JP2007027093A - Connecting member and its manufacturing method as well as connecting member mounting structure having connecting member and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connecting member and its manufacturing method as well as a connecting member mounting structure having the connecting member and its manufacturing method capable of finely forming a connecting material with an elastic arm in a simple mode, maintaining excellent conductive connection between electronic members and preventing electric short circuiting or the like at points other than contact points. <P>SOLUTION: A mounting part 5a of a connector 5 is formed directly on a support member, an elastic arm 5b extended from the mounting part 5a is deformed downward through a through-hole 10 formed on the support member 6, and a top face of the mounting part 5a is jointed to an electrode part 2a of an electronic component 2. Then, the elastic arm 5b is put on and made in contact with a circuit board. With this, the connecting member with the elastic arm can be finely formed in a simple mode, and that, distortion caused by a difference of heat expansion coefficients of the electronic part 2 and the circuit board 1 can be appropriately absorbed to ascertain conductive connection between the electronic component 2 and the circuit board 1 and prevent electric short circuiting or the like at points other than the contact points. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a connection member attached to an electronic member such as an IC, and in particular, a connection member having an elastic arm can be finely formed in a simple form, and the electrical connection between the electronic members is kept good. In addition, the present invention relates to a connecting member that can prevent an electrical short circuit at a place other than a contact, a manufacturing method thereof, a connecting member mounting structure having the connecting member, and a manufacturing method thereof.

  When there is a large difference in the thermal expansion coefficient between the two electronic members when an IC or the like is conductively connected on the substrate, for example, a spring shape is formed under the electrode portion of the IC in order to appropriately absorb the distortion caused by the difference in the thermal expansion coefficient. The structure which provides spring members, such as these, is considered.

  By the way, the size of the spring member itself must be made very small according to the size of the electronic member, especially as the electronic member becomes ultrafine. At this time, forming the spring member into a three-dimensional shape such as a spring shape becomes more difficult as the spring member becomes smaller, and unless the spring member has a certain amount of elastic force, The strain caused by the difference in thermal expansion coefficient cannot be properly absorbed by the spring member.

The following Patent Document 1 (Patent Publication of Japanese Patent No. 3099066) discloses an invention relating to a method for manufacturing a thin film structure. Among several manufacturing methods that have been presented, for example, a thin film structure that bends the thin film using internal stress is disclosed (claim 5 and the description in FIGS. 17 to 22).
Japanese Patent No. 3099066 Patent Publication No. 3366405

  However, Patent Document 1 does not describe or suggest any use of the thin film structure as a connection member between electronic members. In addition, Patent Document 2 describes a method for manufacturing an ultrafine structure formed of metal, but does not describe that the ultrafine structure is used as a connection member, and the ultrafine structure is formed in a spring shape. The three-dimensional forming is not performed.

  Further, as the miniaturization progresses, an electrical short circuit is likely to occur other than at the contact point between the connection member and the electronic member, with only a slight shift in positioning accuracy and the like. Therefore, a structure that can appropriately prevent electrical short-circuiting at locations other than the contact points is desired with good electrical connectivity.

  Further, from the viewpoint of improving the yield and reducing the production cost, it is desired that the connecting member can be formed with a simple structure and a simple manufacturing method.

  Therefore, the present invention is for solving the above-described conventional problems, and in particular, a connection member having an elastic arm can be finely formed in a simple form, and the electrical connection between electronic members can be kept good. An object of the present invention is to provide a connection member capable of preventing an electrical short circuit at a location other than a contact, a manufacturing method thereof, a connecting member mounting structure having the connection member, and a manufacturing method thereof. .

The connection member in the present invention has a support member and a connector,
The connector has a mount part directly joined to the support member, and an elastic arm extending from the mount part,
The support member is formed with a first through hole at a position facing the elastic arm,
The elastic arm is deformed in a direction away from the first through hole, or is deformed in a direction penetrating through the first through hole.

  As a result, the connection member having the elastic arm can be finely formed in a simple form, and the distortion caused by the difference in the thermal expansion coefficient of the electronic member can be appropriately absorbed, and the conductive connection between the electronic members is ensured. In addition, it is possible to prevent an electrical short circuit at a place other than the contact.

In the present invention, the support member is preferably formed of an organic insulating material.
The support member at a position facing a part of the mount part may be formed with a second through hole, and the mount part exposed from the second through hole may function as a contact point. .

  The connector is preferably formed as a thin film. Thereby, refinement | miniaturization of a connection member can be promoted.

  Moreover, the connection member mounting structure in the present invention is characterized in that any of the connection members described above is attached to an electronic member. In the present invention, the connection member can be appropriately attached to the electronic member even in the miniaturization of the electronic member. In addition, it is possible to ensure the conductive connection between the electronic members, and it is possible to prevent an electrical short circuit at a place other than the contacts.

  In the present invention, for example, the elastic arm is deformed in a direction penetrating the first through hole, and the mount portion is an electrode of the electronic member on a surface opposite to the joint surface with the support member. It is the structure joined to the part. Accordingly, the connection member can be appropriately connected to the electronic member, and the elastic arm can be used as an elastic contact between the electronic members.

  The elastic arm is deformed in a direction away from the first through hole, and the mount portion is joined to the electrode portion of the electronic member on a surface opposite to the joint surface with the support member. It may be. In this case, the electronic member preferably has a structure in which a storage portion is formed at a position facing the elastic arm, and the elastic arm enters the storage portion. As a result, even if the elastic arm is pressed into contact with the electrode part of the electronic component on the other side, the elastic arm can be elastically deformed in the storage part, and the conductive connection between the electrode part and the elastic arm is ensured. it can.

  Moreover, in this invention, the structure where the said mount part exposed from the said 2nd through-hole and the electrode part of the said electronic member are joined via the said 2nd through-hole may be sufficient.

  The manufacturing method of the connection member in this invention has the following processes, It is characterized by the above-mentioned.

(A) directly forming a connector having a mount portion and an elastic arm on a support member in a planar shape;
(B) removing the support member at a position facing the elastic arm to form a first through hole;
(C) The step of deforming the elastic arm in a direction away from the first through-hole or in a direction penetrating through the first through-hole.

  In the present invention, it is not necessary to provide a sacrificial layer between the support member and the connector. The sacrificial layer has a function of suppressing both the mount portion and the elastic arm on the support member in the step (a). The sacrificial layer between the elastic arm and the supporting member is removed in the step (b), and the elastic arm is thereby opened. On the other hand, the sacrificial layer between the mount part and the support member is not removed in the step (b), and the state where the mount part is supported on the support member is maintained. There is no need to provide such a sacrificial layer in the present invention. This is because, in the step (b), the support member located at the position facing the elastic arm is removed and a through hole is provided, and the elastic arm is opened by the removal of the support member. The elastic arm can be deformed as in the process.

  As described above, in the present invention, it is possible to form a connection member composed of a connector having a support member and an elastic arm by a very simple method as compared with the prior art.

In the present invention, during the step (a), different internal stresses are applied to the lower surface side and the upper surface side of the connector,
In the step (c), the elastic arm is deformed in a predetermined direction due to a difference in its internal stress.

  Through the above steps, the elastic arm of the connector can be easily deformed even if the connector is miniaturized in accordance with the miniaturization of the electronic member. In particular, the elastic arm can be deformed in a predetermined direction through a simple process of applying an internal stress difference to the elastic arm and removing a support member at a position facing the elastic arm.

  In the present invention, it is preferable to control the internal stress of the connector by changing the vacuum gas pressure at the time of the step (a) by using the sputter deposition method. Thereby, the internal stress of the connector can be controlled by a simple method.

  The manufacturing method of the connection member mounting structure according to the present invention is characterized in that the mount portion of the connection member described in any of the above is joined to the electrode portion of the electronic member. In such a case, it is appropriate and simple to connect the mount part to the electrode part of the electronic member from the surface opposite to the joint surface with the support member. This is preferable. In such a case, deforming the elastic arm in the direction penetrating through the first through hole can form an elastic arm that protrudes from the surface of the electronic member toward the electronic member on the other side. The electronic members can be easily connected to each other via the elastic arm.

  Alternatively, the elastic arm may be deformed in a direction away from the first through hole. In such a case, a storage portion is formed at a position facing the elastic arm of the electronic member, and the mount portion and the electronic member are When joining with an electrode part, it is preferable to make the said elastic arm enter in the said accommodating part.

  In addition, a second through hole is formed in a part of the support member at a position facing the mount portion, and the mount portion exposed from the second through hole and the electrode portion of the electronic member are connected to the first portion. You may join through two through-holes.

  In the present invention, the connector is formed to have a mount portion directly joined to the support member and an elastic arm extending from the mount portion, and the support member has a first position at a position facing the elastic arm. Through-holes are formed, and the elastic arm is deformed in a direction away from the first through-hole, or deformed in a direction penetrating through the first through-hole. As a result, the connection member having the elastic arm can be finely formed in a simple form, and the distortion caused by the difference in the thermal expansion coefficient of the electronic member can be appropriately absorbed, so that the conductive connection between the electronic members is ensured. It is possible to prevent the occurrence of an electrical short circuit at a place other than the contact.

  In the connection member manufacturing method of the present invention, there is no need to form a sacrificial layer between the support member and the connector. Therefore, in the present invention, a connecting member comprising a connector having a support member and an elastic arm can be formed by a very simple method as compared with the prior art.

  1, 3, 4, and 6 are partial cross-sectional views illustrating a substrate, an electronic component, and a connection member according to the present embodiment, and FIGS. 2 and 5 are portions of the connection member according to an embodiment different from FIG. 1. FIG.

  In the following, the term “deformation” is frequently used for the elastic arm of the connection member. In this specification, the term “deformation” refers to a state in which the deformation is not in the same planar form as the mount portion of the connection member, but is distorted upward or downward as viewed from the mount portion. In addition, a member that is electrically connected via the “connecting member” of the present embodiment corresponds to an “electronic member” in this specification. The electronic member is an electronic component such as an IC, a circuit board, or the like.

  As shown in FIG. 1, an electronic component 2 is attached on a circuit board 1 made of an insulating material. The electronic component 2 is an IC, a capacitor, a transistor, or the like. The electronic component 2 may be a bare chip or may be packaged.

  As shown in FIG. 1, an electrode portion 2 a made of, for example, Al is formed on the lower surface of the electronic component 2.

  The electrode portion 2a is conductively connected to an electrode pattern (not shown) formed on the circuit board 1 through a connection member 3 described below.

  As shown in FIG. 1, a connection member 3 is provided below the electrode portion 2a. The connecting member 3 includes a connector 5 and an insulating support member 6 made of polyimide or the like. The support member 6 is formed in a sheet shape.

  The connector 5 includes a mount portion 5a and an elastic arm 5b, and the surface of the connector 5 is covered with a metal film 7 made of Au or the like except for the lower surface of the mount portion 5a. ing. The metal coating 7 is, for example, plated as will be described later, and the metal coating 7 formed on the mount portion 5a functions as a bonding layer with the electrode portion 2a of the electronic component 2, The upper surface of the mount portion 5a of the connector 5 is firmly joined to the electrode portion 2a via the metal film 7 by ultrasonic welding or the like.

  As shown in FIG. 1, the mount 5 a of the connector 5 is directly joined on the support member 6. As will be described later, the connector 5 is formed on the support member 6 by sputtering or the like.

  As shown in FIG. 1, each connector 5 has an elastic arm 5b extending in one direction from the mount portion 5a, and the elastic arm 5b bends downward from a height position of the mount portion 5a. Yes.

  The elastic arm 5b is deformed into a curved shape as shown in FIG. 1 on the upper surface side and the lower surface side of the elastic arm 5b based on the internal stress difference given in different sizes. Specifically, compressive stress is applied to the lower surface side of the elastic arm 5b, while tensile stress is applied to the upper surface side of the elastic arm 5b. As a result, the elastic arm 5b is deformed downward.

  As shown in FIG. 1, a through hole (first through hole) 10 is formed in the support member 6 at a position facing the elastic arm 5 b in the height direction, and the elastic arm 5 b is formed in the through hole 10. The tip 5b1 of the elastic arm 5b protrudes downward from the lower surface of the support member 6. The tip 5b1 is electrically connected to a predetermined electrode pattern provided on the circuit board 1. That is, in the embodiment of FIG. 1, the tip 5b1 functions as a contact.

  In the form shown in FIG. 1, the electrode part 2 a of the electronic component 2 is conductively connected to the circuit board 1 through the elastic arm 5 b of the connector 5. By providing such a connection member 3 below the electrode portion 2a, electrical connection between the circuit board 1 and the electronic component 2 can be ensured.

  Further, when the electronic component 2 is conductively connected to the circuit board 1, even if the height dimension between each electrode portion 2a and the circuit board 1 is slightly different, the connector 5 deformed downward is Due to the elastic force, when the tip 5b1 of the connector 5 is brought into contact with a predetermined electrode pattern of the circuit board 1, the elastic arm 5b of the connector 5 is elastically deformed by the elastic force, Each connector 5 can be reliably electrically connected to the electrode pattern of the circuit board 1.

  Moreover, even if there is a large difference in the thermal expansion coefficient between the electronic component 2 and the circuit board 1, the elastic arm 5b of the connector 5 having elasticity can absorb the distortion caused by the thermal expansion coefficient difference, The electronic component 2 and the circuit board 1 can be reliably connected to each other.

  In addition, connectors 5 corresponding to the number of electrode portions 2a of the electronic component 2 are attached to the support member 6, and a plurality of mount portions 5a of the connectors 5 are simultaneously attached under the electrode portions 2a of the electronic component 2. Can be bonded. Conventionally, the individual spring members are individually joined under the electrode portions 2a of the electronic component 2, but in the present embodiment, the support member 6 corresponds to the number of electrode portions 2a of the electronic component 2. Since the connector 5 is attached, the support member 6 can be arranged under the electrode portion 2a of the electronic component 2 and a plurality of connectors 5 can be simultaneously joined under the electrode portion 2a by ultrasonic welding or the like. It is.

  Further, when the connector 5 is viewed from the circuit board 1 side, only a part of the elastic arm 5 b is visible, and the other part is covered with the support member 6. Therefore, even if the elastic arm 5b is elastically deformed by an impact or the like, and the distance H1 between the electronic component 2 and the circuit board 1 approaches, the mount portion 5a does not come into contact with the circuit board 1, It is possible to appropriately prevent an electrical short circuit other than at a location. Moreover, since the said supporting member 6 is formed with the organic insulating sheet, while being able to prevent appropriately an electrical short circuit other than the above-mentioned contact location, according to the manufacturing method mentioned later, especially the said supporting member 6 and a connector 5, there is no need to provide a sacrificial layer for preventing the mount 5 a from being deformed based on its own internal stress, and the elastic arm 5 b is deformed in a predetermined direction with a simple structure. The connecting member 3 can be formed. Further, by providing the support member 6, for example, an adhesive or the like is interposed in the gap between the support member 6 and the electronic component 2, and it is easy to more firmly join the connection member 3 to the electronic component 2. it can.

  If a part of the elastic arm 5b of the connector 5 extends at least onto the through hole 10 and a part of the elastic arm 5b is seen from the through hole 10 when viewed from the circuit board 1 side, the elastic arm 5b. Even though the through hole 10 does not protrude downward from the lower surface of the support member 6, the electrode pattern of the circuit board 1 and the elastic arm 5b are electrically connected using a conductive adhesive or the like. However, when the tip 5b1 of the connector 5 protrudes downward from the lower surface of the support member 6, an electrical test or the like is performed before joining the elastic arm 5b and the electrode pattern, as will be described later. It is preferable that the electrical connection between the electronic component 2 and the circuit board 1 can be ensured.

  Next, the dimensions of the connecting member 3 will be described. The thickness of the connector 5 is formed in the range of 6 μm to 100 μm. Moreover, the pitch T1 (refer FIG. 1) between each connector 5 is about 20-100 micrometers. Further, the protrusion amount σ (see FIG. 1) of the connector 5 from the support member 6 is about 10 to 100 μm.

  The protrusion amount σ of the connector 5 is such that the tip 5b1 of the elastic arm 5b faces the lower surface of the support member 6 (the electronic component 2 (one electronic member) to which the mount portion 5a of the connector 5 is fixed). The stress required to distort the same surface as the surface 6b of the support member 6 facing the other electronic member (circuit board 1) is set to be smaller than the yield point. As a result, even if the tip 5b1 of the elastic arm 5b is bent to the same plane as the lower surface 6b of the support member 6 due to an impact or the like, the impact is removed and the space between the support member 6 and the circuit board 1 is again separated. 1, the elastic arm 5b is elastically deformed downward (restored to the state shown in FIG. 1) while maintaining the state of being in contact with the circuit board 1 as shown in FIG. 1, and the elastic arm 5b serves as an elastic contact. Acts properly.

  Further, the tip 5b1 of the connector 5 of the connection member 3 attached to the electronic component 2 and the electrode pattern of the circuit board 1 are joined by, for example, conductive adhesive, soldering, welding, etc. Before performing, for example, a desired electrical test is performed in a state where the electronic component 2 and the circuit board 1 are electrically temporarily connected via the connection member 3 as shown in FIG. The elastic arm 5b and the circuit board 1 can be joined by the conductive adhesive or the like. Although not particularly shown, for example, a fixing member that holds the upper surface of the electronic component 2 in the direction of the circuit board 1 may be provided on the circuit board 1 or the like. In such a case, in particular, the tip 5b1 and the circuit board 1 The tip 5b1 may simply be brought into contact with the electrode pattern without joining the electrode pattern by a conductive adhesive, soldering, welding or the like.

  Further, the metal coating 7 formed on the surface of the connector 5 functions as a bonding layer with the electrode portion 2a of the electronic component 2 as described above, and the mount portion 5a and the electrode of the connector 5 are formed by ultrasonic welding or the like. The part 2 a can be firmly bonded to the metal film 7 via the metal film 7. Further, since the metal film 7 is formed of a noble metal such as Au having excellent electrical conductivity or a film of Ni, the electrical connectivity between the electronic component 2 and the circuit board 1 can be improved, and rusting can be achieved. It is also possible to suppress the deterioration of conductivity due to the like.

  The connection member 15 in FIG. 2 is partially different in structure from the connection member 3 in FIG. In FIG. 2, the connection member 15 includes a support member 6 and a connector 16. A through hole 10 is formed in the support member 6 as in FIG. The connector 16 is formed on the upper surface of the support member 6, and the mount portion 16 a of the connector 16 is directly joined to the support member 6. The mount portion 16a is formed in a planar shape, and the elastic arm 16b extending integrally with the mount portion 16a from the mount portion 16a is deformed upward. In other words, the elastic arm 16 b is deformed in a direction away from the through hole 10. Similarly to FIG. 1, the surface of the connector 16 is covered with a metal film 7 made of Au or the like except for the lower surface of the mount portion 16a.

  In the connecting member 15 shown in FIG. 2, the elastic arm 16b is deformed in a direction away from the through hole 10 formed in the support member 6, and this point is different from the connecting member 3 shown in FIG. . As shown in FIG. 2, in order to deform the elastic arm 16b upward, a tensile stress may be applied to the lower surface side of the elastic arm 16b, and a compressive stress may be applied to the upper surface side.

  The connecting member 15 shown in FIG. 2 is used in a state as shown in FIG. 3, for example. Reference numeral 19 denotes an electronic component such as an IC, a capacitor, or a transistor. An electrode portion 19 a is formed on the lower surface of the electronic component 19. In FIG. 3, the electrode portion 19a has a BGA shape, but the shape of the electrode portion 19a, such as LGA or CGA, is not particularly limited.

  Reference numeral 20 denotes a mother board (circuit board). An electrode portion 20 a is formed on the mother substrate 20. An attachment substrate 21 for attaching the connection member 15 is provided on the mother substrate 20. A through hole 22 is formed in the mounting substrate 21 as shown in FIG. A conductive portion 23 made of a conductive material is formed on the inner wall surface 22a of the through hole 22 by a sputtering method or the like. An upper connection portion 24 is formed on the upper surface of the mounting substrate 21 by sputtering or the like, a lower connection portion 25 is formed on the lower surface of the mounting substrate 21, and both the upper connection portion 24 and the lower connection portion 25 are provided. The conductive part 23 is electrically connected.

  In the state where the connection member 15 is turned upside down from the state of FIG. 2, that is, in the state where the connector 16 is provided on the lower surface side of the support member 6 and the elastic arm 16b is deformed downward, the mount portion 16a. Is connected to the upper connection portion 24 of the mounting substrate 21 through, for example, a conductive adhesive 26. Alternatively, the metal film 7 formed on the mount portion 16a and the upper connection portion 24 of the mounting substrate 21 may be joined by ultrasonic welding, solder, or the like. As shown in FIG. 3, the elastic arm 16b enters the through hole 22 formed in the mounting substrate 21, and is supported by the mounting substrate 21 while maintaining a deformed state. The electronic component 19 moves downward in the figure, and the electrode portion 19a of the electronic component 19 passes through the through hole 10 formed in the support member 6 and contacts the elastic arm 16b. Further, when the electronic component 19 moves downward, the electrode portion 19a elastically deforms the elastic arm 16b downward while maintaining a state in contact with the elastic arm 16b. Thus, even if the elastic arm 16b is deformed in the direction of the mounting substrate 21, by forming the through hole 22 in the mounting substrate 21, the elastic arm 16b can be placed in the through hole 22 and the elastic arm 16b. The elastic arm 16b and the electrode part 19a of the electronic component 19 can be appropriately conductively connected without being hindered from being deformed. The mounting substrate 21 may be formed with a recess instead of the through hole 22. The shape of the storage portion is not particularly limited as long as a storage portion capable of storing the elastic arm 16b is formed without inhibiting the deformation of the elastic arm 16b. Further, for example, the elastic arm 16b and the electrode portion 19a of the electronic component 19 may or may not be joined by a conductive adhesive or the like. When not joining, for example, the mother board 20, the mounting board 21, and the connection member 15 shown in FIG. 3 can be used as a burn-in board used in the burn-in test. In the embodiment shown in FIG. 3, the elastic arm 16b may naturally be deformed upward. In this case, the elastic arm 16 b passes through the through hole 10 formed in the support member 6 and protrudes upward from the upper surface of the support member 6. When the elastic arm 16b is pressed downward by the electrode portion 19a, the elastic arm 16b is elastically deformed downward. At this time, the elastic arm 16b can be deformed to the inside of the through hole 22. It has become.

  The connection member 30 attached on the circuit board 1 shown in FIG. 4 has substantially the same form as the connection member 15 shown in FIG. The connecting member 30 includes a connector 16 and a support member 6, and the elastic arm 16b of the connector 16 is deformed upward as in FIG. A first through hole 10 is formed in the support member 6 at a position facing the elastic arm 16b in the height direction. The support member 6 is formed with a second through hole 31 in a part of the support member 6 facing the mount 16a of the connector 16 in the height direction. The connection member 30 shown in FIG. 4 is different from the connection member 15 shown in FIG. 2 in that the second through hole 31 is formed.

  As shown in FIG. 4, the lower surface of the mount portion 16 a is exposed from the second through hole 31. The exposed lower surface of the mount portion 16a functions as a contact point. As shown in FIG. 4, an electrode portion 33 is formed on the circuit board 1, and the electrode portion 33 enters the second through hole 31 so that the electrode portion 33 and the mount portion 16a are electrically connected. Become. For example, a conductive adhesive 32 is interposed between the support member 6 and the circuit board 1, and the support member 5 and the circuit board 1 are joined. The electrode portion 33 may be, for example, a solder bump, and the circuit board 1 and the mount portion 16a may be in a soldered state. Alternatively, the mount portion 16a and the electrode portion 33 may be joined by ultrasonic welding or the like. The elastic arm 16b of the connector 16 of the connecting member 30 mounted on the circuit board 1 is deformed upward and functions as a contact point with the electrode portion 19a of the electronic component 19. When the electronic component 19 moves downward, the electrode portion 19a and the elastic arm 16b come into contact with each other, and the elastic arm 16b is elastically deformed downward.

  In the embodiment shown in FIG. 4, the elastic arm 16 b is used as a contact point with the electronic component 19, and the lower surface of the mount portion 16 a is used as a contact point with the circuit board 1. As a result, the elastic arm 16b is deformed in the direction away from the first through hole 10 formed in the support member 6, but is also deformed in the direction away from the circuit board 1. Thus, the electrode portion 19a and the elastic arm 16b can be electrically connected without providing a storage portion formed by a recess or the like for allowing the elastic arm 16b to enter the circuit board 1 to which the connection member 30 is attached. (It is also possible to provide a storage portion in the embodiment shown in FIG. 4). Note that the elastic arm 16b of FIG. 4 may be deformed toward the circuit board 1, that is, downward. In such a case, the circuit board 1 needs to be formed with a storage portion into which the elastic arm 16b is inserted.

  In the embodiment shown in FIG. 5, the connector 40 is formed by a two-layer structure of a lower layer 41 and an upper layer 42. The lower layer 41 and the upper layer 42 are both formed of a conductive material, but are different in material. The lower layer 41 of the connector 40 has a compressive stress, and the upper layer 42 has a tensile stress. Thereby, the elastic arm 40 b of the connector 40 is deformed downward through the through hole 10 of the support member 6. The connector 40 may be composed of a lower layer 41 and an upper layer 42 having different materials and different internal stresses as shown in FIG. 5, or, as will be described later, the connecting member is formed using a sputter deposition method. In this case, the internal stress of the connection member may be controlled by changing the vacuum gas pressure.

  In each embodiment, the connectors 5, 16, and 40 are formed by a thin film by sputtering deposition, electron beam deposition, molecular beam epitaxial growth, chemical vapor deposition, electrolytic plating, or the like. preferable. Since the connectors 5, 16, and 40 are formed of thin films, the connectors 5, 16, and 40 can be reduced in size and thickness, so that the connection structure between the circuit board 1 and the electronic component 2 is appropriately miniaturized. I can do it. The connector 5 is formed of a conductive material to ensure electrical connectivity between the electronic members (for example, between the electronic component 2 and the circuit board 1 in FIG. 1), and can be exemplified by a NiZr alloy, for example.

  Incidentally, the connectors 5, 16, and 40 are not limited to the shapes shown in FIGS. 1 to 5, and for example, the planar shape when the connector 5 is viewed from directly above may be a spiral shape or the like. The form will be described with reference to FIG.

  In FIG. 6, the mount part 50a of the connector 50 is directly formed on the upper surface of the support member 6 constituting the connection member 60, and the elastic arm 50b integrally formed with the mount part 50a extends from the winding start end 50b1 to the winding end (tip). 50b2 is formed so as to protrude downward through a through hole 10 formed in the support member 6 in a spiral staircase shape.

  As shown in FIG. 6, the tip 50 b 2 of the elastic arm 50 b of the connector 50 is conductively connected on the electrode pattern of the circuit board 1.

  In the embodiment shown in FIG. 6, the elastic arm 50b of the connector 50 is formed so as to project in a spiral staircase shape, and the elastic arm 50b functioning as an elastic contact is elastically deformed in the vertical direction. The conductive connection between the components 2 can be ensured.

  The elastic arm 50b of the connector 50 has a difference in internal stress between the lower surface side and the upper surface side, and is three-dimensionally formed in a spiral step shape using the difference in the internal stress.

  Each of the connectors 5, 16, 40, 50 described above has a difference in internal stress between the upper surface side and the lower surface side, and the elastic arm is deformed using the difference in the internal stress. However, in addition to the form in which it is deformed by its own force due to the difference in internal stress, a form in which the elastic arm is mechanically deformed using, for example, a jig may be used. For example, a connector mainly made of Ni having springiness is formed, and a portion corresponding to the elastic arm is three-dimensionally deformed by a jig.

Next, a method for manufacturing the connection member 3 will be described.
A method for manufacturing the connecting member 3 shown in FIG. 1 will be described with reference to FIGS. Each figure is a partial cross-sectional view of the connecting member 3 during the manufacturing process.

  In FIG. 7, the support member 6 is attached to the surface 11 a of the work table 11. The work table 11 is formed of, for example, copper foil. A through hole 12 is formed in the work table 11 in advance. The through hole 12 is for forming the through hole 10 shown in FIG. 1 with respect to the support member 6, and the work table 11 is matched to the position and number of the through holes 10 to be provided in the support member 6. A through hole 12 is formed.

  The support member 6 is an organic insulating resin sheet formed of, for example, polyimide. Although not shown, a release layer made of, for example, a thermoplastic resin may be formed on the surface 11a of the work table 11.

  In the step shown in FIG. 8, a conductive layer 13 that will later become the connector 5 is formed directly on the entire surface 6a of the support member 6 by, for example, a sputter deposition method. Specifically, the conductive layer 13 is formed of a NiZr alloy (Ni added at 1 at%), MoCr, or the like.

  When the conductive layer 13 is formed by the sputter deposition method, the conductive layer 13 is formed by sputtering while gradually changing the vacuum gas pressure (for example, using Ar gas), and the conductive layer 13 is formed on the lower surface side of the conductive layer 13. A compressive stress is applied to the upper surface side as a tensile stress.

  In the step shown in FIG. 9, a mask layer 14 such as a resist is formed on the conductive layer 13. The mask layer 14 is first applied to the entire surface of the conductive layer 13 by spin coating or the like, and is patterned in the same shape as the connector 5 by exposure and development.

  In the step shown in FIG. 9, the conductive layer 13 not covered with the mask layer 14 is removed by an etching method. For the etching, ion milling, reactive ion etching, plasma etching, or the like can be used. By this etching process, the conductive layer 13 remains in the same shape as the connector 5. In the following process, the conductive layer 13 left in the process of FIG. 9 is referred to as a connector 5 in order to match the name and symbol with those of FIG.

  In the step shown in FIG. 10, the mask layer 14 formed of the resist or the like is removed by immersing it in a solution.

  In the step shown in FIG. 11, the through hole 10 is formed in the support member 6 from the through hole 12 formed in the work table 11 by an etching method, laser processing, or the like. As shown in FIG. 11, the connector 5 at a position facing the through hole 10 in the height direction is an elastic arm 5b, and the mount 5a of the connector 5 is a support in which the through hole 10 is not formed. It is formed on the member 6. In the etching, selective etching is used, and only the support member 6 is selectively etched to form the through hole 10. By forming the through hole 10 by etching or laser processing as described above, the width of the through hole 10 can be finely and accurately formed to about a dozen μm.

  In the process shown in FIG. 11, by forming the through hole 10 in the support member 6, the opened elastic arm 5b undergoes elastic deformation based on the difference in internal stress (state of FIG. 12). As described above, in the step of forming the conductive layer 13 in FIG. 8, the conductive layer 13 is formed on the support member 6 while making a difference in internal stress between the lower surface side and the upper surface side. At this time, since the conductive layer 13 formed on the support member 6 is bonded to the support member 6 and is in a restrained state, it is not deformable and maintains a planar shape. Then, when part of the support member 6 is removed and the through hole 10 is formed, the restraining force from the support member 6 to the elastic arm 5b is lost, and the elastic arm 5b is free to move up and down without any restraint. It becomes a state. At this time, since the compressive stress is applied to the lower surface side of the connector 5 and the tensile stress is applied to the upper surface side, the elastic arm 5b is deformed downward in a curved shape. As shown in FIG. 12, since the elastic arm 5b enters the through holes 10 and 12 provided in the support member 6 and the work table 11, the deformation based on the internal stress difference of the elastic arm 5b is not hindered.

  Further, the mount portion 5a of the connector 5 maintains a planar form joined to the upper surface of the support member 6, and the mount portion 5a is not deformed.

  In the step shown in FIG. 13, a precious metal such as Au or a metal film 7 of Ni is plated on the entire exposed surface of the connector 5 by an electrolytic plating method or the like. Since the lower surface of the mount portion 5a is joined to the support member 6 in the connector 5, the lower surface of the mount portion 5a is not exposed and the entire surface of the connector 5 except the lower surface of the mount portion 5a. Then, the metal film 7 is formed. The metal coating 7 may not be formed. However, if the metal coating 7 is formed, the conductive deterioration due to the rust of the connector 5 can be suppressed, and the conductive connection between the circuit board 1 and the electronic component 2 can be improved. This is preferable. In addition, the bonding of the electronic component 2 with the electrode portion 2a can be improved.

  Next, the electrode portion 2a formed on the electronic component 2 such as an IC shown in FIG. 1 is a surface opposite to the surface on which the support member 6 of the mount portion 5a of the connector 5 is attached (upper surface in FIG. 1). The mounting portion 5a of the connector 5 is joined to the electrode portion 2a by, for example, ultrasonic welding.

  In this way, the metal coating 7 can function as a bonding layer. For example, the mount 5a of the connector 5 can be bonded to the electrode 2a by ultrasonic welding. That is, since the mount 5a of the connector 5 can be easily joined to the electrode 2a without using a conductive adhesive or the like, the manufacturing process can be simplified.

  Further, after the connector 5 is joined under the electrode portion 2a, the work table 11 is removed. An etching method or the like may be used as a removal method. However, if a release layer is previously provided between the work table 11 and the support member 6 in the step of FIG. 7, the work table 11 can be easily removed from the release layer. In addition, since the detached work table 11 can be used again, an increase in manufacturing cost can be suppressed.

  For example, the connecting member 3 may be heat-treated between the step of FIG. 12 and the step of FIG. 13, that is, before the electronic component 2 is attached. By this heat treatment, the internal stress in the elastic arm 5b of the connector 5 can be further increased and can be easily deformed into a curved shape.

  In the present embodiment, in FIG. 8, in the step of applying different internal stresses on the lower surface side and the upper surface side of the connector 5 (conductive layer 13), the connector 5 (conductive layer 13) is directly attached to the support member. 6 is characterized in that a film is formed on 6 (that is, no adhesive or the like is used). That is, when the connector 5 is formed on the support member 6, it is not necessary to provide a sacrificial layer between the connector 5 and the support member 6. For example, when the connector 5 is directly formed on the circuit board 1 (that is, there is no support member 6), the sacrificial layer is first formed on the circuit board 1, and the connector 5 is formed thereon. . After that, when the sacrificial layer under the mount 5a of the connector 5 is left as it is and the sacrificial layer under the elastic arm is removed, the elastic arm that is no longer restrained by the sacrificial layer has its own internal stress difference. Deforms based on Alternatively, even when the support member 6 is not formed with the through hole 10, the sacrificial layer is necessarily required.

  However, in the manufacturing method shown in FIGS. 7 to 13, since the through hole 10 is formed in the support member 6 at a position facing the elastic arm 5 b in the height direction, the elastic arm is formed by forming the through hole 10. 5b can be in an open state without any restriction on the upper and lower sides, the formation of the sacrificial layer is not particularly required, and the connection member 3 can be formed by a simple manufacturing process.

  The support member 6 is preferably an organic insulating sheet. When the support member 6 is formed of an organic insulating sheet, the connector 5 can be formed into a predetermined shape without affecting the support member 6 by selective etching in the step of FIG. 9, and selected in the step of FIG. Through the etching, the through hole 10 can be appropriately and easily formed in the support member 6 without affecting the connector 5.

  In addition, since the plurality of connectors 5 formed according to the number of electrode portions 2a of the electronic component 2 and the interval between the electrode portions 2a can be fixedly supported on the support member 6, the mount portions 5a of the plurality of connectors 5 can be simultaneously attached to the support member 6. This is preferable because it can be joined under the electrode portion 2a of the electronic component 2 and the manufacturing process can be simplified. In addition, since the plurality of connectors 5 are attached to the sheet-like support member 6, the connectors 5 are not separated before joining to the electronic component 2, and transportation of the connection members 3 is easy. Can be done.

  The work table 11 in the step of FIG. 7 may not be used, but it is preferable to use it because the manufacturing process can be facilitated. A through hole 10 is formed in the support member 6 in the step of FIG. 11, but the through hole 10 can be easily and reliably formed in the support member 6 using the through hole 12 formed in the work table 11. In addition, the conductive layer 13 can be easily formed on the support member 6 by placing the soft support member 6 on the work table 11 that is harder than the support member 6. The work table 11 has a through hole 12 formed from the beginning, but the through hole 12 is in any stage up to the step of FIG. 11 (that is, before the through hole 10 is formed in the support member 6). What is necessary is just to form.

  When the conductive layer 13 is formed in the step of FIG. 8, if the tensile stress is applied to the lower surface side and the compressive stress is applied to the upper surface side, the elastic arm 5b is directed upward in FIG. Deforms toward the direction away from The connection member 15 shown in FIG. 2 is attached to the mounting substrate 21 shown in FIG. 3 using a conductive adhesive 26, or the second through hole is formed in the support member 6 below the mount portion 16a as shown in FIG. 31 may be formed, and the mount portion 16 a and the electrode portion 33 of the circuit board 1 may be joined via the second through hole 31.

  Further, in the above, the connector 5 is formed with a difference in internal stress, and the open elastic arm 5b is deformed by its own force by forming the through hole 10 in the support member 6 in the step of FIG. Although there is no difference in the internal stress of the connector 5 after forming the through hole 10 as shown in FIG. 11, the jig is inserted through the through hole 10 or from the upper side of the through hole 10. May be used to mechanically deform the elastic arm 5b upward or downward.

  Although the connection member used between electronic components, such as IC, and a circuit board was demonstrated above, the said connection member may be used between electronic components.

The board | substrate which shows embodiment in this invention, the electronic component, and the fragmentary sectional view which shows a connection member, The fragmentary sectional view of the connection member of embodiment different from FIG. FIG. 1 is a partial cross-sectional view showing a substrate, an electronic component, and a connection member according to an embodiment of the present invention different from FIG. FIG. 1 is a partial cross-sectional view showing a substrate, an electronic component, and a connection member according to an embodiment of the present invention different from FIG. The fragmentary sectional view of the connection member of embodiment different from FIG. FIG. 1 is a partial cross-sectional view showing a substrate, an electronic component, and a connection member according to an embodiment of the present invention different from FIG. 1 process drawing (partial expanded sectional view) for demonstrating the manufacturing method of the connection member shown in FIG. FIG. 7 is a process diagram (partial enlarged cross-sectional view) performed next to FIG. FIG. 8 is a process diagram (partially enlarged sectional view) performed next to FIG. FIG. 9 is a process diagram (partial enlarged cross-sectional view) performed next to FIG. FIG. 10 is a process diagram (partially enlarged sectional view) performed next to FIG. FIG. 11 is a process diagram (partial enlarged cross-sectional view) performed next to FIG. FIG. 12 is a process diagram (partially enlarged sectional view) performed next to FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Electronic component 3, 15, 30, 60 Connection member 5, 16, 40, 50 Connector 5a, 16a, 40a, 50a Mount part 5b, 16b, 40b, 50b Elastic arm 6 Support member 7 Metal coatings 10, 12 , 22, 31 Through-hole 11 Base 13 Conductive layer 20 Mask layer

Claims (18)

A support member and a connector;
The connector has a mount part directly joined to the support member, and an elastic arm extending from the mount part,
The support member is formed with a first through hole at a position facing the elastic arm,
The connection member, wherein the elastic arm is deformed in a direction away from the first through hole or deformed in a direction penetrating the first through hole.   The connection member according to claim 1, wherein the support member is formed of an organic insulating material.   The support member at a position facing a part of the mount portion is formed with a second through hole, and the mount portion exposed from the second through hole functions as a contact point. Connection member.   The connecting member according to claim 1, wherein the connector is formed as a thin film.   5. A connection member mounting structure, wherein the connection member according to claim 1 is attached to an electronic member.   The elastic arm is deformed in a direction penetrating through the first through hole, and the mount portion is joined to an electrode portion of the electronic member on a surface opposite to a joint surface with the support member. Item 6. The connecting member mounting structure according to Item 5.   The elastic arm is deformed in a direction away from the first through hole, and the mount portion is joined to the electrode portion of the electronic member on a surface opposite to the joint surface with the support member. The connecting member mounting structure described.   The connecting member mounting structure according to claim 7, wherein a storage portion is formed in the electronic member at a position facing the elastic arm, and the elastic arm enters the storage portion.   The connection member mounting structure according to claim 5, wherein the mount portion exposed from the second through hole and the electrode portion of the electronic member are joined via the second through hole. The manufacturing method of the connection member characterized by having the following processes.
(A) directly forming a connector having a mount portion and an elastic arm on a support member in a planar shape;
(B) removing the support member at a position facing the elastic arm to form a first through hole;
(C) The step of deforming the elastic arm in a direction away from the first through-hole or in a direction penetrating through the first through-hole. During the step (a), different internal stresses are applied on the lower surface side and the upper surface side of the connector,
The method for manufacturing a connection member according to claim 10, wherein, in the step (c), the elastic arm is deformed in a predetermined direction by a difference in its internal stress.   12. The method for manufacturing a connection member according to claim 11, wherein in the step (a), the connector is formed using a sputter deposition method, and the internal stress of the connector is controlled by changing the vacuum gas pressure.   A method for manufacturing a connecting member mounting structure, wherein the mounting portion of the connecting member according to any one of claims 10 to 12 is joined to an electrode portion of an electronic member.   The method for manufacturing a connection member mounting structure according to claim 13, wherein the mount portion is joined to the electrode portion of the electronic member from a surface opposite to the joint surface with the support member.   The manufacturing method of the connection member mounting structure according to claim 14, wherein the elastic arm is deformed in a direction penetrating into the first through hole.   The method for manufacturing a connection member mounting structure according to claim 14, wherein the elastic arm is deformed in a direction away from the first through hole.   The connection according to claim 16, wherein a storage portion is formed at a position facing the elastic arm of the electronic member, and the elastic arm is inserted into the storage portion when the mount portion and the electrode portion of the electronic member are joined. Manufacturing method of member mounting structure.   A second through hole is formed in a part of the support member at a position facing the mount portion, and the mount portion exposed from the second through hole and the electrode portion of the electronic member are connected to the second portion. The manufacturing method of the connection member mounting structure of Claim 13 joined through a through-hole.

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