JPH1140605A - Tape carrier package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid occurrences of warpage or the like of inner leads as much as possible and to achieve positional accuracy of bonding, by forming the inner leads so as to traverse a device hole of a tape member, and fixing the inner leads to the tape member at both sides of the device hole. SOLUTION: Inner leads 2 are formed so as to traverse a device hole 5 which is formed in such a way that a semiconductor chip 4 can be arranged therein and bumps 3 are exposed to, and are fixed to a polyimide film 1 at both sides of the device hole 5. The semiconductor chip 4 is arranged so that each of the bumps 3 is located between the fixed end of one inner lead 2 and the fixed end of the other inner lead 2. More specifically, the arrangement is made such that the inner leads 2 traverse the chip 4. Since the individual inner leads 2 are fixed at both sides of the device hole 5, no deformation is caused by external force at the time of manufacturing, conveying and mounting, thereby keeping a carrier tape in a given form at the time of formation thereof.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a TCP (Tape Automated Bonding) of a semiconductor integrated circuit.
The present invention relates to a mounting technology for a carrier package, and more particularly to a structure for improving the mounting accuracy of an inner lead.

[0002]

2. Description of the Related Art A conventional technique will be described with reference to the drawings. FIG. 3 is a plan view showing a conventional TCP, and FIG. 4 is a sectional view thereof. As shown in FIG. 3 or FIG. 4, in TAB, a semiconductor chip 10 and a polyimide film 7 for TCP are prepared. The polyimide film 7 has a device hole 11 in which the semiconductor chip 10 is arranged. Further, an inner lead portion 8 is formed for connection with an electrode terminal of the semiconductor chip 10. The inner lead portion 8 is usually made of a copper foil or the like formed by photolithography, and is fixed on the polyimide film 7 with an adhesive. In the device hole 11, a tip portion of the inner lead portion 8 connected to the semiconductor chip 10 by the bump 9 is formed in a protruding state. That is, the tip of the protruding inner lead portion 8 is not particularly fixed before bonding. For this reason, the tip portion of the inner lead portion 8 protruding into the device hole 11 may be deformed, and there is a problem that accurate positional accuracy with the bump 9 cannot be maintained before bonding.

Further, it is necessary to correct for deformation due to expansion of the tape due to heating during bonding. The present invention has been made in view of the above problems, and provides a highly reliable and high-yield TCP that is resistant to external impacts and injuries.

[0004]

In the conventional TCP, an inner lead portion projecting into a device hole is used for connecting a semiconductor chip and a lead formed on a polyimide film. One of the inner lead portions is fixed on the polyimide film by an adhesive. However, the tip in the device hole, that is, the part in contact with the bump of the semiconductor chip has a structure that is not fixed, and the tip of the lead is deformed during the manufacturing process and becomes an obstacle during bonding. I was

According to the present invention, since the tip of the inner lead is not fixed in the device hole, external shock, pressure, vibration,
Improves the property of being vulnerable to injuries, makes it harder for inner leads to bend, etc., provides accurate positioning of bonding in the manufacturing process of forming TCP, prevents a decrease in bonding yield, and manufactures products. It aims to improve cost and reliability.

[0006]

A semiconductor device according to the present invention has a tape carrier package in which electrodes of a semiconductor chip are bonded to inner leads formed on a tape member, and the inner leads are provided with the semiconductor chip. And has a structure fixed to the tape member on both sides of the device hole. The bonding between the inner lead and the semiconductor chip is performed via a bump formed on the surface of the semiconductor chip or via a bump formed on the inner lead. Further, the inner leads may be formed so that the inner leads on the input side and the inner leads on the output side face each other, and the number of the inner leads may be different between the input side and the output side.

Further, in the tape carrier according to the present invention, the leads connected to the electrodes of the semiconductor chip are formed so as to cross the device holes of the tape member on which the semiconductor chips are arranged, and the tape member is formed on both sides of the device holes. It is characterized by being fixed.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the following embodiments with reference to the drawings, but the present invention is not limited to the embodiments described here. The following embodiments can be variously changed.

FIG. 1 is a plan view of a TCP showing an embodiment of the present invention. FIG. 2 shows T according to the embodiment of the present invention.
It is sectional drawing of CP. As shown in FIG. 1 or 2, a semiconductor chip 4 having bumps 3 on its terminals and a polyimide film 1 which is a tape member having leads for external wiring of the semiconductor chip 4 on its surface are prepared. The semiconductor chip 4 and the lead for external wiring are connected to each other via the bump 3.

The leads for external wiring are formed by etching a metal foil having high conductivity such as a copper foil adhered to the surface of the polyimide film 1 by photolithography and patterning the metal foil, and are connected to the semiconductor chip 4. The inner lead portion 2 is formed. Usually, the inner lead portion 2 is connected to the wiring of the circuit board by soldering or the like.
1 and 2, the leads for the external wiring are formed on the upper surface of the polyimide film 1, but they may be formed on the lower surface.

Although a polyimide film is suitable as the tape member, other insulating films can be used, and the tape member is not particularly limited to the polyimide film. As the bump 3, a solder bump, a gold bump, an indium bump, or the like can be used, and interconnection with a lead is performed by welding or thermocompression bonding. 1 and 2
In the embodiment shown in FIG.
However, the position of the bump 3 is not limited to this. For example, the bump 3 can be formed at the periphery of the semiconductor chip 4. Further, although the bumps 3 are formed on the semiconductor chip 4 in the present embodiment, they can be formed not on the semiconductor chip side but on the inner lead portion side.

The inner lead portion 2 according to the present invention is formed so as to cross the device hole 5 formed so that the semiconductor chip 4 is disposed and the bump 3 is exposed. Fixed. The bump 3 of the semiconductor chip 4 is arranged between one fixed end of the inner lead 2 and the other fixed end. That is,
The inner lead portion 2 has a structure passing over the chip 4, and the inner lead portion 2 is supported on the polyimide film 1 on both sides of the device hole 5. Inner lead 2
Is fixed at both ends of the device hole 5, it is not deformed by an external force at the time of manufacture, transportation, or mounting, and the shape at the time of forming the carrier tape can be maintained.

In this embodiment, the device hole 6 is smaller than the shape of the semiconductor chip 4 and is formed in a range where the bump 3 is exposed. As another method, the size of the device hole 6 can be made larger than that of the semiconductor chip. In this case, the device hole 6 is formed about 0.3 mm to 1 mm larger than the semiconductor chip 4.

In the embodiment of FIG. 1, the number of leads extending from the right side and the number of leads extending from the left side are different, for example, because the number of input and output terminals is different. There is a case where a conventional terminal having the same number of inputs and outputs is useless, and in this embodiment, a minimum number of leads are arranged.

Further, it is not necessary that all the leads are formed so as to cross the device hole 5. For example, when the width of the inner lead portion is increased in the power supply lead or the ground lead and the mechanical lead has sufficient mechanical strength, Needless to say, some of these inner lead portions can be shaped to protrude into device holes as in the prior art. Further, it goes without saying that the present invention can change the number and length of the leads, the width of the inner lead portion, the size of the chip size, and the like as necessary.

[0016]

According to the present invention, the inner lead portion of the TCP is formed so as to cross the device hole, and both ends thereof are fixed on a film, so that the positional accuracy of the inner lead portion is improved, and the inner lead portion is resistant to external impact and injury. , Without bending
It is possible to manufacture TCP with high reliability and high yield.

Further, by using the present invention, tape bonding can be performed without changing the manufacturing equipment used in the conventional process. Further, it is not necessary to correct the bonding position for the thermal expansion as in the conventional process. Furthermore, the package size can be reduced by changing the arrangement and the number of leads according to the shape of the semiconductor chip and the arrangement of the terminals. In addition, it can be used for a film package, a tape BGA, and the like.

[Brief description of the drawings]

FIG. 1 is a plan view showing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing the semiconductor device according to the first embodiment of the present invention.

FIG. 3 is a plan view showing a semiconductor device according to a conventional technique.

FIG. 4 is a sectional view showing a semiconductor device according to a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Tape member 2 ... Inner lead part 3 ... Bump 4 ... Semiconductor chip 5 ... Device hole 7 ... Tape member 8 ... Inner lead part 9 ... Bump 10 ... Chip 11 ... Device hole

Claims (5)

[Claims] 1. A tape carrier package wherein an electrode of a semiconductor chip is bonded to an inner lead formed on a tape member, wherein the inner lead is formed to cross a device hole of the tape member on which the semiconductor chip is arranged. A semiconductor device, wherein the semiconductor device is fixed to a tape member on both sides of the device hole. 2. The semiconductor device according to claim 1, wherein the bonding between the inner lead and the semiconductor chip is performed via a bump formed on a surface of the semiconductor chip. 3. The semiconductor device according to claim 1, wherein the bonding between the inner lead and the semiconductor chip is performed via a bump formed on the inner lead. 4. The apparatus according to claim 1, wherein said inner lead is formed so that an input inner lead and an output inner lead face each other, and the number of the inner leads is different between the input side and the output side. 4. The semiconductor device according to any one of 3. 5. A lead connected to an electrode of a semiconductor chip is formed so as to cross a device hole of a tape member on which the semiconductor chip is disposed, and is fixed to the tape member on both sides of the device hole. And a tape carrier.