CN109084216A - Integrally packaged type row unit based on class stage structure - Google Patents

Integrally packaged type row unit based on class stage structure Download PDF

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Publication number
CN109084216A
CN109084216A CN201810792706.4A CN201810792706A CN109084216A CN 109084216 A CN109084216 A CN 109084216A CN 201810792706 A CN201810792706 A CN 201810792706A CN 109084216 A CN109084216 A CN 109084216A
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functional layer
layer
row unit
emitting
light
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CN201810792706.4A
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CN109084216B (en
Inventor
蒋伟东
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Guangzhou Chaowei Photoelectric Technology Co Ltd
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Guangzhou Chaowei Photoelectric Technology Co Ltd
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Priority to PCT/CN2018/096311 priority Critical patent/WO2020014923A1/en
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/40—Lighting for industrial, commercial, recreational or military use
    • F21W2131/406—Lighting for industrial, commercial, recreational or military use for theatres, stages or film studios
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The invention discloses a kind of integrally packaged type row unit based on class stage structure, including as the first functional layer, as the second functional layer and as third functional layer, the luminous class stage structure of side opening that is complete and being formed afterwards by three functional layers, not only solve various problems existing for current row unit, realize the embedded integrated of component, the light-emitting component scope of application is also widened, it is applicable not only to side light-emitting component, applies also for top light emitting element or even luminescence chip and various solid-state light emitters.The embodiment of the present invention is not only in the case where keeping row unit rigidly constant, improve hollow out spacing, and, it also achieves the planarization of row cell surface, luminous point periphery homogeneous media, without light leakage, also solves that row cell surface color is mixed and disorderly, the problems such as can not unifying merely, can not being surface-treated after patch.

Description

Integrally packaged type row unit based on class stage structure
Technical field
The invention belongs to semiconductor light emitting technical applications, and in particular to photoelectricity transparence display technology.
Background technique
In recent years, so-called LED transparent display screen obtains fast-developing, principle be several drive integrated circults with Light-emitting component is arranged in formation strip luminescence unit on strip circuit board, which is commonly called as lamp bar, sheet Case is referred to as row display unit (Strip display Unit), referred to as row unit (Strip Unit).Again several rows Unit hollow out as shutter is alternatively arranged the mould group to form monolith, then forms different sides by single module or several pieces of mould groups The display screen of product size, so, this display screen should be referred to as grid hollow out screen.Referring to Fig. 1, transparent principle is single by row Hollow out between member realizes remote transparent effect, so, for identical point spacing P, how to guarantee that row unit is rigid In the case where degree, increases hollow out interval S and be only the key enhanced the transparency.Currently, the light-emitting component of row unit, general to use LED element, from the perspective of display screen, referred to as luminous point；From the perspective of circuit, referred to as light-emitting component；From image From the point of view of angle, referred to as pixel, these types of saying this case are all related to, in case statement is chaotic.
By the development of many years, the technical solution and process that the relevant technologies of grid hollow out screen are readily apparent that have been thought It arrives, it is quite mature till now, it is summed up that there are three types of modes.
Mode one, referring to such as Fig. 1 (a), strip circuit board front mounts top light emitting element (Top-LED), early stage Back of circuit board attachment includes driving IC and peripheral cell element.Although driving IC and peripheral cell are concentrated on one in recent years It rises, circuit board surface only pastes LED, but connects each LED due to needing largely to be routed in circuit board, even if the back side does not mount drive Dynamic IC and peripheral cell, width of circuit board H value is still larger, and is difficult to be further narrow as, and causing a spacing is the transparence display of P The hollow out distance S of screen is smaller.
Mode two, referring to such as Fig. 1 (b), strip board side face paste fills Top-LED, upper or lower surface attachment driving IC And peripheral cell.This mode is utilized circuit plate thickness H value and is worth narrow feature than frontal width H, reduces to a certain extent Circuit board blocks sight, increases hollow out distance S, still, enough because needing thicker circuit board that could make in side To mount Top-LED, side is made pad and not only increases circuit board itself technology difficulty big pad, also, also increases Paster technique difficulty, because when carrying out print tin slurry and patch to side circuit, needing through special fixture direction of rotation, It just can be carried out the paster technique of LED, it can not be with the other elements of upper and lower surface together patch.Meanwhile the driving IC of upper and lower surface Sight can be blocked with peripheral cell, reduces effective hollow out distance S.
Mode three, referring to Fig. 1 (c), strip board edge mounts side-emitting led (Side-LED), upper and lower surface Other positions attachment driving IC and peripheral cell.This mode is worth also with circuit plate thickness H value than frontal width H narrow Feature reduces circuit board and blocks to sight, increases hollow out distance S.Although this mode, does not need to make in side and weld Disk can reduce circuit plate thickness H value, but all elements including LED all can cause to block to sight, reduce effectively Hollow out distance S.Importantly, this mode in board edge attachment Side-LED, if Side-LED is attached to table Face, upper part hollow out do not have medium to block, and lower part has strip circuit substrate to block, and luminous point upper and lower medium is simultaneously uneven, If the Side-LED encapsulated using COB, because element does not have box dam, the problem of there is also light leakages backward；If Side-LED is pasted In lower surface, problem remains unchanged, so, this mode can because luminous point periphery medium unevenly caused by up and down non-uniform light.Separately Outside, although circuit plate thickness H, which is thinned, can increase hollow out distance S, circuit board is too thin insufficient in the presence of rigidity, easily-deformable curved Song, problem is more prominent when the problems such as being not easy operation, especially strip circuit board level place, so, circuit board also needs Enough thickness H just can guarantee rigidity.
As another form of mode two, the lateral emitting of the more small COB of use (Chip On Board) encapsulation LED is mounted on the mode of board edge, referring to such as Fig. 2 (a).Although this mode can reduce screening of the LED itself to sight Gear, but because COB encapsulation LED does not have box dam guide-lighting, there is serious leakage problem, upward light leakage can be anti-through adjacent rows unit It penetrates and causes behind light leakage, left and right light leakage can be irradiated to adjacent luminous point, influence the clarity of whole image.If using COB The top light emitting LED of encapsulation mainly shines upwardly, and not only leakage problem is more serious, but also influences luminous efficiency, referring to fig. 2 (b).Therefore, mode two can only use side emitting elements.Meaning is respectively marked in illustrated above is respectively as follows: 1- strip circuit Plate；2A- top light emitting LED；2B- is side-emitting led；3- drive integrated circult；4- peripheral cell.
Above-mentioned three kinds of modes, in addition to there is a problem of it is respective other than, because surface component, especially light-emitting component be mounted on it is outer The problem of all there is component and block sight, reduce hollow out distance S in surface, moreover, the various element bodies of circuit board surface and Pin, pad, the color between various elements are different from, and can not be unified at all.No matter circuit board surface is printed as any face Color, after row unit finished product is made in patch, surface color all can be mixed and disorderly, and is difficult to change, and not only influences display screen appearance, sternly It also will affect the display effect of final image when weight.Although color can be changed by spraying, screening when spraying to numerous LED Gear will be a thing that is extremely difficult or even can not completing, and LED pollution is easily caused to scrap.Still further it can be seen that Existing row unit, very narrow to light-emitting component adaptation range, light-emitting component Selective type is single or uses side emitting elements It is mounted on the edge of circuit board or using top light emitting component mounter in the side of circuit board, a kind of mode can only use one The light-emitting component of seed type.
How could be in the mature photoelectricity transparence display technical field of industry, inventing a kind of can make full use of existing production to make The technical solution of journey extends multiple embodiments that can be embodied by the technical solution, can not only keep row unit In the case that rigidity and point spacing P are constant, increase hollow out distance S, moreover, to the wide adaptation range of light-emitting component, no matter top Luminous, lateral emitting or even luminescence chip and various solid-state light emitters can be applicable in, simultaneously, moreover it is possible to it is miscellaneous to solve row cell colors Disorderly, can not unify merely, luminous point periphery medium is uneven, light leakage, can not performance enhancement and the problems such as Function Extension, also have It is easy to produce in batches, seals a series of technological progresses such as waterproof.Therefore, it is necessary to existing row monotechnics thinking be broken through, to already Mature technical solution, which does innovation thought, can just new breakthrough.
Summary of the invention
It is an object of that present invention to provide a kind of integrally packaged type row unit based on class stage structure, to solve existing row Unit can not reduce row unit to the occlusion issue of sight in the case where keeping the rigidity of row unit, thus keeping row single In the case where first rigidity, reduces row unit and sight is blocked, increase the hollow out distance between row unit, obtain higher transparent Degree.
The object of the invention is also resided in through the integrally packaged type row unit based on class stage structure, to solve existing row unit The problem of luminous point periphery medium is uneven, light leakage, so that it is single to obtain a kind of luminous point periphery homogeneous media, the row without light leakage Member.
The object of the invention is also resided in through the integrally packaged type row unit based on class stage structure, to solve existing row unit Technology is narrow to light-emitting component adaptation range, and light-emitting component type selects single problem, thus, obtain a kind of energy wide scope adaptation Light-emitting component is applicable not only to side emitting element, moreover it is possible to be suitable for top light emitting element or even luminescence chip and various solid-states The row unit of illuminator.
The object of the invention is also resided in through the integrally packaged type row unit based on class stage structure, to solve existing row list First surface irregularity, color are mixed and disorderly, can not unify merely, it is difficult to change color, can not expand for progress performance enhancement and function The problem of exhibition, thus obtain a kind of surfacing, color is unified merely, can change after being made color, can carry out it is various Surface treatment, and there is performance can enhance, the row unit of functional expansionary.
Technical scheme is as follows:
It is adaptable for light-emitting component because overall architecture of the present invention design is unique ingenious, either top light emitting element, side Light-emitting component or LED luminescence chip or other solid-state light emitters are (for example, OLED, perovskite shine, phosphorus is dilute, graphene Deng) it may be used to the row unit of Fa Benming, so the present invention uses luminescent device (Luminous Elements, following shorthand LE it) states.Possible this case is locally still stated with LED, but for the present invention is to the adaptability of light emitting component, and is not only limited In LED element.
Integrally packaged type row unit based on class stage structure, including the first functional layer, the second functional layer and third function Layer, alleged each functional layer, three functional layers each mean these three functional layers below；
First functional layer is underlying circuit layer, and shape is elongate in shape, for being routed the electrical connection realized between component, and Component needed for playing the role of carrying and mounting, including at least one layer of bottom insulation substrate, the insulating substrate lower surface or on A surface at least layer printed circuit, for mounting required component.These required components include drive integrated circult (Integrated Circuit, abbreviation IC), peripheral cell (Peripheral Components, abbreviation PC) and luminescent device (Luminous Elements, abbreviation LE).
Second functional layer is support reinforcing layer, and shape is the elongate in shape to match with the first functional layer, single for row While the support reinforcing function of member, the insertion chamber of required component is also formed by inner recess or through-hole.These insertion chambers Including drive integrated circult insertion chamber (referred to as IC is embedded in chamber), peripheral cell insertion chamber (referred to as PC is embedded in chamber) and the member that shines Device is embedded in chamber (referred to as LE is embedded in chamber or emitting cavity), plays receiving embeddeding action to IC, PC and LE respectively, especially for LE forms upward, downward, side (display direction) hatch frame an insertion chamber in the long side of display direction.Wherein, IC It is embedded in chamber or PC is embedded in chamber, other than using through-hole, blind hole can also be used according to embedded components depth information.
Third functional layer is class stage top capping layer, and shape is the elongate in shape to match with the second functional layer, the function The most important effect of layer is that the class stage structure that can accommodate luminescent device LE is collectively formed with the first functional layer and the second functional layer. Meanwhile the functional layer is also function and the expansible layer of performance, in addition to having most basic package cap and matching with other functional layers It closes and is formed outside the effect for the emitting cavity being packaged to luminescent device, it can also be different by using different materials, increase Skin-material extends realization Function Extension and performance reinforcement by function or shape.
After the completion of three functional layers are prepared respectively, complete row unit could be become as whole by needing to be bonded.When bonding, The component of first functional layer upper surface attachment and each insertion chamber of the second functional layer, just correspond in position, Each insertion that the component in shape mounting just the first functional layer upper surface is embedded into the second functional layer is intracavitary.Bonding Afterwards, the row unit that appearance is flat, surface does not have component is just constituted, meanwhile, the emitting cavity of the second functional layer is dexterously The class stage structure that side opening is together formed with the first functional layer and third functional layer, can accommodate and open up as stage Existing program equally accommodates light emitting component and output light.
Row unit of the present invention is placed in luminescent device in the emitting cavity in the class stage structure of side opening, not only solves A series of problems, such as surrounding's luminescence medium when being mounted on edge using Side-LED is uneven, also makes row unit to luminescent device The scope of application expand to Top-LED, meanwhile, emitting cavity in addition to play the role of to luminescent device it is embedded integrated other than, also to light Play the role of guidance output.To make full use of its guidance output action to light, and keep row unit complete appearance seamless, The shapes and sizes of light-emitting component and emitting cavity can be made to match, make luminescent device full of emitting cavity, only reserve the error space If (can need to fill up by packaging plastic with sealed damp-proof), leaded light is carried out by luminescent device itself packaging plastic, with luminescent device Some face as light-emitting surface, for example, using the top Side-LED as light-emitting surface, using the side of Top-LED as light-emitting surface.Light out The leading flank of face and three functional layers of row unit constitutes the light-emitting surface of row unit.
Before between leading flank it is possible to further pass through three functional layers of light-emitting surface and row unit for adjusting luminescent device The relationship of position afterwards realizes the adjustment of the luminous aspect, angle and deviation of row unit light-emitting surface.For example, when luminescent device goes out light When face and three leading flanks of row unit are generally aligned in the same plane, light emission direction is side surface direction；It is inward-facing on front side of the first functional layer When contraction, expose luminescent device bottom-emission face, so that it may so that the light emission direction of row unit and angle extend downwards；Other sides Formula and so on.
To further expand emitting space to the wide in range adaptability of different LE, especially for luminescence chip and other solid-states For illuminator, certain emitting space is reserved between in class stage structure to LE, and with packaging plastic encapsulating, hair can be realized Optical chip is expert at the direct encapsulation in unit；For select Top-LED or Side-LED as LE for, be expert at unit by LE Interior secondary encapsulation, makes secondary encapsulation glue and the packaging plastic of LE itself combine together, plays the role of jointly to light guide-lighting, makes light The side that line is formed after encapsulation adhesive curing is exported to light output face (referred to as light-emitting surface).Light-emitting surface is from entire display screen From the perspective of be exactly luminous point, as long as keep light-emitting surface upper and lower side thickness it is identical or close, so that it may realize luminous point In upper and lower, left and right same direction upper periphery homogeneous media.Meanwhile the emitting cavity in class stage structure also plays reflection to light And guiding function, it avoids light from leaking to direction to be shown is not required to, solves leakage problem.
Further, after emitting cavity reserves emitting space and is inoculated with packaging plastic, it can also be cut and be realized to row by scribing The adjustment to the light emission direction, angle and deviation of the row unit light-emitting surface after being made is realized in the adjusting at unit light-emitting surface inclination angle.
Further, can also be according to the shape of luminescent device after emitting cavity reserves emitting space, and cooperate in emitting cavity The adjustment to light output efficiency, light output angle or deviation is realized in the adjustment of spatial form.For example, if emitting cavity height has Space, emitting cavity inner top surface can also use the structure, etc. of arch other than it can use flat-tope structure.
Further, after the planarization of row cell surface, also individually to carry out Function Extension to some layer and performance is reinforced It is possibly realized.For example, by row unit upper surface or following table surface treatment and performance enhancement, for example, surface mount, spraying height Thermally conductive, high-modulus material, such as carbon cloth or even third functional layer directly adopt carbon fiber sheet or aluminium sheet, to increase The rigidity of row unit improves heat dissipation performance；
Further, by extending downwardly forward, again while upwards on front side of the second functional layer, make the second functional layer leading flank Leading flank as entire row unit；Or by extending downwardly simultaneously forward, again on front side of third functional layer, make third function Layer leading flank becomes the leading flank of entire row unit；The extension, etc. of the wiring number of plies can also be realized by increasing printed circuit.
Further, when the circuit number of plies needed for the first functional layer is more than two layers, if necessary, it may be considered that third function Ergosphere is expanded into circuit board；If not being able to satisfy wiring layer number requirement still, printing electricity can also be increased in the second functional layer Road.The hermetic water-proof structure that can become after being bonded as row unit due to each functional layer, so that it may as handling common multilayer electricity Road plate carries out various metallization and conductive hole processing like that.In short, row unit of the invention, is not only realized by functional stratification Multiple technologies progress, moreover, when needed, different design requirements can be realized by the function new to each function Layer assignment, For example, the number of plies can be distributed to different functional layers when there is the requirement of more printed wire numbers of plies, pass through the thickness of each functional layer Thin and the printed circuit number of plies the adjustment, still can keep row unit of the invention under the premise of keeping row unit rigidity Every technological progress.
Further, can be in its lower surface mounting surface element after third functional layer is expanded into circuit board, and make Surface element is embedded into the second functional layer.
Further, if the insertion chamber structure of the surface element and the second functional layer mounted by third functional layer lower surface At the side opening direction of class stage structure do not increasing row cell width towards rear side, and can reduce row element thickness In the case where the transparent display screens of double-sided display different images is made.
Further, if it is desired, the second functional layer and third functional layer can also be made to merge second be integrally formed comprehensive Functional layer is closed, after the second comprehensive function layer is Nian Jie with the first functional layer, still there are a series of advantages.
Existing row element circuit plate is supported function by the integrally packaged type row unit provided by the invention based on class stage structure Can be with the Function Decomposition that circuit function mixes at three different functional layers, the first functional layer is for being routed needed for realization Electrical connection between component, and make each component towards the second functional layer；Second functional layer is used to support reinforcement, increases pair The insertion function of component especially increases towards the luminescent device of light emission direction and is embedded in chamber；Third functional layer, except basic Package cap effect is outer, can also carry out Function Extension or performance is reinforced.After the bonding of three functional layers, by insertion chamber to each member The insertion of device realizes the embedded integrated of each component, solves surface element and block sight, it is single to influence hollow out spacing, row First color is mixed and disorderly, the problems such as can not unifying merely, can not being surface-treated.Especially luminescent device and three functional layers are aobvious Show that direction forms a class stage structure, not only solves that periphery medium existing for existing row unit is uneven and light leakage is asked Topic, has also expanded the range of choice of luminescent device, also, because luminescent device is attached to circuit face, can be easier to by layout patch In production, and production efficiency greatly improved.
Detailed description of the invention
Fig. 1 (a), circuit board front mount the existing row monotechnics of top light emitting LED；
Fig. 1 (b), board edge mount side-emitting led existing row monotechnics；
Fig. 1 (c), board side face paste fill the existing row monotechnics of top light emitting LED；
Fig. 2 (a), board edge mount the light-emitting LED existing row monotechnics of COB package side surface；
Fig. 2 (b), board edge mount the row monotechnics of COB encapsulation top light emitting LED；
Fig. 3, the composition cross-sectional exploded view (position A-A) of each functional layer of row unit of the invention；
Fig. 4, each functional layer bonding are encapsulated into the cross-sectional view (position A-A) after row unit；
Fig. 5, each functional layer bonding are encapsulated into the front view (position A-A) after row unit；
Fig. 6 (a), the top view of the first functional layer of row unit；
Fig. 6 (b), the top view of the second functional layer of row unit；
Fig. 6 (c), the top view of the third functional layer of row unit；
Fig. 6 (d), the top view (perspective view) after three functional layer bonding encapsulation；
Fig. 7, IC are embedded in chamber and use through-hole, and PC is embedded in the case where chamber is using when blind hole；
Fig. 8, the case where when driving IC integrated level highly integrated no peripheral cell；
Fig. 9, luminescent device use box dam plastic packaging side emitting elements when the case where；
Figure 10, luminescent device using COB encapsulation top light emitting element when the case where；
The case where Figure 11, luminescent device is using when luminescence chip；
Figure 12, luminescent device use the transparent plastic packaging of box dam top light-emitting component when the case where；
Figure 13, the case where when row unit leading flank and upper and lower surface turn forward at on-right angle；
Figure 14 (a), emitting cavity side surface use trapezium structure；
Figure 14 (b), emitting cavity bottom surface use the hyperbolic configuration of central protuberance；
Figure 14 (c), emitting cavity bottom surface use more meander line structures of central protuberance；
The case where Figure 15, emitting cavity bottom surface is using when domes；
Figure 16, the case where when luminescent device is matched with emitting cavity shape size；
Figure 17, the case where when luminescent device light-emitting surface is outwardly protruded from row unit leading flank；
Figure 18 changes each functional layer leading flank and light-emitting surface protrusion degree and obtains the deviation that Bu Tong shines；
Figure 19, the case where when being matched using top light emitting component with emitting cavity shape size；
Figure 20, third functional layer open up through-hole corresponding with the second functional layer insertion chamber；
Figure 21, the case where when third function Layer assignment printed wire；
Figure 22, third functional layer are double-layer circuit board and distribute the first funtion part surface element；
Figure 23, third functional layer uniformly staggeredly distribute the first functional layer part of the surface element；
Figure 24, the first functional layer and third functional layer surface element are mutually embedded into other side's circuit board；
Figure 25, the second functional layer front side extend downwards simultaneously upwards again forward；
The front view when leading flank of Figure 26, entire row unit are made of second layer leading flank；
Figure 27, the case where when luminescent device is mounted among the first functional layer using multilayer circuit board；
Figure 28, second and third functional layer merge become the second function synthesized layer when cross-sectional exploded view；
Figure 29, the first functional layer cross-sectional view as after row unit Nian Jie with the second function synthesized layer；
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clearly and completely Description.
Embodiment one:
Referring to Fig. 3 ~ 8, the integrally packaged type row unit provided in this embodiment based on class stage structure, including the first functional layer 100, the second functional layer 200 and third functional layer 300；
First functional layer 100, shape are elongate in shape；
First functional layer 100, be underlying circuit layer, include at least the first insulating substrate 110, further include on insulating substrate First layer top circuit 132 that surface 112, lower surface 111 are bonded to each other respectively, first layer bottom circuit 131 (also referred to as first Lower surface circuit 131), and be mounted on first layer top circuit 132(and be also referred to as the first upper surface circuit 132) surface element device Part 180；The surface component 180, the component including luminescent device LE102, which includes drive integrated circult IC104, peripheral cell PC106 and luminescent device LE102, wherein PC106 whether is needed to be decided what to use by IC104 integrated level.
First functional layer 100, also referred to as bottom circuit substrate layer 100, for being routed the electricity realized between component Connection, and play the role of carrying and mount these components.Because double-layer printing circuit is fully able to statement the technology of the present invention Scheme, therefore two layers or more circuit board omits herein.
With the raising of drive integrated circult integrated level, peripheral cell is gradually integrated into chip interior, therefore, when using nothing When the drive integrated circult of peripheral cell, it is convenient to omit peripheral cell, result have only lacked peripheral cell insertion chamber 206, but Have no effect on the substantive content of this patent.If light-emitting component also belongs to periphery from the perspective of centered on integrated circuit Element；But for display screen angle, light emitting component has become core component, is no longer peripheral cell, peripheral cell master Refer to the elements such as pressure stabilizing, capacitance-resistance.
Second functional layer 200, shape are the elongate in shape to match with the first functional layer 100；
Second functional layer 200 also plays receiving insertion to IC104 and PC106 in addition to playing the role of support reinforcing to row unit, Play the role of embedded integrated, encapsulation and guidance output light to LE102.
Second functional layer 200, be support reinforcing layer, including supporting substrate 210 and pass through its second layer lower surface The component that 211, which are recessed inwardly, to form is embedded in chamber 280；The component is embedded in chamber 280, including drive integrated circult is embedded in chamber 204 (referred to as IC is embedded in chamber 204), peripheral cell insertion chamber 206(are referred to as PC insertion chamber 206) and luminescent device insertion chamber 202 (referred to as LE is embedded in chamber 202 or emitting cavity 202).Wherein, PC is embedded in chamber 206 by whether having peripheral cell PC106 to decide what to use.
Wherein, IC is embedded in chamber 204 and PC and is embedded in chamber 206, the position in second layer lower surface 211 respectively with IC104 The position mirror symmetry of first layer upper surface 172 is in PC106, is corresponded, and inner space can accommodate IC104 completely And PC106, and reserve certain error gap.A kind of statement is changed, IC is embedded in chamber 204 and PC insertion chamber 206 in the first functional layer Projection on 100 is corresponded with corresponding IC104 and PC106, and projection of shape is slightly larger than corresponding IC104 and PC106.
It can be embedded in chamber according to row element thickness design requirement, most thick element, generally IC is embedded in chamber 204, can be used Through-hole；Relatively thin element is embedded in chamber, and blind hole can be used in generally PC insertion chamber 206；It or is easy to process, both of which use Through-hole.When IC insertion chamber 204 is using through-hole, other than playing embeddeding action to IC104 element, IC104 can also be made straight Play the role of encapsulating box dam when connecing using chip.
Above-mentioned first layer upper surface 172, including first layer top circuit 132 and insulating substrate upper surface 112 are not printed Circuit exposed part, equally, first layer lower surface 171 include that 111 exposed part of insulating substrate lower surface and bottom circuit 131 are total With composition.The minute asperities of surface circuit can be considered flat surfaces for macroscopic perspective.When stating each function layer surface, Especially surface is there are printed wire surface, several situations in exposed insulating substrate surface and dimeric surface Simplify statement, different situations are not added differentiation or directly with upper surface, lower surface, leading flank (right side), trailing flank (left side) Statement.Luminescent device is embedded in chamber 202, i.e. emitting cavity 202, and position and LE102 in second layer lower surface 211 are in first The position mirror symmetry of layer top circuit 132 corresponds；And in position corresponding with LE102, by the second leading flank 261, That is the long side 261 of display direction, be recessed inwardly the notch to be formed and be made of three direction openings, three inner surfaces, the notch Three direction openings are respectively under shed 505A, upper opening 501A, open front 402A, and three inner surfaces include bottom surface 502, a left side Surface 503, right surface 504(when LE102 it is overstocked next to when, left surface 503, right surface 504 can disappear, only bottom surface 502).Change a kind of statement, emitting cavity 202, positioned at the long side 261 of 200 display direction of the second functional layer, and it is attached in side 261 Close three faces (upper surface 212, lower surface 211, side 261) formed one upwards, downwards, to display direction open on three sides Shape, the opening, and can be according to emitting cavities in the projection of 100 upper surface of the first functional layer, at least slightly greater than luminescent device LE102 Influence of 202 shapes to output light is designed.
The third functional layer 300, shape are the elongate in shape to match with the second functional layer 200.
The third functional layer 300, also referred to as class stage top capping layer are function and the expansible layer of performance.It can also basis Need the extension for carrying out surface enhanced, increasing circuit layer, sharing the multiple functions such as surface element or performance.Even if by one When the flat insulating substrate of upper and lower surface is constituted, when having the function of most basic package cap, it is bonded to be formed in three functional layers After row unit, that is, various technical advantages not available for present row unit are provided with, dexterously solved such as side in technical background Formula two need to overturn 90 ° could patches, can not layout processing the problems such as, it is uneven to solve three light-emitting component upper and lower medium of mode It is even, block the problems such as sight, in the case where keeping row element stiffness, reduce the overall thickness of row unit, improve between hollow out Away from, so that row unit is become multiplicity from single to element adaptability, including side light-emitting component, top light emitting element, or even using hair Optical chip directly encapsulates.The problems such as existing row unit can not be surface-treated, surface color is mixed and disorderly is also solved, various tables are made Surface treatment becomes very easy, and no matter carrying out traditional printing or air brushing, spraying, coating, surface mount etc. all can become non- It is often convenient to be easy.
The third functional layer 300, is made of third substrate 310, including upper and lower two flat surfaces, respectively third layer Upper surface 312, third layer lower surface 311, and cooperatively form with the second functional layer 200 the insertion chamber of open hole or blind hole.
After three functional layer preparations, it is middle layer with the second functional layer 200, makes on second layer lower surface 211 and first layer Surface 172, second layer upper surface 212 become whole by Nian Jie with third layer lower surface 311.
After each functional layer bonding becomes row unit, row unit upper surface 602, unit lower surface 603 are flat surfaces.Row is single First upper surface 602 is the flat surfaces being made of third layer upper surface 312；Row unit lower surface 603, by first layer lower surface 171 flat surfaces constituted；First layer lower surface 171, including 111 exposed part of insulating substrate lower surface and bottom circuit 131. Row unit rear side face 604 is made of first layer trailing flank 162, second layer trailing flank 262 and third layer trailing flank 362.Because needing Consideration is fixed row unit by rear side, perhaps consider to pass through rear side and other circuits be electrically connected or in order to Reduce row cell width, makes the portion concave of not route, trailing flank is processed into non-flat shape, naturally it is also possible to according to need It is processed into flat shape.
For the ease of showing and marking, the element ratio drawn in figure and not true to scale, upper and lower, front and back described in the text All be opposite concept, can't because of figure carry out overturning or axial symmetry after just change patent essence.It is drawn in figure Layer printed circuit board and surface mount elements between electrical connection be not true circuit connecting mode, different layer printed circuits it Between conductive hole or the connection of side conductive layer is omitted, layer printed circuit board is provided to simply by the way of being paved with insulating substrate Simplify the key problem that non-present invention needs to discuss, also for the convenience of statement.Specific wire laying mode can be ever-changing, and Technical advantage possessed by the present invention is not influenced.PC106 and IC104 is using arranged side by side, it is clear that it will increase the width of row unit, Its purpose also for convenient for by illustrative clarity express, practical wiring design when unless special circumstances will not generally be located in this way Reason.Equally, the first functional layer 100 only depicts odt circuit in figure, is not offered as the present invention and is only applicable to odt circuit, because Wiring needs that three layers of circuit can be used completely, four layers of circuit, and so on.About verbal description and mark problem, because not The presence of congenerous layer for simplicity, can be selected according to circumstances if full name description can make verbal description become very redundancy Different titles or abbreviation, for example, first layer insulating substrate 110, may be simply referred to as the first insulating substrate 110, insulating substrate 110, Substrate 110 can't mutually be obscured because there is the presence of mark 110 with other layers of substrate.It describes also to have from different perspectives similar The case where, for example, the upper surface 112 of the first functional layer 100 is properly termed as on first layer from the perspective of entire functional layer Surface 112 can also be referred to as the first upper surface if being properly termed as insulating substrate upper surface 112 for specific position 112, upper surface 112, it is same because marking 112 presence, can't mutually it obscure with other layers of upper surface.
Embodiment two:
Referring to Fig. 9 ~ 12, the integrally packaged type row unit provided in this embodiment based on class stage structure, emitting cavity 202, in Portion space also reserves certain emitting space in addition to it can accommodate LE102 completely for LE102；The emitting space, shape and big It is small according to LE102 shape size and light emission direction, to be conducive to light output efficiency and the requirement to output angle determines；
Emitting cavity 202, under shed 505A, upper opening 501A are respectively perpendicular and downwardly and upwardly project, and distinguish table on the first layer Face 172 and third layer lower surface 311 form lower projected area 505 and upper projected area 501, LE102 are mounted in lower projected area 505；
LE102 is side emitting elements, top light emitting element, luminescence chip thrin；
After three functional layers bonding, by lower projected area 505, upper projected area 501 and emitting cavity 202, constitute and be open to side, i.e., to The class stage structure 500 of display direction opening；
Emitting space except 500 inside LE102 of class stage structure forms class stage after the filling solidification of transparent encapsulant glue 401 The light-emitting surface 402 of structure 500.
The class stage structure 500 of above-mentioned side opening, abbreviation class stage structure 500, when reserving emitting space for LE102 When, not only 202 shapes and sizes of emitting cavity can also be determined according to LE102 shapes and sizes, and according to being conducive to light output Efficiency and requirement to output angle determine, moreover, also there is wide in range element adaptability.When LE102 has in emitting cavity 202 When certain emitting space, either top emission device or sided light emitting device or even luminescence chip are placed in LE102 When in the class stage structure 500 of side opening, after 401 package curing of packaging plastic poured into emitting cavity 202, packaging plastic 401 Combine together with the packaging plastic 103 of LE102 itself, play the role of jointly to light it is guide-lighting, make light from packaging plastic 401 solidification after The lateral light output face 402(of the class stage structure 500 of formation is referred to as light-emitting surface 402) it is exported.Moreover, class stage knot Reflection and guiding function are also played to the light of LE102 in the inner space of structure 500, avoid light to being not required to direction to be shown Leakage, solves leakage problem.Furthermore it is also possible to which some ancillary measures is taken to improve the adaptability to different type element, example Such as, when being encapsulated using transparent box dam, so that it may so that the scope of application widens top light emitting element with box dam, etc..
Embodiment three:
Referring to Figure 13, the integrally packaged type row unit provided in this embodiment based on class stage structure, when being in emitting cavity 202 LE102 reserves emitting space, and three functional layer bondings after filling is with packaging plastic 401, go out light made of being solidified as packaging plastic 401 Face 402 constitutes row list with including 361 3 first layer leading flank 161, second layer leading flank 261 and third layer leading flank sides First light-emitting surface makes row unit light-emitting surface obtain different luminous deviations by the way that different inclination angles is made.In other words, above-mentioned row list First light-emitting surface and row unit upper surface 602 or lower surface 603 not only can also be out of plumb with horizontal plane.
Row unit provided in this embodiment, luminous point of the light-emitting surface 402 as row unit leading flank 601, from upper and lower relation On from the point of view of, between first layer leading flank 161 and third layer leading flank 361, not only can pass through change 402 top of light-emitting surface 361 thickness of third layer leading flank and lower part first layer leading flank 161 thickness, keep 402 surrounding medium of light-emitting surface uniform, also The inclination angle for the row unit light-emitting surface that can be made of change light-emitting surface 402 and row unit leading flank 601 obtains different shine Direction and deviation.Under normal circumstances, the light-emitting surface and row unit upper and lower surface that light-emitting surface 402 and row unit leading flank 601 are constituted It is vertical relationship, but be also required to above-mentioned light-emitting surface sometimes to have certain inclination angle, for example, many times display screen is mounted on height Place, effectively display are that in downward direction, upward direction is invalid display, at this time, it is necessary to which the light-emitting surface of row unit tilts down, just Can make the inclination angle of row unit leading flank 601 can be solved downwards.
Example IV:
Referring to Figure 14 ~ 15, the integrally packaged type row unit provided in this embodiment based on class stage structure, the emitting cavity 202, When reserving emitting space for LE102, there is wide in range adaptability not only for luminescent device, moreover, it is also possible to according to light The requirement of delivery efficiency and output angle makes the appropriate adjustments the interior shape of emitting cavity 202.
Emitting cavity 202, from the perspective of top view, by the bottom surface 502 of the second functional layer 200, left surface 503, the right side The surface shape that surface 504 is constituted.Concrete shape is that bottom surface 502 and left surface 503, right surface 504 can use bottom surface The structure of more broken lines of 502 protrusions, can also be using the hyp structure of 502 protrusion of bottom surface, that is to say, that its bottom surface 502 shapes, from the point of view of top view, for from being recessed into some shape between flat or even intermediate projections；Its left surface 503, right table It face 504 can be using from right angle to the structure of scalar horn mouth-shaped, that is to say, that its left surface 503, right surface 504 and the Within angle between two layers of leading flank 261, for equal to right angle to some angle being less than between right angle, shape of generatrix is from straight To some shape between broken line or even curve.From the perspective of cross section, bottom surface 502 and emitting cavity 202 and third function 300 lower surface of ergosphere, the inner space that the upper surface of the first functional layer 100 is formed all may be used when reserving emitting space for LE102 With the requirement according to the shape of LE102 or to light output efficiency and output angle, realized by the adjustment to 502 shape of bottom surface Adjustment to 202 shape of emitting cavity.Concrete shape is that 202 inner top surface of emitting cavity is vertical in addition to that can use bottom surface 502 Flat-tope structure outside, can also by the adjustment of 502 shape of bottom surface become domes.That is, its 502 shape of bottom surface Shape, from the point of view of cross section, for from vertically to some shape arch.
In fact, by the way that the circuit board disassembling of existing row unit is become different functional layers, and and component is placed in embedding Enter the class stage structure that chamber and luminescent device and emitting cavity are formed, has completely solved a series of existing the of row unit and asked Topic, about the discussion of 202 shape of emitting cavity, its object is to illustrate that 202 inner space of reflection cavity of row unit of the invention also has There is the advantage of adjustability.
Embodiment five:
Referring to Figure 16 ~ 19, the integrally packaged type row unit provided in this embodiment based on class stage structure, emitting cavity 202, in Portion space is mutually matched with LE102, and luminescent device LE102 is full of 202 inner space of emitting cavity, and it is empty only to reserve certain error Gap；
Emitting cavity 202, under shed 505A, upper opening 501A are respectively perpendicular and downwardly and upwardly project, and distinguish table on the first layer Face 172 and third layer lower surface 311 form lower projected area 505 and upper projected area 501, LE102 are mounted in lower projected area 505；
LE102 is side emitting elements, top light emitting element alternative one；
After three functional layer bondings, by lower projected area 505, upper projected area 501 and emitting cavity 202, the class dance of side opening is constituted Platform structure 500；500 inner space of class stage structure is filled by LE102 element body and the packaging plastic 103 of itself, that is, logical LE102 luminescent device itself filling is crossed, light-emitting surface 402 is directly constituted by the top LE102 or side.
Between light-emitting surface 402 and three sides for constituting row unit leading flank 601, same plane not only may be at, also It can be combined by different location that is forwardly convex or shrinking back backward, row unit is made to obtain different light emission directions, angle or inclined To.Three sides of above-mentioned composition row unit leading flank 601, including first layer leading flank 161, second layer leading flank 261 and Three layers of leading flank 361.That is, three sides of light-emitting surface 402 and unit leading flank 601, from conplane group Close, to it is forwardly convex and backward shrink back different position groupings (from same plane to mutual straggly), obtain different hairs Light direction, angle or deviation.For example, under normal circumstances, light-emitting surface 402 and row unit leading flank 601 are in same plane, energy Realize the various advantages of row unit of the present invention；If necessary to increase light emitting angle, light-emitting surface 402 can be made to protrude；If Keep light emitting angle on the lower side, third layer leading flank 361, first layer leading flank 161 can be made more forwardly convex.Current row is single Member is biased to very troublesome, has oblique weld, the unilateral technical solutions such as padded, require to shine to each if it is desired to adjusting to shine Element is processed, at high cost, cumbersome, and row unit of the invention only needs to adjust three functional layer flanking relationships, or Person forms row unit light-emitting surface different angle by cutting as embodiment three, and the adjusting for adjusting and shining and being biased to can be realized.
Embodiment six:
Referring to fig. 20, the integrally packaged type row unit provided in this embodiment based on class stage structure, third functional layer 300, until It offers less and is embedded in chamber 204 and PC insertion 206 one of both of chamber with IC, position is corresponding, the identical through-hole of size.
Row unit of the invention circuit board disassembling at three functional layers after, also for individually to the second functional layer 200 and Three functional layers, 300 thickness and insertion cavity configuration adjustment create condition, so that row unit has the advantage of flexible choice thickness.One As in the case of, third functional layer 300 is not necessarily required to open up through-hole, but in order to adjust the needs of row element thickness, or in order to fill out The convenience of packaging plastic is filled, or in order to easy to process, can be opened up in third functional layer 300 embedding with IC insertion chamber 204 or PC Enter through-hole possessed by chamber 206 correspondence, the identical through-hole of size completely, to reduce the second functional layer 200 and third functional layer 300 The thickness of stacking.After opening up through-hole, even if the stack thickness of the second functional layer 200 and third functional layer 300 is equal to even smaller It is also able to maintain the flat of row unit in the thickness of most thick element, surface treatment and various extensions will not be influenced.What is opened up is logical Hole only needs encapsulated glue to handle, and will not influence sealing waterproof performance.
Embodiment seven:
Referring to fig. 21, the integrally packaged type row unit provided in this embodiment based on class stage structure, second functional layer 200 With third functional layer 300, a functional layer at least within is made of the substrate at least with a layer printed circuit.
When the first functional layer 100 is unable to satisfy cabling requirement using double-deck or even multilayer circuit board, in addition to that can pass through First functional layer 100 increases outside the circuit number of plies, can also increase third layer in the third layer upper surface 312 of third functional layer 300 Upper surface circuit 332, that is, constitute third functional layer 300 by printed circuit board, equally, third functional layer can also be made 300 are made of printed circuit board, if the circuit number of plies not enough can also be using double-deck or even multilayer circuit board.
Circuit board disassembling is become different functional layers by row unit of the invention, so that it may individually carry out function to some layer Extension and performance are reinforced, moreover, each functional layer can become hermetic water-proof structure after becoming row unit by bonding, even if certain embedding Enter chamber using through-hole, packaging plastic can also be poured into through-hole and obtains hermetic water-proof structure, so, it can be as processing after bonding Common multilayer circuit board carries out conductive hole in side metallization or circuit board like that and handles, so that the printed circuit that newly increases and the The printed circuit of one functional layer 100 is electrically connected.Row unit has sealing one of fire resistance characteristic and technological progress of the invention.
Embodiment eight:
Referring to fig. 22 ~ 24, the integrally packaged type row unit provided in this embodiment based on class stage structure, third functional layer 300 When using circuit board, the surface element 180 of the first functional layer 100 is assigned to the lower surface of third functional layer 300, is mounted on third Lower 331 surface of circuit of layer, becomes surface element 380, and open up in the second functional layer 200 with 380 mirror symmetry of surface element, One-to-one insertion chamber 280A.
Third functional layer 300 can not only be passed through using printed circuit board with the printed circuit in the first functional layer 100 Electrical connection is mutually realized in internal metallization hole or side metallization, moreover, it is also possible to surface element 180 is assigned under third layer electric 331 surface of road becomes the surface element 380 of third functional layer 300.If it is desired to reduce row element thickness, surface element can be made The needs of part 380 are mutually staggered with surface element 180, avoid being overlapped on thickness.It further, can also surface element 180 is equal It is even to be staggeredly distributed to 331 surface of circuit under third layer, keep surface element 180 quantitatively identical or close as surface element 380, It is interlaced in position.Meanwhile it being opened up and 380 mirror symmetry of surface element, one-to-one correspondence in 200 upper surface of the second functional layer Insertion chamber 280A, make row unit do not increase width so that reduce thickness in the case where, accommodate higher component density.According to This principle can also be open the side of surface element 380 and insertion chamber 280A the class stage structure 500 constituted towards rear side, In the case where not increasing row cell width, the transparent display screen of double-sided display different images is made.Because of the schematic diagram after bonding It is difficult to clearly show, therefore exploded view is used to indicate.
The thickness of row unit is further decreased if necessary, can be by the thickness of the second functional layer 200 of reduction, or even save The slightly method of the second functional layer 200, while being opened up on the respective circuit board of the first functional layer 100 and third functional layer 300 With other side surface component mirror-symmetrical, mutual corresponding through-hole or blind hole, makes surface element 180(according to circumstances, may include LE102 can not also include) and surface element 380(is according to circumstances, may include LE302, can not also include) part or complete Portion is mutually embedded into other side's circuit board.When omitting the second functional layer 200, the rear side of LE102 by other side circuit board recess Insertion chamber 202A is formd, if it is single equally to can solve luminous point light leakage, row using the plastic packaging side emitting elements for having box dam A series of problems, such as first color is mixed and disorderly, and realize the reduction of row element thickness.If using COB lateral emitting, as long as being expert at Unit upper and lower surface pastes barrier bed can.
Embodiment nine:
Referring to fig. 25 ~ 26, the integrally packaged type row unit provided in this embodiment based on class stage structure, on front side of the second layer Face 261, extends forward, then simultaneously upwards, extend downwardly, formed before extend lower section 251, preceding extension upper section 253, just shelter from First layer leading flank 161 and third layer leading flank 361, at this point, row unit leading flank 601 is only made of second layer leading flank 261.
Second layer trailing flank 262 can also do similar extension, if extend back, need to consider the rear side of row unit with The connectivity problem of other circuit connectors or plate to plate, it is also necessary to according to the position of surface element 280 and installation scenarios, not have The position of component is narrowed, in this way, the possible simultaneously non-flat forms in second layer trailing flank 262.It extends back if necessary, even if trailing flank 262 is uneven, can also be similar as 261 extension method of second layer leading flank, so that second layer trailing flank 262 is extended back, then together When upwards, extend downwardly, extend after formation lower section 252, it is rear extend upper section 254, just shelter from first layer trailing flank 162, the Three layers of trailing flank 362.At this point, the first functional layer 100 extends before being placed between lower section 251 and rear extension lower section 252, third function Layer 300 extends before being placed between upper section 253 and rear extension upper section 254.
Second layer leading flank 261 forward, again simultaneously upwards, extend downwardly, make second layer leading flank 261 become row unit before Side 601, thus to obtain the side of another form of planarization, can also regard as 200 surface of the second functional layer into Capable another Function Extension.And electrical connection and support reinforcing function are realized in existing row monotechnics, the possessed wiring of circuit board It can mix, light-emitting component is mounted on outer surface again, can not be extended at all.Come from the angle solved the problems, such as It sees, row unit leading flank 601 and light-emitting surface 402 are in same plane and constitute flat surfaces, have been fully able to solve existing row To block that sight, color are mixed and disorderly, light leakage, luminous point periphery medium are uneven etc. a series of asks for surface element existing for unit Topic can further pass through second layer leading flank 261, first layer leading flank 161, third layer leading flank 361 and light-emitting surface 402 again The different combination of front-rear position or inclination angle, obtains the row unit side light output characteristic of different characteristics, these are even more existing Row unit cannot achieve, but one embodiment as the extensible extension sexual clorminance of row unit of the present invention, it is necessary to do herein A statement.
Embodiment ten:
Referring to fig. 27, the integrally packaged type row unit provided in this embodiment based on class stage structure, the first functional layer 100 is by more Layer circuit board is constituted, and LE102 is mounted on 135 surface of intermediate circuit layer, to solve to use when the design of row element thickness is restricted 402 upper and lower medium of smooth surface is uniform.
It, can be using in the second functional layer when the first functional layer 100 is unable to satisfy cabling requirement using double-layer circuit board The method that 200 upper surfaces increase second layer top circuit 232 can also make the first functional layer 100 use multilayer circuit board, this When, if having the limitation of thickness to the row unit after merging, and even with circuit board as thin as possible, and by adjusting hair The shape of optical cavity 202 also cannot achieve 402 upper and lower medium of light-emitting surface it is uniform when, it may be considered that LE102 is mounted on the first function Some 135 surface of intermediate circuit layer of multilayer circuit board of layer 100, at this time, it may be necessary to notch is reserved in 135 or more intermediate circuit layer, To mount LE102.
Embodiment 11:
Integrally packaged type row unit provided in this embodiment based on class stage structure, row unit upper surface 602, lower surface 603, performance enhancement can be obtained by the surface treatment of high performance material；Second functional layer 200 and third functional layer 300 can be with Performance enhancement is obtained by the replacement of high performance material.
By the processing to row unit upper surface or lower surface high performance material, for example, high thermal conductivity (such as metal film, gold Belong to powder etc.), material (such as carbon cloth) surface mount of high-modulus, spraying, printing means, so that row unit is obtained performance and increase By force；Second functional layer 200 and third functional layer 300, it is single to increase row such as carbon fiber sheet or aluminium sheet using high performance material The rigidity of member improves heat dissipation performance；Use the plastics of high rigidity to improve production efficiency, etc..For existing row unit, Because carbon fiber board and aluminium sheet are conductive, there are surface mount elements on surface again, and it is highly difficult to carry out surface property enhancing.And row of the invention is single Member, because of surface planarisation, even if the surface of printed circuit, as long as increasing insulation processing.In short, 100 He of the first functional layer Why third functional layer 300 can individually carry out performance enhancement, still have benefited from the Function Decomposition of circuit board, and be based on this hair The application of bright row unit structure and principle.
Embodiment 12:
Referring to fig. 28 ~ 29, the integrally packaged type row unit provided in this embodiment based on class stage structure, the second functional layer 200 It as top cover encapsulation function and is combined into one as insertion supporting layer and third functional layer 300, merging becomes the second function synthesized Layer 200A makes it while playing insertion support and top cover encapsulation effect, be also considered as the second functional layer 200 and third functional layer 300 is first being bonded as a result, possessed various advantages are fully retained after merging.
Obviously, the embodiment of the present invention is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this hair Embodiment in bright, for example, subelement is set to row unit outer surface；A not similar shape is done along the technology of the present invention thinking The emitting cavity of shape；The connector welding that row unit is connect with other circuit boards is in row cell surface etc., ordinary skill Personnel's every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
Integrally packaged type row unit provided in an embodiment of the present invention based on class stage structure, existing row element circuit plate The Function Decomposition that support function and circuit function mix is at three different functional layers, and the first functional layer is for being routed reality Electrical connection between component needed for existing, and make each component towards the second functional layer；Second functional layer is used to support reinforcement, increases The insertion function to component is added, has especially increased towards the luminescent device of light emission direction and be embedded in chamber；Third functional layer, is removed Basic package cap effect is outer, can also carry out Function Extension or performance is reinforced.After the bonding of three functional layers, by being embedded in chamber Insertion to each component realizes the embedded integrated of each component, solves surface element and block sight, influences between hollow out , can not merely unify, can not be surface-treated the problems such as mixed and disorderly away from, row cell colors.Especially luminescent device and three function Ergosphere forms a class stage structure in display direction, not only solve periphery medium existing for existing row unit unevenly and The problem of light leakage, has also expanded the range of choice of luminescent device, also, because luminescent device is attached to circuit face, can pass through layout Patch, it is easier to produce, and production efficiency greatly improved.

Claims (12)

1. the integrally packaged type row unit based on class stage structure, abbreviation row unit, including the first functional layer, the second functional layer and Third functional layer, which is characterized in that
First functional layer, shape are elongate in shape；
First functional layer, includes at least one layer of insulating substrate and top circuit, and the surface mount of the top circuit is at least driven Dynamic integrated circuit, luminescent device and the peripheral cell thrin to be decided what to use by integrated level；
Second functional layer, shape are the elongate in shape to match with the first functional layer；
Second functional layer, including supporting substrate, and the component the to be formed insertion chamber that is recessed inwardly by its lower surface；It should Whether component insertion chamber includes drive integrated circult insertion chamber, luminescent device insertion chamber, and by needing peripheral cell to determine The peripheral cell of choice is embedded in chamber；
Wherein, integrated circuit insertion chamber and peripheral cell are embedded in chamber, are through-hole, blind hole one of both；
Integrated circuit is embedded in the projection of chamber and peripheral cell insertion chamber in the first functional layer and corresponding integrated circuit and periphery Element corresponds, and shape is slightly larger than corresponding integrated circuit and peripheral cell；
The luminescent device is embedded in chamber, forms one positioned at the long side of the second functional layer display direction, and in the side edges Upwards, downwards, to the shape of display direction open on three sides, which at least omits in the projection of the first functional layer upper surface Greater than luminescent device；
The third functional layer, the function of be made of the flat plate in surface and the expansible layer of performance；
The third functional layer, shape are the elongate in shape to match with the first functional layer and the second functional layer；
The row unit makes second layer lower surface and first layer upper surface, second layer upper surface using the second functional layer as middle layer Become whole by Nian Jie with third layer lower surface.
2. the integrally packaged type row unit based on class stage structure as described in claim 1, which is characterized in that
The luminescent device is embedded in chamber, and inner space also reserves one in addition to it can accommodate luminescent device completely for luminescent device Fixed emitting space；The emitting space, shapes and sizes are according to luminescent device shape size and light emission direction, and are conducive to Light output efficiency and requirement to output angle determine；
The luminescent device is embedded in chamber, and under shed, upper opening, which are respectively perpendicular, downwardly and upwardly to be projected, and distinguishes table on the first layer Face and third layer lower surface form lower projected area and upper projected area, and luminescent device is mounted in lower projected area；
The luminescent device is side emitting elements, top light emitting element, luminescence chip thrin；
After first functional layer, the second functional layer and third functional layer three bonding, by lower projected area, upper projected area and emitting cavity, Constitute side opening, i.e., the class stage structure being open to display direction；
Emitting space in the class stage structure except luminescent device forms class stage after the filling solidification of transparent encapsulant glue The light-emitting surface of structure；The light-emitting surface and three including first layer leading flank, second layer leading flank and third layer leading flank Side constitutes row unit light-emitting surface；
The row unit light-emitting surface makes row unit light-emitting surface obtain different luminous deviations by the way that different inclination angles is made.
3. as claim 1 ~ 2 is any?The integrally packaged type row unit based on class stage structure, which is characterized in that institute Row unit is stated, after the first functional layer, the second functional layer and third functional layer bonding, at least under row unit upper surface, row unit Surface is flat surfaces.
4. the integrally packaged type row unit based on class stage structure as claimed in claim 2, which is characterized in that the photophore Part is embedded in chamber,
From the point of view of top view, the shape of bottom surface, for from being recessed into some shape between flat or even intermediate projections；
From the point of view of cross section, bottom surface, for from vertically to some shape arch；
From the point of view of top view, within angle between left surface and right surface, with second layer leading flank is straight to being less than equal to right angle Some angle between angle, shape of generatrix are from straight some shape between broken line or even curve.
5. the integrally packaged type row unit based on class stage structure as claimed in claim 3, which is characterized in that third function Layer offers and is at least embedded in chamber and peripheral cell insertion chamber one of both with integrated circuit, and position is corresponding, and size is identical logical Hole.
6. the integrally packaged type row unit based on class stage structure as claimed in claim 3, which is characterized in that second function Ergosphere and third functional layer, a functional layer at least within are made of the substrate at least with a layer printed circuit.
7. the integrally packaged type row unit based on class stage structure as claimed in claim 6, which is characterized in that the third function Ergosphere, when using printed circuit board, the surface element of the first functional layer is assigned to third functional layer, is mounted on third functional layer Lower surface, and it is corresponding with the insertion chamber opened up in the second functional layer.
8. the integrally packaged type row unit based on class stage structure as claimed in claim 7, which is characterized in that be thinned or omit Second functional layer opens up and other side surface component mirror image pair on the respective circuit board of the first functional layer and third functional layer Title, mutual corresponding through-hole or blind hole, make the surface element for being mounted on the first functional layer and the surface for being mounted on third functional layer Element is partly or entirely mutually embedded into other side's circuit board.
9. the integrally packaged type row unit based on class stage structure as claimed in claim 3, which is characterized in that the second layer Leading flank extends forward, then simultaneously upwards, extend downwardly, formed before extend lower section, preceding extension upper section, just shelter from first Layer leading flank and third layer leading flank, constitute row unit leading flank only by second layer leading flank.
10. the integrally packaged type row unit based on class stage structure as claimed in claim 3, which is characterized in that on row unit Surface, lower surface, the second functional layer, third functional layer obtain performance enhancement by the surface treatment or replacement of high performance material.
11. the integrally packaged type row unit based on class stage structure as claimed in claim 3, which is characterized in that described first Functional layer is made of multilayer circuit board, and luminescent device is mounted on the surface of intermediate circuit layer.
12. the integrally packaged type row unit based on class stage structure as claimed in claim 3, which is characterized in that described second Functional layer and third functional layer are combined into one, and merging becomes the second function synthesized layer.
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