TWM394578U - Frame substrate of illumination device and its package structure - Google Patents

Frame substrate of illumination device and its package structure Download PDF

Info

Publication number
TWM394578U
TWM394578U TW099207185U TW99207185U TWM394578U TW M394578 U TWM394578 U TW M394578U TW 099207185 U TW099207185 U TW 099207185U TW 99207185 U TW99207185 U TW 99207185U TW M394578 U TWM394578 U TW M394578U
Authority
TW
Taiwan
Prior art keywords
illumination device
package structure
frame substrate
substrate
frame
Prior art date
Application number
TW099207185U
Other languages
Chinese (zh)
Inventor
jun-jie Liu
ming-xun Zhuang
Original Assignee
Sdi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sdi Corp filed Critical Sdi Corp
Priority to TW099207185U priority Critical patent/TWM394578U/en
Publication of TWM394578U publication Critical patent/TWM394578U/en
Priority to JP2011001299U priority patent/JP3168024U/en
Priority to KR2020110002123U priority patent/KR200462245Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW099207185U 2010-04-20 2010-04-20 Frame substrate of illumination device and its package structure TWM394578U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW099207185U TWM394578U (en) 2010-04-20 2010-04-20 Frame substrate of illumination device and its package structure
JP2011001299U JP3168024U (en) 2010-04-20 2011-03-10 Light emitting device package frame substrate and light emitting device package
KR2020110002123U KR200462245Y1 (en) 2010-04-20 2011-03-15 Substrate for a package frame of a luminous device and a luminous device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099207185U TWM394578U (en) 2010-04-20 2010-04-20 Frame substrate of illumination device and its package structure

Publications (1)

Publication Number Publication Date
TWM394578U true TWM394578U (en) 2010-12-11

Family

ID=45083362

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099207185U TWM394578U (en) 2010-04-20 2010-04-20 Frame substrate of illumination device and its package structure

Country Status (3)

Country Link
JP (1) JP3168024U (en)
KR (1) KR200462245Y1 (en)
TW (1) TWM394578U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419365B (en) * 2011-10-18 2013-12-11 Sdi Corp Manufacturing method of light - emitting device package holder
TWI463709B (en) * 2011-02-28 2014-12-01 Advanced Optoelectronic Tech Conductive substrate for led package
CN107275466A (en) * 2016-03-31 2017-10-20 日亚化学工业株式会社 Lead frame, encapsulation and light-emitting device and its manufacture method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6477328B2 (en) * 2014-09-29 2019-03-06 日亜化学工業株式会社 Package manufacturing method, light emitting device manufacturing method, package, and light emitting device
JP6260593B2 (en) 2015-08-07 2018-01-17 日亜化学工業株式会社 Lead frame, package, light emitting device, and manufacturing method thereof
JP6634724B2 (en) * 2015-08-07 2020-01-22 日亜化学工業株式会社 Lead frame, package, light emitting device, and manufacturing method thereof
CN116864498B (en) * 2023-09-05 2024-04-19 青岛泰睿思微电子有限公司 Light sensor packaging structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
JP2010097982A (en) 2008-10-14 2010-04-30 Sanyo Electric Co Ltd Light-emitting device
JP2010251493A (en) 2009-04-15 2010-11-04 Panasonic Corp Leadframe for semiconductor light-emitting device, and semiconductor light-emitting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI463709B (en) * 2011-02-28 2014-12-01 Advanced Optoelectronic Tech Conductive substrate for led package
TWI419365B (en) * 2011-10-18 2013-12-11 Sdi Corp Manufacturing method of light - emitting device package holder
CN107275466A (en) * 2016-03-31 2017-10-20 日亚化学工业株式会社 Lead frame, encapsulation and light-emitting device and its manufacture method
CN107275466B (en) * 2016-03-31 2021-06-15 日亚化学工业株式会社 Lead frame, package, light emitting device, and method of manufacturing the same

Also Published As

Publication number Publication date
KR200462245Y1 (en) 2012-08-31
KR20110010135U (en) 2011-10-26
JP3168024U (en) 2011-05-26

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees