KR20090019042A

KR20090019042A - Light emitting device

Info

Publication number: KR20090019042A
Application number: KR1020070083159A
Authority: KR
Inventors: 이건교
Original assignee: 엘지이노텍 주식회사
Priority date: 2007-08-20
Filing date: 2007-08-20
Publication date: 2009-02-25

Abstract

In the embodiment, a light emitting device is disclosed.

The light emitting device according to the embodiment includes a first substrate having a groove; A second substrate mounted on a bottom surface of the groove; A light emitting diode mounted on the second substrate; And a reflective wall formed on the side of the groove.

Description

Light emitting element {LIGHT EMITTING DEVICE}

In the embodiment, a light emitting device is disclosed.

A light emitting diode (LED) refers to a semiconductor device capable of realizing various colors by forming a light emitting source using compound semiconductor materials such as GaAs, AlGaAs, GaN, InGaN, and AlGaInP.

The light emitting device using the light emitting diode is used as a light source or a lighting device of various electronic devices.

An embodiment provides a light emitting device.

The embodiment provides a light emitting device having a narrow light distribution.

The embodiment can provide a light emitting device.

The embodiment can provide a light emitting device having a narrow light distribution.

1 is a cross-sectional view illustrating a light emitting device according to an embodiment, and FIG. 2 is a cross-sectional view illustrating a light emitting device according to another embodiment.

Referring to FIG. 1, in the light emitting device according to the embodiment, a second substrate 30 having a light emitting diode 50 mounted thereon is mounted on a bottom surface of a cavity formed in the first substrate 10.

The first substrate 10 may be a printed circuit board (PCB) or a ceramic substrate, and the second substrate 30 may be a silicon wafer or ceramic. In the embodiment, a silicon wafer is used as the second substrate 30.

The first wiring 21, the second wiring 22, and the third wiring 23 are formed on the first substrate 10. The first wiring 21 and the second wiring 22 are for supplying power to the light emitting diode 50.

On the other hand, the third wiring 23 allows the heat emitted from the light emitting diode 50 to be quickly released, and the third wiring 23 is supported by the first wiring 21 and the second wiring 22. 2 supports the substrate 30.

The third wiring 23 is a dummy wiring not connected to a power source, and may be selectively formed.

The first electrode 31, the second electrode 32, and the third electrode 33 are formed on the second substrate 30. The first electrode 31 and the second electrode 32 are for supplying power to the light emitting diode 50.

The first electrode 31 and the second electrode 32 are electrically connected to the first wiring 21 and the second wiring 22, respectively.

On the other hand, the third electrode 33 allows the heat emitted from the light emitting diode 50 to be quickly released.

The third electrode 33 is a dummy electrode that is not connected to a power source, and may be selectively formed.

Grooves are formed on the second substrate 30, and the light emitting diode 50 is mounted on the bottom surface of the grooves. The light emitting diode 50 is electrically connected to the first electrode 31 and the second electrode 32 through at least one wire 80 which is a conductive member.

In the exemplary embodiment, the first electrode 31 and the second electrode 32 are electrically connected to the light emitting diode 50 through the wire 80, respectively, but the light emitting diode 50 is the first electrode. The electrode layer may be mounted on the electrode 31 or the second electrode 32. If the electrode layer is formed on the lower side of the light emitting diode 50, the first electrode 31 or the second electrode may naturally exist even if the wire 80 is not used. It may be electrically connected to the electrode 32.

The molding member 60 is filled in the second substrate 30 on which the light emitting diode 50 and the wire 80 are formed. The molding member 60 may include a phosphor.

The reflective layer 40 is formed on the upper surface of the second substrate 30. Al or Ag may be used as the reflective layer 40, and the efficiency of light emitted from the light emitting diode 50 is increased.

Meanwhile, a reflective wall 70 is formed on the side surface of the groove formed in the first substrate 10. Al or Ag may be used as the reflective wall 70, and the light distribution of the light emitted from the light emitting diode 50 is narrowed.

That is, the reflective wall 70 narrows the directivity angle of the light emitted from the light emitting diodes 50 so that the light can be concentrated in a narrow area.

Referring to FIG. 2, in the light emitting device according to another embodiment, the reflective wall 70 is inclined at an angle of 80 degrees.

In FIG. 1, the reflective wall 70 is formed at an angle of 80 degrees, in contrast to 90 degrees.

The light distribution of the light emitted from the light emitting diodes 50 may vary depending on the inclination of the reflective wall 70. In the light emitting device according to the embodiment, the reflective wall 70 is formed at an angle of 80 to 90 degrees. .

The light emitting device according to the embodiment determines the light distribution of the light emitted from the light emitting diode 50 by controlling the angle of the reflective wall 70, that is, the inclination of the side surface of the groove formed in the first substrate 10.

For example, the light distribution of the light emitted from the light emitting diode 50 may be narrowed so that light may be concentrated in a narrow area.

The characteristics of the light emitting device according to the embodiment may be applied to a field where light needs to be intensively irradiated only in a narrow area, and, for example, to a room lamp of a car that needs to not interfere with the driver's view. Can be used.

1 is a cross-sectional view illustrating a light emitting device according to an embodiment.

2 is a cross-sectional view illustrating a light emitting device according to another embodiment.

Claims

A first substrate having grooves formed therein;

A second substrate mounted on a bottom surface of the groove;

A light emitting diode mounted on the second substrate; And

A light emitting device comprising a reflective wall formed on the side of the groove.

The method of claim 1,

The first substrate is a light emitting device (PCB) or a ceramic substrate.

The method of claim 1,

The second substrate is a silicon wafer or a ceramic light emitting device.

The method of claim 1,

A groove is formed in the second substrate, and the light emitting diode is mounted on the bottom surface of the groove of the second substrate.

The method of claim 1,

The first substrate and the second wiring for providing power to the light emitting diode is formed on the first substrate, the second substrate is mounted on the first wiring and the second wiring.

The method of claim 5,

The first substrate is a light emitting element, characterized in that the dummy wiring for supporting the second substrate is formed between the first wiring and the second wiring.

The method of claim 5,

A first electrode and a second electrode are formed on the second substrate to supply power to the light emitting diode, and the first electrode and the second electrode are electrically connected to the first wiring and the second wiring, respectively. Light emitting element.

The method of claim 6,

And a dummy electrode connected to the dummy wiring on the second substrate.

The method of claim 7, wherein

And at least one conductive member electrically connecting the first electrode and the second electrode to the light emitting diode.

The method of claim 1,

The reflective wall is a light emitting device, characterized in that formed at an angle of 80 ~ 90 degrees.

The method of claim 1,

The reflective wall is a light emitting device, characterized in that formed of Ag or Al.