. In FIG. 8, when the protrusion 36b is cut from the height direction, a cross section thereof is obtained. Is in the shape of an isosceles triangle. That is, both side portions 36b1 and 36b1 of the protruding portion 36b are inclined so that the width of the cross section of the protruding portion 36b gradually increases downward.

The apex portion 36c of the protruding portion 36b in the present invention, for example, of the space between each contact child piece 20a of the spiral contact 20 shown in FIG. 6, just there to become a dead end on the side of the winding end 2 3 The spiral contact 20 is pushed upward through the apex 36c of the protrusion 36b.

  Since both side portions 36b1 and 36b1 of the projecting portion 36b are inclined so that the width dimension of the projecting portion 36b gradually expands downward, the projecting portion 36b is pushed up to raise the spiral contactor 20. When the three-dimensional molding is performed, each contact piece 20a of the spiral contact 20 is easily pushed up so that the height position gradually increases from the winding end 22 toward the winding end 23, and the spiral contact 20 is formed into a predetermined mountain shape. It is easy to form the contact 20 three-dimensionally.

  The cross-sectional shape of the protrusion 36b is not limited to that of FIG. 8, but at least both side portions 40a1 and 40a1 of the tip 40a of the protrusion 40 are gradually lowered downward as shown in FIG. A shape that is curved or inclined so that the width of the cross section is widened is preferable.

  As shown in FIG. 11, when the cross section of the protruding portion 41 is substantially rectangular and the upper surface 41a of the protruding portion 41 is widely formed in a planar shape, the alignment with the spiral contact 20 is particularly accurately performed. Otherwise, solid molding is not performed in a well-balanced manner overall, and a strong stress is applied to a certain part, and problems such as breakage or damage of the part are likely to occur.

  Further, as shown in FIG. 12, the protrusion adjusting member 36 shown in FIG. 8 has a configuration in which a plurality of protrusions 36b (only two protrusions are marked in FIG. 12) are provided on the base 26a. It is preferable that

  The protrusion 36b shown in FIG. 12 has a conical shape. Each protrusion 36b is provided at a position facing each spiral contact 20, and is regularly provided with a predetermined interval in the X and Y directions of the base 36a as shown in FIG. .

  If the protrusion adjusting member 36 as shown in FIG. 12 is used, a plurality of spiral contacts 20 can be three-dimensionally formed at the same time, and variations in the height dimension of each spiral contact 20 can be suppressed.

  In the present invention, the spiral contactor 20 is three-dimensionally formed in the process of FIG. 8 as described above, but is characterized in that a first heat treatment is performed after the three-dimensional formation.

  By performing the first heat treatment, the crystal state of the metal element constituting the spiral contactor 20 can be changed, the crystal state can be stabilized while maintaining the three-dimensional shape, and the stress can be relaxed. The spiral contact can be appropriately formed into a three-dimensional shape having a predetermined height.

  For this reason, even if the protrusion adjusting member 36 is removed, the amount of spring back of the spiral contactor 20 can be reduced, so that the height dimension H3 when the spiral contactor 20 is three-dimensionally formed in the process of FIG. There is no need to do it. As a result, in anticipation of a large future spring back as in the prior art, the spiral contact 20 is pushed up more than necessary during three-dimensional molding, and a large amount of stress is applied to each contact piece 20a of the spiral contact 20. It is possible to prevent damage such as breakage caused by the addition.

  The first heat treatment described above is preferably performed without removing the protrusion adjusting member 36 after the spiral contact 20 is three-dimensionally formed using the protrusion adjusting member 36 as shown in FIG. This is because if the protrusion adjusting member 36 is removed before the first heat treatment, the spiral contact 20 returns to a state close to the planar shape shown in FIG.

  Therefore, the first heat treatment is performed in a state where the protrusion adjusting member 36 pushes the spiral contact 20 upward as shown in FIG.

As for this 1st heat processing conditions, it is preferable that heating temperature is between 100 degreeC-200 degreeC, and heating time is between 30 minutes-12 hours. The heating temperature is the temperature at a or the heating time less than this is too short, not done properly the stress relaxation, when removing the protrusion adjustment member 36 after the first heat treatment step, springback It will be big.

  Next, in the step shown in FIG. 9, the protrusion adjusting member 36 and the fixing member 35 are removed. At this time, the height H4 of the spiral contact 20 is slightly lower due to the spring back than before the protrusion adjusting member 36 of FIG. 8 is removed, but since the first heat treatment has already been performed, the amount of spring back The height dimension H4 of the spring contact 20 can be maintained within an allowable range.

  In FIGS. 8 and 9, the height dimensions H3 and H4 of the spring contact 20 are set to the height from the upper surface of the joining member 32 that connects the spiral contacts 20 to the upper surface of the contact piece 20a that protrudes highest. However, the range in which the height dimension is specified is free.

  By the way, although the manufacturing of the spiral contact 20 may be finished in the step of FIG. 9, it is preferable to perform the following second heat treatment next.

  The second heat treatment step preferably has a higher heating temperature and a longer heating time than the first heat treatment step.

This second heat treatment step is performed as necessary after removing the protrusion adjusting member 36 and the fixing member 35. It is preferable to remove the protrusion adjusting member 36 and to apply the second heat treatment to the spiral contactor 20 with no load because it can promote further relaxation of the stress. Even if it is removed, the amount of spring back is small, so that it does not return to the spiral contact 20 close to the original planar shape. Therefore, after removing the protrusion adjusting member 36, a second heat treatment step is performed. In this case, the selectivity for performing the second heat treatment process at which timing can be improved.

  Although the heating temperature of the second heat treatment step needs to be higher than the heating temperature of the first heat treatment step, the actual use of the inspection apparatus 10 shown in FIG. It is more preferable that the temperature is higher than the ambient temperature.

  As described above, the inspection apparatus 10 shown in FIG. 1 is used for a test for confirming the operation of the electronic component 1 such as a semiconductor. The inspection apparatus 10 is heated to a predetermined temperature to perform the test. May do. For example, a burn-in test (such as a test for confirming high-temperature operation) corresponds to this, and the heating temperature is, for example, 125 ° C. and the heating time is 24 hours.

  Under such high temperature heating, if the spiral contact 20 constituting the inspection apparatus 10 is stuck, the test for the electronic component 1 cannot be performed appropriately. For this reason, the spiral contact 20 needs to maintain a predetermined three-dimensional shape without sagging due to the actual use environment temperature of the inspection apparatus 10.

  Therefore, in the present invention, the spiral contact 20 is subjected to the second heat treatment step at a heating temperature higher than the actual use environment temperature of the inspection apparatus 10.

  By this reheating treatment, recrystallization of a metal such as Ni, Au, or Cu or a mixed metal constituting the spiral contact 20 is promoted, and a more thermally stable spiral contact 20 can be formed.

  Specifically, it is preferable that the heating temperature in the second heat treatment step is 170 ° C. to 200 ° C., and the heating time is 20 hours to 200 hours.

  In the present invention, the spiral contact 20 may be three-dimensionally formed by the following method (second manufacturing method).

  That is, after the steps from FIG. 4 to FIG. 7 are performed, the spiral contact 20 is pushed up into a three-dimensional shape from the protrusion adjusting member 36 in the step of FIG. A heat treatment step having a heating temperature higher than the environmental temperature of actual use of the inspection apparatus 10 (hereinafter, this heat treatment will be referred to as “third heat treatment”. , An expression including all of the second and third heat treatments).

  Specifically, it is preferable that the heating temperature of the third heat treatment step is 170 ° C. to 200 ° C., and the heating time is 20 hours to 200 hours.

According to the manufacturing method of the spiral contact 20 described above, it can achieve effective promotion of stress relaxation, especially in an environment temperature of actual use of the inspection apparatus 10, the three-dimensional and low fatigue rate spiral contacts 20 It is possible to mold.

  In the present invention, it is preferable that the spiral contactor 20 is three-dimensionally formed by the protrusion adjusting member 36 shown in FIG. 8 and the protrusion adjusting member 36 is removed after the third heat treatment step is performed. Thereby, the sag ratio of the height dimension of the spiral contactor 20 after the protrusion adjusting member 36 is removed can be more effectively reduced.

  Also in the third heat treatment step, it is preferable to use the protrusion adjusting member 36 having the protrusions having the shapes shown in FIGS. 8 and 10, and the protrusion adjusting member having a plurality of protrusions 36b shown in FIG. According to 36, it is preferable to form a plurality of spiral contacts 20 simultaneously.

  4 to 5, the spiral contact 20 is formed by plating. However, the spiral contact 20 may be formed by a foil body or a laminated structure of a foil body and a plating layer. In the present invention in which the spiral contact 20 is formed by plating or a foil, the spiral contact formed by plating or foil is a very small structure, and therefore only a jig for three-dimensionally forming the spiral contact is used. It is very difficult to adjust the height. Without heat treatment, the spiral contact made of plating or foil is in an amorphous state or a partially crystallized state. Applying the above heat treatment process maintains the spiral contact 20 in a predetermined three-dimensional shape for a long time because the crystal state is likely to change fluidly due to various factors in the environment and plastic deformation is likely to occur. Very effective in terms.

  Further, in the above manufacturing method, the spiral contact 20 is three-dimensionally formed into a mountain shape, but may be three-dimensionally formed into a valley shape.

  13 actually forms the spiral contact 20 shown in FIG. 6 and three-dimensionally forms the spiral contact 20 using the protrusion adjusting member 36 shown in FIG. 8 (step (A)), and the first heat treatment step. After removing the protrusion adjusting member 36 (step (B)), the second heat treatment is not performed and the spiral contactor 20 is placed in an actual use environment (step (C)), or After the heat treatment of step 2 (step (D)), the rate of sag at each step after the second heat treatment and placing the spiral contactor 20 in an actual use environment (step (E)) Asked.

  The specific main conditions and height dimensions at each stage will be described. The height dimension of the spiral contact 20 at the stage (A) when the three-dimensional molding is performed using the protrusion adjusting member 36 shown in FIG. The spiral contactor 20 is subjected to a first heat treatment step at 120 ° C. for 2 hours, and the height dimension of the spiral contactor 20 in the step (B) is set to H6, and the inspection apparatus 10 shown in FIG. The spiral contactor 20 is installed therein, and an LGA or BGA type IC is incorporated in the inspection apparatus 10 and the inspection apparatus 10 is exposed to a burn-in test (high temperature operation confirmation, etc.) environment (heating temperature is At 150 ° C., the heating time was 12 hours), and the height dimension H7 of the spiral contactor 20 after removing the IC was taken as the height dimension in the above step (C).

  On the other hand, after the step (B), the spiral contact 20 is subjected to a second heat treatment step (heating temperature is 200 ° C. and heating time is 96 hours), and the measured height H8 of the spiral contact 20 is measured. And the spiral contact 20 is installed in the inspection apparatus 10 shown in FIG. 1, and an LGA or BGA type IC is incorporated in the inspection apparatus 10, and the inspection apparatus 10 is exposed to the burn-in test environment (heating temperature is 150 ° C. and heating time is 12 hours), and the height dimension H9 of the spiral contact 20 after removing the IC is the height dimension in the above step (E). It was.

  As shown in FIG. 13, the height dimension H6 of the spiral contactor 20 in the stage (B) after the first heat treatment is slightly larger than the height dimension H5 of the spiral contactor 20 in the stage (A). In the stage (C) where the spiral contact 20 is suddenly placed in the burn-in test environment without performing the second heat treatment, the height H7 of the spiral contact 20 is the height in the stage (B). It was found that the thickness was reduced by about 50 to 80% compared to H6.

  On the other hand, after the first heat treatment is performed, the second heat treatment is further performed (step (D)), and then in the step (E) where the spiral contactor is placed in a burn-in test environment, the height of the spiral contactor 20 is increased. It has been found that the ratio of the dimension H9 can be reduced to about 20% or less as compared with the height dimension H8 in the step (D).

  In FIG. 14, the first heat treatment process (at 120 ° C.) is performed on the spiral contact 20 in the same process order as the stage (A) → the stage (B) → the stage (D) → the stage (E) described in FIG. 13. 2 hours) → After the second heat treatment step (96 hours at 200 ° C.), the sample was left in a burn-in test environment (12 hours at 150 ° C.) while changing the stress applied to the spiral contact 20. The sag rate of the spiral contact 20 after removing the stress (relative to the height of the spiral contact 20 after the second heat treatment step) was measured.

  On the other hand, in FIG. 15, the first heat treatment process (at 120 ° C. for 2 hours) is performed on the spiral contact 20 in the same process order as the stage (A) → the stage (B) → the stage (C) described in FIG. 13. After being applied, the stress applied to the spiral contact 20 is left in a burn-in test environment (12 hours at 150 ° C.) while changing the stress, and the sag rate of the spiral contact 20 after removing the stress ( (With respect to the height of the spiral contact 20 after the first heat treatment step) was measured.

  As shown in FIGS. 14 and 15, both the experimental results of FIG. 14 with the second heat treatment and the experimental results of FIG. 15 without the second heat treatment increase the stress of the spiral contactor 20 as the stress increases. Although the sag rate also increases, in FIG. 14, even if the stress is increased to about 500 (MPa), the sag rate of the spiral contact 20 is 20% or less, whereas in FIG. When the pressure is 200 (MPa) or more, the sag rate of the spiral contact 20 exceeds 20%, and when the stress is further increased to about 700 (MPa), the sag rate of the spiral contact 20 is increased to about 80%. I understood that.

  From the experimental results shown in FIG. 13 to FIG. 15, after the first heat treatment step is performed on the spiral contact 20, the heating temperature is higher than that of the first heat treatment step, and the heating time is preferably long. It has been found that applying the second heat treatment step at a heating temperature higher than the environmental temperature of actual use can reduce the settling rate of the spiral contact 20 and can effectively maintain a predetermined three-dimensional shape.

The perspective view which shows the test | inspection apparatus used for the test for confirming operation | movement of an electronic component, 1 is a cross-sectional view taken along line 2-2 of FIG. An enlarged perspective view showing the shape of the spiral contact in the present invention, 1 process figure which shows the manufacturing method of the spiral contactor in this invention, FIG. 4 is a process diagram performed next to FIG. Top view of spiral contact, FIG. 6 is a process diagram performed next to FIG. FIG. 7 is a process diagram to be performed next to FIG. 8 is a process diagram performed next to FIG. Sectional drawing of the protrusion part which comprises the protrusion adjustment member of this invention, A cross-sectional view of an undesirable protrusion, The perspective view of the protrusion adjustment member of the present invention, A graph showing the height of the spiral contact and its change in each of the stages (A) to (E); After performing the first heat treatment and the second heat treatment step, various stresses are applied to the spiral contact in the burn-in test, and the magnitude of the stress and the sag rate of the spiral contact after the stress is removed. A graph showing the relationship, Without performing the second heat treatment step, after the first heat treatment, various stresses are applied to the spiral contact in the burn-in test, the magnitude of the stress, and the sag rate of the spiral contact after the stress is removed. A graph showing the relationship between Plan view of a conventional spiral contact, One process diagram for explaining a conventional method of three-dimensional forming of a spiral contact, FIG. 16 is a process diagram performed next to FIG. FIG. 18 is a process diagram performed next to FIG.

Explanation of symbols

1 Electronic component 1a Spherical contact (external connection)
DESCRIPTION OF SYMBOLS 10 Inspection apparatus 11 Base 20 Spiral contact 20a Contact piece 21 Base 22 Winding start end 23 Winding end 30 Substrate 31 Resist layer 31a Pattern 32 Joining member 36 Projection adjustment members 36b, 40, 41 Projection

Claims (9)

A connecting device having a base and a plurality of spiral-shaped elastic contacts provided on the base, wherein a plurality of external connection portions provided on the electronic component respectively contact the spiral-shaped elastic contacts; In the manufacturing method,
The base, the elastic contact, and the base of the spiral elastic contact in a planar shape are joined to the base and the tip of the elastic contact is opposed to a through hole formed in the base. Forming a stacked structure, and
A jig is passed through the through hole of the base from the side opposite to where the elastic contact is provided to press the elastic contact, and the tip of the elastic contact is separated from the base. A step of forming a three-dimensional shape;
And a step of performing heat treatment to relieve the stress of the elastic contacts of the three-dimensional shape by heating the resilient contacts while maintaining the press by pre Kichi tool,
When the jig is removed after the heat treatment, the elastic contactor maintains its three-dimensional shape with its tip portion separated from the base by a predetermined height and is elastically deformable. Manufacturing method.   2. The connection device according to claim 1, wherein the jig is provided with a protruding portion whose width gradually increases from the front end side toward the rear end side, and the elastic contactor is pressed by the front end portion of the jig. Production method.   The method of manufacturing a connection device according to claim 1, wherein the tip portion of the spiral-shaped elastic contact is pressed by the jig.   The method for manufacturing a connection device according to claim 1, wherein the heat treatment step is performed at 100 ° C. to 200 ° C. and for a heating time of 30 minutes to 12 hours.   5. The method for manufacturing a connection device according to claim 1, wherein after the heat treatment, a second heat treatment step is performed at a higher heating temperature and a longer heating time than the heat treatment.   The method of manufacturing a connection device according to claim 5, wherein the second heat treatment step is performed after the jig is removed from the back side of the base.   The method for manufacturing a connection device according to claim 6, wherein the second heat treatment step is performed at 170 ° C. to 200 ° C. and for a heating time of 20 hours to 200 hours.   The manufacturing method of the connection apparatus in any one of Claim 1 thru | or 7 which presses each some elastic contactor to a solid | 3D shape simultaneously using the said jig | tool.   9. The method of manufacturing a connection device according to claim 1, wherein the elastic contact is formed by a foil body or plating, or a laminated structure of a foil body and a plating layer.

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