JP6642746B2 - Package manufacturing method and light emitting device manufacturing method, and package and light emitting device - Google Patents

Description

The present invention relates to a method for manufacturing a package and a method for manufacturing a light emitting device, and a package and a light emitting device.

Conventionally, a package provided with a lead frame is manufactured by injecting a thermoplastic resin from the back side (for example, see Patent Documents 1 and 2). After the resin is cured, the lead frame is bent to form a light emitting device.
It is known that a package is formed by flowing a resin into a cavity for each lead frame of a molding die, curing the resin, and integrally molding a resin molded body with each lead frame ( For example, see Patent Document 3). In the method for manufacturing a package described in Patent Document 3, the lead frame is bent in advance before being installed in a molding die.

JP 2010-186896 A JP 2013-051296 A JP 2013-077813 A

In the light emitting devices described in Patent Literatures 1 and 2, the thickness of the package is increased because the resin is injected from the back side of the lead frame. Further, the thickness of a light emitting device using such a package has also been increased. Further, in the conventional light emitting device, it is troublesome to perform processing such as bending a lead frame of the package.

Therefore, an embodiment according to the present invention provides a manufacturing method for thinly and easily manufacturing a package and a light emitting device, and a thin package and a light emitting device.

The method for manufacturing a package according to the embodiment of the present disclosure includes the steps of:
Preparing a lead frame having a first electrode and a second electrode different from the first electrode; and forming the first electrode and the second electrode into upper and lower divided molds. Sandwiching the upper mold and the lower mold, and placing the first electrode and the second electrode in the mold outside the region where the package of the mold is to be formed. A step of injecting a first resin from an inlet formed next to the first electrode, a step of curing or solidifying the injected first resin, and a step of curing or solidifying the first resin And a step of cutting off an injection mark of the injection port of the first resin from a position adjacent to the first electrode.

Further, the method for manufacturing the light emitting device according to the embodiment of the present disclosure includes all steps in the method for manufacturing the package, and before or after the step of cutting or removing the injection mark after the first resin is cured or solidified. Mounting a light-emitting element on the first electrode or the second electrode at any later timing.

A package according to an embodiment of the present disclosure includes a first electrode, a second electrode having a polarity different from that of the first electrode, and fixing at least one of the bottom surface and the first electrode and the second electrode. A wall part forming a side wall of a bottomed recess formed by the first electrode and the second electrode;
And a flange protruding outward from the wall in plan view, wherein at least one of the first electrode and the second electrode protrudes outward from the wall in plan view. A lead portion, the outer lead portion has a second concave portion at the tip, and the flange portion is provided at the same thickness as the outer lead portion on both sides of the outer lead portion in plan view, 2. The flange is not provided in the recess.

A light emitting device according to an embodiment of the present disclosure includes the package, and a light emitting element mounted on at least one of the first electrode and the second electrode of the package.

In the manufacturing method of the package and the light emitting device according to the embodiment of the present disclosure, the resin injection port is provided at a position that becomes unnecessary after the resin is hardened or solidified. Thus, a thin package and a light emitting device can be easily manufactured.
Further, the package and the light emitting device according to the embodiment of the present disclosure can be made thinner than before.

It is a figure showing the outline of the package concerning an embodiment, and is a perspective view showing the whole package. It is a figure which shows the outline of the package which concerns on embodiment, and is a top view of a package. FIG. 3 is a view schematically showing a package according to the embodiment, and is a sectional view taken along the line III-III in FIG. 2. It is a figure showing the outline of the package concerning an embodiment, and is a bottom view of the package. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is a top view of a lead frame. FIG. 6 is a diagram schematically illustrating a manufacturing process of the package according to the embodiment, and is a sectional view taken along line VI-VI of FIG. 5. FIG. 10 is a cross-sectional view schematically showing a manufacturing process of the package according to the embodiment, schematically showing an arrangement of a lead frame and a mold at a position corresponding to line XX in FIG. 9. FIG. 10 is a diagram schematically illustrating a manufacturing process of the package according to the embodiment, and is a cross-sectional view schematically illustrating an arrangement of a lead frame and a mold at a position corresponding to line XI-XI in FIG. 9. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is a top view of the lead frame pinched by the upper metallic mold and the lower metallic mold. FIG. 10 is a view schematically showing a manufacturing process of the package according to the embodiment, and is a sectional view taken along the line XX of FIG. 9 after first resin injection. FIG. 10 is a view schematically showing a manufacturing process of the package according to the embodiment, and is a sectional view taken along the line XI-XI in FIG. 9 after the first resin injection. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is a schematic plan view of a package. FIG. 13 is a view schematically showing a manufacturing process of the package according to the embodiment, and is a sectional view taken along the line XIII-XIII of FIG. 12. It is a figure showing the outline of the light emitting device concerning an embodiment, and is a perspective view showing the whole light emitting device. It is a figure which shows the outline of the package which concerns on another embodiment, and is a perspective view which shows the whole package. It is a figure which shows the outline of the manufacturing process of the package which concerns on another embodiment, and is a top view of a lead frame. It is a figure which shows the outline of the manufacturing process of the package which concerns on another embodiment, and is a top view of the lead frame pinched by the upper metal mold | die and the lower metal mold | die. FIG. 18 is a view schematically showing a manufacturing process of a package according to another embodiment, and is a sectional view taken along the line XVIII-XVIII in FIG. 17 after first resin injection. FIG. 18 is a view schematically showing a manufacturing process of a package according to another embodiment, and is a sectional view taken along the line XIX-XIX of FIG. 17 after first resin injection. It is a figure which shows the outline of the light emitting device which concerns on other embodiment, and is a perspective view which shows the whole light emitting device.

Hereinafter, a method for manufacturing a package and a method for manufacturing a light emitting device, and a package and a light emitting device according to an embodiment will be described. Since the drawings referred to in the following description schematically show the present embodiment, the scale, interval, positional relationship, and the like of each member are exaggerated, or some of the members are not shown. May be. In the following description, the same names and reference numerals indicate the same or similar members in principle, and the detailed description thereof will be omitted as appropriate.

<Configuration of Package 100>
This will be described with reference to the drawings. FIG. 1 is a diagram schematically illustrating a package according to an embodiment, and is a perspective view illustrating the entire package. FIG. 2 is a diagram schematically illustrating the package according to the embodiment, and is a top view of the package. FIG. 3 is a view schematically showing a package according to the embodiment, and is a sectional view taken along the line III-III in FIG. FIG. 4 is a diagram schematically illustrating the package according to the embodiment, and is a bottom view of the package.
The package 100 has a substantially rectangular parallelepiped shape as a whole, and is formed in a cup shape having a concave portion (cavity) on an upper surface. The package 100 includes a first electrode 10, a second electrode 20, and a resin molded body 30 made of a first resin.

The first electrode 10 includes a first outer lead 11, a first inner lead 12,
It has. The first outer lead portion 11 is a lead portion located outside the wall portion 31 of the resin molded body 30. Although the shape of the first outer lead portion 11 is rectangular in plan view,
The shape is not limited to this, and may be partially notched, recessed, or provided with a through hole.

The first inner lead portion 12 is a lead portion located inside the wall portion 31 of the resin molded body 30 and below the wall portion 31. Although the shape of the first inner lead portion 12 is substantially rectangular in a plan view, the shape is not limited to this, and a portion having a cutout, a depression, or a through hole may be provided. In the rear view of the package 100, the width W1 of the first outer lead portion 11 exposed from the first resin is, here, the first inner lead portion 1 exposed from the first resin.
2 is shorter than the width W2.

The second electrode 20 includes a second outer lead portion 21, a second inner lead portion 22,
It has. The second outer lead portion 21 is a lead portion located outside the wall portion 31 of the resin molded body 30. Although the shape of the second outer lead portion 21 is rectangular in plan view,
The shape is not limited to this, and may be partially notched, recessed, or provided with a through hole.

The second inner lead portion 22 is a lead portion located inside the wall portion 31 of the resin molded body 30 and below the wall portion 31. Although the shape of the second inner lead portion 22 is substantially rectangular in a plan view, the shape is not limited to this, and a portion having a cutout, a dent, or a through hole may be provided. In the rear view of the package 100, the width W1 of the second outer lead portion 21 exposed from the first resin is equal to the width W1 of the second inner lead portion 2 exposed from the first resin.
2 is shorter than the width W2.

The first electrode 10 and the second electrode 20 are formed on the bottom surface of the package 100 so as to be exposed to the outside. The outside of the bottom surface of the package 100 is a surface on the side mounted on an external substrate. The first electrode 10 and the second electrode 20 are arranged apart from each other, and a resin molding 30 is interposed between the first electrode 10 and the second electrode 20. When used as a light emitting device, the first electrode 10 and the second electrode 20 correspond to an anode electrode and a cathode electrode, respectively, meaning that they have different conductivity.

The length, width, and thickness of the first electrode 10 and the second electrode 20 are not particularly limited, and can be appropriately selected depending on the purpose and application. The material of the first electrode 10 and the second electrode 20 is preferably, for example, copper or a copper alloy, and the outermost surface is preferably coated with a metal material having a high reflectance, such as silver or aluminum. .

The resin molded body 30 includes a wall portion 31 and a flange portion 32. The wall 31 has four rectangular sides formed on the first electrode 10 and the second electrode 20. The wall portion 31 is formed so as to sandwich the first electrode 10 and the second electrode 20 by two opposing sides of the rectangle. Thereby, the wall portion 31 can fix the first electrode 10 and the second electrode 20.

The wall portion 31 is formed so as to form a rectangular concave portion in plan view, and has a rectangular annular shape in plan view. The height, length, and width of the wall portion 31 are not particularly limited, and can be appropriately selected depending on the purpose and application.

The flange portion 32 is formed adjacent to the first outer lead portion 11 or the second outer lead portion 21, and four flange portions 32 are formed here in a plan view. The flange portions 32 project sideways from the wall portion 31 and are formed to have the same length and thickness as the first outer lead portion 11 and the second outer lead portion 21. First outer lead portion 11 and second outer lead portion 11
The outer lead portion 21 and the flange portion 32 are flush with each other. As will be described later, in the present embodiment, the first resin injection port is provided next to the first electrode 10 which is a position that becomes unnecessary after the first resin is cured or solidified. When the material is cured or solidified and cut off, one flange 32 remains next to the first electrode 10. The resin molded body 30
Although the number of the flanges 32 is provided, the number thereof may be one or more. When the flange is not provided, the outer surface of the wall 31 is formed flat from the upper surface to the bottom surface.

Examples of the material of the resin molded body 30 include a thermoplastic resin and a thermosetting resin.
In the case of a thermoplastic resin, for example, polyphthalamide resin, liquid crystal polymer, polybutylene terephthalate (PBT), unsaturated polyester, or the like can be used.
In the case of a thermosetting resin, for example, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, or the like can be used.
In order to efficiently reflect light on the inner peripheral surface of the wall portion 31 of the resin molded body 30, the resin molded body 30 may include a light reflecting member. The light reflecting member is a material having a high light reflectance such as a white filler such as titanium oxide, glass filler, silica, alumina, and zinc oxide. The reflectance is preferably such that the reflectance of visible light is 70% or more, or 80% or more. In particular,
The reflectance is preferably 70% or more, or 80% or more in the wavelength region emitted by the light emitting element. The content of titanium oxide and the like may be 5% by weight or more and 50% by weight or less.
0% by weight is preferred, but not limited thereto.

As described above, the thickness of the package 100 can be reduced because the resin injection port is provided at a position that becomes unnecessary after the resin is cured or solidified. In particular, the thickness on the back surface of the package, that is, the thickness of the flange 32 of the resin molded body 30, the first electrode 10, the second electrode 20, and the like can be made smaller than before. For this reason, heat dissipation during operation of the light emitting element and the like mounted on the package 100 can be improved.

<Method of Manufacturing Package 100>
Next, a method of manufacturing the package 100 will be described with reference to FIGS. FIG.
FIG. 3 is a plan view of a lead frame. FIG. 6 is a sectional view taken along the line VI-VI in FIG. FIG. 7 shows FIG.
It is sectional drawing which shows typically arrangement | positioning of a lead frame and a mold in the position corresponding to XX. FIG. 8 is a cross-sectional view schematically showing the arrangement of the lead frame and the mold at a position corresponding to line XI-XI in FIG. FIG. 9 is a top view of a lead frame sandwiched between an upper mold and a lower mold. FIG. 10 is a sectional view taken along the line XX of FIG. 9 after the first resin injection. FIG. 11 is a sectional view taken along the line XI-XI of FIG. 9 after the first resin injection. FIG. 12 is a schematic plan view of the package. FIG. 13 is a sectional view taken along arrow XIII-XIII in FIG.
The package manufacturing method of the present embodiment includes the following steps (1) to (5).

(1) Prepare a lead frame.
In the step (1), a lead frame 5 on a flat plate with a portion cut away is prepared. The lead frame 5 includes a first electrode 10 and a first electrode 1 in a region 600 where a package is to be formed.
And a second electrode 20 different from 0, and a gap is provided between the first electrode 10 and the second electrode 20. This gap preferably has a width equal to or greater than the thickness of the lead frame 5. Each of the first electrode 10 and the second electrode 20 has a substantially rectangular portion, and has a portion smaller than the width of the first electrode 10 and the width of the second electrode 20, and further forms a package. It is connected outside the scheduled area 600. The cutout of the lead frame 5 can be formed by punching, etching, or the like. Here, the package forming region 600 is a region that is separated from the lead frame 5 and that becomes the outer periphery of the bottom surface of the package 100 after molding. The first electrode 10 in the lead frame 5 is the first electrode 10 after molding.
Means a portion corresponding to the electrode 10 of FIG. Similarly, the second electrode 20 in the lead frame 5 means a portion corresponding to the second electrode 20 after molding, and refers to a state before the individualization. For the sake of simplicity, the lead frame 5 will be described as having one package forming region 600, but the number may be plural.

The lead frame 5 is a plate-shaped member, has a gap of a predetermined shape around the first electrode 10 and the second electrode 20, and the first electrode 10 and the second electrode 20 face each other. Parts are separated. The lead frame 5 includes a frame-shaped lead support 7 surrounding the first electrode 10 and the second electrode 20, and suspension leads 8 and 9.

The first electrode 10 has a portion corresponding to the first outer lead portion 11 after molding, and is connected to the lead support portion 7 by the suspension lead 8. The lead frame 5 has a first
The space 6a and the second space 6b are formed on both sides of the suspension lead 8. First space 6a
And the second space 6 b are formed on both sides of the first electrode 10. Note that, as described later, in the present embodiment, the first resin is injected from the first space 6a.

The portion of the second electrode 20 corresponding to the second outer lead portion 21 after molding is connected to the lead support portion 7 by the suspension lead 9. The lead frame 5 has a third
The space 6c and the fourth space 6d are formed on both sides of the suspension lead 9. Third space 6c
And the fourth space 6 d are formed on both sides of the second electrode 20.

(2) The lead frame is sandwiched between the upper mold and the lower mold.
In this step, the first electrode 10 and the second electrode 20 of the lead frame 5 are sandwiched between the upper mold 550 and the lower mold 560 of the mold 500 that is divided into upper and lower parts. In addition, for convenience of explanation, the lower surface of the lead frame 5 and the lower mold 560 are shown separated from each other, but the lead frame 5 is fixed to the lower mold 560.

The upper mold 550 of the mold 500 has a recess 501 corresponding to the wall 31 of the resin molded body 30 formed on the first electrode 10 and the second electrode 20. The upper mold 550
The first resin is injected into the recess 501 provided in the above. The recess 501 of the upper mold 550
Are connected in a ring shape. A through-hole serving as a gate 555 is formed in the upper mold 550 at a position different from the recess 501 and outside the recess 501 in plan view. The first resin is firmly sandwiched between the lead frame 5 and the upper mold 550 and the lower mold 560 so that the first resin does not enter the gap. When the first resin enters the gaps between the lead frame 5 and the upper mold 550 and the lower mold 560, and the first resin adheres to the surface of the lead frame 5 in the light emitting element mounting area, a deburring process is performed. Required.

(3) Inject the first resin into the mold.
The upper mold 550 of the mold 500 has a gate (injection port) 555 outside the region 600 where the package is to be formed. The cutout portion of the lead frame 5 is arranged in a portion corresponding to the gate 555 of the upper mold 550. The gate 555 is formed on one lead support 7 side outside the first electrode 10. Here, the first resin injected from the gate 555 is mixed with a light reflecting member in advance.

In this step, a gate adjacent to the first electrode 10 (first outer lead portion 11) in plan view is placed in a mold 500 in which the lead frame 5 is sandwiched between the upper mold 550 and the lower mold 560. From 555, the first resin is injected.
The first resin injected from the gate 555 is injected into the recess 501 of the upper mold 550 through the cutout of the lead frame 5. Here, one gate 555 is described,
A plurality of upper molds 550 can be provided. Although the gate 555 is provided in the upper mold 550, a gate may be provided in the lower mold 560, and the first resin may be injected from the lower mold 560 side.
In the step of injecting the first resin, a known molding method such as injection molding, transfer molding, or extrusion molding can be used.

(4) The injected first resin is cured or solidified.
In the present embodiment, as an example, the first resin is a thermosetting resin such as an epoxy resin. In this case, the step of injecting the first resin is a transfer mold. In the transfer molding, a pellet-shaped thermosetting resin (tablet) having a predetermined size is put in a predetermined container connected to the upper mold 550 in advance. In the case of transfer molding, the steps (2), (3) and (4) will be outlined below.

In the case of transfer molding, in the step (2), the lead frame 5 is fixed to the heated lower mold 560 and sandwiched between the similarly heated upper mold 550 and lower mold 560. In the step (3), a pressure is applied to a predetermined container connected to the upper mold 550 by, for example, a piston, so that the concave 5
In FIG. 1, a thermosetting resin (first resin) in a molten state is injected. In the step (4), the filled thermosetting resin (first resin) is heated. Then, the thermosetting resin cured (temporarily cured) by heating becomes the resin molded body 30.

When the first resin is a thermoplastic resin such as a polyphthalamide resin, the first resin can be formed by injection molding. In this case, the thermoplastic resin may be melted at a high temperature, placed in a low-temperature mold, and solidified by cooling.

The first resin thus injected is cured or solidified to form the wall 31 corresponding to the recess 501 of the upper mold 550 of the vertically divided mold 500.
(5) Cut off the injection mark at the injection port of the first resin.
After the first resin is cured or solidified, an injection mark at the injection port of the first resin is cut off. Also the first
And the lead frame 5 are cut to separate the package 100 into individual pieces. Here, as a jig for cutting the suspension leads 8 and 9, for example, a lead cutter can be used. The left and right short sides of the rectangle of the package forming area 600 are the suspension leads 8 and 9 of the lead frame 5.
And the resin molded body 30. The lead frame 5 at the position to be cut may be provided with a cutout or through hole such as a circle, an ellipse, a polygon, or a substantially polygon to reduce the area of the lead frame 5 to be cut.

In the present embodiment, when the package 100 is singulated from the lead frame 5, the suspension leads 8 and 9 are cut along the short sides of the package formation planned area 600. After the injection and curing or solidification of the first resin, the concave portion 501 of the upper mold 550 is filled with the resin molded body 30, so that the end portion of the resin molded body 30 is also cut at the same time.

By cutting the suspension leads 8 and 9 as described above, a gate mark (injection mark) 155 of the first resin can be cut off from the vicinity of the first electrode 10. As a result, no gate mark remains on the surface of the package 100. The cutting may be performed before the light emitting element is mounted or after the light emitting element is mounted. The package 100 can be manufactured through the steps (1) to (5).

In the conventional method, the resin is injected from the back side of the package. However, according to the method for manufacturing the package of the present embodiment, the first electrode 10 is located outside the region 600 where the package is to be formed.
, And the gate trace is cut off, so that the thickness of the package can be reduced.

Further, according to the package manufacturing method of the present embodiment, the step of bending the lead in the conventional package manufacturing method is not required, so that the labor for performing the bending process can be omitted.
In a conventional manufacturing method, for example, in a case where a prepared plate-shaped lead frame has a plurality of package forming regions in a two-dimensional array, the interval between them is a predetermined length in consideration of bending of the leads. On the other hand, according to the package manufacturing method of the present embodiment, it is not necessary to bend the lead, so that it is not necessary to secure the length of the lead in consideration of the bending. In other words, the package interval can be reduced by an amount not considering bending, so that the number of packages that can be taken out from the same plate-shaped lead frame can be increased as compared with the conventional case, and the frame (material) can be used effectively.

<Configuration of Light Emitting Device 1>
Next, the configuration of the light emitting device 1 will be described with reference to FIG. FIG. 14 is a diagram schematically illustrating the light emitting device according to the embodiment, and is a perspective view illustrating the entire light emitting device.
The light emitting device 1 includes a package 100, a light emitting element 200, a wire 250, and a sealing member 300 made of a second resin. The light emitting element 200 is mounted on the second electrode 20 of the package 100. The shape and size of the light emitting element 200 used here are not particularly limited. The emission color of the light emitting element 200 can be selected to have any wavelength according to the application. For example, a GaN-based or InGaN-based light emitting element can be used as a blue (light having a wavelength of 430 to 490 nm) light emitting element. As InGaN, In _X Al _Y
Ga _1- XYN (0 ≦ X ≦ 1, 0 ≦ Y ≦ 1, X + Y ≦ 1) or the like can be used.

The wire 250 is a conductive wiring for electrically connecting electronic components such as the light emitting element 200 and the protection element to the first electrode 10 and the second electrode 20. As a material of the wire 250,
Metals such as Au (gold), Ag (silver), Cu (copper), Pt (platinum), and Al (aluminum);
And those using alloys thereof, but it is particularly preferable to use Au having excellent thermal conductivity and the like. The thickness of the wire 250 is not particularly limited, and can be appropriately selected depending on the purpose and application.

The sealing member 300 covers the light emitting element 200 and the like mounted in the package 100. The sealing member 300 is provided to protect the light emitting element 200 and the like from external force, dust, moisture, and the like, and to improve heat resistance, weather resistance, and light resistance of the light emitting element 200 and the like. Examples of the material of the sealing member 300 include a transparent material such as a thermosetting resin, for example, a silicone resin, an epoxy resin, and a urea resin. In addition to such a material, a filler such as a fluorescent substance or a substance having a high light reflectance may be included in order to have a predetermined function.

The sealing member 300 can easily adjust the color tone of the light emitting device 1 by mixing a phosphor, for example. Note that as the fluorescent substance, a substance which has a higher specific gravity than the sealing member 300, absorbs light from the light emitting element 200, and converts the wavelength can be used. It is preferable that the specific gravity of the phosphor be larger than that of the sealing member 300 because the phosphor is settled on the first electrode 10 and the second electrode 20 sides.
Specifically, for example, a yellow phosphor such as YAG (Y ₃ Al ₅ O ₁₂ : Ce) or a silicate, or a red phosphor such as CASN (CaAlSiN ₃ : Eu) or KSF (K ₂ SiF ₆ : Mn) Can be mentioned.

As the filler to be contained in the sealing member 300, for example, SiO ₂ , TiO ₂ , Al ₂
A substance having high light reflectance such as O ₃ , ZrO ₂ , and MgO can be preferably used. Further, for the purpose of cutting out wavelengths that are not desired, for example, organic or inorganic coloring dyes or coloring pigments can be used.

<Manufacturing method of light emitting device 1>
(First manufacturing method)
In the first method of manufacturing the light emitting device 1, after the above-described steps (1) to (4) and before the step (5) of the entire steps for manufacturing the package 100, The light emitting element 200 is mounted. That is, the package 1 not separated from the lead frame 5
The light emitting device 200 is mounted on the second electrode 20 of FIG.

The light-emitting element 200 is an element having a single-sided electrode structure in which a pair of an n-electrode and a p-electrode are formed on an upper surface. In this case, the back surface of the light emitting element 200 is made of an insulating die bond member and the second electrode 2
0, one electrode on the upper surface is connected to the first electrode 10 by the wire 250, and the other electrode on the upper surface is connected to the second electrode 20 by the wire 250.

Subsequently, the sealing member 3 is inserted into the recess surrounded by the wall 31 of the resin molded body 30 of the package 100.
00, and the light emitting element 200 is sealed. At this time, the sealing member 300 is
To the upper surface of the recess. As a method of filling the sealing member 300 into the concave portion of the resin molded body 30, for example, injection, compression, extrusion, or the like can be used. However, since the air remaining in the concave portion of the resin molded body 30 can be effectively exhausted by dripping, it is preferable to fill the air by dripping.

(Second manufacturing method of light emitting device)
In the first manufacturing method of the light emitting device 1, the light emitting element 200 is mounted on the package 100 in advance and then manufactured into individual pieces, but in the second manufacturing method, the package
The light emitting device 200 may be mounted on the package 100 after all steps of manufacturing the light emitting device 200. That is, the light emitting element 200 is mounted on the individual package 100.

[Modification 1]
In the lead frame 5 shown in FIG. 5, the first space 6a and the second space 6b are formed on both sides of the suspension lead 8, but one space for injecting the first resin is provided. Only one of the first space 6a and the second space 6b may be provided.
In the upper mold 550 of the mold 500 shown in FIG. 9, one gate 555 is formed. However, two gates are formed at positions on both sides of the first electrode 10 and the two gates are formed. The first resin may be injected.
Further, a gate may be provided not only next to the first electrode 10 but also at a position corresponding to one side or both sides of the second electrode 20, and the first resin may be injected.

[Modification 2]
The shape of the lead frame 5 shown in FIG. 5 is an example. For example, the sizes of the first electrode 10 and the second electrode 20 may be equal or may be different from each other.
A through-hole may be provided in the center of the left and right short sides of the package forming region 600 indicated by a rectangular virtual line in FIG. In such a configuration, when the suspension leads 8 and 9 are cut, the portions of the through holes are cut to form castellations. Therefore, when the package is soldered to an external mounting board, for example, the fillet can be observed. In addition, in the step of cutting the suspension leads 8, 9, for example, the life of the blade of the lead cutter can be extended.

[Modification 3]
Assuming that two packages 100 shown in FIG.
A double-sized double-cavity package having shapes connected to each other on two sides may be manufactured. In this case, the package after molding has two concave portions (cavities) in the vertical direction in plan view. This double cavity package is package 100
And a high light output can be realized.

This double cavity package can be equivalent to a package in which two different specification packages 100 are closely arranged. For example, a phosphor may be contained in one concave portion of the resin molded body, and the phosphor may not be contained in the other concave portion. Alternatively, the first phosphor may be contained in one concave portion of the resin molded body, and the second phosphor may be contained in the other concave portion. To manufacture such a double cavity package, the following lead frame may be prepared.

That is, in the lead frame 5 shown in FIG.
Two sets of a package element composed of the first electrode 10 and the second electrode 20 are prepared in the vertical direction, a first space 6a is arranged between the two suspension leads 8, and between the two suspension leads 9. Third
Is arranged. At this time, the package formation region 600 indicated by a rectangular virtual line in FIG. 5 is enlarged in the vertical direction, and a region having two sets of package elements is set as a double cavity package formation region. In this case, the recess 501 of the upper mold 550 of the mold 500 shown in FIGS. 7 and 8 is deformed so as to correspond to the wall of the resin molded body of the double cavity package.

[Modification 4]
In the double cavity package of Modification 3, a wall portion between two concave portions of the resin molded body may be removed to manufacture a double-sized single cavity package. In this case, the package after molding has one concave portion (cavity) of the resin molded body, and 4
It has inner lead portions. Therefore, for example, with three inner lead portions as cathode electrodes (second electrodes), light emitting elements respectively corresponding to RGB are mounted on each cathode electrode,
The remaining one inner lead portion can be used as an anode electrode (first electrode). Further, the protection element may be mounted on the inner lead portion on which the light emitting element is not mounted. In order to manufacture such a single cavity package, a mold 500 shown in FIGS.
The recess 501 of the upper mold 550 may be deformed so as to correspond to the wall of the resin molded body of the single cavity package.

[Other Modifications]
The light-emitting element 200 may be, for example, an element having a counter electrode structure (double-sided electrode structure) in which an n-electrode (or p-electrode) is formed on the back surface of an element substrate. Further, the light emitting element 200 is not limited to the face-up type, and may be a face-down type. When a face-down type light-emitting element is used, a wire can be eliminated.

The light emitting element 200 can be mounted on the first electrode 10 instead of the second electrode 20. When the light emitting device 1 includes, for example, two light emitting elements 200, the first electrode 10 and the second electrode
The light emitting element 200 can be mounted on each of the electrodes 20. The protection element may be mounted on the inner lead portion on which the light emitting element is not mounted.

The shape of the wall portion 31 of the resin molded body 30 of the package 100 in plan view is not limited to the rectangular ring illustrated in FIG. 1. For example, the shape of the wall portion 31 is circular or oval in plan view. There may be.

<Configuration of Package 100B>
The package of Modification 2 will be described with reference to the drawings. FIG. 15 is a diagram schematically illustrating a package according to another embodiment, and is a perspective view illustrating the entire package. The same components as those of the package 100 in FIG. 1 are denoted by the same reference numerals, and the description will be omitted as appropriate.

The package 100 </ b> B includes a bottomed concave portion 110 that opens upward, a first outer surface (hereinafter, referred to as “gasso noodles”) 101, a second outer surface 102 adjacent to the first outer surface 101, A third outer surface 103 adjacent to the second outer surface 102 and opposed to the first outer surface 101
A fourth outer surface 104 adjacent to the first outer surface 101 and the third outer surface 103;
05. Here, the bottom surface 105 is a mounting surface of the package 100B. The package 100B includes a first electrode 10B, a second electrode 20B having a polarity different from that of the first electrode 10B, and a resin molded body 30B, and the bottom surface 105 is formed by these members.

The first electrode 10B has a first outer lead portion 11 protruding outward from the wall portion 31 in plan view (hereinafter, referred to as “slow” unless otherwise noted). The first outer lead portion 11 protrudes from the first outer surface 101 of the package 100B. As described above, the first outer lead portion 11 may be partially provided with a notch, a dent, or a through hole. Therefore, in the present embodiment, the first outer lead portion 11 has the second concave portion 50 at the tip. The second recess 50 is recessed in the depth direction when the package 100B is viewed from the side. Thereby, a fillet can be formed when the second recess 50 is soldered to an external mounting substrate, for example.

In the present embodiment, the second electrode 20B has the second outer lead portion 21 that projects outward from the wall portion 31 in plan view. The second outer lead portion 21 is
B protrudes from the third outer side surface 103. As described above, the second outer lead portion 2
1 may be partially provided with a notch, a dent, or a through-hole. Therefore, in this embodiment,
The second outer lead portion 21 has a second recess 50 at the tip. Package 1
00B, only one of the electrodes may have the second recess 50,
Alternatively, only one of the electrodes may have the outer lead portion.

As described above, it is preferable that the outermost surfaces of the first electrode 10B and the second electrode 20B are coated with a metal material having a high reflectance such as silver or aluminum.
Therefore, in the present embodiment, after a gap portion such as a through hole is provided in a lead frame prepared for manufacturing the package 100B, for example, silver, aluminum,
Plating such as copper and gold is applied. Therefore, the first electrode 10B and the second electrode 20B are plated.

Here, in the first electrode 10B, the distal end surface of the first outer lead portion 11 is not plated except for the side surface 51 of the second concave portion 50. The reason for not being plated is
This is because the side surface 43 of the outer lead portion 11 is a cut surface that appears when the package 100B is singulated.
On the other hand, since the upper surface 41 and the lower surface 42 of the first outer lead portion 11 and the side surface 51 of the second concave portion 50 are plated, the bonding strength with a conductive member such as solder is increased.
Similarly, in the second electrode 20 </ b> B, the second outer lead portion 21 has the upper surface 41 and the lower surface 42 and the side surface 51 of the second concave portion 50 plated, and the distal end surface has the side surface 51 of the second concave portion 50. Not plated except.

In the package 100B, the first inner lead portion 12 of the first electrode 10B and the second inner lead portion 22 of the second electrode 20B are plated. When a light emitting device is configured by mounting a light emitting element in the concave portion 110, the reflectance of light from the light emitting element can be increased.

The resin molded body 30B includes a wall 31 and a flange 32. The wall 31 and the flange 32 are integrally formed of the same material. Since it is integrally molded as described above, the strength of the wall portion 31 and the flange portion 32 can be increased.

The wall portion 31 fixes the first electrode 10B and the second electrode 20B, and has
Are constituted. The bottomed recess 110 has a shape that expands in the opening direction. At least a part of the bottom surface 110a of the bottomed recess 110 is configured by the first inner lead portion 12 of the first electrode 10B and the second inner lead portion 22 of the second electrode 20B.

The flange 32 projects outward from the wall 31 in plan view. The collar 32 is a package 1
00B protrudes from the first outer side surface 101. As described above, the flange portion 32 is provided on both sides of the first outer lead portion 11 in a plan view with the same thickness T as the first outer lead portion 11. The flange 32 is not provided in the second recess 50 of the first outer lead 11.

In the present embodiment, the other flange portions 32 project from the third outer side surface 103 of the package 100B, and have the same thickness as the second outer lead portions 21 on both sides of the second outer lead portions 21 in plan view. Is provided. The flange 32 is provided in the second recess 50 of the second outer lead 21.
Is not provided. Note that a flange may be provided only on both sides of one of the outer lead portions.

In the package 100B, the first electrode 10B protrudes from the first outer surface 101, and the second electrode 20B protrudes from the third outer surface 103.
The first electrode 10 </ b> B and the second electrode 20 </ b> B are not exposed on the outer side surface 104. That is, all of the second outer surface 102 and all of the fourth outer surface 104 are formed of the same material as the wall portion 31. Therefore, when the package 100B is bonded to an external mounting board, for example, by soldering, it is possible to reduce solder leakage to the second outer surface 102 and the fourth outer surface 104.

In the package 100B, the second outer surface 102 and the fourth outer surface 104 are partially recessed. The first recess 33 is formed at the lower end of the second outer surface 102 and has a bottom surface 105.
Is in communication with Further, another first recess 33 is formed at the lower end of the fourth outer surface 104 and communicates with the bottom surface 105. These first recesses 33 are provided in the package 100B.
Are traces of two hanger leads formed in advance on a lead frame used in the manufacture of the present invention. For example, when the lead frame 705 shown in FIG. 16 is used for manufacturing the package 100B, the shape of the first recess 33 in a plan view becomes a trapezoid like the shape of the hanger leads 711 and 712 shown in FIG. The height of the trapezoid is equal to the length of the first recess 33 in the depth direction.

The first recess 33 has the same thickness as the first and second outer lead portions 11 and 21. That is, the length (height H) of the first recess 33 in the vertical direction of the package 100B is
It is the same as the thickness T of the first and second outer lead portions 11 and 21.

<Method for Manufacturing Package 100B>
Hereinafter, a method of manufacturing the package 100B will be described with reference to FIGS. FIG. 16 is a diagram schematically illustrating a manufacturing process of a package according to another embodiment, and is a plan view of a lead frame. FIG. 17 is a diagram schematically illustrating a package manufacturing process according to another embodiment, and is a top view of a lead frame sandwiched between an upper mold and a lower mold. FIG. 18 is a view schematically showing a manufacturing process of a package according to another embodiment, and FIG. 17 after the first resin injection.
FIG. 8 is a sectional view taken along arrow XVIII-XVIII of FIG. FIG. 19 is a view schematically showing a manufacturing process of a package according to another embodiment, and is a sectional view taken along the line XIX-XIX in FIG. 17 after the first resin injection.
In the method for manufacturing the package 100B, the prepared lead frame and the upper die are different from those used for manufacturing the package 100. The method for manufacturing the package according to the present embodiment includes:
It has the following steps (1B) to (5B).

(1B) Prepare a lead frame.
In the step (1B), a lead frame 705 on a flat plate with a portion cut away is prepared.
The step of preparing the lead frame 705 includes the steps of:
It is preferable to include a step of forming a plurality of gaps including the through holes 713 and 714 around a region to be the electrode 20 </ b> B, and a step of plating a plate-like member in which the plurality of gaps are formed.
Here, in the step of forming the gap, the gap can be formed in the plate member by punching, etching, or the like.
In the plating step, plating is performed on a lead frame provided with a clearance such as a through hole. Specifically, for example, Ag is attached to the lead frame by electrolytic plating.

The plated lead frame 705 has a first electrode 10B and a second electrode 20B in a region 600B where a package is to be formed, and the first electrode 10B and the second electrode 20B. And a gap between them. Here, the package formation planned region 600B is a region that is separated from the lead frame 705 and is the outer periphery of the bottom surface 105 of the molded package 100B. Further, the first electrode 10B in the lead frame 705 means a portion corresponding to the first electrode 10B after molding, and refers to a state before individualization. Similarly, the second electrode 20B in the lead frame 705 refers to a portion corresponding to the second electrode 20B after molding, and refers to a state before individualization. Note that, for simplicity, the lead frame 705
Is described as having one package formation scheduled region 600B, but the number may be plural.

In the lead frame 705, the region 600B where the package is to be formed is rectangular in plan view, and the first electrode 1B of the first electrode 10B and the second electrode 20B that are arranged to face each other.
A first edge 601 which is an outer edge on the OB side, and a second edge 602 adjacent to the first edge 601
A third edge 603 adjacent to the second edge 602 and facing the first edge 601;
And a fourth edge 604 adjacent to the third edge 601 and the third edge 603.

The lead frame 705 is a plate-shaped member, and includes a first electrode 10B and a second electrode 20B.
, A gap of a predetermined shape is provided around the first electrode 10B and the portion facing the second electrode 20B is separated. The lead frame 705 includes a frame-shaped lead support 707 surrounding the first electrode 10B and the second electrode 20B, suspension leads 708 and 709, and hanger leads 711 and 712.

The lead support 707 includes suspension leads 708 and 709 and hanger leads 711 and 712.
This is a part for supporting
The suspension leads 708 and 709 are parts for supporting the package 100B after molding in a state where the package 100B is connected from both sides in one direction (horizontal direction in FIG. 16). It is separated from the electrode 10B and the second electrode 20B.
The hanger leads 711 and 712 are portions for supporting the package 100B after molding from both sides in a direction perpendicular to the one direction (vertical direction in FIG. 16), and are not cut. That is, the hanger leads 711 and 712 are not components of the package 100B separated from the lead frame 705.

Specifically, a portion corresponding to the first outer lead portion 11 after molding of the first electrode 10B is connected to the lead support portion 707 by the suspension lead 708. Lead frame 7
05, a first space 706a and a second space 706b as gaps are provided for the suspension leads 708.
Are formed on both sides. The first space 706a and the second space 706b are connected to the first electrode 1
0B. In the present embodiment, the first resin is injected from the first space 706a.

The portion corresponding to the second outer lead portion 21 after molding of the second electrode 20B is connected to the lead support portion 707 by the suspension lead 709. In the lead frame 705, a third space 706c and a fourth space 706d are formed on both sides of the suspension lead 709 as gaps. The third space 706c and the fourth space 706d are formed on both sides of the second electrode 20B.
In the lead frame 705, the first space 706a, the second space 706b, the third space 706c, and the fourth space 706d communicate with the gap around the first electrode 10B and the second electrode 20B. I have.

The lead frame 705 includes a hanger lead 712 projecting from the second edge portion 602 into the package forming region 600B and a hanger lead projecting from the fourth edge portion 604 into the package forming region 600B in plan view. 711.
The thickness of the hanger leads 711 and 712 is equal to the thickness of the lead frame 705. That is, the thickness of the hanger leads 711 and 712 is equal to the thickness of the first and second outer lead portions 11 and 12.
Equal to the thickness T of 1. Therefore, the height H of the first recess 33 of the package 100B is equal to the thickness T of the first and second outer lead portions 11 and 21.

As described in the description of the step (5) (the step of removing the injection mark), a through hole such as a circle, an ellipse, a polygon, or a substantially polygon is provided at a position where the lead frame is cut. Can be. Therefore, in the present embodiment, the lead frame 705 has the through holes 713 and 714 at positions at least one of the first electrode 10B and the second electrode 20B that straddles the outer edge of the region 600B where the package is to be formed.

Specifically, in the present embodiment, the lead frame 705 is
00B, the first edge 601 has an elongated oval through hole 71 extending in a direction along the first edge 601.
Three. In addition, the lead frame 705 has an elongated oval through hole 714 in a direction along the third edge 603 at the third edge 603 of the region 600B where the package is to be formed. The inner peripheral surfaces of the through holes 713 and 714 are also plated. The through hole 7
13, 714 are independent and do not communicate with the first space 706a or the like.

(2B) The lead frame is sandwiched between the upper mold and the lower mold.
In this step, the first electrode 10B and the second electrode 20B of the lead frame 705 are sandwiched between the upper mold 550B and the lower mold 560 of the vertically divided mold 500. The upper mold 550B has a recess 501B corresponding to the wall 31 of the resin molded body 30B and a flat portion adjacent to the recess 501B. The recess 501B is connected in a ring shape. The lead frame 705 is arranged such that the package forming area 600B is located below the recess 501B of the upper mold 550B, and the through holes 713 and 714 are located outside the recess 501B.

The upper mold 550B has a gate 555B at a position where the first space 706a is provided outside the package forming area 600B when the first mold 550B is aligned with the lead frame 705.
Is formed.
Then, the flat portion adjacent to the recess 501B of the upper mold 550B is aligned with at least a part of the lead support portion 707, the suspension leads 708 and 709, and the first and second outer members after molding. The portions corresponding to the lead portions 11 and 21 are brought into contact with each other. At this time, it is firmly sandwiched so that the first resin does not enter the gaps between the lead frame 705 and the upper mold 550B and the lower mold 560.

(3B) Inject the first resin into the mold.
In this step, the first electrode 10 </ b> B (the first outer lead portion 1) in a plan view is placed in the mold 500 in which the lead frame 705 is sandwiched between the upper mold 550 </ b> B and the lower mold 560.
The first resin is injected from the gate 555B adjacent to 1). The first resin injected from the gate 555B passes through the first space 706a of the lead frame 5, and passes through the upper mold 550B.
Is injected into the recess 501B. In addition, the first resin is injected into the second space 706b, the third space 706c, and the fourth space 706d communicating with the first space 706a of the lead frame 705.

At this time, as described above, the lead frame 705 has its through holes 713 and 714
It is arranged so as to be located outside the recess 501B of the upper mold 550B. Also, the upper mold 5
The flat portion adjacent to the recess 501B of the first and second outer lead portions 1 is formed by molding.
The lead frame 705 is sandwiched between the upper mold 550B and the lower mold 560 so that the lead frame 705 is brought into contact with the portions corresponding to 1, 21. Further, the through holes 713 and 714 are formed in the first space 706a.
It is not the one that communicated with others. Therefore, the through holes 713 and 714 of the lead frame 705
Does not enter the first resin.

(4B) The injected first resin is cured or solidified.
The gap 31 other than the through holes 713 and 714 of the lead frame 705 and the recess 501B of the upper mold 550B form the wall 31 and the flange 32 of the resin molded body 30B. At this time, the flanges having the same thickness as the first and second outer lead portions 11 and 21 are provided adjacent to both sides of the portions corresponding to the first and second outer lead portions 11 and 21 after molding. A portion corresponding to the portion 32 is formed. At this point, the flange 32 continues to the gate 555B, but when the package 100B is separated into pieces, the flange 32 is separated from the gate 555B.

(5B) Cut off the injection mark at the injection port of the first resin.
Here, after the first resin is cured or solidified, an injection mark at an injection port of the first resin is cut off. Further, the first resin and the lead frame 705 are cut to separate the package 100B. At this time, the suspension leads 708 and 709 are cut at the outer edges (the first edge 601 and the third edge 603) of the package forming area 600B of the lead frame 705. As a result, the through holes 713 and 714 of the lead frame 705 are cut, and the second recess 50 is formed in the first and second outer lead portions 11 and 21. Further, even when the first electrode 10B and the second electrode 20B are cut off from the lead frame 705 at the time of singulation, the hanger lead 71
Since the package 100B is sandwiched between 1,712, the package 100B does not come off.
By the steps (1B) to (5B), the package 100B can be manufactured.

In the package 100B having the above-described configuration, the flange portion 32 is provided on both sides of the first and second outer lead portions 11 and 21 in the same thickness T as the first and second outer lead portions 11 and 21 in plan view. Have been. Further, the first outer lead portion 11 and the second outer lead portion 21 are provided with a second recess 50.

The second concave portion 50 is formed by cutting the prepared lead frame 705 at a position passing through the through holes 713 and 714. Since the end surface that appears when the lead frame 705 is cut is not plated, a conductive member such as solder does not adhere and does not contribute to joining.
On the other hand, in the step of injecting the first resin during manufacturing, the through holes 713 and 713 of the lead frame 705 are provided.
The first resin does not enter the 714, and the plating on the inner peripheral surfaces of the through holes 713 and 714 remains as it is. Therefore, the flange portion 32 is not provided in the second concave portion 50 of the package 100B. Since the side surface 51 of the second recess 50 is plated, a conductive member such as solder adheres and contributes to joining. Therefore, the package 100B can increase the bonding strength of a conductive member such as solder as compared with the case where the second recess 50 is not provided.

Further, since the side surface 51 of the second concave portion 50 of the package 100B is plated, the fillet is observed when the second concave portion 50 of the package 100B is solder-bonded to an external mounting board as described above. be able to.
Further, in the package 100B, the first outer lead portion 11 and the second outer lead portion 21 are plated on the upper surface 41 and the lower surface 42, so that the conductive member such as solder is provided on the side surface of the second concave portion 50. By joining from 51 to the upper surface 41 and the lower surface 42, a castellation electrode can be formed.

<Configuration of Light Emitting Device 1C>
Next, the configuration of the light emitting device 1C will be described with reference to FIG. FIG. 20 is a diagram schematically illustrating a light emitting device according to another embodiment, and is a perspective view illustrating the entire light emitting device.

The light emitting device 1C differs from the light emitting device 1 in FIG. 14 in that a package 100C is used. The same components as those of the light emitting device 1 of FIG.
The package 100C is different from the package 100B in the shape of the resin molded body 30C.
The resin molded body 30C includes a wall portion 31 and a flange portion 32, and includes a cutout 120 at one of the vertices of the wall portion 31. The notch 120 indicates the polarity of the first electrode 10B and is used as a cathode mark or an anode mark. The shape and size of the notch 120 are arbitrary. Here, the notch 120 has, for example, an inverted triangular shape, and is formed across the first outer surface 101 and the second outer surface 102.

The method for manufacturing the package 100C is the same as the method for manufacturing the package 100B, and a description thereof will be omitted. Regarding the notch 120, in the mold 500 for manufacturing the package 100B, for example, the shape of the recess 501B of the upper mold 550B in FIG.
It can be manufactured by deforming according to the wall 31 of 0C.

The method for manufacturing the light emitting device 1C is the same as the method for manufacturing the light emitting device 1, and a description thereof will be omitted.
In the package 100C of FIG. 20, for example, the end point 121 of the notch 120 is
The notch 120 may be enlarged to extend to the intersection 122 between the flange 1 and the flange 32 so as to stand out.
In the light emitting device 1C, a package 100B may be used instead of the package 100C.

The light emitting device of the embodiment according to the present invention can be used for a lighting device, a vehicle light emitting device, and the like.

1, 1B, 1C Light-emitting device 5, 705 Lead frame 6a, 706a First space 6b, 706b Second space 6c, 706c Third space 6d, 706d Fourth space 7, 707 Lead support 8, 9, 708, 709 Suspended lead 10, 10B First electrode 11 First outer lead 12 First inner lead 20, 20B Second electrode 21 Second outer lead 22 Second inner lead 30, 30B , 30C Resin molded body 31 Wall 32 Flange 33 First dent 41 Upper surface of first outer lead 42 Bottom of first outer lead 43 Front end of first outer lead 50 Second dent 51 2 Side surface of concave portion H Height of first concave T Thickness of first electrode 100, 100B, 100C Package 101 First outside of package Surface 102 second third bottom 120 notch 155 gate mark of the outer side surface 104 of package recess 110a recessed portion of the fourth bottom surface 110 of package outer surface 105 of package outer surface 103 packages of the package (injection mark)
200 light emitting element 250 wire 300 sealing member 500 mold die 501 recess 550 upper die 555 gate (injection port)
560 Lower mold 600, 600B Package formation planned area 711, 712 Hanger lead 713, 714 Through hole (gap)

Claims (24)

A first electrode, a second electrode different from the first electrode, a first suspension lead connected to the first electrode, and a second electrode connected to the second electrode in a region where the package is to be formed. A step of preparing two sets of two suspension leads and a set of lead frames in a direction orthogonal to the direction in which the first electrode and the second electrode are arranged in plan view;
A step of sandwiching the two sets of lead frames between an upper mold and a lower mold divided into upper and lower molds;
A direction in which the first electrode and the second electrode are arranged outside the region where the package of the mold die is to be formed in the mold where the two sets of lead frames are sandwiched, in a plan view A first resin is injected from an injection hole formed between the two sets of first suspension leads or between the two sets of second suspension leads arranged in a direction orthogonal to the first package; Forming,
Curing or solidifying the injected first resin;
After curing or solidifying the first resin, cutting off an injection mark of the injection port of the first resin from between the two sets of the first suspension leads or between the two sets of the second suspension leads; A method for manufacturing a package having:   In the prepared two sets of lead frames, a first space is formed between the two sets of the first suspension leads or between the two sets of the second suspension leads, and a first space is formed from the first space. The method for manufacturing a package according to claim 1, wherein the first resin is injected.   3. The method of manufacturing a package according to claim 1, wherein the two sets of prepared lead frames are such that the two sets of first electrodes and the two sets of second electrodes are separated from each other.   4. The method of manufacturing a package according to claim 1, wherein the step of cutting the injection mark cuts the two sets of lead frames and the first resin simultaneously. 5.   The mold has a recess corresponding to a wall formed on the two sets of first electrodes and the two sets of second electrodes, and injects the first resin into the recess. Item 5. The method for manufacturing a package according to any one of Items 1 to 4.   The mold further has a recess corresponding to a wall formed between the two sets of first electrodes and between the two sets of second electrodes, and the first resin is filled in the recess. The package manufacturing method according to claim 1, wherein the package is injected to form a package having two concave portions. The first resin molded using the molding die,
A bottomed structure that fixes the two sets of first electrodes and the two sets of second electrodes and at least a part of the bottom surface is configured by the two sets of first electrodes and the two sets of second electrodes A wall portion forming a side wall in the concave portion;
A flange protruding outward from the wall,
At least one of the two sets of first electrodes and the two sets of second electrodes has an outer lead portion projecting outward from the wall,
The package manufacturing method according to any one of claims 1 to 6, wherein the flange portion is formed on both sides of the outer lead portion in a plan view with the same thickness as the outer lead portion.   The method of manufacturing a package according to claim 1, wherein the step of forming the package is transfer molding.   9. The method of manufacturing a package according to claim 1, wherein a light reflecting member is mixed with the first resin. 10. The prepared lead frame has a through-hole at a position straddling an outer edge of a region where the package is to be formed in at least one of the two sets of first electrodes and at least one of the two sets of second electrodes. Have
The method of manufacturing a package according to claim 1, wherein in the step of removing the injection mark, the two sets of lead frames are cut at an outer edge of a region where the package is to be formed. The step of preparing the two sets of lead frames includes:
Forming a plurality of gaps including the through hole around a region to be the two sets of first electrodes and the two sets of second electrodes with respect to the plate-like member;
The method of manufacturing a package according to claim 10, further comprising: plating a plate-like member having the plurality of gaps formed therein. The region where the package is to be formed is rectangular in a plan view, and is located on the side of the two sets of first electrodes of the two sets of first electrodes and the two sets of second electrodes that are arranged to face each other. A first edge that is an outer edge of the second edge, a second edge adjacent to the first edge, a third edge adjacent to the second edge and facing the first edge, and A fourth edge adjacent to the first edge and the third edge;
12. The prepared two sets of lead frames have hanger leads projecting from the second edge and the fourth edge into a region where the package is to be formed in a plan view. The method for manufacturing a package according to any one of the above. All steps in the method of manufacturing the package according to any one of claims 1 to 12,
Either of the two sets of first electrodes and the two sets of second electrodes at a timing after the first resin is cured or solidified and before or after the step of cutting the injection mark. Mounting a light emitting element on one of the electrodes.   The method for manufacturing a light emitting device according to claim 13, further comprising a step of applying a second resin and sealing the light emitting element after the step of mounting the light emitting element. Two sets of first electrodes;
Two sets of second electrodes having different polarities from the two sets of first electrodes;
A bottomed structure which fixes the two sets of first electrodes and the two sets of second electrodes and at least a part of the bottom surface is composed of the two sets of first electrodes and the two sets of second electrodes A wall constituting a side wall of the concave portion,
A flange projecting outward from the wall in plan view,
At least one of the two sets of first electrodes and the two sets of second electrodes has an outer lead portion projecting outward from the wall in plan view,
The outer lead portion has a second recess at the tip,
The flange portion is provided on both sides of the outer lead portion in a plan view with the same thickness as the outer lead portion,
A package in which the flange is not provided in the second recess.   16. A central wall portion between the two sets of first electrodes and between the two sets of second electrodes, wherein the bottomed recess is divided into two by the central wall portion. Package described in. Each of the two sets of first electrodes and the two sets of second electrodes has an outer lead portion having the second concave portion,
Both outer lead portions have the flange portions on both sides in plan view,
The package according to claim 15, wherein the second recess does not include the flange. The package includes a first outer surface, a second outer surface adjacent to the first outer surface, a third outer surface adjacent to the second outer surface and facing the first outer surface, and A fourth outer surface adjacent to the first outer surface and the third outer surface;
Outer lead portions of the two sets of first electrodes project from the first outer surface,
Comprising the two sets of second electrodes on the side of the third outer surface facing the two sets of first electrodes;
The package according to any one of claims 15 to 17, wherein the second outer surface and the fourth outer surface are partially concave.   20. The package according to claim 18, wherein the first recess of a part of the second outer surface and the fourth outer surface has the same thickness as the outer lead portion.   20. The package according to claim 18 or 19, wherein the two sets of first electrodes and the two sets of second electrodes are not exposed on the second outer surface and the fourth outer surface.   The package according to any one of claims 15 to 20, wherein the wall and the flange are integrally formed of the same material.   22. The outer lead portion according to claim 15, wherein an upper surface, a lower surface, and side surfaces of the second concave portion are plated, and a distal end surface is not plated except for a side surface of the second concave portion. Package described in. A package according to any one of claims 15 to 22,
A light emitting device comprising: a light emitting element mounted on one of the two sets of first electrodes of the package and one of the two sets of second electrodes. The light emitting device according to claim 23 , wherein the light emitting element is covered with a second resin.

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