JPH02132418A - Production of flexible wiring board having bent part - Google Patents
Production of flexible wiring board having bent partInfo
- Publication number
- JPH02132418A JPH02132418A JP2960189A JP2960189A JPH02132418A JP H02132418 A JPH02132418 A JP H02132418A JP 2960189 A JP2960189 A JP 2960189A JP 2960189 A JP2960189 A JP 2960189A JP H02132418 A JPH02132418 A JP H02132418A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible wiring
- resin
- bent
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 229920005989 resin Polymers 0.000 claims abstract description 55
- 239000011347 resin Substances 0.000 claims abstract description 55
- 238000005452 bending Methods 0.000 claims abstract description 18
- 230000001681 protective effect Effects 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 8
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 21
- 210000002858 crystal cell Anatomy 0.000 abstract description 14
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 229920001721 polyimide Polymers 0.000 abstract description 4
- 229920002050 silicone resin Polymers 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 230000000284 resting effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 230000006866 deterioration Effects 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 210000004027 cell Anatomy 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Liquid Crystal (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、電子部品あるいは電子回路部品を搭載した電
子回路基板間の接続に用いられるフレキシブル配線基板
、特にこのフレキシブル配線基板に折り曲げ部を有する
フレキシブル配線基板の製造方法造に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a flexible wiring board used for connection between electronic components or electronic circuit boards on which electronic circuit components are mounted, and particularly to this flexible wiring board. The present invention relates to a method for manufacturing a flexible wiring board having a bent portion.
（従来の技術）
電子部品あるいは電子回路部品を搭載した電子回路基板
間の結線は、一般に個別のリード線を用いて行なわれる
が、接続すべき電極端子の数が多数ある場合には、個別
リード線を多数用いるのに変えて、多数のリード棒をフ
レキシブル絶縁基板上に形成したフレキシブル配線基板
が一般に用いられている。(Prior art) Wiring between electronic components or electronic circuit boards on which electronic circuit components are mounted is generally done using individual lead wires, but when there are a large number of electrode terminals to be connected, individual lead wires are used. Instead of using a large number of wires, a flexible wiring board in which a large number of lead rods are formed on a flexible insulating board is generally used.
例えば、液晶やエレクトロルミネッセンス等を利用した
Ｘ−Ｙマトリックス型表示素子の電極端子と駆動用電子
回路基板とを接続するには、このようなフレキシブル配
線基板が利用される。For example, such a flexible wiring board is used to connect electrode terminals of an XY matrix type display element using liquid crystal, electroluminescence, etc. and a driving electronic circuit board.
小形液晶テレビなどでは、装置のより小形化のため、例
えば第４図に示すように、液晶セル２０の裏面側に駆動
用電子回路基板２２を配置し、液晶セル２０と駆動用電
子回路基板２２とを、湾曲させた状態のフレキシブル配
線基板２４で接続している。マトリクス型液晶パネルで
は電極端子が高密度に形成されているので、フレキシブ
ル配線基板は熱収縮が少ないこと、また取扱いが容易な
ことを考慮すると、ある程度の厚さが必要となり、接続
した状態では必然的に湾曲状態となる。このような場合
、フレキシブル配線基板の弾性反発力により、フレキシ
ブル配線基板と、液晶セルおよび駆動用電子回路基板と
の接続状態が劣化するのを防止するためには、湾曲の曲
率を大きく、また液晶セルと駆動用電子回路基板との間
隔を大きくする必要があり、液晶セルまたは駆動用電子
回路基板から外方に突出する長さが長くなり、小形化φ
薄形化が妨げられる。また、フレキシブル配線基板の弾
性反発力により接続状態が劣化するのを防止するために
、第２図に示すように、フレキシブル配線基板２４の湾
曲状態を保持するホルダ２６を設けることが実開昭６２
−１２３６８８号公報で提案されている。In order to make the device more compact, such as a small liquid crystal television, for example, as shown in FIG. are connected by a flexible wiring board 24 in a curved state. In a matrix type liquid crystal panel, the electrode terminals are formed in a high density, so considering that the flexible wiring board has little heat shrinkage and is easy to handle, it needs to be thick to a certain extent, and when connected, it is necessary to It is in a curved state. In such cases, in order to prevent the connection between the flexible wiring board and the liquid crystal cell and driving electronic circuit board from deteriorating due to the elastic repulsive force of the flexible wiring board, it is necessary to increase the curvature of the curve and It is necessary to increase the distance between the cell and the driving electronic circuit board, and the length that protrudes outward from the liquid crystal cell or the driving electronic circuit board becomes longer, which reduces the size of the φ
This prevents thinning. In addition, in order to prevent the connection state from deteriorating due to the elastic repulsion force of the flexible wiring board, it is recommended to provide a holder 26 to maintain the curved state of the flexible wiring board 24, as shown in FIG. 2.
This is proposed in the publication No.-123688.
（発明が解決しようとする課題）
しかしながら、上記のものでは、薄形化が充分ではなく
、またホルダーが別途必要であるととも、フレキシブル
配線基板を湾曲状態とするため、液晶セルまたは駆動用
電子回路基板から外方に突出する長さが長くなり、充分
な小形化ができないという問題がある。(Problems to be Solved by the Invention) However, with the above-described method, the thickness is not sufficiently reduced, a separate holder is required, and since the flexible wiring board is in a curved state, the liquid crystal cell or driving electronic There is a problem in that the length protruding outward from the circuit board becomes long, making it impossible to achieve sufficient miniaturization.
これに対して、フレキシブル配線基板に切り欠き部を形
成し、ここで折り曲げることにより弾性反発力を弱め、
湾曲部、ホルダーを不要にして、弾性による接続状態の
劣化を防止するとともに小形化、薄形化を実現すること
が考えられる。例えば、小形液晶テレビなどでは、装置
のより小形化のため、液晶セルの裏面側に駆動用電子回
路基板を配置し、液晶セルと駆動用電子回路基板とを、
駆動用ＩＣをフレキシブルなテープキャリアに搭載した
ＴＡＢ（Ｔａｐｅ ＡｕｔｏｍａｔｅｄＢｏｎｄｉｎ
ｇ）型ＩＣを介して接続するのが一般的になってきてい
る。On the other hand, by forming a notch in the flexible wiring board and bending it there, the elastic repulsion force is weakened.
It is conceivable to eliminate the need for a curved portion and a holder, thereby preventing deterioration of the connection state due to elasticity, and realizing miniaturization and thinning. For example, in small LCD televisions, in order to make the device more compact, a driving electronic circuit board is placed on the back side of the liquid crystal cell, and the driving electronic circuit board is connected to the liquid crystal cell.
TAB (Tape Automated Bondin) has a drive IC mounted on a flexible tape carrier.
g) It is becoming common to connect via type IC.
しかし、フレキシブル配線基板を折り曲げたものでは、
折り曲げ部では、フレキシブル絶縁基板が除去されてお
り、配線は裸の状態にあり、短絡または断線の危険性が
ある。However, with bent flexible wiring boards,
At the bend, the flexible insulating substrate has been removed, leaving the wiring bare and at risk of shorting or disconnection.
この発明は、上述の問題点に鑑みてなされたもので、切
り欠き部を設け、この切り欠き部で折り曲げた折り曲げ
部を有するフレキシブル配線基板の製造方法において、
確実な接続を高信頼性のもとに行なえる折り曲げ部を有
するフレキシブル配線基板の製造方法を提供することを
目的とする。The present invention has been made in view of the above-mentioned problems, and includes a method for manufacturing a flexible wiring board having a notch portion and a bent portion bent at the notch portion.
It is an object of the present invention to provide a method for manufacturing a flexible wiring board having a bent portion that allows reliable connection with high reliability.
［発明の構成］
（課題を解決するための手段）
この発明は、フレキシブル絶縁基板上に複数の導体パタ
ーンが形成され、またこれら導体パターンと交叉する方
向の切り欠き部がフレキシブル絶縁基板に形成されてな
り、この切り欠き部で前記フレキシブル絶縁基板を折り
曲げてなる折り曲げ部を有するフレキシブル配線基板の
製造方法において、フレキシブル絶縁基板を折り曲げる
前に、切り欠き部から露出する導体パターンに予め保護
用樹脂を塗布し、この後折り曲げることを特徴とする折
り曲げ部を有するフレキシブル配線基板の製造方法であ
る。[Structure of the Invention] (Means for Solving the Problems) The present invention is characterized in that a plurality of conductor patterns are formed on a flexible insulating substrate, and a cutout portion in a direction intersecting with these conductor patterns is formed in the flexible insulating substrate. In the method for manufacturing a flexible wiring board having a bent portion formed by bending the flexible insulating substrate at the notch, a protective resin is applied in advance to the conductor pattern exposed from the notch before bending the flexible insulating substrate. This is a method for manufacturing a flexible wiring board having a folded portion, which is characterized by coating and then bending.
（作 用）
フレキシブル配線基板を折り曲げる前に、切り欠き部か
ら露出する導体パターンに予め保護用樹脂を塗布するこ
とにより、配線の短絡または断線を防ぎ、高密度、高信
頼性の折り曲げ部を有するフレキシブル配線基板を効率
よく胃ることかできる。(Function) Before bending the flexible wiring board, a protective resin is applied to the conductor pattern exposed from the notch to prevent short circuits or disconnections of the wiring, resulting in a high-density, highly reliable bent part. Flexible wiring boards can be processed efficiently.
（実施例１）
この実施例は、液晶表示装置に本発明を適用したもので
、フレキシブル配線基板として駆動用集積回路素子を実
装したテープキャリアを利用し、このテープキャリアを
介して液晶表示パネルと、コントロール回路を形成した
回路基板とを接続したものである。(Example 1) In this example, the present invention is applied to a liquid crystal display device, and a tape carrier on which a driving integrated circuit element is mounted is used as a flexible wiring board, and a liquid crystal display panel is connected via this tape carrier. , and a circuit board on which a control circuit is formed.
第１図は本発明の折り曲げ部を有するフレキシブル配線
基板の製造工程を示す図である。FIG. 1 is a diagram showing the manufacturing process of a flexible wiring board having a bent portion according to the present invention.
第１図ａに示すように、フレキシブル配線基板（テープ
キャリア）は、フレキシブル絶縁基板１例えばポリイミ
ド・フィルムからなり、中央部には、開口１ａが、また
図の右方には、切り欠き部ｌｂ，Ｉｃが形成されている
。フレキシブル絶縁基板１の表面には多数の導体パター
ンリード２が形成され、リード２は開口１ａでは一端が
突出し、また切り欠き部１ｂ，ｌｃではこれを跨いでい
る。As shown in FIG. 1a, the flexible wiring board (tape carrier) consists of a flexible insulating board 1 made of, for example, a polyimide film, and has an opening 1a in the center and a notch lb on the right side of the figure. , Ic are formed. A large number of conductive pattern leads 2 are formed on the surface of the flexible insulating substrate 1, and one end of the leads 2 protrudes from the opening 1a and straddles them at the notches 1b and lc.
なお、開口１ａは駆動用集積回路素子（ＩＣチップ）と
の接続のために、また切り欠き部１ｂ，１ｃはフレキシ
ブル配線基板の折り曲げのために設けられる。Note that the opening 1a is provided for connection with a driving integrated circuit element (IC chip), and the notches 1b and 1c are provided for bending the flexible wiring board.
開口１ａから突出する多数のリード２の先端はＩＣチッ
プ３に設けられたバンプ４と接続される。The tips of the many leads 2 protruding from the opening 1a are connected to bumps 4 provided on the IC chip 3.
そして、リード２とＩＣチップ３との接続部は、保護の
ために、エポキシ樹脂５で封止される。なお、このフレ
キシブル配線基板１は、長尺フィルムの状態でＩＣチッ
プ３が接続され、この後所望の大きさにカッティングさ
れる。図では、カッティングされた状態のものを示して
いる。The connection portion between the lead 2 and the IC chip 3 is sealed with an epoxy resin 5 for protection. Note that the flexible wiring board 1 is connected to the IC chip 3 in the form of a long film, and is then cut into a desired size. The figure shows the product in a cut state.
次に、第１図ｂに示すように、折り曲げ予定部である切
り欠き部１ｂ，ｌｃを設けた部分から露出するリード２
の両面に、刷毛などを用いてシリコーンレジン等の保護
用樹脂７を塗布して、一昼夜常温放置して硬化させる。Next, as shown in FIG. 1b, the leads 2 are exposed from the portions where the notches 1b and lc are provided, which are the portions to be bent.
A protective resin 7 such as silicone resin is applied to both sides of the protective resin 7 using a brush or the like, and the protective resin 7 is left at room temperature overnight to harden.
なお、保護用樹脂７はリード２上のみならず、リード２
間にも形成する。この実施例では、保護用樹脂７として
信越化学製のシリコーンレジンであるＫＪＲ−４０１０
（室温硬化型）を使用した。なお、塗布する保護用樹
脂としてはシリコーンレジンに限らず、塩化ビニール系
の樹脂（例えば住友化学製：ＳＵλ＋ＩＫＡＰＬＥＸ）
、ゴム系の樹脂を溶剤に溶かした回路保護用樹脂や、
フィルム状の保護シートなども用いることができる。ま
た、硬化後においてフレキシブル絶縁基板１よりも曲げ
強さが低いことが望ましい。更に、保護用樹脂の塗布は
刷毛による塗布以外に、ロボットを応用して動かすディ
スペンサを用いた自動塗布法などが考えられる。Note that the protective resin 7 is applied not only on the lead 2 but also on the lead 2.
It also forms in between. In this example, the protective resin 7 is KJR-4010, which is a silicone resin manufactured by Shin-Etsu Chemical.
(room temperature curing type) was used. The protective resin to be applied is not limited to silicone resin, but also vinyl chloride resin (for example, SUλ+IKAPLEX manufactured by Sumitomo Chemical).
, circuit protection resin made by dissolving rubber-based resin in a solvent,
A film-like protective sheet can also be used. Further, it is desirable that the bending strength is lower than that of the flexible insulating substrate 1 after curing. Furthermore, in addition to applying the protective resin with a brush, an automatic application method using a dispenser operated by a robot can be considered.
この後、第１図Ｃに示すように、図の右方のリード２を
異方性導電フィルム８を用いて、液晶セル９と電極端子
と接続する。Thereafter, as shown in FIG. 1C, the lead 2 on the right side of the figure is connected to the liquid crystal cell 9 and the electrode terminal using the anisotropic conductive film 8.
次に、第１図ｄに示すように、ＩＣチップ側を上方に持
上げフレキシブル配線基板を切り欠き部ｌｂ，ｌｃを形
成した部分で逆コ字状に折り曲げる。そして、更に液晶
セル９の上方に配置されたチップ部品、ＩＣチップ等を
搭載したコントロール回路を形成した回路基板１０の電
極端子と、他方のリード２を半田１１により接続する。Next, as shown in FIG. 1d, the IC chip side is lifted upward and the flexible wiring board is bent into an inverted U-shape at the portions where the notches lb and lc are formed. Then, the other lead 2 is connected by solder 11 to an electrode terminal of a circuit board 10 on which a control circuit mounted with chip components, IC chips, etc. arranged above the liquid crystal cell 9 is formed.
以上のようにして、岐晶表示装置が完成される。In the manner described above, the crystal display device is completed.
この発明によれば、フレキシブル配線基板は折り曲げ部
に切り欠き部を形成しているので、従来技術のように湾
曲部が不要で小形に形成できる。According to this invention, since the flexible wiring board has a notch formed in the bent part, a curved part is not required as in the prior art, and the flexible wiring board can be formed in a small size.
特に、フレキシブル配線基板がＩＣチップを実装したテ
ープキャリアである場合には、ＩＣチップの電極端子の
ピッチがより高密度となり、フレキシブル配線基板は熱
収縮が少なく、剛性の高いフレキシブル絶縁基板が用い
られるので、折り曲げ部に切り欠き部を形成することは
、湾曲部を不要にし小形化する上でより好ましい。In particular, when the flexible wiring board is a tape carrier on which an IC chip is mounted, the pitch of the electrode terminals of the IC chip becomes denser, and the flexible wiring board has less heat shrinkage and is a highly rigid flexible insulating board. Therefore, it is more preferable to form a notch in the bent portion in order to eliminate the need for a curved portion and to downsize the device.
そして、折り曲げ部分の配線を樹脂で保護しているので
リードの短絡、断線を防ぎ、信頼性を高くでき、また折
り曲げる前に樹脂を塗布しているので自動化が容易であ
り、高い作業性が得られる。In addition, since the wires at the bent portion are protected with resin, short circuits and disconnections of the leads are prevented, increasing reliability.Also, since resin is applied before bending, automation is easy and high workability is achieved. It will be done.
なお、フレキシブル配線基板を折り曲げ後、保護用樹脂
を塗布することも考えられるが、フレキシブル配線基板
を折り曲げて他の回路基板などの電極端子と接続し、モ
ジュールとして組み込んだ後に保護用樹脂を塗布するこ
とは作業性が悪く、また歩留まりを下げることになり、
好ましくはない。It is also possible to apply a protective resin after bending the flexible wiring board, but it is also possible to apply the protective resin after bending the flexible wiring board, connecting it to the electrode terminals of other circuit boards, etc., and incorporating it as a module. This results in poor workability and lower yield.
Not preferable.
なお、信頼性試験例えば高温高湿保存試験（７０℃、９
０％、１０００時間）で折り曲げ部の樹脂膜の劣化、樹
脂膜およびリードのクラック、破断等は全く発生しなか
った。In addition, reliability tests such as high-temperature and high-humidity storage tests (70°C, 9
(0%, 1000 hours), there was no deterioration of the resin film at the bent portion, no cracks or breakage of the resin film or leads, etc.
また、この実施例では硬化時の熱による液晶セルの劣化
を考慮し、テープキャリアのみの状態で樹脂を塗布・硬
化させたが、本発明ではフレキシブル配線基板と他の回
路基板などの電極端子と接続した後に、保護用樹脂を塗
布し、この後折り曲げても良い。なお、テープキャリア
のみの状態で樹脂を塗布・硬化させる場合は、保護用樹
脂として熱硬化タイプの樹脂を利用でき、樹脂の選択範
囲が拡がるという利点がある。In addition, in this example, the resin was applied and cured with only the tape carrier in consideration of the deterioration of the liquid crystal cell due to heat during curing, but in the present invention, the resin was applied and cured with only the tape carrier, but in the present invention, the resin was applied with the tape carrier only and the electrode terminals of other circuit boards, etc. After connection, a protective resin may be applied and then bent. Note that when applying and curing the resin with only the tape carrier, a thermosetting resin can be used as the protective resin, which has the advantage of expanding the range of resin selections.
（実施例２）
実施例１はフレキシブル配線基板として半導体素子を具
備するテープキャリアについて説明したが、従来例に示
したような半導体素子を具備しないものにも適用できる
。以下、この実施例について図を参照して説明する。(Example 2) Although Example 1 describes a tape carrier equipped with a semiconductor element as a flexible wiring board, it can also be applied to a tape carrier not equipped with a semiconductor element as shown in the conventional example. This embodiment will be described below with reference to the drawings.
第２図はこの実施例を示す図である。FIG. 2 is a diagram showing this embodiment.
フレキシブル配線基板は長尺フィルムの状態で、フレキ
シブルな絶縁基板１例えばカプトン（商品名）と称する
ポリイミド・フィルムからなり、切り欠き部１ｂ，ｌｃ
が形成されている。フレキシブル絶縁基板１の表面には
多数の導体パターンリード２が形成され、切り欠き部１
ｂ，ｌｃではこれを跨いでいる。切り欠き部１ｂ，ｌｃ
はテープキャリアの折り曲げのために設けられる。フレ
キシブルな絶縁基板１上には同一のパターンが同一の間
隔で繰返し形成されている。切り欠き部１ｂ，ＩＣから
露出するリード２の表面に、ディスペンサーを用いて保
護樹脂（図示せず）、例えば塩化ビニール系の樹脂を塗
布して、１時間程度放置して硬化させる。この実施例で
は保護用樹脂として住友化学製ＳＵＭＩＫＡＦＬＥＸを
使用した。この保護用樹脂としては、硬化後において、
絶縁基板１よりも硬度が低いことが望ましい。即ち、本
実施例ではカプトンの曲げ強さ１７．［ｉｋｇ／ ｍｍ
２より低い値を示すものである必要がある。The flexible wiring board is in the form of a long film, and is made of a flexible insulating board 1, for example, a polyimide film called Kapton (trade name), with cutout portions 1b, lc.
is formed. A large number of conductor pattern leads 2 are formed on the surface of the flexible insulating substrate 1, and a cutout portion 1
b and lc straddle this. Notch portion 1b, lc
is provided for bending the tape carrier. The same pattern is repeatedly formed on the flexible insulating substrate 1 at the same intervals. A protective resin (not shown), for example, a vinyl chloride resin, is applied using a dispenser to the notch portion 1b and the surface of the lead 2 exposed from the IC, and is left for about one hour to harden. In this example, SUMIKAFLEX manufactured by Sumitomo Chemical was used as the protective resin. As this protective resin, after curing,
It is desirable that the hardness is lower than that of the insulating substrate 1. That is, in this example, the Kapton bending strength is 17. [ikg/mm
It must have a value lower than 2.
このようにして作製したフレキシブル配線基板は、所望
する形状に切断して、電子部品あるいは電子回路部品を
搭載した電子回路基板間の結線に用い、切り欠き部１ｂ
，ｌｃで第１図ｄに示すと同様にして、折り曲げて用い
られる。The flexible wiring board thus produced is cut into a desired shape and used for connection between electronic components or electronic circuit boards on which electronic circuit components are mounted.
, lc are used by being folded in the same manner as shown in FIG. 1d.
（実施例３）
第３図は本発明の他の実施例のフレキシブル配線基板の
作製工程を示す図である。この実施例は、実施例１と同
様に液晶表示装置に本発明を適用したもので、フレキシ
ブル配線基板としてドライバーＩＣを実装したテープキ
ャリアを利用し、このテープキャリアを介して液晶パネ
ルと、コントロルＩＣ，チップ部品などを搭載した回路
基板とを接続するものである。(Example 3) FIG. 3 is a diagram showing the manufacturing process of a flexible wiring board according to another example of the present invention. In this embodiment, the present invention is applied to a liquid crystal display device as in the first embodiment, and a tape carrier on which a driver IC is mounted is used as a flexible wiring board, and a liquid crystal panel and a control IC are connected via this tape carrier. , and a circuit board on which chip components and the like are mounted.
第３図ａに示すように、テープキャリアは長尺フィルム
の状態で、フレキシブルな絶縁基板１例えばポリイミド
・フィルムからなり、開口部ｌａｓ切り欠き部１ｂ，ｌ
ｃが形成されている。リード２は開口部１ａでは一端が
突出している。開口部１ａはドライバーＩＣとの接続の
ために設けられている。また本実施例のテープキャリア
においても実施例２と同様に、同一のパターンが同一の
間隔で繰返し形成されている。なお、図中１ｄはスプロ
ケット・ホールである。As shown in FIG. 3a, the tape carrier is a long film made of a flexible insulating substrate 1, for example, a polyimide film, and has openings las and cutouts 1b, l.
c is formed. One end of the lead 2 protrudes from the opening 1a. The opening 1a is provided for connection with a driver IC. Also, in the tape carrier of this embodiment, the same pattern is repeatedly formed at the same interval, similarly to the second embodiment. Note that 1d in the figure is a sprocket hole.
第３図ｂに示すように、開口部１ａから突出する多数の
リード２の先端はＩＣチップ３に設けられたＡｕバンプ
４と一括接続される。なおこのテプキャリアは長尺フィ
ルムの状態でＩＣチップ３が接続される。As shown in FIG. 3b, the tips of a large number of leads 2 protruding from the opening 1a are collectively connected to Au bumps 4 provided on the IC chip 3. As shown in FIG. Note that the IC chip 3 is connected to this tape carrier in the form of a long film.
そして第３図Ｃに示すように、リード２とＩＣチップ３
との接続部は、保護のためにエポキシ樹脂を塗布して封
止される。この後、図には示さないが、オーブンなどで
加熱処理を行い、エポキシ樹脂の硬化を行う。Then, as shown in FIG. 3C, the lead 2 and the IC chip 3
For protection, the connection area is sealed with epoxy resin. Thereafter, although not shown in the figure, heat treatment is performed in an oven or the like to harden the epoxy resin.
封止樹脂塗布装置を用いて、第３図ｄに示すように、リ
ード２とＩＣチップ３との接続部を樹脂封止されたテー
プキャリアの折り曲げ予定部である切り欠き部１ｂ、Ｉ
Ｃを設けた部分から露出するリード２の表面に、ディス
ペンサーを用いて塩化ビニール系の保護樹脂７を塗布し
て、１時間程度放置して硬化させる。保護用樹脂７が硬
化したら、液晶セルまたは駆動用電子回路に接続する前
に所望の形状にカッティングまたは打ち抜かれる。Using a sealing resin applicator, as shown in FIG. 3d, the connecting portions between the leads 2 and the IC chip 3 are coated with notches 1b and I, which are the portions of the resin-sealed tape carrier that are to be bent.
Using a dispenser, a vinyl chloride-based protective resin 7 is applied to the surface of the lead 2 exposed from the portion where C is provided, and left to harden for about one hour. Once the protective resin 7 has hardened, it is cut or punched into the desired shape before being connected to the liquid crystal cell or drive electronics.
次に、第３図ｅに示すように、打ち抜かれたテープ・キ
ャリア１を異方性導電フィルム８を用いて液晶セル９に
接続する。さらに第３図ｆに示すように、テープキャリ
ア１を折り曲げて、チップ部品などを搭載した回路基板
１０と、リード２を半田接続し、半導体素子のセルへの
接続を終了する。Next, as shown in FIG. 3e, the punched tape carrier 1 is connected to a liquid crystal cell 9 using an anisotropic conductive film 8. Further, as shown in FIG. 3f, the tape carrier 1 is bent and the circuit board 10 on which chip components and the like are mounted are connected to the leads 2 by solder, thereby completing the connection of the semiconductor element to the cell.
また、この実施例ではテープキャリアをリールで扱える
状態で樹脂を折り曲げ部分に塗布するため、保護用樹脂
の塗布において複雑な装置なしで自動化が容易であり、
作業性も高い。またテープキャリアが液晶セルに接続さ
れた状態では、液晶セルが劣化するため加熱することが
できないが、テープキャリアのみの状態で樹脂を塗布す
るので、保護用樹脂として熱硬化タイプの樹脂も使用す
ることができ、保護用樹脂を選ばない。In addition, in this embodiment, since the resin is applied to the bent portion while the tape carrier can be handled with a reel, it is easy to automate the application of the protective resin without the need for complicated equipment.
Workability is also high. In addition, when the tape carrier is connected to the liquid crystal cell, it cannot be heated because the liquid crystal cell will deteriorate, but since the resin is applied only to the tape carrier, a thermosetting resin is also used as a protective resin. It can be used with any protective resin.
さらにこの実施例では、リードとＩＣチップの接続部の
樹脂封止の後に保護用樹脂を塗布したが、本発明はこれ
に限定されない。即ち、接続部の封止樹脂の硬化工程に
よって損なわれない保護用樹脂を選べば、接続部の樹脂
封止工程前、もしくは接続部の樹脂封止工程中に保護用
樹脂を塗布することは、本発明の主旨をなんら損なうも
のではない。Further, in this embodiment, the protective resin was applied after the connection portion between the lead and the IC chip was sealed with the resin, but the present invention is not limited thereto. In other words, if you choose a protective resin that will not be damaged by the curing process of the sealing resin for the connection part, it is possible to apply the protective resin before or during the resin sealing process for the connection part. This does not in any way detract from the gist of the present invention.
なお信頼性試験例えば高温高湿保存試験（７０℃、９０
％、１０００時間）で折り曲げ部の樹脂膜の劣化、樹脂
膜及びリードのクラック、破断等は全く発生しなかった
。In addition, reliability tests such as high temperature and high humidity storage tests (70°C, 90°C
%, 1000 hours), there was no deterioration of the resin film at the bent portion, no cracks or breakage of the resin film or leads, etc.
［発明の効果］
本発明の折り曲げ部を有するフレキシブル配線基板の製
造方法では、折り曲げ部分に切り欠き部を有するフレキ
シブル配線基板を折り曲げる前に、切り欠き部に折り曲
げる前に予め保護用樹脂を塗布することにより、切り欠
き部での配線の短絡または断線を防ぎ、高密度、高信頼
性の折り曲げ部を有するフレキシブル配線基板を得るこ
とができる。また、樹脂の塗布後に折り曲げるので作業
性も良い。[Effects of the Invention] In the method for manufacturing a flexible wiring board having a bent portion of the present invention, before bending a flexible wiring board having a notch in the bent portion, a protective resin is applied in advance to the notch. By doing so, it is possible to prevent short-circuiting or disconnection of the wiring at the cutout portion, and to obtain a flexible wiring board having a bent portion with high density and high reliability. In addition, since it is bent after applying the resin, it is easy to work with.
また、フレキシブル配線基板を必要な形状に打ち抜く前
に保護用樹脂を塗布すれば、フレキシブル配線基板がガ
イド用のホールのある状態で保護用樹脂を塗布すること
ができるため、保護用樹脂の塗布用に高度な位置合せや
、複雑な動きのできる装置を必要とせず、作業性もよい
。Additionally, if you apply the protective resin before punching out the flexible wiring board into the required shape, you can apply the protective resin while the flexible wiring board has guide holes. It does not require sophisticated positioning or equipment capable of complex movements, and is easy to work with.
第１図は本発明の一実施例の折り曲げ部を有するフレキ
シブル回路基板の製造方法を示す工程図、第２図は他の
実施例のフレキシブル配線基板を示す図、第３図は更に
他の実施例のフレキシブル配線基板の製造方法を示す工
程図、第４図はこの発明によらないフレキシブル配線基
板を利用した従来例を示す図である。
１・・・可撓性の絶縁基板、 １ａ・・・開口、１ｂ
％ＩＣ・・・切り欠き部、
１ｄ・・・スプロケット・ホール、
２・・・リード、
３・・・駆動用集積回路素子（ＩＣチップ）、４・・・
バンプ、 ５・・・エポキシ樹脂、７・・・
保護用樹脂、８・・・異方性導電フィルム、９・・・液
晶セル、
１０・・・コントロール回路基板、
１１・・・半田。
代理人 弁理士 則 近 憲 佑
同 竹 花 喜久男
へ
ヘFIG. 1 is a process diagram showing a method for manufacturing a flexible circuit board having a folded portion according to one embodiment of the present invention, FIG. 2 is a diagram showing a flexible wiring board according to another embodiment, and FIG. 3 is a diagram showing still another embodiment. FIG. 4 is a process diagram showing a method of manufacturing an example flexible wiring board, and is a diagram showing a conventional example using a flexible wiring board not according to the present invention. 1... Flexible insulating substrate, 1a... Opening, 1b
%IC...notch, 1d...sprocket hole, 2...lead, 3...driving integrated circuit element (IC chip), 4...
bump, 5... epoxy resin, 7...
Protective resin, 8... Anisotropic conductive film, 9... Liquid crystal cell, 10... Control circuit board, 11... Solder. Agent Patent Attorney Nori Chika Yudo Kikuo Takehana Hehe
Claims (1)
され、またこれら導体パターンと交叉する方向の切り欠
き部が前記フレキシブル絶縁基板に形成されてなり、こ
の切り欠き部で前記フレキシブル絶縁基板を折り曲げて
なる折り曲げ部を有するフレキシブル配線基板の製造方
法において、前記フレキシブル絶縁基板を折り曲げる前
に、前記切り欠き部から露出する前記導体パターンに予
め保護用樹脂を塗布し、この後折り曲げることを特徴と
する折り曲げ部を有するフレキシブル配線基板の製造方
法。A plurality of conductor patterns are formed on a flexible insulating substrate, and a notch in a direction intersecting with these conductor patterns is formed in the flexible insulating substrate, and the flexible insulating substrate is bent at the notch. In the method for manufacturing a flexible wiring board having a bending part, the bending part is characterized in that, before bending the flexible insulating board, a protective resin is applied in advance to the conductor pattern exposed from the cutout part, and then the bending part is bent. A method for manufacturing a flexible wiring board comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1029601A JPH07122713B2 (en) | 1988-07-11 | 1989-02-10 | Flexible wiring board, manufacturing method thereof, and electronic component |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17101188 | 1988-07-11 | ||
| JP63-171011 | 1988-07-11 | ||
| JP1029601A JPH07122713B2 (en) | 1988-07-11 | 1989-02-10 | Flexible wiring board, manufacturing method thereof, and electronic component |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35258196A Division JP3073701B2 (en) | 1996-12-16 | 1989-02-10 | Manufacturing method of flexible wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02132418A true JPH02132418A (en) | 1990-05-21 |
| JPH07122713B2 JPH07122713B2 (en) | 1995-12-25 |
Family
ID=26367817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1029601A Expired - Lifetime JPH07122713B2 (en) | 1988-07-11 | 1989-02-10 | Flexible wiring board, manufacturing method thereof, and electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07122713B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04359443A (en) * | 1991-06-05 | 1992-12-11 | Hitachi Cable Ltd | Tape carrier for tab |
| US5739887A (en) * | 1994-10-21 | 1998-04-14 | Hitachi, Ltd. | Liquid crystal display device with reduced frame portion surrounding display area |
| JPH11316386A (en) * | 1998-03-05 | 1999-11-16 | Sharp Corp | Liquid crystal display device |
| US6133978A (en) * | 1996-04-26 | 2000-10-17 | Sharp Kabushiki Kaisha | Tape carrier package and liquid crystal display device |
| JP2002108231A (en) * | 2000-09-27 | 2002-04-10 | Fujitsu Ltd | Connection member and matrix-type display device |
| JP2003077959A (en) * | 2001-09-03 | 2003-03-14 | Shindo Denshi Kogyo Kk | Method of preventing tab tape carrier from warping, and tab tape carrier |
| JP2003086636A (en) * | 2001-09-07 | 2003-03-20 | Shindo Denshi Kogyo Kk | Method for preventing warpage of tab tape carrier and tab tape carrier |
| JP2007063697A (en) * | 2005-08-30 | 2007-03-15 | Rakupri Co Ltd | Sash product and method for producing the same |
| JP2018116224A (en) * | 2017-01-20 | 2018-07-26 | 株式会社ジャパンディスプレイ | Display device |
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| JPS60216573A (en) * | 1984-04-12 | 1985-10-30 | Seiko Epson Corp | Manufacture of flexible printed circuit board |
| JPS616832A (en) * | 1984-06-20 | 1986-01-13 | Matsushita Electric Ind Co Ltd | Material to be loaded |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5580328A (en) * | 1978-12-12 | 1980-06-17 | Citizen Watch Co Ltd | Circuit-installation structure |
| JPS5710258A (en) * | 1980-05-20 | 1982-01-19 | Gao Ges Automation Org | Integrated circuit chip carrier element for identification card |
| JPS58204547A (en) * | 1982-05-25 | 1983-11-29 | Citizen Watch Co Ltd | Sealing method for ic |
| JPS58188684U (en) * | 1982-06-10 | 1983-12-15 | セイコーエプソン株式会社 | electronic display device |
| JPS60216573A (en) * | 1984-04-12 | 1985-10-30 | Seiko Epson Corp | Manufacture of flexible printed circuit board |
| JPS616832A (en) * | 1984-06-20 | 1986-01-13 | Matsushita Electric Ind Co Ltd | Material to be loaded |
| JPS6313651U (en) * | 1986-07-13 | 1988-01-29 | ||
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04359443A (en) * | 1991-06-05 | 1992-12-11 | Hitachi Cable Ltd | Tape carrier for tab |
| US5739887A (en) * | 1994-10-21 | 1998-04-14 | Hitachi, Ltd. | Liquid crystal display device with reduced frame portion surrounding display area |
| US6133978A (en) * | 1996-04-26 | 2000-10-17 | Sharp Kabushiki Kaisha | Tape carrier package and liquid crystal display device |
| US6396557B1 (en) | 1996-04-26 | 2002-05-28 | Sharp Kabushiki Kaisha | Tape carrier package and liquid crystal display device |
| JPH11316386A (en) * | 1998-03-05 | 1999-11-16 | Sharp Corp | Liquid crystal display device |
| JP2002108231A (en) * | 2000-09-27 | 2002-04-10 | Fujitsu Ltd | Connection member and matrix-type display device |
| JP2003077959A (en) * | 2001-09-03 | 2003-03-14 | Shindo Denshi Kogyo Kk | Method of preventing tab tape carrier from warping, and tab tape carrier |
| JP2003086636A (en) * | 2001-09-07 | 2003-03-20 | Shindo Denshi Kogyo Kk | Method for preventing warpage of tab tape carrier and tab tape carrier |
| JP2007063697A (en) * | 2005-08-30 | 2007-03-15 | Rakupri Co Ltd | Sash product and method for producing the same |
| JP2018116224A (en) * | 2017-01-20 | 2018-07-26 | 株式会社ジャパンディスプレイ | Display device |
| WO2018135127A1 (en) * | 2017-01-20 | 2018-07-26 | 株式会社ジャパンディスプレイ | Display device |
| US10985232B2 (en) | 2017-01-20 | 2021-04-20 | Japan Display Inc. | Display device included a folded-back display panel portion for a driver |
| US11508802B2 (en) | 2017-01-20 | 2022-11-22 | Japan Display Inc. | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07122713B2 (en) | 1995-12-25 |
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