KR20110079980A - Electronic paper panel, method of manufacturing the same - Google Patents

Abstract

PURPOSE: An electronic paper panel and a method of manufacturing the same are provided to install an electronic paper film and a driving chip in a substrate. CONSTITUTION: An electronic paper panel comprises a substrate(110), a wiring layer(120) which is formed on the substrate, a pad part(121) which are placed on the substrate and electrically connected with the wiring layer, a segment electrode which is electrically connected with the wiring layer, an electronic film which includes a segment electrode, and a driving chip which is mounted on the pad part.

Description

Electronic paper panel and its manufacturing method {Electronic paper panel, method of manufacturing the same}

The present invention relates to an electronic paper panel, and more particularly, to an electronic paper panel for mounting an electronic paper film and a driving chip on one substrate, and a method of manufacturing the same.

BACKGROUND ART As a next generation display device, a liquid crystal display (LCD), a plasma display panel (PDP), an organic EL device, an electronic paper display, and the like are widely used.

Among them, the electronic paper display device does not require backlighting or continuous recharging, so it can be driven with very little energy, so the energy efficiency is excellent.

In addition, since the electronic paper display device has a clear and wide viewing angle and also has a memory function that does not completely disappear the displayed characters or images even when the power is momentarily turned off, the electronic paper display device can be folded, including print media such as books, newspapers or magazines. It is expected to be widely used in a wide range of fields such as screens and electronic wallpaper.

On the other hand, the electronic paper display device includes an electronic paper film, a substrate having an electrode for applying power to the electronic paper film, a driving chip for applying a driving signal to the electronic paper film, a chip on film (COF) for supporting the driving chip, and It may include a main board electrically connected to the driving chip.

Here, the driving chip is electrically connected to the printed circuit board and the main board, the driving chip may receive a driving signal from the main board to apply the driving signal to the electronic paper film through the printed circuit board.

In this case, the printed circuit board and the COF or the COF and the main board may be electrically connected to each other through ACF (Anisotropic Conductive Film) bonding. As a result, in order to manufacture the electronic paper display device, an anisotropic conductive film (ACF) bonding process must be performed at least two times, which complicates the manufacturing process of the electronic paper display device and uses a material such as an anisotropic conductive film (ACF). Due to this, there was a problem that the product price rises.

Accordingly, the present invention has been made to solve a problem that may occur in an electronic paper panel, and in particular, an object of the present invention is to provide an electronic paper panel and a manufacturing method thereof for mounting an electronic paper film and a driving chip on a single substrate. have.

The object of the present invention is to provide an electronic paper panel. The electronic paper panel is a substrate; A wiring layer formed on the substrate; A pad part electrically connected to the wiring layer and disposed on the substrate; A barrier layer disposed on the wiring layer; A segment electrode disposed on the barrier layer and electrically connected to the wiring layer; An electronic paper film disposed on the substrate including the segment electrode; And a driving chip mounted on the pad part.

Here, the electronic paper film is an electronic paper layer, a common electrode layer disposed on the electronic paper layer; And a protective layer disposed on the common electrode layer.

In addition, it may further include a conductive adhesive member interposed between the electronic paper layer and the segment electrode.

In addition, the segment electrode may include any one of tin oxide (TO), indium tin oxide (ITO), Ag, and copper.

In addition, the wiring layer may be formed of ITO.

In addition, the substrate may include any one of a glass substrate, a plastic substrate, and a ceramic substrate.

In addition, the barrier layer may include a colored pigment.

Another object of the present invention is to provide a method for producing an electronic paper panel. The manufacturing method includes forming a wiring layer and a pad portion on a substrate; Forming a barrier layer on the substrate including the wiring layer; Forming a segment electrode disposed on the barrier layer and electrically connected to the wiring layer; Attaching an electronic paper film onto the substrate including the segment electrode; And mounting a driving chip on the pad part.

Here, the barrier layer may be formed by any one of a screen printing method, an offset printing method, and a photolithography method.

In the forming of the barrier layer, a via hole exposing a part of the wiring layer may be formed.

In the forming of the segment electrode and the pad unit, a via for electrically connecting the segment electrode and the wiring layer to each other may be formed in the via hole.

In addition, the segment electrode and the electronic paper film may be electrically connected to each other through a conductive adhesive member interposed therebetween.

The segment electrode may further include depositing a conductive material on the barrier layer to form a conductive film; And selectively etching the conductive layer to form the segment electrode.

In addition, the mounting of the driving chip may use any one of wire bonding or flip chip bonding.

In addition, the barrier layer may include a pigment exhibiting color.

The electronic paper panel of the present invention can be manufactured by mounting an electronic paper layer and a driving chip on one substrate, thereby simplifying the manufacturing process and reducing the manufacturing cost.

In addition, the electronic paper panel of the present invention may be provided with a barrier layer between the wiring layer and the segment electrode, thereby preventing the wiring layer from being displayed while the electronic paper panel displays an image.

In addition, according to the electronic paper panel of the present invention, as the wiring layer is formed through a thin film forming process such as ITO, the degree of freedom in designing the wiring line width can be increased, thereby reducing the size of the driving chip and increasing the resolution.

1 is a plan view of an electronic paper panel according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of a part of the electronic paper panel shown in FIG. 1.
3 is an operation screen of an electronic paper panel having no barrier layer.
4 is an operation screen of an electronic paper panel having a barrier layer.
5 to 8 are cross-sectional views illustrating a manufacturing process of an electronic paper panel according to a second embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings of the electronic paper display device. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a plan view of an electronic paper panel according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of a part of the electronic paper panel shown in FIG. 1.

3 is an operation screen of an electronic paper panel having no barrier layer.

4 is an operation screen of an electronic paper panel having a barrier layer.

1 to 4, the electronic paper panel 100 according to the first embodiment of the present invention includes a substrate 110, a wiring layer 120, a pad part 121, and a wiring layer disposed on the substrate 110. The barrier layer 130 disposed on the 120, the segment electrode 140 disposed on the barrier layer 130, the electronic paper film 160 disposed on the substrate 110 including the segment electrode 140, and The driving chip 170 may be mounted on the pad part 121.

The substrate 110 may serve as a base layer for supporting the electronic paper film 160 and forming a wiring layer 120 electrically connected to the electronic paper film 160 on the substrate 110. The substrate 110 may be made of a material that can withstand the process environment for forming the electronic paper panel 100. Examples of the material used as the substrate 110 may be glass, plastic, ceramic, or the like.

In addition, the substrate 110 may include a buffer layer (not shown) deposited on a surface. Here, the buffer layer may serve to prevent contamination of the wiring layer due to impurities emitted from the substrate 110 in the process of forming the electronic paper panel 100, particularly in a high temperature process. Here, the buffer layer may be formed of an inorganic film, such as a silicon oxide film or a silicon nitride film.

The wiring layer 120 may be disposed on the substrate 110. The wiring layer 120 electrically connects the segment electrode 140 and the driving chip 170 to be described later to serve to apply a driving signal applied from the driving chip 170 to the segment electrode 140. In this case, the wiring layer 120 may be formed of a conductive material, for example, indium tin oxide (ITO).

The pad part electrically connected to the wiring layer may be disposed on the substrate 110.

The barrier layer 130 may be disposed on the substrate 110 including the wiring layer 120. The barrier layer 130 may serve to prevent the unnecessary image displayed by the wiring layer 120 from being displayed.

Hereinafter, the function of the barrier layer will be described in detail with reference to FIGS. 3 and 4.

As shown in FIG. 3, when the barrier layer 130 is not present, when the wiring layer 120 receives a driving signal from the driving chip 170 to display an image, the wiring layer 120 is electrically connected to the wiring layer 120 in the display area P. FIG. An image corresponding to the wiring layer 120 as well as the segment electrode 140 connected to each other may be displayed. This is because the wiring layer 120 is electrically connected to the electronic paper film 160 like the segment electrode 140.

On the other hand, as shown in FIG. 4, when the barrier layer 130 is disposed between the segment electrode 140 and the wiring layer 120, the barrier layer 130 insulates the wiring layer 120 and the electronic paper film 160 from each other. You can. Accordingly, even when a driving signal is applied to the wiring layer 120, it is possible to prevent the image corresponding to the wiring layer 120 from being displayed. That is, the barrier layer 130 may play a role of preventing the unnecessary image from being displayed in the display area P. FIG.

Again, referring to FIGS. 1 and 2, the barrier layer 130 may be formed of an insulating material to secure insulation between the wiring layer 120 and the electronic paper film 160.

In addition, the barrier layer 130 may further include colored pigments. As a result, when the electronic paper panel 100 does not display an image or when displaying an image, it is possible to more effectively prevent the wiring layer 120 from being displayed on the display area.

A plurality of segment electrodes 140 may be disposed on the barrier layer 130 to display an image. That is, the segment electrode 140 may be a minimum unit for displaying an image. Here, the segment electrode 140 may be electrically connected to the wiring layer 120 through the via 142 penetrating the barrier layer 130.

The segment electrode 140 may be formed of any one of a conductive material such as tin oxide (TO), indium tin oxide (ITO), Ag, and copper.

In addition, the common electrode pad 121 may be disposed on the barrier layer 130 to apply a common voltage to the electronic paper film 160 to be described later. Here, the common electrode pad part 121 may be electrically connected to an external circuit part, for example, a main board, through a wiring layer disposed under the barrier layer 130.

The electronic paper film 160 may be electrically connected to the segment electrode 140 and attached to the substrate 110 including the segment electrode 140.

Here, the electronic paper film 160 may include an electronic paper layer 161, a common electrode layer 162, and a protective layer 163 sequentially stacked.

Here, the electronic paper layer 161 may be driven by a voltage applied between the segment electrode 140 and the common electrode layer 162 to display an image. Here, examples of the form of the electronic paper layer 161 may be an electrophoresis type, a microcapsule type, a twist ball type, or the like.

In addition, the common electrode layer 162 may be formed of a transparent electrode, for example, ITO. In this case, the common electrode layer 162 may be electrically connected to the common electrode pad 122 to receive a common voltage from the outside.

In addition, the protective layer 163 may serve to protect the surface of the electronic paper layer 161 from the outside. In this case, the protective layer 163 may be made of a transparent material. Examples of the transparent material include polyethylene terephthalate (PET), polyvinyl alcohol (PVA), polyethylene (PE), polycarbonate (PC), polyacrylate, polymethylmethacrylate, polyurethane, and cellulose acetate butyrate (CAB). Can be. However, the embodiment of the present invention does not limit the material of the protective layer 163.

The electronic paper layer 161 and the segment electrode 140 may be electrically connected to each other through the conductive adhesive member 150 interposed therebetween. Here, examples of the conductive adhesive member 150 may include an anisotropic conductive film (ACF) and an anisotropic conductive paste (ACP).

The driving chip 170 may be mounted on the substrate 110 together with the electronic paper layer 161. In this case, the driving chip 170 may be electrically connected to the pad part 121. In this case, the electrical connection between the driving chip 170 and the pad unit 121 may be made by flip chip bonding or wire bonding. As a result, the driving chip 170 may be electrically connected to the segment electrode 140 through the wiring layer 120 disposed under the barrier layer 130.

In addition, a contact pad part 121 may be disposed on an area of one side of the substrate 110 to be in electrical contact with an external printed circuit board, for example, a flexible printed circuit board to be electrically connected to the main board. In addition, a pad line 124 for electrically connecting the contact pad part 121 and the pad part 121 to each other may be disposed on the substrate 110.

Accordingly, the driving chip 170 may be electrically connected to the external circuit part to drive the segment electrode 140 in accordance with a driving signal applied from the external circuit part.

Therefore, as in the first embodiment of the present invention, by mounting the electronic paper film and the driving chip on one substrate, it is possible to simplify the manufacturing process and lower the manufacturing cost of the electronic paper panel due to material cost reduction .

In addition, as in the first embodiment of the present invention, since the electronic paper panel includes a barrier layer, it is possible to prevent an unnecessary image by the wiring layer from being displayed.

Hereinafter, a manufacturing process of an electronic paper panel according to a second embodiment of the present invention will be described with reference to FIGS. 5 to 8.

5 to 8 are cross-sectional views illustrating a manufacturing process of an electronic paper panel according to a second embodiment of the present invention.

Referring to FIG. 5, in order to manufacture an electronic paper panel, a substrate 110 is first provided. The substrate 110 may be made of a material that can withstand the subsequent process. Here, examples of the material used as the substrate 110 may be glass, plastic, ceramic, or the like. In addition, the substrate 110 may further include a buffer layer disposed on the surface.

Thereafter, the wiring layer 120 is formed on the substrate 110. The wiring layer 120 may be formed through a photolithography method. Specifically, after the conductive film is formed on the substrate 110, the conductive film may be selectively etched to form the conductive film. Here, examples of the method of forming the conductive film may be a vacuum deposition method, a sputtering method, or the like. In addition, the conductive film can be formed of ITO. In the etching of the conductive film, first, a photoresist film may be formed on the conductive film, and then a resist pattern may be formed by performing exposure and development processes on the photoresist film. Thereafter, the conductive layer may be selectively etched using the resist pattern as an etching mask to form the wiring layer 120 on the substrate 110.

Here, as another method of forming the wiring layer 120, the wiring pattern 120 may be formed on the substrate 110 by printing a conductive pattern on the substrate 110 by using a screen printing method or an offset printing method.

In addition, in the process of forming the wiring layer 120, a pad part 121 electrically connected to the wiring layer 120 may be further formed on the substrate 110.

Here, the wiring layer 120 is formed using an ITO thin film forming process having a high line width degree of freedom, so that the wiring layer 120 and the pad 121 formed on the substrate 110 can be formed at a fine pitch. As a result, the size of the driving chip 170 mounted on the electronic paper panel can be reduced, and the resolution can be increased.

Referring to FIG. 6, after forming the wiring layer 120, the barrier layer 130 is formed on the substrate 110 including the wiring layer 120.

The barrier layer 130 may include a via hole 141 exposing a portion of the wiring layer 120. In this case, an example of a method of forming the barrier layer 130 including the via hole 141 may be a screen printing method, an offset printing method, a photolithography method, or the like. In addition, the barrier layer 130 may be formed to expose at least a portion of the pad part 121.

The barrier layer 130 may be formed of an insulating material. Here, the insulating material may be an organic film or an inorganic film. Here, examples of the organic film may be acrylic resin, imide resin, urethane resin, ethylene resin, or the like. In addition, examples of the inorganic film may be a silicon oxide film or a silicon nitride film.

In addition, the barrier layer 130 may further include colored pigments. Thus, when the electronic paper panel does not display an image or when displaying an image, it is possible to more effectively prevent the wiring layer 120 from being displayed on the display area.

Referring to FIG. 7, after forming the barrier layer 130 including the via hole 141, a plurality of segment electrodes 140 are formed on the barrier layer 130. Here, the segment electrode 140 may be a minimum unit for displaying an image.

In order to form the segment electrode 140, first, a conductive film may be formed on the barrier layer 130, and then the conductive film may be selectively etched. Here, the conductive film may be formed of a conductive material through vacuum deposition or sputtering. In this case, examples of the conductive material may include TO (Tin Oxide), ITO (Indium tin Oxide), Ag, and copper. In addition, selective etching of the conductive film may be performed through a photolithography method.

Another method of forming the segment electrode 140 may be a vacuum deposition method using a shadow mask. That is, the segment electrode 140 may be formed by selectively depositing a conductive material on the barrier layer 130 using a shadow mask.

In the process of forming the segment electrode 140, a via 142 electrically connected to the wiring layer exposed by the via hole 141 may be formed. That is, the wiring layer 120 and the segment electrode 140 may be electrically connected to each other through the via 142.

Referring to FIG. 8, the conductive adhesive member 150 is attached onto the barrier layer 130 including the segment electrode 140. Thereafter, by pressing and compressing the electronic paper film 160 on the conductive adhesive member 150, the electronic paper film 120 may be adhered to the barrier layer 130. In this case, the segment electrode 140 and the electronic paper film 160 may be electrically connected to each other by the conductive adhesive member 150.

Here, examples of the conductive adhesive member 150 may include an anisotropic conductive film (ACF) and an anisotropic conductive paste (ACP).

 Thereafter, the driving chip 170 may be mounted to be electrically connected to the pad part 121 formed on the substrate 110. In this case, electrical connection between the driving chip 170 and the pad unit 121 may be performed through a wire bonding method or a flip chip bonding method.

Therefore, as in the embodiment of the present invention, by mounting the electronic paper layer and the driving chip on a single substrate, it is possible to simplify the process and save materials such as ACF to reduce the manufacturing cost.

In addition, as in the embodiment of the present invention, as the wiring layer is formed by the ITO thin film forming process, the size of the driving chip mounted on the electronic paper panel can be reduced, and the resolution can be increased.

100: electronic paper panel
110: substrate
120: wiring layer
130: barrier layer
140: segment electrode
150: conductive adhesive member
160: electronic paper film
170: driving chip

Claims (15)

Board;
A wiring layer formed on the substrate;
A pad part electrically connected to the wiring layer and disposed on the substrate;
A barrier layer disposed on the wiring layer;
A segment electrode disposed on the barrier layer and electrically connected to the wiring layer;
An electronic paper film disposed on the substrate including the segment electrode; And
A driving chip mounted on the pad part;
Electronic paper panel comprising a.
The method of claim 1,
The electronic paper film is
Electronic paper layer
A common electrode layer disposed on the electronic paper layer; And
Electronic paper panel comprising a protective layer disposed on the common electrode layer.
The method of claim 1,
Electronic paper panel further comprising a conductive adhesive member interposed between the electronic paper layer and the segment electrode.
The method of claim 1,
The segment electrode includes an electronic paper panel including any one of tin oxide (TO), indium tin oxide (ITO), Ag, and copper.
The method of claim 1,
The wiring layer is formed of ITO electronic paper panel.
The method of claim 1,
The substrate is an electronic paper panel comprising any one of a glass substrate, a plastic substrate and a ceramic substrate.
The method of claim 1,
The barrier layer is an electronic paper panel containing a colored pigment.
Forming a wiring layer and a pad portion on the substrate;
Forming a barrier layer on the substrate including the wiring layer;
Forming a segment electrode disposed on the barrier layer and electrically connected to the wiring layer;
Attaching an electronic paper film onto the substrate including the segment electrode; And
Mounting a driving chip on the pad part;
Method of manufacturing an electronic paper panel comprising a.
The method of claim 8,
The barrier layer is formed by using any one of a screen printing method, an offset printing method, and a photolithography method.
The method of claim 8,
In the step of forming the barrier layer
And a via hole exposing a portion of the wiring layer.
The method of claim 10,
And forming a via in the via hole to electrically connect the segment electrode and the wiring layer to each other in the forming of the segment electrode and the pad part.
The method of claim 8,
And the segment electrode and the electronic paper film are electrically connected to and bonded to each other through a conductive adhesive member interposed therebetween.
The method of claim 8,
The segment electrode
Depositing a conductive material on the barrier layer to form a conductive film; And
Selectively etching the conductive film to form the segment electrode.
The method of claim 8,
The mounting method of the driving chip is an electronic paper panel using any one of wire bonding or flip chip bonding.
The method of claim 8,
The barrier layer is a manufacturing method of an electronic paper panel containing a pigment exhibiting color.

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