JP2010153236A - Method of manufacturing contactor equipped with elastically deforming part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a contactor capable of forming an elastically deforming part on its surface layer which enables to achieve improvement of a transfer of solder and stabilization of contact resistance more than conventionally, especially by electroless plating. <P>SOLUTION: The method of manufacturing the contactor equipped with the elastically deforming part includes a step of forming a core part 23 having a fixed part 21 and the elastically deforming part 22 formed in extension from the fixed part 21, a step of plating a platinum group metallic layer 28 on the surface of the core part 23 by electroless plating, a step of plating an Au layer 29 on the surface of the platinum group metallic layer 28 by the electroless plating, and a step of forming an alloy layer of a platinum group element and Au on an outermost surface layer by heating. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a contact having an elastically deforming portion that comes into contact with an electrode of an electronic component such as an IC package.

  The following Patent Document 1 discloses a connection device including a plurality of contacts including elastic deformation portions (elastic arms). A plurality of spherical electrodes are provided on the bottom surface of an electronic component such as an IC package, and each electrode is elastically pressed by the elastic deformation portion, and the electrodes and the contacts are individually connected in a one-to-one relationship. .

Patent Document 1 discloses a form in which a coating layer made of a platinum group metal layer is formed on the surface of a core part. Furthermore, a form in which an Au layer is formed on the surface of the coating layer is also disclosed.
JP 2008-78032 A Japanese Patent Laid-Open No. 11-260981

  However, in the form in which the Au layer is exposed on the outermost surface, when an electrode of an electronic component is formed of solder, an intermetallic compound is formed between the electrode and the contact when the contact is repeatedly brought into contact with the electrode. There is a problem that solder is transferred to the contact side. For this reason, contact reliability was lacking, and shortening of the connection device became a problem.

  Further, in the form in which the platinum group metal layer is exposed on the outermost surface, the contact resistance is not stabilized by forming an oxide layer on the surface. Furthermore, due to the catalytic action, there has been a problem that the use environment is limited, such as organic matter contamination depending on the use environment and the inability to use lubricating oil. Further, when a platinum group element such as Pd is used for the outermost surface layer, there is a problem in that the fixing surface for supporting and fixing the contact and the contact cannot be appropriately soldered.

  The invention described in Patent Document 2 described above discloses a lead frame manufacturing method. Patent Document 2 discloses that Au—Pd alloy plating is formed on the surface of a lead frame, and further, a sealing treatment is applied to the Au—Pd alloy plating.

  However, the invention described in Patent Document 2 is not a contact provided with an elastically deforming portion that repeatedly comes into contact with an electrode of an electronic component such as an IC in the first place, and there is no conventional problem of the above-described solder transfer.

  Moreover, each contact provided with an elastic deformation part mentioned above is not electrically connected, respectively, but is isolate | separated separately. Therefore, when plating a coating layer on these contacts, the electrolytic plating method cannot be used, and the electroless plating method is used.

  However, since the Au—Pd plating described in Patent Document 2 cannot be formed by the electroless plating method, the form described in Patent Document 2 cannot be directly adopted.

  Therefore, the present invention is for solving the above-described conventional problems, and in particular, by using an electroless plating method, it is possible to improve the solder transfer and the stability of the contact resistance as compared with the conventional surface. It aims at providing the manufacturing method of the contactor which can form a layer in an elastic deformation part.

The present invention provides a method for manufacturing a contact provided with an elastically deforming portion.
Forming a core having a fixed portion and the elastically deformable portion extending from the fixed portion;
A step of plating a platinum group metal layer on the surface of the core part constituting at least the elastically deformable part by an electroless plating method;
Plating the Au layer on the surface of the platinum group metal layer by electroless plating,
Applying heat treatment to form an alloy layer of a platinum group element and Au on the outermost surface layer;
It is characterized by having.

  In the present invention, an alloy layer of a platinum group element and Au can be appropriately and easily formed on the surface of the core portion of the elastic deformation portion by using an electroless plating method. Therefore, it is possible to form a contactor including an elastically deformable portion that can suppress solder transfer and can improve the stability of contact resistance and the like as compared with the conventional case.

  In the present invention, it is preferable that the alloy layer is formed by subjecting the fixing portion to plating of the platinum group metal layer and the Au layer by an electroless plating method and a heat treatment. Thereby, when the fixing portion is soldered onto the land portion of the substrate, good solderability can be ensured while suppressing the sucking up of the solder.

  Further, in the present invention, the alloy layer is formed by forming a plurality of individually separated core portions and subjecting all the core portions supported by a support sheet to the electroless plating step and the heat treatment step. It is preferable to form a plurality of the contacts including: As described above, it is necessary to use an electroless plating method in order to apply plating to a plurality of individually separated core parts, but according to the present invention, a plurality of individually separated contactors are used. On the other hand, an alloy layer of a platinum group element and Au can be appropriately and easily formed.

  Moreover, in this invention, it is preferable to perform the said heat processing process in the state which shape | molded the said elastic deformation part. Thereby, the formation of the alloy layer of the platinum group element and Au and the formation of a three-dimensional elastic deformation portion capable of appropriately exerting the elastic force can be formed.

  In the present invention, it is preferable that the Au layer is formed thinner than the platinum group metal layer or has an equivalent film thickness. Thereby, the alloy layer of a platinum group element and Au can be formed appropriately. Moreover, it can form in an alloy layer rich in platinum group elements, and solder transfer can be improved more effectively. In addition, if the Au layer is formed thinner than the platinum group metal layer, it becomes easier to leave the platinum group metal layer between the core portion and the alloy layer after the heat treatment. Strength can be increased.

  In the present invention, the core portion is formed on the surface of the conductive portion made of copper or a copper alloy by Ni-X (where X is P, W, Mn, Ti, Be, B) by electroless plating. It is possible to form a laminated structure in which an elastic portion made of any one or more of the above is plated.

  Alternatively, in the present invention, the core portion can be electroformed by Ni-X (where X is any one or more of P, W, Mn, Ti, Be, and B).

  In this invention, it is preferable to adjust the said heating temperature within the range of 150 to 300 degreeC. In particular, if the above-described elastic part made of Ni-X is subjected to heat treatment at an excessively high temperature, crystallization proceeds and the spring characteristics deteriorate. If the heating temperature is too low, an alloy layer of platinum group element and Au cannot be formed properly. Therefore, it was decided to adjust the heating temperature within the range of 150 ° C to 300 ° C.

  In the present invention, an alloy layer of a platinum group element and Au can be appropriately and easily formed on the surface of the core portion of the elastic deformation portion by using an electroless plating method. Therefore, it is possible to form a contactor including an elastically deformable portion that can suppress solder transfer and can improve the stability of contact resistance and the like as compared with the conventional case.

  FIG. 1 is a process diagram (cross-sectional view) illustrating a method for manufacturing a contact sheet having a large number of connectors in the present embodiment, and FIG. 2A is a plan view of a worksheet in which a large number of contact sheets are arranged. 2 (b) is an enlarged plan view of one contactor sheet surrounded by a circle A in FIG. 2 (a), and FIG. 2 (c) is one contact surrounded by a circle B in FIG. 2 (b). FIG. 3 is an enlarged plan view of the child, and FIG. 3 is an enlarged cross-sectional view of the elastically deformed portion taken along the line CC of FIG. 2C and viewed from the arrow direction (showing the state before the heat treatment), FIG. FIG. 4A is a partially enlarged cross-sectional view of the elastically deformable portion before the heat treatment, and FIG. 4B is a partially enlarged cross-sectional view of the elastically deformable portion after the heat treatment.

  In the step shown in FIG. 1 (a), a large number of core parts 23 in the shape of the contact 20 shown in FIG. 2 (c) are formed in an array as shown in FIG. The state where the formed core portion 23 is fixedly supported by a resin sheet (support sheet) 24 is shown.

  As shown in FIG. 3, the core portion 23 is formed with a laminated structure of, for example, a conductive portion 31 and an elastic portion 32.

  The conductive portion 31 is a single layer of copper (Cu) or an alloy containing copper. As the copper alloy, a Corson alloy having Cu, Si, Ni having high electric conductivity and high mechanical strength is preferably used. The Corson alloy is, for example, Cu—Ni—Si—Mg, Cu 96.2 mass%, Ni 3.0 mass%, Si 0.65 mass%, and Mg 0.15 mass%. The

  A copper plate or a copper alloy plate is etched to form a large number of conductive portions 31 having a planar shape shown in FIG. At this time, since each conductive part 31 is in a separated state, each conductive part 31 is fixedly supported on the resin sheet 24 to obtain the contact sheet 25. As shown in FIG. 2C, the contact 20 (conductive portion 31) has a shape having a fixed portion 21 and an elastically deformable portion 22 formed extending from the fixed portion 21. And the hole 24a is formed in the resin sheet 24, the elastic deformation part 22 is made to oppose the position of the said hole 24a, and each electroconductive part 31 is fixed to the resin sheet 24 (refer Fig.1 (a)). . The fixing method is performed using, for example, an adhesive. The planar shape of the contact 20 in FIG. 2C is an example. In FIG. 2C, the elastic deformation portion 22 is formed in a spiral shape, but is not limited to this shape.

  Then, as shown in FIG. 2A, a worksheet 27 is obtained in a state where a large number of contactor sheets 25 are supported on a support plate 26.

  2A is placed in a first plating bath, and at this time, Ni—X (where X is P, W) so as to cover the periphery of each conductive portion 31 by electroless plating. , Mn, Ti, Be, or B) is formed by plating (see FIG. 3). In the plating process of the elastic portion 32, since each conductive portion 31 is in a separated state, the electrolytic plating method cannot be used, and the elastic portion 32 is formed by an electroless plating method.

  Subsequently, in the step shown in FIG. 1B, after the work sheet 27 is taken out from the first plating bath, it is put in the second plating bath. At this time, the electroconductive portion 31 and the elastic portion 32 are formed by electroless plating. A platinum group metal layer 28 is formed by plating so as to cover the periphery of each of the contact-shaped core portions 23 made of (see also FIG. 3). Here, the platinum group metal layer 28 is preferably formed of a Pd layer.

  Subsequently, in the step shown in FIG. 1C, the work sheet 27 is taken out of the second plating bath and then put in the third plating bath. At this time, each platinum group metal layer 28 is electrolessly plated. An Au layer 29 is formed by plating so as to cover the periphery of (see also FIG. 3). At this time, it is preferable to form the Au layer 29 thinner than the platinum group metal layer 28.

  In the step shown in FIG. 1 (d), the worksheet 27 is taken out from the third plating bath, and then heated while maintaining the elastically deforming portions 22 of the contactors 20 pushed up using the jig 30. Apply processing. After the heat treatment, the jig 30 is removed. The internal residual stress is removed by this heat treatment, and the contact 20 can exhibit an elastic force in a three-dimensional shape.

  In addition, by this heat treatment, the platinum group element constituting the platinum group metal layer 28 and Au in the Au layer 29 are elementally diffused, and as shown in FIG. 4B, an alloy layer of the platinum group element and Au. 33 is formed. FIG. 4A is a cross-sectional view showing a state before the heat treatment. The thickness of the platinum group metal layer 28 is H1, and the thickness of the Au layer 29 is H2. When heat treatment is performed as shown in FIG. 4B, an alloy layer 33 having a film thickness H3 slightly thicker than the film thickness H2 of the Au layer 29 is formed on the outermost surface layer, and the alloy layer 33 and the core 23 are formed. In between, the platinum group metal layer 28 having a thin film thickness H4 is left as compared with that before the heat treatment in FIG.

  In the present embodiment, it is preferable to adjust the heating temperature within a range of 150 ° C to 300 ° C. If the heating temperature is lower than 150 ° C., element diffusion between the platinum group metal layer 28 and the Au layer 29 does not occur sufficiently, and the alloy layer 33 cannot be formed properly. Moreover, when heating temperature exceeds 300 degreeC, the elastic part 32 formed with Ni-X will crystallize. The elastic part 32 formed of Ni-X can obtain a high elastic coefficient and high tensile strength by maintaining an amorphous state, and can improve spring characteristics. Here, the “amorphous state” means a state where the whole is amorphous, a dominant amorphous state, a state where crystals (crystal grains are preferably 3 nm to 15 nm) are scattered in the amorphous state, a dominant alphas state, In addition, it refers to either a state in which ultrafine precipitates (emprio) having a diameter of 1 nm or less are scattered in the amorphous, a dominant amorphous state, and a state in which the crystals and the ultrafine precipitates are mixed in the amorphous. Further, “dominant amorphous” refers to containing 60% by volume or more in the film, preferably 80% by volume or more, and more preferably 90% by volume or more.

  As described above, in the present embodiment, the heating temperature is set in the range of 150 ° C to 300 ° C. The heating time is preferably in the range of 1 minute to 1 hour. As an example, by setting the heating temperature to 250 ° C. and the heating time to 10 minutes, the elastically deformable portion 22 can be appropriately three-dimensionally formed and the alloy layer 33 of the platinum group element and Au 29 can be appropriately formed. I can do it.

  The contactor sheet 25 formed through the above steps is installed in the connection device 1 shown in FIG. The connection device 1 shown in FIG. 6 has a base 10. The planar shape of the base 10 is, for example, a quadrangular shape, and side walls 10 a that rise substantially vertically are formed on each of the four sides of the base 10. The region surrounded by the four side wall portions 10a is a concave portion, and the upper surface of the bottom portion 10b is the fixed surface 12. Then, the contact sheet 25 is installed on the fixed surface 12.

  As shown in FIG. 7, a large number of contacts 20 arranged in the contact sheet 25 have their fixing portions 21 joined to the land portions 13 formed on the fixing surface 12 via the solder layers 14. Yes. The solder layer 14 is formed of solder containing no lead, and is, for example, a tin / bismuth alloy or a tin / silver alloy.

  As shown in FIG. 6, the electronic device 40 is installed in the connection device 1. The electronic component 40 is an IC package or the like, and various electronic elements such as an IC bare chip are sealed in the main body 41. A plurality of protruding electrodes 42 are provided on the bottom surface 41 a of the main body 41, and each protruding electrode 42 is electrically connected to a circuit in the main body 41. In the electronic component 40 of this embodiment, the protruding electrode 42 has a spherical shape. The protruding electrode 42 may have a truncated cone shape or the like.

  The protruding electrode 42 is formed of a conductive alloy containing tin. That is, it is formed of solder containing no lead, such as a tin / bismuth alloy or a tin / silver alloy.

  The connection device 1 of the present embodiment is, for example, for inspecting an electronic component 40, and the electronic component 40 that is an object to be inspected is mounted in the recess of the base 10 as shown in FIG. At this time, the electronic component 40 is positioned such that each protruding electrode 42 provided on the bottom surface 41 a of the main body 41 is placed on the contact 20. A pressing lid (not shown) is provided on the base 10. When the lid is placed on the base 10, the electronic component 40 is pressed in the direction of arrow F by the lid. With this pressing force, each protruding electrode 42 is pressed against the elastic deformation portion 22, the three-dimensional elastic deformation portion 22 is crushed, and the protruding electrode 42 and the elastic deformation portion 22 are individually connected.

  When the connection device 1 is used for so-called burn-in inspection, an electric current is applied to the protruding electrode 42 from the external inspection circuit via the contact 20 in a state where the connection device 1 is set to a predetermined temperature. It is inspected whether the circuit in the main body 41 of the component 40 is disconnected. Alternatively, a predetermined signal is given from the contact 20 to the protruding electrode 42, and an operation test of the circuit in the main body 41 is performed.

  The electronic component 40 that has been inspected is taken out from the connection device 1, the electronic component 40 to be inspected next is installed in the connection device 1, and the inspection is performed in the same manner. This inspection is repeated. Therefore, the protruding electrodes 42 of new electronic components 40 come in contact with the elastically deforming portion 22 of the contact 20 one after another.

  The contact 20 of the present embodiment is formed through the process shown in FIG. 1, and the platinum group element and Au shown in FIG. 4B are formed on the outermost surface layer of the elastically deformable portion 22 after the manufacturing process. The alloy layer 33 is formed. The platinum group metal layer 28 is preferably Pd, and therefore the alloy layer 33 is preferably Au—Pd.

  In the present embodiment, the alloy layer 33 can be appropriately and easily formed by using an electroless plating method. In this embodiment, as shown in FIG. 1A and FIG. 2B, each contact 20 is in an individual state. Therefore, the subsequent plating process must use an electroless plating method. Therefore, in the present embodiment, in the step shown in FIG. 1B, first, the platinum group metal layer 28 is plated around the core portion 23 by using an electroless plating method, and further shown in FIG. In the process, the Au layer 29 was plated around the platinum group metal layer 28 by using an electroless plating method, and finally, heat treatment was performed in the process shown in FIG. By the heat treatment, the platinum group element constituting the platinum group metal layer 28 and Au constituting the Au layer 29 cause element diffusion, and as shown in FIG. An alloy layer 33 of a platinum group element and Au can be formed.

  Thus, the alloy layer 33 of the platinum group element and Au can be formed through the above-described steps even when the electroless plating method is used instead of the electrolytic plating method. Then, the alloy layer 33 is formed on the outermost surface layer of the elastic deformation portion 22, so that the elastic deformation portion 22 repeatedly contacts the protruding electrode 42 of the electronic component 40, as shown in FIGS. 6 and 7. Even if the protruding electrode 42 is formed of a solder material, solder transfer can be effectively suppressed as compared with the conventional configuration in which the Au layer 29 is exposed on the outermost surface. In addition, since the alloy layer 33 contains not only the platinum group element but also Au, the contact resistance can be lowered and stabilized as compared with the conventional form in which the platinum group metal layer 28 is exposed on the outermost surface. Further, the catalytic action on the outermost surface of the elastically deformable portion 22 is suppressed, and generation of atomic oxygen having a large oxidizing power can be effectively suppressed. Thereby, lifetime improvement of the contactor 20 can be achieved.

  In this embodiment, the contact 20 has a configuration in which an elastic deformation portion 22 and a fixing portion 21 are integrally formed, and the elastic deformation portion 22 extends from the fixing portion 21 (see FIG. 2C). Therefore, in FIG. 1A, the core portion 23 is formed in an integral shape of the elastically deformable portion 22 and the fixed portion 21, and the platinum group metal layer 28 is formed by the electroless plating method of FIG. The alloy layer 33 of platinum group element and Au can be formed on the outermost surface layer of the fixing portion 21 by the formation of the Au layer 29 by the electroless plating method of FIG.

  Accordingly, as shown in FIG. 7, when the fixing portion 21 is joined to the fixing surface 12 of the base 10 via the solder layer 14, the sucking up of the solder is suppressed compared to the case where the outermost surface is the Au layer. In addition, better solder joints can be ensured than when the outermost surface is a platinum group metal layer.

  In this embodiment, the heat treatment step of FIG. 1D is performed in a state where the elastic deformation portion 22 is pushed up, and the elastic deformation portion 22 is three-dimensionally formed. Thereby, the formation of the alloy layer 33 of the platinum group element and Au and the three-dimensional molding of the elastic deformation portion 22 can be performed simultaneously. At this time, the heating temperature is preferably adjusted within a range of 150 ° C to 300 ° C. In addition, what is necessary is just to heat-process with respect to the form of FIG.1 (c), when making the elastic deformation part 22 into a planar form without solid-molding.

  In the present embodiment, as shown in FIG. 3A, the film thickness H2 of the Au layer 29 is formed thinner than the film thickness H1 of the platinum group metal layer 28. It is preferable that the film thickness H2 of the Au layer 29 is formed to be about 0.01 to 0.6 [mu] m, and the film thickness H1 of the platinum group metal layer 28 is formed to be about 0.1 to 1 [mu] m. The Au layer 29 may be as thin as a flash Au plating. Moreover, both the film thickness and width dimension of the core part 23 shall be 10 micrometers or more and 100 micrometers or less.

  If the thickness of the Au layer 29 is made larger than that of the platinum group metal layer 28, the Au layer 29 tends to remain on the outermost surface even if heat treatment is performed, and solder transfer cannot be effectively suppressed.

  On the other hand, by forming the film thickness H2 of the Au layer 29 to be smaller than the film thickness H1 of the platinum group metal layer 28, the alloy layer 33 of the platinum group element and Au can be appropriately formed on the outermost surface. Moreover, it can form in the alloy layer 33 rich in the platinum group element, and the content of the platinum group element in the alloy layer 33 can be adjusted to more than 50 volume% and 99 volume% or less. Thereby, solder transfer can be improved more effectively.

  Further, as shown in FIG. 4A, by forming the Au layer 29 thinner than the platinum group metal layer 28, as shown in FIG. 4B, between the core portion 23 and the alloy layer 33 after the heat treatment, as shown in FIG. Although the platinum group metal layer 28 tends to remain, the mechanical strength of the elastically deformable portion 22 can be improved by leaving a part of the platinum group metal layer 28 in this way.

  In addition, the film thickness H1 of the platinum group metal layer 28 and the film thickness H2 of the Au layer 29 may be the same, and the form in which the alloy layer 33 is formed directly on the surface of the core portion 23 after the heat treatment, that is, FIG. Unlike 4 (b), the platinum group metal layer 28 may not be left by heat treatment.

  The form of the core part 23 shown in FIG. 3 is an example, and another form may be sufficient as it. However, as shown in FIG. 3, it is preferable that the core portion 23 has a configuration in which the entire circumference around the conductive portion 31 is covered with the elastic portion 32. At this time, the elastic part 32 is made of a Ni-X alloy (where X is P, W, Mn, Ti, Be, B) as a metal material that is conductive and exhibits high mechanical strength and high bending elastic modulus. Any one or more of them is preferable. At this time, it is preferable to form the elastic part 32 with a Ni-P alloy. In the Ni-P alloy, by setting the concentration of phosphorus (P) to 10 at% or more and 30 at% or less (more preferably 17 to 25 at%), the elastic portion 32 can be appropriately maintained in an amorphous state, and high elasticity is achieved. Coefficient and high tensile strength can be obtained. Or you may form the elastic part 32 with a Ni-W alloy. Also in this case, by setting the concentration of tungsten (W) to 10 at% or more and 30 at% or less, the elastic portion 32 can be appropriately maintained in an amorphous state, and a high elastic coefficient and high tensile strength can be obtained.

  In FIG. 3, the cross-sectional area of the elastic part 32 is preferably 20% or more and 80% or less of the cross-sectional area of the core part 23. Within this range, the core 23 can exhibit both functions of conductivity and springiness.

  Alternatively, as shown in FIG. 5 (showing the state after the heat treatment), the core portion 23 may have a single layer structure in which Ni-X is formed by electroforming. Thereby, the further miniaturization of the whole contact 20 and the spring property of the elastic deformation part 22 can be maintained appropriately.

  In addition, when the core part 23 is formed by electroforming as described above, and the elastically deforming part 22 is three-dimensionally formed, a substrate having a protruding part protruding in a three-dimensional shape (for example, a conical shape) on the surface is used. If the elastic deformation portion 22 is electroformed on the surface of the protruding portion, the elastic deformation portion 22 can be three-dimensionally formed. And the heat processing demonstrated in FIG.1 (d) are given in the state which solid-molded the elastic deformation part 22 in this way.

  Note that the arrangement pitch of the contacts 20 is, for example, 2 mm or less, or 1 mm or less. The maximum outer dimension of the contact 20 is also 2 mm or less, or 1 mm or less (see FIGS. 2B and 2C).

  As described above, the size of the contact 20 is very small, and each contact 20 is not electrically connected but is in an individual state. Therefore, it is very difficult to uniformly and stably plate each contact, unlike the case where the surface of a relatively large lead portion is plated. In this embodiment, the platinum group metal layer 28 and the Au layer 29 are formed by plating using an electroless plating method, followed by elemental diffusion of the platinum group element and Au by heat treatment, and the alloy layer 33. Therefore, the alloy layer 33 can be formed uniformly and stably on each contact 20.

Process drawing (sectional drawing) which shows the manufacturing method of the contactor sheet | seat provided with many connectors in this embodiment, 2A is a plan view of a worksheet in which a large number of contact sheets are arranged, and FIG. 2B is an enlarged plan view of one contact sheet surrounded by a circle A in FIG. 2A. 2 (c) is an enlarged plan view of one contactor surrounded by a circle B in FIG. 2 (b); The expanded sectional view of the elastic deformation part cut along the CC line of Drawing 2 (c) and seen from the direction of an arrow (showing the state before heat processing), 4A is a partially enlarged cross-sectional view of the elastically deformable portion before the heat treatment, FIG. 4B is a partially enlarged cross-sectional view of the elastically deformable portion after the heat treatment, The expanded sectional view of the elastic deformation part of other embodiments (showing the state after heat processing), The fragmentary sectional view of the connecting device which is this embodiment, FIG. 6 is an enlarged cross-sectional view showing the vicinity of the contact of the connecting device shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Connection apparatus 10 Base 12 Fixed surface 14 Solder layer 20 Contactor 21 Fixed part 22 Elastic deformation part 23 Core part 24 Resin sheet 25 Contactor sheet 27 Worksheet 28 Platinum group metal layer 29 Au layer 30 Jig 31 Conductive part 32 Elastic part 33 Alloy layer 40 Electronic component 42 Projecting electrode

Claims (8)

In the method of manufacturing a contact provided with an elastically deformable portion,
Forming a core having a fixed portion and the elastically deformable portion extending from the fixed portion;
A step of plating a platinum group metal layer on the surface of the core part constituting at least the elastic deformation part by an electroless plating method;
Plating the Au layer on the surface of the platinum group metal layer by electroless plating,
Applying heat treatment to form an alloy layer of a platinum group element and Au on the outermost surface layer;
A method for producing a contact, comprising:   The contactor manufacturing method according to claim 1, wherein the alloy part is formed by performing plating on the platinum group metal layer and the Au layer by an electroless plating method and a heat treatment also on the fixing portion.   A plurality of the core parts that are individually separated are formed, and the electroless plating process and the heat treatment process are performed on all the core parts supported by the support sheet, and the plurality of the alloy layers are provided. The manufacturing method of the contact of Claim 1 or 2 which forms a contact.   The manufacturing method of the contactor of any one of Claim 1 thru | or 3 which performs the said heat processing process in the state which shape | molded the said elastic deformation part three-dimensionally.   5. The method of manufacturing a contact according to claim 1, wherein the Au layer is formed thinner than the platinum group metal layer or has an equivalent film thickness.   Ni-X (where X is P, W, Mn, Ti, Be, B or more of one or more of the core portion on the surface of a conductive portion formed of copper or a copper alloy by electroless plating) The method for manufacturing a contact according to any one of claims 1 to 5, wherein the elastic portion is formed of a laminated structure plated.   The contact according to any one of claims 1 to 5, wherein the core portion is electroformed by Ni-X (where X is any one or more of P, W, Mn, Ti, Be, and B). Child manufacturing method.   The manufacturing method of the contactor of any one of Claim 1 thru | or 7 which adjusts the said heating temperature within the range of 150 to 300 degreeC.

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