JP6018869B2 - Light source module - Google Patents

Description

  The present invention relates to a light source module.

  The light source of the backlight for liquid crystal and the light source for illumination are being replaced by light emitting diodes (LEDs).

  For example, in the case of a backlight for liquid crystal, a cold cathode fluorescent lamp (CCFL) has been mainly used as a light source in the past. However, in recent years, replacement with LEDs has been progressing. By replacing this LED, it is possible to abolish the use of mercury with high environmental impact used in CCFLs and fluorescent lamps, reduce power consumption, improve color reproducibility, and extend the life of the light source device. .

  Similarly for lighting applications, replacement of incandescent lamps and fluorescent lamps, which have been the mainstream in the past, with LEDs, is rapidly progressing.

  The LED light source device 100 which is an edge light type surface light source device will be described with reference to FIGS.

  FIG. 8 is an exploded perspective view showing an example of the configuration of main components of the LED light source device 100, and FIG. 9 is a cross-sectional view of the LED light source device 100 in an assembled state.

  The LED light source device 100 is an edge light type surface light source device including a housing 110, a light guide plate 120, a reflection sheet 130, a diffusion sheet 150, and an LED light source module 140.

  The light emitted from the LED light source module 140 is incident on an incident surface that is one side surface of the light guide plate 120. The light incident from the incident surface is mixed and uniformed inside the light guide plate 120 and is emitted as a planar light from the top surface serving as the irradiation surface. The reflection sheet 130 has a function of returning light leaking from the light guide plate 120 to the side opposite to the irradiation surface into the light guide plate 120 and contributes to improvement of light use efficiency. The diffusion sheet 150 has the effect of uniforming the light emitted from the light guide plate 120 and reducing unevenness in brightness, and is used in combination with other various optical sheets as necessary. The casing 110 houses and fixes these members.

  The said LED light source device 100 functions as a surface irradiation apparatus using the light emission of an LED element by being comprised as mentioned above.

  Like the LED light source device 100, a light source that converts light irradiated from the edge of the screen into planar irradiation light using some light guide means is called an edge light type, and a light source is directly under the irradiation surface. Compared to the direct type arranged in an array, it is advantageous in reducing the thickness of the light source module. Therefore, it is suitable for a liquid crystal backlight application in which a product such as a television receiver is strongly demanded to be thin, and an edge light type like the LED light source device 100 is mainly used (Patent Document 1 (Japanese Patent Laid-Open No. 2010-2010)). No. 0039299)).

  The LED light source device used in the above application is usually realized by using a light source module on which an LED element is mounted by some method. For example, a method of solder mounting an LED package on which an LED element is mounted on a wiring board. In particular, a method of solder mounting an LED package using a surface mounting package by reflow is currently mainstream.

  Apart from solder mounting by reflow, an LED light source module configured by COB (Chip On Board) mounting can also be used. The LED light source module by COB mounting will be described in detail with reference to FIGS.

  FIG. 10 is a plan view of an LED light source module 500, which is an example of the LED light source module 140. The LED light source module 500 has an LED element 515 mounted thereon by COB. 11 is a cross-sectional view taken along the line CC in FIG.

  In the LED light source module 500, the substrate member 511 has four recesses 517 for mounting the LED elements 515 as an example. Three LED elements 515 are mounted in each of the four recesses 517. Accordingly, a total of 12 LED elements 515 are mounted on the board member 511.

  As shown in FIG. 11, the LED light source module 500 includes a wiring layer 513 composed of four parts formed integrally with the substrate member 511. Each of the four portions of the wiring layer 513 is disposed corresponding to the four concave portions 517. Three LED elements 515 are mounted on each part of each wiring layer 513 by COB.

  In addition, the structure which mounts the LED element 515 not on the said wiring layer 513 but on the surface of the board | substrate member 511 is also possible. In any case, the COB is characterized in that the LED element 515 is not mounted indirectly on the wiring layer or the substrate member after being stored in the package, but is mounted as it is.

  The recess 517 included in the substrate member 511 is recessed from the surface 511 </ b> A, and the LED element 515 is mounted in the recess 517.

  In the LED light source module 500, the LED element 515 is electrically connected to the wiring layer 513 by the bonding wire 516. The wiring layer 513 is electrically connected to an electrode terminal (not shown) of the connector 512. With this configuration, it is possible to control the light emission of the LED element 515 by electrically controlling a harness (not shown) connected to the connector 512.

  The LED element 515 and the bonding wire 516 and the connection portion between the LED element 515 and the bonding wire 516 may be damaged by an impact. Therefore, in order to prevent damage, the LED element 515 and the bonding wire 516 are connected to the connection portion. And the sealing resin 514. That is, the sealing resin 514 is injected into the recess 517. With this configuration, the LED element 515 and the bonding wire 516 can be protected from moisture and foreign matter in addition to being able to withstand a certain amount of impact applied from the outside.

  FIG. 12 is a plan view showing an example of the lead frame 600 including the above four wiring layers 513. The lead frame 600 is usually manufactured by forming a metal plate into an arbitrary shape by pressing or etching. In this processing, in order to improve productivity, a plurality of wiring layers 513 are often formed integrally as a unit, rather than individually forming a single wiring layer 513. The lead frame 600 is an example thereof, and four wiring layers 513 are formed.

  In order to improve the productivity of the lead frame 600, a plurality of wiring layers 513 for the plurality of LED modules 500 are usually formed in one lead frame 600. Therefore, the lead frame 600 is configured by combining a frame portion 602 for integrally forming and a portion 603 to be finally cut off.

  As described above, in the LED module 500 shown in FIG. 10 as an example of the LED light source module 140 shown in FIG. 8, the LED element 515 is mounted by COB. In this mounting by COB, it is not necessary to use solder for mounting, so there is no temperature restriction due to the soldering temperature at the time of use compared to the case where a device in which an LED element is sealed in a package is mounted on a wiring board. There is an advantage. In addition, the mounting by the COB has an advantage that the LED element can be manufactured in the final form in the same process as the LED package, so that a small substrate can be manufactured at low cost. The LED light source module by the COB mounting is described in, for example, Japanese Patent Application Laid-Open No. 2008-171931.

JP 2010-039299 A JP 2008-171931 A

  By the way, in evaluation of development of a light source module using LED elements and analysis of defects in production, a part of the light source module is often observed using a microscope or a photograph. The LED frame that is the light source, the wires used for COB mounting, and the lead frame that forms the wiring portion are the main observation targets.

  Therefore, it is important in the evaluation and analysis of the light source module to grasp without error the position of the concave portion of the substrate member on which the LED element is mounted. It is also important in evaluating and analyzing the light source module that the wiring part of the light source module is the part of the lead frame, and it is also easy to grasp without error the type used for producing the lead frame.

  However, when the substrate member has a plurality of recesses for mounting the LED elements, the shape of each recess is made the same in order to match the optical characteristics of each recess. For this reason, there is a problem that it is difficult to determine which of the plurality of concave portions is the portion being observed at first glance.

  Similarly, with respect to the wiring portion of the lead frame, the wiring portions arranged in the respective concave portions have substantially the same shape in order to make the optical characteristics of the concave portions coincide with each other. Further, when a plurality of wiring portions are integrally formed on the lead frame, the respective wiring portions are formed in substantially the same shape so as not to cause a difference in characteristics between the individual wiring portions. Further, when a plurality of molds (press mold or etching mask) for manufacturing the lead frame are prepared, the plurality of molds are all made the same shape for the same reason. For this reason, there is also a problem that it is difficult to specify a plurality of wiring layers of the lead frame to be observed and the lead frame itself.

  Accordingly, an object of the present invention is to provide a light source module that can easily identify a plurality of concave portions of a substrate member on which a plurality of light emitting elements are arranged and a wiring portion for electrically connecting the plurality of light emitting elements. is there.

In order to solve the above problems, a light source module of the present invention includes a substrate member having a plurality of recesses,
A plurality of light emitting elements disposed in the plurality of recesses of the substrate member;
A plurality of wiring portions electrically connected to the plurality of light emitting elements,
Further, a first identification symbol formed on the substrate member or the wiring part and for individually identifying a plurality of recesses, and a wiring formed on the wiring part and for identifying the wiring part Comprising at least one of the second identification symbols ;
The first identification symbol is formed integrally with the substrate member .

  The substrate member may be made of a substantially white resin.

  The first identification symbol may be represented by a shape of a recess formed on the surface of the substrate member.

  Further, the substrate member may be an injection molded resin, and the first identification symbol may be injection molded integrally with the substrate member.

  Moreover, the 2nd identification symbol formed in the said wiring part may be provided, and the said 2nd identification symbol may be optically exposed from the said board | substrate member.

  The wiring part may be a molded metal plate, and the second identification symbol may be formed integrally with the wiring part.

  Moreover, the said board | substrate member may be produced with substantially white resin, and the exposed surface of the said wiring part may be produced with silver.

  According to the light source module of the present invention, the plurality of concave portions of the substrate member in which the plurality of light emitting elements are arranged can be easily and individually identified by the first identification symbol formed on the substrate member or the wiring portion. The wiring part can be easily identified by the second identification symbol formed on the part.

It is a top view which shows typically 1st Embodiment of the light source module by this invention. It is AA arrow sectional drawing of FIG. 3 is a plan view of a lead frame including a plurality of wiring layers according to the first embodiment. FIG. It is a top view which shows typically the modification of the said 1st Embodiment. It is a top view which shows typically 2nd Embodiment of the light source module by this invention. It is BB arrow sectional drawing of FIG. It is a top view of the lead frame containing the some wiring layer of the said 2nd Embodiment. It is a disassembled perspective view of the LED light source device which is an edge light type surface light source device for liquid crystal backlights. It is sectional drawing of the said LED light source device. It is a top view of the LED light source module used with the said LED light source device. It is CC sectional view taken on the line of FIG. It is a top view of the lead frame containing the some wiring layer of the said LED light source module.

  Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.

(First embodiment)
FIG. 1 is a plan view schematically showing a first embodiment of a light source module of the present invention, and FIG. 2 is a cross-sectional view taken along the line AA in FIG. FIG. 3 is a plan view of a lead frame including a plurality of wiring layers according to the first embodiment.

  The first embodiment includes a substrate member 11 having four rectangular recesses 17A, 17B, 17C, and 17D, and a plurality of LED elements 15 disposed in the recesses 17A to 17D of the substrate member 11. The four recesses 17 </ b> A to 17 </ b> D have a substantially rectangular shape, and are formed at predetermined intervals along the longitudinal direction of the substrate member 11. The four recesses 17A to 17D are formed in substantially the same shape. The wiring layer 13 as a wiring part is composed of four parts 13A to 13D.

  The substrate member 11 is formed by, for example, injection molding, and four portions 13A to 13D corresponding to the four concave portions 17A to 17D are integrally formed as shown in FIG. As the material of the substrate member 11, a resin capable of precise injection molding is preferable, and a material having a high reflectivity is suitable for efficiently using light emitted from the LED element 15. As a specific example, LCP (Liquid Crystal Polymer) to which a white filler such as titanium oxide is added is selected.

  In the first embodiment, three LED elements (light emitting elements) 15 are arranged for each of the recesses 17A to 17D. And three LED elements 15 are mounted by COB on each site | part 13A-13D of the wiring layer 13, respectively.

  In the first embodiment, the LED element 15 is electrically connected to the wiring layer 13 by the bonding wire 16. The bonding wire 16 electrically connects the adjacent LED elements 15 to each other.

  A sealing resin 14 is injected into the recesses 17 </ b> A to 17 </ b> D of the substrate member 11. With this sealing resin 14, the LED element 15 and the bonding wire 16 and the connection portion between the LED element 15 and the bonding wire 16 are sealed. The sealing resin 14 protects the LED element 15 and the bonding wire 16 from moisture and foreign matter, in addition to being able to withstand a certain amount of impact applied from the outside.

  In the first embodiment, the numeral “1” is imprinted as the first identification symbol 31A beside the longitudinal end of the concave portion 17A of the substrate member 11. Further, a number “2” is engraved as a first identification symbol 31B beside the one end portion in the longitudinal direction of the concave portion 17B adjacent to the concave portion 17A. Further, a number “3” is imprinted as a first identification symbol 31C beside one end portion in the longitudinal direction of the concave portion 17C adjacent to the concave portion 17B. In addition, a numeral “4” is engraved as a first identification symbol 31D beside one end portion in the longitudinal direction of the concave portion 17D adjacent to the concave portion 17C.

  The numbers “1” to “4” as the first identification symbols 31A to 31D are formed, for example, by recessing a part of the surface of the substrate member 11 when the substrate member 11 is injection molded. . Thereby, the numbers “1” to “4” as the first identification symbols 31A to 31D can be formed on the substrate member 11 without changing any special member or production process.

  Further, if the substrate member 11 is white and the depressions forming the first identification symbols 31A to 31D are sufficiently shallow, the mechanical and optical effects due to the presence of the identification symbols 31A to 31D are minimized. can do.

  In addition, it is possible to adjust the color tone of the emitted light from the LED light source 15 by adding a coloring agent or phosphor to the sealing resin 14. For example, when the LED element 15 emits blue light or ultraviolet light, the light source module can emit white light by containing a suitable phosphor in the sealing resin 14.

  FIG. 3 shows an example of the lead frame 20 including the four wiring layers 13. The lead frame 20 is usually manufactured by forming a metal plate into an arbitrary shape by pressing or etching. In the lead frame 20, the four wiring layers 13 are integrally molded.

  The lead frame 20 includes portions 21A to 21D constituting each wiring layer 13, a frame portion 22 that is a portion for maintaining the shape of the entire lead frame 20, and a portion 23 that is cut out in the manufacturing process of the light source module. Consists of. Although only a part is shown in FIG. 3, all of the parts excluding the parts 21 </ b> A to 21 </ b> D and the frame part 22 become the part 23 to be excised.

  The portion 23 to be cut out is not necessary as the wiring layer 13 of the light source module, but is necessary for integrally forming the lead frame 20 and can sufficiently maintain the strength of the lead frame 20. Is provided. The part 23 to be cut out is cut out in the manufacturing process of the light source module. The frame portion 22 is a frame for integrally configuring the lead frame 20, and is not used for the light source module.

  As shown in FIG. 3, in the lead frame 20, the electrode terminals 18 and 19 of the connector 12 are formed in a portion 13 </ b> A that is one end of the wiring layer 13, and the wiring portion 25 extends from one electrode terminal 19. In addition, the wiring portion 25 is connected to a portion 13D that is the other end of the wiring layer 13. Accordingly, the one electrode terminal 19 is electrically connected to the other end portion 13 </ b> D by the wiring portion 25.

  According to the light source module of the first embodiment, as shown in FIG. 1, first identification symbols 31 </ b> A to 31 </ b> D are individually formed for the recesses 17 </ b> A to 17 </ b> D of the substrate member 11. Therefore, the plurality of recesses 17A to 17D of the substrate member 11 on which the plurality of LED elements 15 are arranged can be easily and individually identified by the first identification symbols 31A to 31D. Therefore, for example, when observing the substrate member 11 of the light source module using a microscope or a photograph, it can be easily determined without error which of the plurality of recesses is being observed, and the light source module The reliability of evaluation in development and analysis of defects in production can be improved.

  In the first embodiment, the numbers “1” to “4” imprinted on the board member 1 are imprinted on the board member 1 with the first identification symbols 31A to 31D for identifying the recesses 17A to 17D. However, as a modification of the first embodiment, first identification symbols 33 </ b> A to 33 </ b> D as shown in FIG. 4 may be formed on the substrate member 1. The first identification symbols 33 </ b> A to 33 </ b> D include three dotted portions 42, 43, 44 and one linear portion 41 arranged in the longitudinal direction. The four first identification symbols 33 </ b> A to 33 </ b> D that are different from each other are configured according to the arrangement order of the three point-like portions 42, 43, 44 and one linear portion 41. Each of the recesses 17A to 17D can be individually identified by the four first identification symbols 33A to 33D. Since the first identification symbols 33A to 33D of this modification are simple symbols as compared with the first identification symbols 31A to 31D by the numbers “1” to “4”, for example, formation by injection molding is easy. become. On the other hand, according to the first identification symbols 31A to 31D by the numbers “1” to “4”, there is an advantage that they are easily recognized.

  Moreover, in the said 1st Embodiment and its modification, 1st identification symbol 31A-31D, 33A-33D is formed by denting a part of surface of the board | substrate member 11 when the board | substrate member 11 is injection-molded. However, the substrate member 11 may be formed as a protrusion when injection molding.

  On the other hand, the first identification symbols 31A to 31D and 33A to 33D can be produced by printing colored marks on the upper surface of the substrate member, but there is a possibility of optically adverse effects. Also, heating for curing the ink when printing the mark may affect the characteristics of the substrate member and the sealing resin.

  On the other hand, when the first identification symbols 31A to 31D and 33A to 33D are dents, the influence on the optical characteristics, the substrate member, and the sealing resin can be minimized.

(Second embodiment)
FIG. 5 is a plan view schematically showing a second embodiment of the light source module according to the present invention, and FIG. 6 is a sectional view taken along the line BB in FIG. FIG. 7 is a plan view of a lead frame including a plurality of wiring layers according to the second embodiment.

  This second embodiment differs from the first embodiment described above in the following points (1) to (3).

   (1) The point provided with the board | substrate member 51 by which it replaces with the board | substrate member 11 and the 1st identification symbols 31A-31D are not formed.

   (2) The point provided with the wiring layer 53 including the parts 53A to 53D in which the first identification symbols 71A to 71D are formed instead of the wiring layer 13 including the parts 13A to 13D.

   (3) Second identification symbols 72A to 72D are formed in the portion 53D, and a second identification symbol 73 is formed in the portion 53A.

  Therefore, in the second embodiment, parts similar to those in the first embodiment described above are denoted by the same reference numerals, and differences from the first embodiment described above will be mainly described.

  Similar to the substrate member 11 described above, the substrate member 51 includes four rectangular recesses 57A, 57B, 57C, and 57D, and includes three LED elements 15 disposed in the recesses 57A to 57D. The material and manufacturing method of the substrate member 51 are the same as those of the substrate member 11 of the first embodiment described above.

  Since the sealing resin 14 needs to transmit light emitted from the LED element 15, the sealing resin 14 has translucency. Therefore, a portion of the wiring layer 53 that is not covered with the substrate member 11 is optically exposed.

  As shown in the cross-sectional view of FIG. 6, three LED elements 15 are mounted on the portions 53 </ b> A to 53 </ b> D of the wiring layer 53 by COB. As an example, the portions 53A to 53D of the wiring layer 53 are formed integrally with the substrate member 51 when the substrate member 51 is injection molded.

  In the second embodiment, as shown in the plan view of FIG. 5, the first identification symbol 71A is provided on each portion 53A, 53B, 53C, 53D of the wiring layer 53 exposed from the recess 57A of the substrate member 51, respectively. , 71B, 71C, 71D are formed.

  Each of the first identification symbols 71A to 71D includes one long portion 81 and three short portions 82, 83, and 84, respectively. The four first identification symbols 71A to 73D that are different from each other are configured by the arrangement order of the three short portions 82, 83, 84 and one long portion 81.

  As shown in FIG. 5, a second identification symbol 73 is formed on the wiring layer 53A exposed in the recess 57A of the substrate member 51. The second identification symbol 73 is composed of four long portions 87 and four short portions 88. The second identification symbol 73 is a symbol for identifying a mold used for manufacturing the lead frame 60 including the wiring layer 53. The lead frame 60 will be described later with reference to FIG.

  A second identification symbol 72C is formed on the wiring layer 53D exposed in the recess 57D of the substrate member 51. The second identification symbol 72C includes, for example, one long portion 85 and one short portion 86. The second identification symbol 72C is a symbol for identifying which portion of the four portions 61A, 61B, 61C, 61D of the lead frame 60 the wiring layer 53 is.

  FIG. 7 shows an example of the lead frame 60 including the wiring layer 53. The lead frame 60 is usually manufactured by forming a metal plate into an arbitrary shape by pressing or etching. In the lead frame 60, the four wiring layers 53 are integrally molded.

  The lead frame 60 includes portions 61A to 61D constituting each wiring layer 53, a frame portion 62 that is a portion for maintaining the shape of the entire lead frame 60, and a portion 63 that is cut out in the manufacturing process of the light source module. Consists of. Although only a part is shown in FIG. 7, all the parts excluding the parts 61 </ b> A to 61 </ b> D and the frame part 62 become a part 63 to be cut out.

  As shown in FIG. 7, in the lead frame 60, electrode terminals 58 and 59 of the connector 52 are formed at a portion 53 </ b> A that is one end of the wiring layer 53, and a wiring portion 65 extends from one electrode terminal 59. In addition, the wiring portion 65 continues to the other end portion 53 </ b> D of the wiring layer 53. Accordingly, the one electrode terminal 59 is electrically connected to the wiring layer 53D at the other end by the wiring portion 65.

  The long portions 81 and the short portions 82 to 84 of the four first identification symbols 71A to 73D can be formed as depressions or openings when the lead frame 60 is manufactured by press working, for example. Further, the long portion 85 and the short portion 86 forming the second identification symbol 72C and the long portion 87 and the short portion 88 forming the second identification symbol 73 can also be formed as a depression or an opening during the press working. Therefore, the first identification symbols 71A to 73D and the second identification symbols 72A to 72D, 73 can be produced without adding manufacturing steps or materials.

  The second identification symbol 72C is formed in the portion 53D of the wiring layer 53 included in the portion 61C of the lead frame 60, but the portion 53D of the wiring layer 53 included in the other portion 61A of the lead frame 60. Is formed with a second identification symbol 72A composed of two short portions 86, and the portion 53D of the wiring layer 53 included in the portion 61B of the lead frame 60 includes the second identification symbol 72C. A second identification symbol 72B in which the arrangement order of the long portion 85 and the short portion 86 is different is formed. Further, a second identification symbol 72D composed of two long portions 85 is formed at a portion 53D of the wiring layer 53 included in the portion 61D of the lead frame 60.

  According to the light source module of the second embodiment, as shown in FIG. 5, each of the portions 53 </ b> A to 53 </ b> D of the wiring layer 53 exposed in the recesses 57 </ b> A to 57 </ b> D of the substrate member 51 is individually first Identification symbols 71A to 71D are formed. Therefore, the plurality of concave portions 57A to 57D of the substrate member 51 on which the plurality of LED elements 15 are arranged can be easily and individually identified by the first identification symbols 71A to 71D. Therefore, for example, when observing the substrate member 51 of the light source module using a microscope or a photograph, it can be easily determined without error which of the plurality of recesses is being observed, and the light source module The reliability of evaluation in development and analysis of defects in production can be improved.

  In the second embodiment, the second identification symbol 73 is formed on the wiring layer 53A optically exposed in the recess 57A of the substrate member 51. With this second identification symbol 73, the mold used to produce the lead frame 60 can be identified. The mold is, for example, a mold when the lead frame 60 is produced by press working, and a mask (photomask) when the lead frame 60 is produced by etching. The workmanship of the mold and the mask affects the workmanship of the lead frame 60. Only the lead frame 60 manufactured with a specific mold may have some defects. Therefore, by identifying the mold by the second identification symbol 73, it is possible to help identify the cause of the malfunction.

  In the second embodiment, the second identification symbol 72C is formed on the wiring layer 53D optically exposed in the recess 57D of the substrate member 51. With the second identification symbol 72C, it is possible to specify that the wiring layers 53A to 53D belong to the portion 61C of the four portions 61A, 61B, 61C, 61D of the lead frame 60. As described above, by specifying which part of the lead frame 60 the wiring layers 53A to 53D included in the light source module are formed, for example, in a specific part of a mold for producing the lead frame 60 It can be used for failure analysis such as the cause of the failure.

  In the first and second embodiments, the substrate members 11 and 51 may be made of white resin, and the surfaces of the wiring layers 13 and 53 on which the light emitting diodes 15 are mounted may be made of silver. In this case, since the surfaces of the substrate members 11 and 51 and the wiring layers 13 and 53 have a high total reflectance, the light generated from the light emitting diode 15 can be used effectively. Further, since the surfaces of the substrate member and the wiring layer have a high total reflectance, the surface area of the wiring layer is reduced by providing the first and second identification symbols, and the surface area of the substrate member is reduced. Even if it increases, the influence on an optical characteristic can be reduced.

  The light source module of the present invention is easy to evaluate in development and analyze defects in production, and can be applied to, for example, liquid crystal backlight applications and illumination applications, and includes linear illumination devices such as fluorescent tubes and light guide plates. It can be set as the used surface emitting illuminating device.

11, 51 Substrate member 12, 52 Connector 13, 53 Wiring layers 13A-13D, 53A-53D Site 14 Sealing resin 15 LED element (light emitting element)
16 Bonding wires 17A to 17D, 57A to 57D Recesses 18, 19, 58, 59 Electrode terminals 20, 60 Lead frames 21A to 21D, 61A to 61D Parts 22, 62 Frame parts 23, 63 Cut parts 25, 65 Wiring parts 31A to 31D, 33A to 33D, 71A to 71D First identification symbol 41 Linear portion 42 to 44 Point portion 72A to 72D, 73 Second identification symbol 81, 85, 87 Long portion 82 to 84, 86, 88 Short part

Claims (4)

A substrate member having a plurality of recesses;
A plurality of light emitting elements disposed in the plurality of recesses of the substrate member;
A plurality of wiring portions electrically connected to the plurality of light emitting elements,
Further, a first identification symbol formed on the substrate member or the wiring part and for individually identifying a plurality of recesses, and a wiring formed on the wiring part and for identifying the wiring part Comprising at least one of the second identification symbols ;
The light source module, wherein the first identification symbol is formed integrally with the substrate member . The light source module according to claim 1,
The plurality of light emitting elements are:
A light source module, which is mounted on the substrate member or the wiring portion by a chip-on-board. The light source module according to claim 1 or 2 ,
The second identification symbol is:
A light source module characterized in that a mold for molding the wiring part can be identified. The light source module according to any one of claims 1 to 3,
A plurality of the wiring portions are provided so as to correspond to the plurality of concave portions of the substrate member,
The plurality of wiring portions are formed integrally with the substrate member,
The second identification symbol is:
A light source module for identifying a plurality of wiring portions formed integrally with the substrate member.

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