JP2010092670A - Illuminating device and image display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illuminating device capable of easily making positioning even against a light guide plate having a flat side face and hardly generating luminance unevenness. <P>SOLUTION: A supporting member of a linear light source is structured of a base plate part 131 of a longitudinal shape with the semiconductor light emitting module 110 mounted on one main face 131a, a spacer part 132 intervening between the base plate part 131 and the light guide plate 13 and preventing the semiconductor light emitting module 110 from approaching a side face 13a of the light guide plate 13 further than a given distance, and a rear face side contacting part 133 which is provided directly or indirectly on the base plate part 131 and preventing the base plate part 131 from moving further toward the light guide plate to a front face 13b side in a thickness direction of the light guide plate by making contact with the rear face 13c of the light guide plate 13 or a member mounted on the rear face 13c. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a lighting device and an image display device, and more particularly to a lighting device used for a large image display device.

  Illumination devices (backlight units) used for image display devices (liquid crystal display devices) such as liquid crystal televisions and liquid crystal displays include an edge light type and a direct type. As an edge light system, there is a type in which a linear light source device in which a plurality of LED modules are held by a long holding member is mounted on a side surface of a light guide plate, but light emitted from an LED module has directivity. In order to suppress the luminance unevenness of the backlight unit, the linear light source device must be mounted in an appropriate posture along the side surface of the light guide plate.

Therefore, for example, in the backlight unit according to Patent Document 1, as shown in FIG. 36 (a), a rail-like convex portion 1003 is provided along the longitudinal direction on the side surface 1002 of the light guide plate 1001, and the linear light source device 1004 is provided. The holding member 1005 is provided with a rail groove 1006 that fits with the convex portion 1003, positioning is performed by fitting the convex portion 1003 and the rail groove 1006, and the linear light source device 1004 is formed on the side surface 1002 of the light guide plate 1001. Along with this, it is disclosed that it is mounted in a proper posture. The light guide plate 1001 having such a convex portion 1003 can be manufactured at a relatively low cost by injection molding.
JP-A-9-185055

  In recent years, the light guide plate 1001 has been increased in size due to the increase in size of the backlight unit accompanying the increase in the size of the liquid crystal display device, but it is difficult to manufacture the large light guide plate 1001 having the convex portions 1003 with high dimensional accuracy by injection molding. However, if an attempt is made to manufacture the liquid crystal display device, the manufacturing cost of the light guide plate 1001 increases and the price of the liquid crystal display device increases. In order to suppress such an increase in the price of the liquid crystal display device, as shown in FIG. 36B, it is conceivable to eliminate the convex portion 1003 and make the side surface 1002 of the light guide plate 1001 flat. The linear light source device 1004 cannot be positioned by fitting with the groove 1006, and the linear light source device 1004 is properly positioned on the side surface 1002 of the light guide plate 1001, as shown in FIGS. 36 (c) and 36 (d). In some cases, the backlight unit cannot be mounted, and the backlight unit may have uneven brightness.

  In view of the above problems, an object of the present invention is to provide an illuminating device that can be easily positioned even with respect to a light guide plate having a flat side surface and is less likely to cause uneven luminance. Another object of the present invention is to provide an image display device using such an illumination device.

  In order to solve the above-described problem, an illumination device according to the present invention includes a light guide plate having a flat side surface, a semiconductor light emitting module disposed opposite to the side surface, and a holding member that holds the semiconductor light emitting module. The holding member is interposed between a long substrate portion on which the semiconductor light emitting module is mounted on one main surface, the substrate portion and the light guide plate, and the semiconductor light emitting module A spacer part that prevents the side surface of the light guide plate from approaching a predetermined distance or more and a substrate part that is provided directly or indirectly on the back surface of the light guide plate or a member stacked on the back surface. It is characterized by comprising a back side abutting part for preventing the substrate part from moving further to the front side in the thickness direction of the light guide plate with respect to the light guide plate.

  An image display device according to the present invention includes the above-described illumination device and a liquid crystal display unit.

  The illumination device according to the present invention is provided between the substrate unit and the light guide plate, and is provided directly or indirectly on the substrate unit, a spacer unit that prevents the semiconductor light emitting module from approaching the side surface of the light guide plate by a predetermined distance or more. The back side contact portion that prevents the substrate portion from further moving to the front side in the thickness direction of the light guide plate with respect to the light guide plate by contacting the back surface of the light guide plate or a member stacked on the back surface. Therefore, when the semiconductor light emitting module is positioned with respect to the light guide plate, positioning in two directions is easy. Specifically, positioning in the direction orthogonal to the side surface of the light guide plate is easy by the spacer portion, and positioning in the thickness direction of the light guide plate is easy by the back-side contact portion. Accordingly, it is easier to mount the semiconductor light emitting module in a proper posture along the side surface of the light guide plate compared to a conventional lighting device that can only position the light guide plate having a flat side surface in a direction orthogonal to the side surface of the light guide plate. The brightness unevenness hardly occurs in the lighting device.

  Since the image display device according to the present invention includes the illumination device, luminance unevenness is small.

Hereinafter, an image display device and an illumination device according to the present embodiment will be described with reference to the drawings.
[Image display device]
FIG. 1 is an exploded perspective view showing a schematic configuration of the image display apparatus according to the present embodiment. As shown in FIG. 1, an image display device 1 according to the present embodiment is, for example, a 46-inch liquid crystal television, a liquid crystal screen unit 2 including a liquid crystal panel and the like, and an illumination device disposed on the back of the liquid crystal screen unit 2 10. The liquid crystal screen unit 2 is a well-known one and includes a liquid crystal panel (color filter substrate, liquid crystal, TFT substrate, etc.) (not shown), a drive module, etc. (not shown), and color based on an image signal from the outside. Form an image.

[Lighting device]
FIG. 2 is an exploded perspective view showing a schematic configuration of the lighting device according to the present embodiment, and in FIG. 2, the X-axis direction is the thickness direction of the lighting device (the X-axis (+) direction is the light extraction direction of the lighting device). The Y-axis direction is the left-right direction (longitudinal direction) of the lighting device, and the Z-axis direction is the vertical direction (short direction) of the lighting device. It should be noted that the drawings of the present application other than FIG. 2 also indicate the same direction when the directions are described in the X axis, the Y axis, and the Z axis.

As shown in FIG. 2, the illumination device 10 according to the present embodiment is an edge light (side light) type backlight unit, and includes a pair of linear light source devices 100, a casing 11, a reflection sheet 12, a light guide. A light plate 13, a diffusion sheet 14, a prism sheet 15, a polarizing sheet 16, and a lighting circuit 17 are provided.
Each linear light source device 100 includes an LED module 110, a module mounting jig 120, and a holding member 130. The holding member 130 includes a substrate part 131, a spacer part 132, a back side contact part 133, and a front side contact part. 134 and a side locking portion 135. Details of the linear light source device 100 will be described later.

  The casing 11 is made of a metal such as a galvanized steel plate, for example, and includes a box-shaped casing main body 11a and a rectangular outer frame including an upper side portion 11b, a right side portion 11c, a lower side portion 11d, and a left side portion 11e. In the state where the outer frame is attached to the housing body 11a and the housing 11 is assembled, the area surrounded by the outer frame becomes the light outlet 11f. Inside the housing 11, a pair of linear light source devices 100, a reflection sheet 12, a light guide plate 13, a diffusion sheet 14, a prism sheet 15, and a polarizing sheet 16 are laminated in that order from the bottom surface side of the housing body 11a. Yes.

Light emitted from the pair of linear light source devices 100 accommodated in the housing 11 enters the light guide plate 13 from the light incident surface (long side surface) 13 a of the light guide plate 13, and the light of the light guide plate 13. The light is emitted from the extraction surface (front surface) 13b, passes through the diffusion sheet 14, the prism sheet 15, and the polarizing sheet 16, and is extracted from the light extraction port 11f to the outside of the housing 11.
The reflection sheet 12 is made of, for example, PET (polyethylene terephthalate), has a dimension (thickness) of about 0.2 [mm] in the X-axis direction, a dimension (dimension in the longitudinal direction) of about 1040 [mm] in the Y-axis direction, and a Z-axis direction. The sheet is a square sheet having a dimension of about 600 [mm], and is disposed on the back surface 13c side of the light guide plate 13, and the light exiting from the back surface 13c of the light guide plate 13 is the light extraction surface 13b. Reflect towards The reflective sheet 12 may be a metallic foil having metallic luster, an Ag sheet, or the like.

  The light guide plate 13 is made of, for example, PC (polycarbonate) resin. The dimension (thickness) in the X-axis direction is about 4 [mm], the dimension in the Y-axis direction (longitudinal dimension) is about 1040 [mm], and the dimension in the Z-axis direction. (Dimension in the short side direction) A rectangular plate material of about 600 [mm], in which a dot pattern (not shown) is formed according to the arrangement of the LED module 110, and the light of the LED module 110 is transmitted through the light guide plate 13. The light is diffused and averaged when passing through and is taken out from the front surface 13 b of the light guide plate 13.

The diffusion sheet 14 is made of, for example, PET or PC resin, and has a dimension (thickness) of about 0.3 [mm] in the X-axis direction, a dimension (dimension in the longitudinal direction) of about 1040 [mm] in the Y-axis direction, and a dimension in the Z-axis direction. It is a rectangular film having a dimension (dimension in the short direction) of about 600 [mm], and is laminated so as to be in close contact with the front surface of the light guide plate 13.
The prism sheet 15 is a translucent optical sheet formed by forming a uniform prism pattern with an acrylic resin on one surface of a face material made of, for example, a polyester resin, and has a dimension (thickness) of about 0.00 in the X-axis direction. 3 [mm], Y-axis dimension (longitudinal dimension) of about 1040 [mm], Z-axis dimension (short-side dimension) of about 600 [mm], and the light extraction of the diffusion sheet 14 Laminated on the side.

  The polarizing sheet 16 is made of, for example, a PC film, a polyester film, and an acrylic resin, or made of PEN (polyethylene naphthalate), and has a dimension (thickness) of about 1040 mm in the X-axis direction and a dimension (longitudinal length). A rectangular film having a dimension of about 0.4 [mm] in the direction and a dimension in the Z-axis direction (dimension in the short direction) of about 600 [mm], and is laminated on the light extraction side of the prism sheet 15.

  The lighting circuit 17 is attached to the back surface of the housing 11 and supplies power to the linear light source device 100. Further, the current flowing through the LED module 110 is controlled. The lighting circuit 17 may be formed inside the housing 11, for example, on the mounting substrate 111 of the LED module 110. Then, the connection line with the outside is only the power supply line for operating the circuit and the control signal line for adjusting the brightness, and the connection can be simplified.

[Linear light source device]
FIG. 3 is a diagram illustrating a configuration of a main part of the illumination device according to the present embodiment, and FIG. 3A is a schematic diagram illustrating a mounting state of the linear light source device on the light guide plate. FIG. 3B is an enlarged cross-sectional view of a range indicated by A in FIG. FIG. 4 is a schematic diagram showing a state in which the linear light source device is mounted on the light guide plate, and FIG. 4A is a cross-sectional view taken along the line BB shown in FIG. FIG. 4B is a cross-sectional arrow view along the line CC shown in FIG.

As shown in FIG. 3A, the pair of linear light source devices 100 are mounted on opposite edges of the light guide plate 13, and the distance d1 between the back-side contact portions 133 is 2 [mm]. It is. Thus, by providing the separation distance d <b> 1 between the back-side contact portions 133, the dimensional tolerance of the linear light source device 100 (particularly, the dimensional tolerance of the back-side contact portion 133) is absorbed.
As described above, the linear light source device 100 includes the plurality of LED modules 110, the module mounting jig 120, and the holding member 130.

Details of the LED module 110 will be described later.
As shown in FIG. 2, the module mounting jig 120 is made of, for example, copper, has a dimension in the X-axis direction (dimension in the short direction) of about 6 [mm], and a dimension in the Y-axis direction (dimension in the longitudinal direction) of about 1040. [Mm] is a long plate shape having a dimension (thickness) of about 1 [mm] in the Z-axis direction, and is disposed along the light incident surface 13 a of the light guide plate 13. A plurality of LED modules 110 are mounted in a line along the longitudinal direction. As shown in FIG. 3B, each LED module 110 is affixed to the module mounting jig 120 with an adhesive sheet 140, and the module mounting jig 120 is mounted on the substrate portion 131 with the adhesive sheet 150. It is affixed on the surface 131a.

  As described above, the holding member 130 includes the substrate part 131, the spacer part 132, the back side contact part 133, the front side contact part 134, and the side surface locking part 135, and holds the LED module 110. The holding member 130 includes, for example, a substrate portion 131, a back-side contact portion 133, a front-side contact portion 134, and a side surface locking portion that are integrally formed by molding aluminum or bending a single copper plate. The spacer part 132 which is another member is fixed to 135 with an adhesive or a screw.

  As shown in FIG. 3A, for example, the substrate 131 has a dimension L1 in the X-axis direction (dimension in the short direction) of about 8 [mm] and a dimension in the Y-axis direction (dimension in the longitudinal direction) of about 1040 [dimensions]. mm] and a Z-axis direction dimension (thickness) of about 1 [mm], and one main surface is a mounting surface 131a for mounting the LED module 110, and the mounting surface 131a. Is disposed so as to face the light incident surface 13 a of the light guide plate 13. Twenty-two LED modules are mounted on the mounting surface 131a. Each LED module 110 is linearly arranged with no gap in a state in which the longitudinal direction of the mounting substrate 111 and the longitudinal direction of the mounting surface 131a are aligned.

  The spacer portion 132 is made of, for example, POM (polyacetal) and has a block shape with a dimension of about 8 [mm] in the X-axis direction, a dimension of about 8 [mm] in the Y-axis direction, and a dimension L2 of about 10 [mm] in the Z-axis direction. 4 (a) and 4 (b), both ends in the longitudinal direction (Y-axis direction) of the substrate 131, and from the substrate 131 to the light guide plate 13 side as shown in FIG. 3 (b). It is arranged to extend. As shown in FIG. 4B, the mounting surface 131 a and the light incident surface 13 a are parallel with the light guide plate side end surface 132 a of the spacer portion 132 in contact with the light incident surface 13 a of the light guide plate 13. And as shown in FIG.3 (b), the distance d2 of each LED module 110 and the light-incidence surface 13a will be 0.2 [mm], for example.

  Since such a spacer portion 132 is provided on the holding member 130, it is easy to position the light guide plate 13 in the Z-axis direction when the linear light source device 100 is mounted on the light guide plate 13. In addition, the spacer part 132 provides a gap of a distance d2 between the LED module 110 and the light incident surface 13a of the light guide plate 13, and regulates an emission angle of the light emitted from the LED module 110 to the light guide plate 13. Playing a role.

  As shown in FIG. 3A, the back-side contact portion 133 is, for example, approximately 8 [mm] in the X axis direction, approximately 1040 [mm] in the Y axis direction, and approximately L 299 in the Z axis direction. As shown in FIG. 3 (b), the back surface 13 c of the light guide plate 13 extends from the X-axis (−) direction side edge of the substrate portion 131 toward the light guide plate 13 side. A part of the reflective sheet 12 extending along the surface and stacked on the back surface 13 c of the light guide plate 13 is in surface contact. Further, a groove 133a that is recessed in the opposite direction to the light guide plate 13 and extends along the Y-axis direction is formed in the back-side contact portion 133 by, for example, bending, and the screw head is formed in the groove 133a. The back-side contact portion 133 is fixed to the housing 11 by a screw 136 and a screw receiver 137 so that the

Since the back surface side contact portion 133 is in contact with the reflection sheet 12, the substrate portion 131 is prevented from further moving to the thickness direction front surface 13b side of the light guide plate 13 with respect to the light guide plate 13. When mounting the light source device 100 on the light guide plate 13, it is easy to position the light guide plate 13 in the X-axis direction.
As shown in FIG. 3A, for example, the front-side contact portion 134 has a dimension of about 1 [mm] in the X-axis direction, a dimension of about 1040 [mm] in the Y-axis direction, and a dimension L4 of about 8 in the Z-axis direction. [Mm] is a plate with unevenness, and as shown in FIG. 3B, extends from the X-axis (+) direction side edge of the substrate part 131 along the front surface 13 b of the light guide plate 13. Part of the front surface 13b of the light guide plate 13 is in surface contact with both edges in the Z-axis direction. As described above, since the front-side contact portion 134 is provided in addition to the back-side contact portion 133, when the linear light source device 100 is mounted on the light guide plate 13, the X-axis direction positioning with respect to the light guide plate 13 is performed. It is easier.

  As shown in FIG. 5, the linear light source device on the optical laminate 18 (a plate material in which the diffusion sheet 14, the prism sheet 15, and the polarizing sheet 16 are bonded to the light guide plate 13 with an adhesive or the like). In the case of mounting 100, a part of the front-side contact portion 134 is in surface contact with both edges in the Z-axis direction of the front surface 18a (surface on the X-axis (+) direction side) of the optical laminate 18. As described above, the light guide plate 13, the diffusion sheet 14, the prism sheet 15, and the polarizing sheet 16 are integrated in advance before mounting the linear light source device 100, so that the diffusion sheet 14, the prism sheet 15, and the polarizing sheet are integrated. 16 deviations and deflections can be suppressed.

  As an adhesive for attaching the diffusion sheet 14, the prism sheet 15, and the polarizing sheet 16 to the light guide plate 13, a pressure sensitive adhesive, a heat sensitive adhesive (including hot melt), a solvent volatile adhesive, or the like is used. it can. Preferably, it is a curable adhesive. Curing the adhesive after adhering two light-transmitting films to the front and back surfaces of the polarizing layer provides an optical laminate having high thermal stability (hard to cause thermal shrinkage and thermal deformation). It becomes easy. In particular, a multilayer film (such as the polarizing sheet 16) has anisotropy in physical characteristics such as a coefficient of linear expansion, and therefore, deformation such as undulation easily occurs due to an external thermal action such as heat shock. Therefore, in the optical laminate including the polarizing sheet 16 made of a multilayer film, a form using a curable adhesive as an adhesion means between the light transmissive film and the polarizing layer is one of particularly preferred embodiments.

  For curing of the adhesive, a normal curing means such as heat, moisture, electron beam, and ultraviolet light can be employed. However, an ultraviolet curable adhesive is preferable. In thermosetting or electron beam curing, a relatively large amount of heat is generated, and the polarizing sheet 16 and / or the diffusion sheet 14 may be thermally damaged (deformed or the like). On the other hand, moisture curing and room temperature curing have a relatively long curing time, which may make it difficult to increase the productivity of the optical laminate. The ultraviolet curable adhesive has a relatively short curing time, and the amount of heat generated during the curing process is relatively small.

  The material of the adhesive is not particularly limited as long as the effects of the present invention are not impaired. For example, a composition comprising a resin such as an acrylic resin, a polyester resin, an epoxy resin, a polyurethane resin, a polyolefin resin, or a silicone resin (including a modified silicone such as silicone polyurea) can be used. In the case of a curable type, the resin composition can contain a curable (reactive) monomer or / and oligomer.

  The adhesive is usually disposed on the adhesion surface (adhesion surface) of the polarizing layer or the light transmissive film in the form of an adhesion layer (that is, an adhesion layer). The thickness of the adhesion layer is usually 5 to 200 μm. The light transmittance of the adhesive is not particularly limited, but is usually 60% or more, preferably 70% or more, particularly preferably 80% or more. In addition, as the material for the adhesion layer, materials other than the adhesive can be used. For example, using an adhesion layer containing rubber or elastomer (however, weaker adhesive strength than general adhesives), optically avoiding the formation of an optical interface between the light transmissive film and the polarizing layer. It can also be adhered. Moreover, as long as the brightness increasing effect is not impaired, it is possible to dispose the adhesion layer in order to adhere the light transmissive film and the polarizing layer. For example, the close contact surfaces of the light transmissive film and the polarizing layer may be made very smooth so that the air layer does not substantially intervene.

As shown in FIG. 2, the side locking portions 135 are extended from both ends of the rear-side contact portion 133 in the Y-axis direction and support both ends of the light guide plate 13 in the Y-axis direction. This makes it difficult for the light guide plate 13 to move in the Y-axis direction.
Since the holding member 130 is made of a heat conductive material such as aluminum, copper, or carbon, it serves as a heat sink. The heat generated in the LED module 110 is dissipated from the first to side locking portions 132 to 135 that are thermally connected to the substrate portion 131 via the substrate portion 131. In particular, each back-side contact portion 133 is plate-shaped so as to cover substantially half of the back surface 13c along the back surface 13c of the light guide plate 13, and thus has a large surface area and a large heat dissipation effect.

  Since the back surface side contact part 133 is a plate shape with an unevenness | corrugation, it can make it easy to radiate the heat | fever which generate | occur | produces in an LED module. In addition, it is preferable that the back contact portion 133 has a larger area in contact with the housing 11 than an area in contact with the reflection sheet 12. In this case, it is possible to make it difficult to transfer heat to the light guide plate side while enhancing the heat dissipation effect. Further, the back side contact portion 133 may be flat. In this case, the lighting device can be made thinner.

  In addition, although it is not necessarily limited to the magnitude | size which covers the substantially half area | region of the back surface 13c of the light-guide plate 13, about the back side contact part 133, in order to acquire sufficient heat dissipation effect, it is a 1/5 or more area | region of the back surface 13c. Is preferably a size that covers a region of 1/4 or more of the back surface 13c, and more preferably a size that covers a region of 1/3 or more of the back surface 13c.

[LED module]
FIG. 6 is a perspective view showing the LED module according to the present embodiment.
As shown in FIG. 6, each LED module 110 encapsulates a long mounting board 111, a total of 8 LED elements 112 as light sources mounted on the mounting board 111, and the LED elements 112. And a resin sealing portion 113 that is disposed opposite the light incident surface 13a of the light guide plate 13.

  The mounting substrate 111 is, for example, approximately 6 [mm] in the X-axis direction (short direction), approximately 46 [mm] in the Y-axis direction (longitudinal direction), and approximately 1 [mm] in the Z-axis direction (thickness). The integral multiple of the dimension in the Y-axis direction is adjusted to be substantially equal to the length of the light incident surface 13a of the light guide plate 13 in the longitudinal direction. That is, one [one] LED module 110 has a length corresponding to one inch, and one LED module 110 is added every time the image display device is increased by one inch, so that one type has various screen sizes. The LED module 110 can be used. The mounting substrate 111 may be a resin substrate such as an epoxy resin.

  On the mounting substrate 111, the LED element 112 is die-bonded to the mounting surface 111a on which the LED element 112 is mounted, and a wiring pattern (not shown) electrically connected to the cathode, and an anode and a wire (not shown) above the LED element 112 are mounted. A wiring pattern (not shown) that is conductively connected through the wiring pattern and a pair of electrodes 114 that are conductively connected to the wiring pattern are provided. Then, the pair of electrodes 114 and the lighting circuit 17 are conductively connected via the lead wire 115, and electric power for causing the LED element 112 to emit light is supplied by this connection. One spacer portion 132 is provided with a through hole (not shown) for leading the lead wire 115 to the outside of the holding member 130.

The 7 [pieces] of LED elements 112 are connected in series in the LED module 110, and each LED module 110 is subjected to constant current control by an independent drive system. The lighting circuit 17 includes a drive circuit using a general-purpose multi-channel constant current driver IC for that purpose.
Each LED element 112 has, for example, an X-axis direction dimension of about 0.3 [mm], a Y-axis direction dimension of about 0.3 [mm], and a Z-axis direction dimension (thickness) of about 0.3 [mm]. A light emitting diode that emits blue light in which a GaN-based compound semiconductor layer is formed on a light-transmitting substrate, and is mounted on a wiring pattern mounting portion (not shown) formed on the mounting surface 111a of the mounting substrate 111. Has been. The mounting surface 111a is a reflective surface, and the luminance efficiency is improved by reflecting the light emitted from the LED element 112 to the mounting substrate 111 side.

  The LED elements 112 are arranged in two rows on the mounting surface 111 in a row along the longitudinal direction of the mounting substrate 111. Thus, by arranging the LED elements 112 in two rows, an increase in the thickness of the light guide plate 13 accompanying an increase in size is dealt with. In addition, the LED elements 112 are arranged in a staggered manner so as not to overlap when viewed from the lateral end face side of the mounting substrate 111 (direction along the X axis in FIG. 6). In this way, the light extraction efficiency is improved by arranging them at positions that do not overlap when viewed from the end face side in the short direction. Further, the LED elements 112 are arranged so that the pitch widths W1 to W7 are the same when viewed from the end face side of the mounting substrate 111 in the short direction. Thereby, the brightness nonuniformity of the illuminating device 10 is suppressed.

  The resin sealing portion 113 is made of, for example, a silicone resin in which a phosphor (not shown) is dispersed, and has a dimension of about 3 [mm] in the X-axis direction (short direction) and a dimension of about Y-axis direction (longitudinal direction). 44 [mm], the dimension (thickness) in the Z-axis direction is about 1 [mm], and the LED element 112 is sealed. The resin sealing portion 113 converts, for example, part of blue light emitted from the LED element 112 by a phosphor into yellow-green light that is a complementary color, and the yellow-green light and blue light that has not been converted by the fluorescent material. Creates white light by mixing colors. In addition, as a fluorescent substance, the mixture of red and green fluorescent substance which consists of silicon nitride, YAG fluorescent substance, etc. can be considered, for example.

[Modification]
The image display device and the illumination device according to the present embodiment have been specifically described above based on the embodiment. However, the image display device and the illumination device according to the present invention are not limited to the above-described embodiment.
<About lighting device>
(Modification 1)
The configuration of the illumination device according to Modification 1 is basically the same as that of the illumination device 100 according to the above embodiment, but the structures of the LED module, the substrate unit, and the spacer unit are greatly different. In the following, description of common configurations will be omitted or simplified, and differences will be mainly described.

  FIG. 7 is an enlarged cross-sectional view illustrating a configuration of a main part of a lighting device according to the first modification. 8A and 8B are diagrams showing a wiring structure when LED elements are connected in parallel. FIG. 8A is a diagram showing the mounting surface side of the substrate, and FIG. 8B is a diagram showing the back surface side of the substrate. is there. 9A and 9B are diagrams showing a wiring structure when LED elements are connected in series, wherein FIG. 9A is a diagram showing the mounting surface side of the substrate, and FIG. 9B is a diagram showing the back surface side of the substrate. is there.

As illustrated in FIG. 7, the lighting device according to the first modification includes a plurality of LED modules 210 and a holding member 230.
The LED module 210 includes a mounting board 211 made of metal or resin, a plurality of LED elements 212 mounted on the mounting board 211, and a resin sealing portion 213 that seals the LED elements 212. A wiring pattern (not shown) is provided on the mounting surface 211a of the mounting substrate 211, and the LED elements 212 are connected in parallel by the wiring pattern and the bonding wires 215 as shown in FIG. Further, the wiring pattern is electrically connected to the electrode 214 provided on the surface 211b opposite to the mounting surface 211a through the bore 216 fitted or filled in the mounting substrate 211. As shown in FIG. 8B, the electrode 214 is provided with one anode and one cathode along the longitudinal direction of the mounting substrate 211 with respect to one LED module 210.

In addition, as shown with the dashed-two dotted line 214a in FIG.8 (b), the electrode 214 can also consider providing two each of the anode and the cathode in the position corresponding to the bore 216. FIG. Further, the LED elements 212 may be connected in series as shown in FIGS. 9 (a) and 9 (b).
As shown in FIG. 7, the holding member 230 has a pair of spacer portions extending from the X-axis (+) direction side edge and the X-axis (−) direction side edge of the substrate portion 131 to the light guide plate 13 side. The light guide plate side end surfaces 232a of the pair of spacer portions 232 are in contact with the light extraction surfaces 13b of the light guide plate 13, respectively. The back contact portion 233 extends from the light guide plate side end surface 232a of the spacer portion 232 on the X-axis (−) direction side along the reflection sheet 12.

  The spacer portions 232 according to the modified example are not disposed as two separate members at both ends in the longitudinal direction of the substrate portion 131 as in the spacer portion 132 according to the above embodiment, but are arranged along the longitudinal direction of the substrate portion 231. Extending in the entire longitudinal direction and integral with the substrate portion 231. Thus, since the spacer part 232 is provided over the whole longitudinal direction, the stable positioning in a longitudinal direction is possible.

  In the pair of spacer portions 232, a pair of rail grooves 217 are formed on surfaces 232 a facing each other so as to be fitted to both edges in the short direction of the mounting substrate 211 of the LED module 210. The holding member 230 is mounted on the holding member 230 so as to slide from the end in the Y-axis direction. In the state where each LED module 210 is mounted on the holding member 230, the rail groove 217 is formed such that the mounting surface 231 a and the light incident surface 13 a are parallel to each other, and between the LED modules 210 and the light incident surface 13 a of the light guide plate 13. Are formed so that a gap of a predetermined distance is formed. In addition, in order to guide the light of the LED module 210 to the light guide plate 13 efficiently, a process for increasing the light reflectance is performed on the mutually opposing surfaces 232 a of the pair of spacer portions 232.

  A wiring pattern (not shown) for supplying power to the LED module 210 and an insulating substrate (not shown) on which power supply terminals 235 are formed are attached to the mounting surface 231a of the substrate portion 231. In a state in which both lateral edges of the mounting substrate 211 are fitted into the pair of rail grooves 217, the electrode 214 of the LED module 210 and the power supply terminal 235 formed on the mounting surface 231a are electrically connected. .

(Modification 2)
The configuration of the lighting device according to the modification 2 is basically the same as that of the lighting device according to the modification 1, but the structure of the spacer portion is greatly different. In the following, description of common configurations will be omitted or simplified, and differences will be mainly described.
FIG. 10 is an enlarged cross-sectional view illustrating a main configuration of a lighting device according to Modification 2.

As illustrated in FIG. 10, the lighting device according to the second modification includes a plurality of LED modules 310 and a holding member 330.
The LED module 310 has the same configuration as the LED module 210 according to the first modification, and includes a mounting substrate 311, a plurality of LED elements 312, and a resin sealing portion 313, and each LED element 312 is mounted on the mounting substrate 311. The wiring pattern (not shown) provided on the surface 311a is connected to the bonding wire 315, and the wiring pattern is electrically connected to the electrode 314 provided on the surface 311b opposite to the mounting surface 311a through the bore 316. Has been.

  The spacer part 332 according to the modification 2 has a block shape like the spacer part 132 according to the above-described embodiment, and two spacer parts 332 are arranged at both ends in the longitudinal direction of the substrate part 331. The spacer portion 332 has the mounting surface 331a and the light incident surface 13a in parallel with the light guide plate side end surface 332a in contact with the light incident surface 13a of the light guide plate 13, and the LED module 310 and the light. It is interposed between the substrate portion 331 and the light guide plate 13 so that a gap of a predetermined distance is formed between the incident surface 13a.

  A wiring pattern (not shown) for supplying power to the LED module 310 and an insulating substrate (not shown) on which a power supply terminal 335 is formed are attached to the mounting surface 231a of the board portion 331. In a state where both edges in the short direction are fitted in the pair of rail grooves 317, the electrode 314 of the LED module 310 and the power supply terminal 335 formed on the mounting surface 331a are electrically connected.

(Modification 3)
The configuration of the lighting device according to Modification 3 is basically the same as that of the lighting device according to Modification 1, but the electrical connection structure of the LED module is greatly different. In the following, description of common configurations will be omitted or simplified, and differences will be mainly described.
FIG. 11 is an enlarged cross-sectional view illustrating a main configuration of a lighting device according to Modification 3. FIG. 12 is a diagram showing a wiring structure of LED elements.

As illustrated in FIG. 11, the lighting device according to the third modification includes a plurality of LED modules 410 and a holding member 430.
The LED module 410 includes a mounting board 411, a plurality of LED elements 412, and a resin sealing portion 413. Each LED element 412 is shown in FIG. 12 by a wiring pattern (not shown) provided on the mounting surface 411a of the mounting board 411. As shown, the wiring patterns are electrically connected to the electrodes 414 provided on the mounting surface 411a.

The holding member 430 includes a pair of spacer portions 432, and the light guide plate side end surfaces 432 a of the pair of spacer portions 432 are in contact with the light extraction surfaces 13 b of the light guide plate 13, respectively.
The pair of spacer portions 432 are formed with rail grooves 417 that respectively fit with both edges in the short direction of the mounting substrate 411 of the LED module 410. Further, a wiring pattern (not shown) for supplying power to the LED module 410 and an insulating substrate (not shown) on the surface 417a facing the mounting surface 411a of the mounting substrate 411 in the rail groove 417 are formed. The electrode 414 of the LED module 410 and the power supply terminal 435 are electrically connected in a state in which both edges in the short direction of the mounting substrate 411 are fitted in the pair of rail grooves 417, respectively. The

(Modification 4)
The configuration of the lighting device according to Modification 4 is basically the same as that of the lighting device according to Modification 3, but the electrical connection structure of the LED module is somewhat different. In the following, description of common configurations will be omitted or simplified, and differences will be mainly described.
FIG. 13 is an enlarged cross-sectional view illustrating a main configuration of a lighting device according to Modification 4. FIG. 14 is a diagram showing a wiring structure of LED elements.

As illustrated in FIG. 13, the lighting device according to the modification 4 includes a plurality of LED modules 510 and a holding member 530.
The LED module 510 includes a mounting substrate 511, a plurality of LED elements 512, and a resin sealing portion 513. Each LED element 512 is shown in FIG. 14 by a wiring pattern (not shown) or the like provided on the mounting surface 511a of the mounting substrate 511. As shown, the wiring patterns are electrically connected to a pair of hemispherical electrodes 514 provided on the mounting surface 511a.

    The pair of spacer portions 532 are formed with rail grooves 517 that respectively fit to both edges in the short direction of the mounting substrate 511 of the LED module 510, and are mounted in the rail groove 517 on the X axis (+) side. A wiring pattern (not shown) for supplying power to the LED module 510 and a power supply terminal 535 are formed on the surface 517 of the substrate 511 facing the mounting surface 511a. The power supply terminal 535 has a notch structure that engages with the electrode 514, and the electrode 514 and the power supply terminal 535 are connected to each other in a state where both edges in the short direction of the mounting substrate 511 are fitted in the pair of rail grooves 517. Engage and they are electrically connected.

(Modification 5)
The configuration of the illumination device according to the modification 5 is basically the same as that of the illumination device according to the modification 3, but the structure of electrical connection of the LED module is different. In the following, description of common configurations will be omitted or simplified, and differences will be mainly described.
FIG. 15 is an enlarged cross-sectional view illustrating a main configuration of a lighting device according to Modification 5. FIG. 16 is a diagram showing a wiring structure of LED elements.

As illustrated in FIG. 15, the lighting device according to the modification 5 includes a plurality of LED modules 610 and a holding member 630.
The LED module 610 includes a mounting substrate 611, a plurality of LED elements 612, and a resin sealing portion 613. Each LED element 612 is shown in FIG. 16 by a wiring pattern (not shown) provided on the mounting surface 611a of the mounting substrate 611. As shown, the wiring patterns are electrically connected to a pair of electrodes 614 provided on the mounting surface 611a.

The holding member 630 includes a pair of spacer portions 632 extending from the X-axis (+) direction side edge and the X-axis (−) direction side edge of the substrate portion 631 to the light guide plate 13 side. The light guide plate side end surface 632 a of the spacer portion 632 is in contact with the light extraction surface 13 b of the light guide plate 13.
A wiring pattern (not shown) and a power supply terminal 635 for supplying power to the LED module 610 are formed on the mutually facing surfaces 632 b of the pair of spacer portions 632. The power supply terminal 635 has a leaf spring structure, and the power supply terminal is in a state where the surface 611b opposite to the mounting surface 611a of the LED module 610 is in contact with the convex portion 631b provided on the mounting surface 631a of the substrate portion 631. The electrode 614 is pressed against the mounting substrate 611 by the power supply terminal 635 by the spring pressure of 635, whereby the power supply terminal 635 and the electrode 614 are engaged and electrically connected.

<About the arrangement of LED elements>
In the LED module 110 according to the above-described embodiment, as shown in FIG. 17, 8 [pieces] of LED elements 112 are arranged in two rows in a staggered manner on the mounting substrate 111. The arrangement is not limited to this, and an infinite number of arrangements are possible.
For example, as shown in FIG. 18, the LED elements 701 may be arranged in a staggered pattern in three rows on the mounting substrate 702, and the LED elements 711 are arranged in a staggered shape in four rows on the mounting substrate 712, as shown in FIG. May be arranged. In the case where three rows are arranged in a staggered manner, as shown in FIG. 20, the light extraction direction side (X-axis (+) direction side) of the light guide plate is opposite to the light extraction direction (X-axis (−)). If the LED element 721 is arranged on the mounting substrate 722 so that the element density is smaller than that of the direction side (so that the number of elements is reduced), the LED element 721 is visible when viewed from the obliquely outer side of the illumination device 10. The number of LED elements 721 can be reduced. Further, the LED element 721 serving as a heat source can be arranged far from the liquid crystal screen unit 2. The same applies to the case of arranging in a staggered manner in a plurality of rows such as two rows and four rows.

In the case of use in an edge light type backlight unit, it is preferable that the number of rows is two or three. This is because the light output can be increased while keeping the thickness of the backlight unit thin.
As shown in FIG. 21, when the LED elements 731 are arranged in three rows on the mounting substrate 732, the first row of red (R) light emitting LED elements 731 and the second row of green (G) light emitting LED elements 731 are arranged. It is also conceivable that the third row has a blue (B) light emitting LED element 731 to obtain white color by mixing red, green and blue. Further, as shown in FIG. 22, when the LED elements 741 are arranged in four rows on the mounting substrate 742, the first row of red (R) light emitting LED elements 741, the second row and the third row are green (G ) LED elements 741 for light emission, and blue (B) light emitting LED elements 741 in the fourth column, the number of green LED elements 741 having the highest influence on luminance improvement is more than the LED elements 741 for other colors (red and blue). It is conceivable to increase the amount.

  Furthermore, the LED elements are not necessarily arranged in a plurality of rows, and the LED devices 751 may be arranged in one row on the mounting substrate 752 as shown in FIG. The LED elements are not necessarily arranged in a staggered manner, and as shown in FIG. 24, the LED elements 761 are viewed from the end surface side of the mounting substrate 762 (the direction along the X axis in FIG. 24). May be arranged so as to overlap each other.

<LED module connection structure>
As the connection structure of the LED module, for example, the following structures 6 to 9 can be considered.
FIG. 25 is a perspective view showing an LED module according to Modification 6. FIG. 26 is a perspective view showing a connection structure of an LED module according to Modification 6.

As shown in FIG. 25, the LED module 810 according to the modified example 6 includes a mounting substrate 811, a plurality of LED elements 812 mounted on the mounting substrate 811, and a resin sealing portion that seals the LED elements 812. 813 and a pair of electrodes 814.
In order to arrange the LED modules 810 in a straight line along the longitudinal direction of the light incident surface of the light guide plate without distortion, for example, it is considered to provide notched portions 815 at both longitudinal ends of the mounting substrate 811 of each LED module 810. It is done. In this case, as shown in FIG. 26, the notch portions 815 of the adjacent LED modules 810 are engaged with each other, so that the positional deviation in the X-axis direction between the LED modules 810 can be effectively prevented.

  Note that when the cutout portion 815 is provided in the mounting substrate 811, the corner portion 816 of the mounting substrate 811 may be chamfered to prevent the chipping. Further, in order to prevent the distance between the LED elements 812 from being too vacant at the joint between the LED modules 810, the LED element 812a and the resin sealing portion 813a are also provided at the position indicated by the phantom line (two-dot chain line), The distance W11 between the LED elements 812, the distance W12 between the LED elements 812 and 812a, and the distance W13 between the LED elements 812a may be the same.

FIG. 27 is a perspective view showing an LED module according to Modification 7. FIG. FIG. 28 is a perspective view showing an LED module connection structure according to Modification 7.
As shown in FIG. 27, the LED module 820 according to the modified example 7 includes a mounting board 821, a plurality of LED elements 822 mounted on the mounting board 821, and a resin sealing portion that seals the LED elements 822. 823 and a pair of electrodes 824.

  In order to arrange the LED modules 820 in a straight line without distortion along the longitudinal direction of the light incident surface of the light guide plate, for example, as shown in FIG. 28, the longitudinal ends 825 of the mounting substrate 821 of each LED module 820 are provided. By cutting diagonally with respect to the short direction (X-axis direction) and aligning the end portions 825 of the adjacent LED modules 820 with each other, the positional deviation in the X-axis direction between the LED modules 820 may be reduced. Conceivable. In this case, since the LED elements 822 positioned at both ends in the longitudinal direction of the LED module 820 are arranged at a distance from the longitudinal tip of the mounting substrate 821, the LED elements 822 are easily mounted.

  In this case as well, the corner portion 826 of the mounting substrate 821 may be chamfered to prevent chipping. Further, the LED element 822a and the resin sealing portion 823a are also provided at the position indicated by the phantom line (two-dot chain line), the distance W21 between the LED elements 822, the distance W22 between the LED elements 822 and the LED elements 822a, and the LED The distance W23 between the elements 822a may be the same.

FIG. 29 is a perspective view showing an LED module according to Modification 8. FIG. 30 is a perspective view showing a connection structure of an LED module according to Modification 8.
As shown in FIG. 29, the LED module 830 according to the modified example 8 includes a mounting board 831, a plurality of LED elements 832 mounted on the mounting board 831, and a resin sealing portion that seals the LED elements 832. 833 and a pair of electrodes 834.

The LED module 830 is provided with connecting portions 835 at both ends in the longitudinal direction of the mounting surface 831a of the mounting substrate 831. By connecting the connecting portions 835, adjacent LED modules 830 can be connected. By setting it as such a structure, the some LED module 830 can be handled as integral, and workability | operativity of manufacture of an illuminating device becomes good.
The height of the connecting portion 835 (dimension in the Z-axis direction) is set so that the top portion 835a hits the light incident surface of the light guide plate, thereby providing the connecting portion 835 with the same function as the spacer portion of the holding member. Is possible.

FIG. 31 is a perspective view showing an LED module according to Modification 9. FIG. 32 is a perspective view showing a connection structure of an LED module according to Modification 9.
As illustrated in FIG. 31, the LED module 840 according to the modification 9 includes a mounting substrate 841, a plurality of LED elements 842 mounted on the mounting substrate 841, and a resin sealing portion that seals the LED elements 842. 843 and a pair of electrodes 844.

  The mounting substrate 841 has a pair of longitudinal end faces 841b that are obliquely cut in the same direction as viewed from the short-side end face side of the mounting substrate 841, and the pair of electrodes 844 are longitudinally extending from the mounting surface 841a of the mounting board 841. It is provided over the end face 841b. By providing the electrodes 844 on the longitudinal end surface 841b in this manner, the electrodes 844 are electrically connected to each other when the longitudinal end surfaces 841b of the adjacent LED modules 840 are aligned. In particular, since the longitudinal end face 841b is cut obliquely, the area of the electrode 844 can be increased in the longitudinal end face 841b, and the electrical connection is made more reliable. In order to prevent the mounting substrate 841 from being chipped, the corner portion 846 of the longitudinal end surface 841b may be chamfered.

<Dimensions of LED module>
Although it has already been described above that the LED module is not limited to 8 [number of LED elements], the dimensions of the LED module can be appropriately changed according to the increase or decrease in the number of LED elements.
33A and 33B are diagrams showing an LED module according to Modification Example 10, in which FIG. 33A is a perspective view, FIG. 33B is a plan view, FIG. 33C is a right side view, and FIG. ) Is a left side view, FIG. 33 (e) is a front view (the same applies to the rear view), and FIG. 33 (f) is a bottom view.

FIG. 34 is a diagram illustrating a state in which the LED module according to Modification 10 is turned on, in which FIG. 34 (a) is a perspective view, FIG. 34 (b) is a plan view, and FIG. 34 (c) is a right side view. FIG. 34 (d) is a left side view, FIG. 34 (e) is a front view (the same applies to the rear view), and FIG. 34 (f) is a bottom view.
For example, as shown in FIGS. 33A to 33E, in the LED module 910 in which 18 [LED] LED elements 912 are arranged in two rows in a staggered manner, the mounting substrate 911 provided with a pair of electrodes 914 is as follows. The dimension in the X-axis direction (short direction) is about 6 [mm], the dimension in the Y-axis direction (longitudinal direction) is about 46 [mm], and the dimension (thickness) in the Z-axis direction is about 1 [mm].

Each LED element 912 has a dimension of about 0.3 [mm] in the X-axis direction (short direction), a dimension of about 0.3 [mm] in the Y-axis direction (longitudinal direction), and a dimension (thickness) in the Z-axis direction. 0.3 [mm].
The resin sealing portion 913 has an X-axis direction (short direction) dimension of about 3 [mm], a Y-axis direction (longitudinal direction) of about 44 [mm], and a Z-axis direction dimension (thickness) of about 1 [mm]. ].
In the LED module 910, the resin sealing portion 913 is translucent, and the portion indicated by reference numeral 915 in FIGS. 34 (a) to (e) is particularly bright in the lighting state.

FIG. 35 is a diagram showing an LED module according to the eleventh modification, in which FIG. 35 (a) is a perspective view, FIG. 35 (b) is a front view (the same applies to the rear view), and FIG. 35 (c) is a right side view. FIG. 35 (d) is a plan view, and FIG. 35 (e) is a bottom view.
Further, when the number of LED elements is increased to, for example, 400 [pieces], an LED module 920 as shown in FIGS. If it is the said LED module 920, it is only necessary to provide 1 [piece] with respect to the holding member 130 according to the above embodiment, and it is easier to assemble the linear light source device than when a plurality of LED modules 110 are provided in a row. It is.

The mounting substrate 921 provided with the pair of electrodes 924 has a dimension of about 6 [mm] in the X-axis direction (short direction), a dimension of about 1050 [mm] in the Y-axis direction (longitudinal direction), and a dimension in the Z-axis direction ( Thickness) is about 1 [mm].
The resin sealing portion 923 has a dimension in the X-axis direction (short direction) of about 3 [mm], a dimension in the Y-axis direction (longitudinal direction) of about 1040 [mm], and a dimension (thickness) in the Z-axis direction of about 1 [mm]. ].

<Others>
The lighting device and the image display device according to the present invention may be configured by combining a part of the configuration of the lighting device and the image display device according to the present embodiment and the lighting device according to the modification.

  The illumination device and the image display device according to the present invention can be used as, for example, a liquid crystal television, a liquid crystal display, a planar light source for general illumination, and the like.

1 is an exploded perspective view showing a schematic configuration of an image display apparatus according to the present embodiment. Exploded perspective view showing a schematic configuration of a lighting device according to the present embodiment. It is a figure which shows the principal part structure of the illuminating device which concerns on this Embodiment, Comprising: Fig.3 (a) is the schematic which shows the mounting state to the light-guide plate of a linear light source device, FIG.3 (b) is a figure. Enlarged sectional view of the range indicated by A in 3 (a) It is the schematic which shows the mounting state to the light-guide plate of a linear light source device, and Fig.4 (a) is a cross-sectional arrow view along the BB line shown in FIG.3 (b). FIG. 4B is a cross-sectional view taken along line CC shown in FIG. The figure which shows the principal part structure of the illuminating device which concerns on a modification. The perspective view which shows the LED module which concerns on this Embodiment The expanded sectional view which shows the principal part structure of the illuminating device which concerns on the modification 1. It is a figure which shows the wiring structure at the time of connecting an LED element in parallel, Comprising: Fig.8 (a) is a figure which shows the mounting surface side of a board | substrate, FIG.8 (b) is a figure which shows the back surface side of a board | substrate. . 9A and 9B are diagrams showing a wiring structure when LED elements are connected in series, wherein FIG. 9A shows a mounting surface side of the substrate, and FIG. 9B shows a back side of the substrate. The expanded sectional view which shows the principal part structure of the illuminating device which concerns on the modification 2. The expanded sectional view which shows the principal part structure of the illuminating device which concerns on the modification 3. The figure which shows the wiring structure of the LED element The expanded sectional view which shows the principal part structure of the illuminating device which concerns on the modification 4. The figure which shows the wiring structure of the LED element The expanded sectional view which shows the principal part structure of the illuminating device which concerns on the modification 5. The figure which shows the wiring structure of the LED element The figure which shows the arrangement | sequence of the LED element which concerns on this Embodiment The figure which shows the arrangement | sequence of the LED element which concerns on a modification The figure which shows the arrangement | sequence of the LED element which concerns on a modification The figure which shows the arrangement | sequence of the LED element which concerns on a modification The figure which shows the arrangement | sequence of the LED element which concerns on a modification The figure which shows the arrangement | sequence of the LED element which concerns on a modification The figure which shows the arrangement | sequence of the LED element which concerns on a modification The figure which shows the arrangement | sequence of the LED element which concerns on a modification The perspective view which shows the LED module which concerns on the modification 6. The perspective view which shows the connection structure of the LED module which concerns on the modification 6. The perspective view which shows the LED module which concerns on the modification 7. The perspective view which shows the connection structure of the LED module which concerns on the modification 7. The perspective view which shows the LED module which concerns on the modification 8. The perspective view which shows the connection structure of the LED module which concerns on the modification 8. The perspective view which shows the LED module which concerns on the modification 9. The perspective view which shows the connection structure of the LED module which concerns on the modification 9. It is a figure which shows the LED module which concerns on the modification 10, Comprising: Fig.33 (a) is a perspective view, FIG.33 (b) is a front view, FIG.33 (c) is a right view, FIG.33 (d) is a left view. Fig. 33 (e) is a plan view (the same applies to the bottom view), and Fig. 33 (f) is a rear view. It is a figure which shows the state which the LED module concerning the modification 10 lighted, Comprising: Fig.34 (a) is a perspective view, FIG.34 (b) is a front view, FIG.34 (c) is a right view, FIG.34 (d). ) Is a left side view, FIG. 34 (e) is a plan view (the same is the bottom view), and FIG. 34 (f) is a rear view. It is a figure which shows the LED module which concerns on the modification 11, Comprising: Fig.35 (a) is a perspective view, FIG.35 (b) is a front view (a back view is also the same), FIG.35 (c) is a right view (left side). Fig. 35 (d) is a plan view, and Fig. 35 (e) is a bottom view. The figure which shows the principal part structure of the conventional illuminating device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Image display apparatus 10 Illuminating device 13 Light guide plate 13a Side surface 13b Front surface 13c Back surface 130 Holding member 100 Linear light source device 110 Semiconductor light emitting module 111 Mounting substrate 112 Semiconductor light emitting element 131 Substrate part 131a Main surface 132 Spacer part 133 Back side contact part

Claims (8)

A lighting device comprising a light guide plate having a flat side surface, a semiconductor light emitting module disposed opposite to the side surface, and a holding member for holding the semiconductor light emitting module,
The holding member is
An elongated substrate portion on which the semiconductor light emitting module is mounted on one main surface;
A spacer portion interposed between the substrate portion and the light guide plate, and preventing the semiconductor light emitting module from approaching a side surface of the light guide plate by a predetermined distance or more;
A thickness direction of the light guide plate is further increased with respect to the light guide plate by contacting the back surface of the light guide plate or a member stacked on the back surface directly or indirectly on the substrate portion. A lighting device, comprising: a back surface side contact portion that prevents movement to the front surface side.   The lighting device according to claim 1, wherein the back-side contact portion has a plate shape covering an area of 1/5 or more of the back surface of the light guide plate.   2. The lighting device according to claim 1, wherein the back-side contact portion has a plate shape that covers a substantially entire region or a substantially half region of the back surface of the light guide plate. The semiconductor light emitting module includes a long mounting substrate and a plurality of semiconductor light emitting elements mounted on the mounting substrate,
The lighting device according to claim 1, wherein the plurality of semiconductor light emitting elements are arranged in a plurality of rows in a row along the longitudinal direction of the mounting substrate.   The lighting device according to claim 4, wherein the plurality of semiconductor light emitting elements are arranged at positions that do not overlap each other when viewed from the end surface side in the short direction of the mounting substrate. The semiconductor light emitting module includes a long mounting substrate, a plurality of semiconductor light emitting elements mounted on the mounting substrate, and a pair of electrodes.
The holding member is formed with a pair of rail grooves into which both lateral edges of the mounting substrate are respectively fitted, and a pair of power supply terminals for supplying power to the semiconductor light emitting modules,
The pair of electrodes and the pair of power supply terminals are electrically connected to each other in a state where both edges in the short direction of the mounting board are fitted in the pair of rail grooves, respectively. The illumination device according to any one of 1 to 3. A pair of the semiconductor light emitting module and the holding member are mounted on opposite edges of the light guide plate,
The back-side contact portions of the holding members that are mounted to face each other are plate-like that cover substantially half the area of the back surface of the light guide plate, and are spaced apart from each other. The lighting device according to claim 1.   An image display device comprising: the illumination device according to claim 1; and a liquid crystal display unit.

Images