CN112349214A - Micro LED panel, manufacturing method thereof and display device - Google Patents
Micro LED panel, manufacturing method thereof and display device Download PDFInfo
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- CN112349214A CN112349214A CN202011165668.3A CN202011165668A CN112349214A CN 112349214 A CN112349214 A CN 112349214A CN 202011165668 A CN202011165668 A CN 202011165668A CN 112349214 A CN112349214 A CN 112349214A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/046—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by electromagnetic means
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- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Human Computer Interaction (AREA)
- Mathematical Physics (AREA)
- Electromagnetism (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention provides a micro LED panel, a manufacturing method thereof and a display device, wherein the micro LED panel comprises: the substrate comprises a substrate base plate and an electromagnetic touch structure arranged on one side of the substrate base plate; the control circuit structure is arranged on one side, away from the substrate, of the electromagnetic touch structure; and the micro LED structure is connected with the control circuit structure through a binding electrode. The method is used for realizing the light and thin design of the micro LED display device.
Description
Technical Field
The invention relates to the technical field of display, in particular to a micro LED panel, a manufacturing method thereof and a display device.
Background
A Light Emitting Diode (LED) display device is to miniaturize and matrix a conventional LED structure to realize display. It has been the focus of research in the display field due to its advantages of small size, high resolution, high brightness, high light emitting efficiency, low power consumption, etc.
How to realize the light and thin design of the micro LED display device becomes a problem to be solved urgently.
Disclosure of Invention
The invention provides a micro LED panel, a manufacturing method thereof and a display device, which are used for realizing the light and thin design of the micro LED display device.
In a first aspect, an embodiment of the present invention provides a micro LED panel, including:
the substrate comprises a substrate base plate and an electromagnetic touch structure arranged on one side of the substrate base plate;
the control circuit structure is arranged on one side, away from the substrate, of the electromagnetic touch structure;
and the micro LED structure is connected with the control circuit structure through a binding electrode.
In a possible implementation manner, the electromagnetic touch structure includes a first insulating layer, a first electromagnetic touch electrode, a second insulating layer, a second electromagnetic touch electrode, and a third insulating layer, which are sequentially arranged away from the substrate, and an orthographic projection of the first electromagnetic touch electrode on the substrate is at least partially overlapped with an orthographic projection of the second electromagnetic touch electrode on the substrate.
In one possible implementation manner, the first insulating layer, the second insulating layer, and the third insulating layer are planarization layers, and the first electromagnetic touch electrode and the second electromagnetic touch electrode are made of copper.
In one possible implementation manner, the first insulating layer and the second insulating layer are both white ink layers, and the first electromagnetic touch electrode and the second electromagnetic touch electrode are both made of silver paste.
In a second aspect, an embodiment of the present invention further provides a micro LED display device, including:
a liquid crystal display panel;
a micro LED panel as described above;
wherein the micro LED structure in the micro LED panel is used as a backlight of the liquid crystal display panel.
In one possible implementation manner, a side of the liquid crystal display panel facing away from the micro LEDs is provided with a high-hardness polarizer.
In a third aspect, an embodiment of the present invention provides a micro LED display device, including:
the micro LED panel as described above, wherein the micro LED panel is used to display an image.
In a fourth aspect, an embodiment of the present invention provides a method for manufacturing a micro LED panel, including:
forming an electromagnetic touch structure on one side of a substrate;
forming a control circuit structure on one side of the electromagnetic touch structure, which is far away from the substrate;
and connecting the micro LED structure with the control circuit structure through a binding electrode.
In one possible implementation manner, the forming an electromagnetic touch structure on one side of a substrate includes:
forming a first insulating layer on one side of the substrate base plate;
forming a pattern of a first electromagnetic touch electrode on one side of the first insulating layer, which is far away from the substrate base plate, by adopting a photoetching process;
forming a second insulating layer on one side of the first electromagnetic touch electrode, which is far away from the substrate base plate;
forming a pattern of a second electromagnetic touch electrode on one side of the second insulating layer, which is far away from the substrate base plate, by adopting a photoetching process;
and forming a third insulating layer on one side of the second electromagnetic touch electrode, which is far away from the substrate, wherein the first insulating layer, the first electromagnetic touch electrode, the second insulating layer, the second electromagnetic touch electrode and the third insulating layer form the electromagnetic touch structure.
In one possible implementation manner, the forming an electromagnetic touch structure on one side of a substrate includes:
adopting a screen printing process, and arranging white ink on one side of the first electromagnetic touch electrode, which is far away from the substrate, to form a first insulating layer;
silver paste is arranged on one side, away from the substrate, of the first insulating layer by adopting a screen printing process to form a pattern of a first electromagnetic touch electrode;
adopting a screen printing process, and arranging white ink on one side of the first electromagnetic touch electrode, which is far away from the substrate, to form a second insulating layer;
silver paste is arranged on one side, away from the substrate, of the second insulating layer by adopting a screen printing process to form a pattern of a second electromagnetic touch electrode;
and forming a third insulating layer on one side of the second electromagnetic touch electrode, which is far away from the substrate, wherein the first insulating layer, the first electromagnetic touch electrode, the second insulating layer, the second electromagnetic touch electrode and the third insulating layer form the electromagnetic touch structure.
The invention has the following beneficial effects:
the embodiment of the invention provides a micro LED panel, a manufacturing method thereof and a display device, wherein the micro LED panel comprises a substrate, an electromagnetic touch structure arranged on one side of the substrate, a control circuit structure arranged on one side of the electromagnetic touch structure, which is far away from the substrate, and a micro LED structure connected with the control circuit structure through a binding electrode, namely, the electromagnetic touch structure is directly arranged between the control circuit structure and the substrate, which are bound and connected with the micro LED structure, and the electromagnetic touch function of the micro LED panel can be realized through the electromagnetic touch structure without additionally attaching other touch film layer structures, so that the light and thin design of the micro LED display device is realized.
Drawings
Fig. 1 is a schematic structural diagram of a micro LED display device provided in the related art;
fig. 2 is a schematic structural diagram of a micro LED panel according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a micro LED panel according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a micro LED display device according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a micro LED display device according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a micro LED display device according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a micro LED display device according to an embodiment of the present invention;
fig. 8 is a flowchart illustrating a method for manufacturing a micro LED panel according to an embodiment of the present invention;
fig. 9 is a flowchart of one method of step S101 in a method for manufacturing a micro LED panel according to an embodiment of the present invention;
fig. 10 is a flowchart of one method of step S101 in the method for manufacturing a micro LED panel according to the embodiment of the present invention.
Description of reference numerals:
1-a glass cover plate; 2-a touch substrate; 3-first optical cement; 4-second optical cement; 10-a substrate base plate; 20-an electromagnetic touch structure; 30-a control circuit configuration; 40-micro LED structure; 201-a first electromagnetic touch electrode; 202-a second electromagnetic touch electrode; 301-a first insulating layer; 302-a second insulating layer; 303 — a third insulating layer; 50-a liquid crystal display panel; 500-high hardness polarizer; 60-micro LED panel; 501-color film substrate; 502-a liquid crystal layer; 503-an array substrate; 70-a composite film layer; 80-black glue; 90-protective cover plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. And the embodiments and features of the embodiments may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of the word "comprise" or "comprises", and the like, in the context of this application, is intended to mean that the elements or items listed before that word, in addition to those listed after that word, do not exclude other elements or items.
It should be noted that the sizes and shapes of the figures in the drawings are not to be considered true scale, but are merely intended to schematically illustrate the present invention. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
In the prior art, the touch function of the micro LED display device is often realized by using the schematic structural diagram shown in fig. 1, specifically, a glass cover plate 1 and a touch substrate 2 attached with an acceleration sensor (G-sensor) are separately manufactured, and then the glass cover plate and the touch substrate are attached to the micro LED display device by a first optical Adhesive (OCA) 3 and a second optical Adhesive 4, so that the overall thickness of the micro LED display device is relatively thick and the weight of the micro LED display device is relatively heavy.
In view of this, embodiments of the present invention provide a micro LED panel, a method for manufacturing the same, and a display device.
Fig. 2 is a schematic structural diagram of a micro LED panel according to an embodiment of the present invention, and in particular, the micro LED panel includes:
the touch control device comprises a substrate base plate 10 and an electromagnetic touch control structure 20 arranged on one side of the substrate base plate 10;
in a specific implementation process, the substrate 10 may be a glass substrate, or may also be a silicon substrate, which is not limited herein.
The control circuit structure 30 is arranged on one side, away from the substrate base plate 10, of the electromagnetic touch structure 20;
a micro LED structure 40 connected to the control circuit structure 30 through a bonding electrode.
In a specific implementation process, the control circuit structure 30 may be used to control the light emitting brightness, the light emitting duration, and the like of the micro LED structure 40 connected to the control circuit structure through the bonding electrode, which is not limited herein. In practical applications, the Micro LED may be a Mini LED or a Micro LED, which is not limited herein. In addition, the control circuit structure 30 may include a Pwr signal line and a GND line, and the specific design is the same as that of the circuit structure for driving the micro LED structure 40 in the prior art, which is not described in detail herein.
In a specific implementation process, the electromagnetic touch structure 20 may be directly disposed between the control circuit structure 30 bound to the micro LED structure 40 and the substrate 10, and the electromagnetic touch function of the micro LED panel 60 may be achieved through the electromagnetic touch structure 20 without additionally attaching other film structures, so as to achieve a light and thin design of the micro LED display device.
In an embodiment of the present invention, as shown in fig. 3, which is a schematic structural diagram of a micro LED display panel provided in an embodiment of the present invention, the electromagnetic touch structure 20 includes a first insulating layer 301, a first electromagnetic touch electrode 201, a second insulating layer 302, a second electromagnetic touch electrode 202, and a third insulating layer 303, which are sequentially disposed away from the substrate 10, and an orthographic projection of the first electromagnetic touch electrode 201 on the substrate 10 is at least partially overlapped with an orthographic projection of the second electromagnetic touch electrode 202 on the substrate 10. In practical application, when the electromagnetic touch pen is close to the micro LED panel, the induction line generated between the first electromagnetic touch electrode 201 and the second electromagnetic touch electrode 202 in the electromagnetic touch structure 20 will change, and the coordinate position of the electromagnetic touch pen can be determined through the change of magnetic flux, so that the electromagnetic touch pen can be positioned without directly contacting the micro LED panel with the electromagnetic touch pen in the whole process, and the use performance of the micro LED panel is improved.
In the embodiment of the invention, different manufacturing processes may be adopted to manufacture the electromagnetic touch structure 20. In a specific implementation process, when the electromagnetic touch structure 20 is manufactured by using a photolithography process, the first insulating layer 301, the second insulating layer 302, and the third insulating layer 303 are all planarization layers, and the planarization layers may be an Over Coater (OC) material or a Polyimide Film (PI) material. The first electromagnetic touch electrode 201 and the second electromagnetic touch electrode 202 are both made of copper, so that the low-cost design of the micro LED panel is ensured, and meanwhile, the better magnetic induction capability of the micro LED panel is ensured.
In a specific implementation process, when the electromagnetic touch structure 20 is manufactured by a screen printing process, the first insulating layer 301 and the second insulating layer 302 are both white ink layers, and the first electromagnetic touch electrode 201 and the second electromagnetic touch electrode 202 are both made of silver paste. The first insulating layer 301 and the second insulating layer 302 made of the white ink layer can effectively reflect light from the micro LED structure 40 while avoiding short circuit, thereby improving light extraction efficiency and improving brightness of the micro LED panel. In addition, the first electromagnetic touch electrode 201 and the second electromagnetic touch electrode 202 are made of silver paste, so that the electromagnetic touch structure 20 has better electromagnetic characteristics, and the manufacturing efficiency of the first electromagnetic touch electrode 201 and the second electromagnetic touch electrode 202 is improved.
Based on the same inventive concept, an embodiment of the present invention further provides a micro LED display device, as shown in fig. 4, the micro LED display device includes:
a liquid crystal display panel 50;
wherein the micro LED structure 40 in the micro LED panel 60 serves as a backlight of the liquid crystal display panel 50.
In a specific embodiment, a certain light mixing distance is reserved between the micro LED structure 40 in the micro LED panel 60 and the liquid crystal display panel 50, so as to improve the display quality of the micro LED display device.
In the embodiment of the present invention, as shown in fig. 5, one of the structural diagrams of the micro LED display device is shown, specifically, a high-hardness polarizer 500 is disposed on a side of the liquid crystal display panel 50 facing away from the micro LEDs. In this way, when the display of the liquid crystal display panel 50 is realized through the high-hardness polarizer 500, the effective protection of the micro LED display device can be achieved, so that the use performance of the micro LED display device is ensured.
In an embodiment of the present invention, as shown in fig. 6, a schematic structural diagram of a micro LED display device is shown, specifically, the liquid crystal display panel 50 includes a color film substrate 501, an array substrate 503 disposed opposite to the color film substrate 501, and a liquid crystal layer 502 disposed between the color film substrate 501 and the array substrate 503, a composite film layer 70 is further disposed between the array substrate 503 and the micro LED structure 40, and the composite film layer 70 may include a prism layer, a quantum dot film, a diffusion sheet, and the like, and the specific configuration is the same as that in the prior art, and details are not described here.
In a specific implementation process, the principle of the micro LED display device for solving the problem is similar to that of the micro LED panel 60, so that the implementation of the micro LED display device can refer to the implementation of the micro LED panel 60, and repeated details are not repeated.
In a specific implementation process, the micro LED display device provided in the embodiment of the present invention may be a mobile phone, and certainly, the micro LED display device provided in the embodiment of the present invention may also be any product or component having a display function, such as a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, a television, an electronic whiteboard, and the like. Other essential components of the display device are understood by those skilled in the art, and are not described herein nor should they be construed as limiting the present invention.
Based on the same inventive concept, as shown in fig. 7, one of the schematic structural diagrams of a micro LED display device provided in an embodiment of the present invention includes:
the micro LED panel 60 as described above, wherein the micro LED panel 60 is used to display an image.
In the specific implementation process, as shown in fig. 7, taking RGB display as an example, a black glue 80 is further disposed between the two adjacent micro LED structures 40, where the black glue 80 is used to avoid a color mixture phenomenon between the two adjacent micro LED structures 40, and improve the display quality of the micro LED display device. Wherein reference numeral 90 in fig. 7 denotes a protective cover plate, which may be related to the prior art for other film layer structures in the micro LED display device shown in fig. 7 and will not be described in detail herein.
Based on the same inventive concept, as shown in fig. 8, a method flowchart of a method for manufacturing a micro LED panel provided in an embodiment of the present invention includes:
s101: forming an electromagnetic touch structure on one side of a substrate;
s102: forming a control circuit structure on one side of the electromagnetic touch structure, which is far away from the substrate;
s103: and connecting the micro LED structure with the control circuit structure through a binding electrode.
In the specific implementation process, the specific implementation process from step S101 to step S103 is as follows:
first, an electromagnetic touch structure 20 is formed on one side of a substrate 10, for example, a whole layer of copper may be plated on one side of the substrate 10 by an electroplating process, and a specific process for manufacturing the electromagnetic touch structure 20 will be described in detail below. Then, the electromagnetic touch structure 20 is formed by patterning the copper by using a photolithography process. After the electromagnetic touch structure 20 is formed, a control circuit structure 30 is formed on a side of the electromagnetic touch structure 20 away from the substrate 10. The manufacturing process of the control circuit structure 30 is the same as the prior art, and will not be described in detail here. Then, the micro LED structure 40 is connected to the control circuit structure 30 through the bonding electrode, specifically, a bulk transfer technique in the prior art may be adopted to realize the connection between the micro LED structure 40 and the control circuit structure 30, which is not described in detail herein.
In the embodiment of the present invention, as shown in fig. 9, step S101: forming an electromagnetic touch structure on one side of a substrate base plate, comprising:
s201: forming a first insulating layer on one side of the substrate base plate;
s202: forming a pattern of a first electromagnetic touch electrode on one side of the first insulating layer, which is far away from the substrate base plate, by adopting a photoetching process;
s203: forming a second insulating layer on one side of the first electromagnetic touch electrode, which is far away from the substrate base plate;
s204: forming a pattern of a second electromagnetic touch electrode on one side of the second insulating layer, which is far away from the substrate base plate, by adopting a photoetching process;
s205: and forming a third insulating layer on one side of the second electromagnetic touch electrode, which is far away from the substrate, wherein the first insulating layer, the first electromagnetic touch electrode, the second insulating layer, the second electromagnetic touch electrode and the third insulating layer form the electromagnetic touch structure.
In the specific implementation process, the specific implementation process of step S201 to step S205 is as follows:
first, a first insulating layer 301 is formed on one side of the base substrate 10, for example, the first insulating layer 301 may be formed on one side of the base substrate 10 on which an OC material is coated. Then, a pattern of the first electromagnetic touch electrode 201 is formed on a side of the first insulating layer 301 away from the substrate base plate 10 by using a photolithography process, where a whole layer of copper is electroplated on the side of the first insulating layer 301 away from the substrate base plate 10, and then the pattern of the first electromagnetic touch electrode 201 is formed by using photolithography processes such as exposure and development. Then, forming the second insulating layer 302 on the side of the first electromagnetic touch electrode 201 away from the substrate 10, then forming the second electromagnetic touch electrode 202 on the side of the second insulating layer 302 away from the substrate 10 by using the same preparation principle as the first electromagnetic touch electrode 201, and then forming the third insulating layer 303 on the side of the second electromagnetic touch electrode 202 away from the substrate 10, thereby realizing the preparation of the electromagnetic touch structure 20.
In a specific implementation process, the first electromagnetic touch electrode 201, the second electromagnetic touch electrode 202, the first insulating layer 301 and the second insulating layer 302 in the electromagnetic touch structure 20 can be manufactured through a photolithography process, so that the micro LED panel is thinned to a thinner thickness.
In the embodiment of the present invention, as shown in fig. 10, step S101: forming an electromagnetic touch structure on one side of a substrate base plate, comprising:
s301: adopting a screen printing process, and arranging white ink on one side of the first electromagnetic touch electrode, which is far away from the substrate, to form a first insulating layer;
s302: silver paste is arranged on one side, away from the substrate, of the first insulating layer by adopting a screen printing process to form a pattern of a first electromagnetic touch electrode;
s303: adopting a screen printing process, and arranging white ink on one side of the first electromagnetic touch electrode, which is far away from the substrate, to form a second insulating layer;
s304: silver paste is arranged on one side, away from the substrate, of the second insulating layer by adopting a screen printing process to form a pattern of a second electromagnetic touch electrode;
s305: and forming a third insulating layer on one side of the second electromagnetic touch electrode, which is far away from the substrate, wherein the first insulating layer, the first electromagnetic touch electrode, the second insulating layer, the second electromagnetic touch electrode and the third insulating layer form the electromagnetic touch structure.
In the specific implementation process, the specific implementation process of step S301 to step S305 is as follows:
firstly, printing a white ink whole layer on one side of the first electromagnetic touch electrode 201, which is far away from the substrate base plate 10, by adopting a screen printing process to form a first insulating layer 301, then printing a silver paste whole layer on one side of the first insulating layer 301, which is far away from the substrate base plate 10, by adopting the same process, in practical application, a screen printing plate can be designed according to a pattern of the first electromagnetic touch electrode 201, so that the pattern of the first electromagnetic touch electrode 201 can be obtained by adopting the screen printing process through the silver paste, then printing the white ink whole layer on one side of the first electromagnetic touch electrode 201, which is far away from the substrate base plate 10, by adopting the same process, to form a second insulating layer 302, and according to the principle of manufacturing the first electromagnetic touch electrode 201, on one side of the second insulating layer 302, which is far away from the substrate base plate 10, the second electromagnetic touch electrode 202 is patterned. Similarly, a third insulating layer 303 is formed on a side of the second electromagnetic touch electrode 202 away from the substrate base plate 10, so as to implement the preparation of the electromagnetic touch structure 20.
In addition, in the implementation process, a photolithography process and a screen printing process may be simultaneously used to fabricate the relevant film structure in the electromagnetic touch structure 20, which is not described in detail herein.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A micro LED panel, comprising:
the substrate comprises a substrate base plate and an electromagnetic touch structure arranged on one side of the substrate base plate;
the control circuit structure is arranged on one side, away from the substrate, of the electromagnetic touch structure;
and the micro LED structure is connected with the control circuit structure through a binding electrode.
2. The micro LED panel of claim 1, wherein the electromagnetic touch structure comprises a first insulating layer, a first electromagnetic touch electrode, a second insulating layer, a second electromagnetic touch electrode, and a third insulating layer disposed sequentially away from the substrate base, wherein an orthographic projection of the first electromagnetic touch electrode on the substrate base at least partially overlaps an orthographic projection of the second electromagnetic touch electrode on the substrate base.
3. The micro LED panel of claim 2, wherein the first insulating layer, the second insulating layer, and the third insulating layer are planarization layers, and the first electromagnetic touch electrode and the second electromagnetic touch electrode are made of copper.
4. The micro LED panel of claim 2, wherein the first insulating layer and the second insulating layer are both white ink layers, and the first electromagnetic touch electrode and the second electromagnetic touch electrode are both made of silver paste.
5. A micro LED display device, comprising:
a liquid crystal display panel;
the micro LED panel of any one of claims 1-4;
wherein the micro LED structure in the micro LED panel is used as a backlight of the liquid crystal display panel.
6. The display device according to claim 5, wherein a side of the liquid crystal display panel facing away from the micro LEDs is provided with a high-hardness polarizer.
7. A micro LED display device, comprising:
the micro LED panel of any of claims 1-4, wherein the micro LED panel is configured to display an image.
8. A manufacturing method of a micro LED panel is characterized by comprising the following steps:
forming an electromagnetic touch structure on one side of a substrate;
forming a control circuit structure on one side of the electromagnetic touch structure, which is far away from the substrate;
and connecting the micro LED structure with the control circuit structure through a binding electrode.
9. The method of claim 8, wherein forming the electromagnetic touch structure on one side of the substrate base plate comprises:
forming a first insulating layer on one side of the substrate base plate;
forming a pattern of a first electromagnetic touch electrode on one side of the first insulating layer, which is far away from the substrate base plate, by adopting a photoetching process;
forming a second insulating layer on one side of the first electromagnetic touch electrode, which is far away from the substrate base plate;
forming a pattern of a second electromagnetic touch electrode on one side of the second insulating layer, which is far away from the substrate base plate, by adopting a photoetching process;
and forming a third insulating layer on one side of the second electromagnetic touch electrode, which is far away from the substrate, wherein the first insulating layer, the first electromagnetic touch electrode, the second insulating layer, the second electromagnetic touch electrode and the third insulating layer form the electromagnetic touch structure.
10. The method of claim 8, wherein forming the electromagnetic touch structure on one side of the substrate base plate comprises:
adopting a screen printing process, and arranging white ink on one side of the first electromagnetic touch electrode, which is far away from the substrate, to form a first insulating layer;
silver paste is arranged on one side, away from the substrate, of the first insulating layer by adopting a screen printing process to form a pattern of a first electromagnetic touch electrode;
adopting a screen printing process, and arranging white ink on one side of the first electromagnetic touch electrode, which is far away from the substrate, to form a second insulating layer;
silver paste is arranged on one side, away from the substrate, of the second insulating layer by adopting a screen printing process to form a pattern of a second electromagnetic touch electrode;
and forming a third insulating layer on one side of the second electromagnetic touch electrode, which is far away from the substrate, wherein the first insulating layer, the first electromagnetic touch electrode, the second insulating layer, the second electromagnetic touch electrode and the third insulating layer form the electromagnetic touch structure.
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