CN110798975B - Surface-mounted device - Google Patents
Surface-mounted device Download PDFInfo
- Publication number
- CN110798975B CN110798975B CN201911006852.0A CN201911006852A CN110798975B CN 110798975 B CN110798975 B CN 110798975B CN 201911006852 A CN201911006852 A CN 201911006852A CN 110798975 B CN110798975 B CN 110798975B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- led lamp
- holes
- main body
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000011324 bead Substances 0.000 claims abstract description 28
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 230000007547 defect Effects 0.000 abstract description 4
- 230000003287 optical effect Effects 0.000 abstract description 3
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention provides a surface mount device, comprising: the circuit board is provided with a plurality of through holes; the LED lamp beads are arranged on one side of the circuit board; and the electronic devices are consistent with the layout of the through holes, one end of each electronic device is provided with a pin, the pins are arranged on the circuit board, and the other end of each electronic device passes through the through holes and extends towards one side of the circuit board different from the LED lamp beads. The other end of the electronic device passes through the through hole and extends towards one side of the circuit board different from the LED lamp bead, and at the moment, the electronic device cannot appear in the area where the light of the LED lamp bead radiates, so that the light emitted by the LED lamp bead cannot be blocked. Therefore, the defects that the LED optical drive integrated lamp is easy to generate dark areas, low in light efficiency and even shadows are overcome. Meanwhile, the electronic devices are arranged on different sides of the LED lamp beads, so that uniformity of one side of the integrated light source of the LED CD driver is facilitated, and further light efficiency and attractiveness of the lamp are improved.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to an LED lamp manufactured in a surface-mount mode.
Background
The LED lamp provided in the prior art, as shown in fig. 1, is often provided with LED beads 2 directly on the top surface of the circuit board 1, and meanwhile, various electronic devices 3 are placed on the top surface in a welding manner, and the specific structure is shown in fig. 1.
Such a structure as described above has the following disadvantages: because the electronic devices are directly arranged on the same side of the LED lamp beads and protrude out of the circuit board 1, the electronic devices 3 can block light generated by the LED lamp beads, so that partial areas are darker in light and even shadow is generated.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is to overcome the defect that the LED lamp in the prior art is easy to generate dark areas and even shadows.
To this end, the invention provides a surface mount device comprising: the circuit board is provided with a plurality of through holes; the LED lamp beads are arranged on one side of the circuit board; and the electronic devices are consistent with the layout of the through holes, one end of each electronic device is provided with a pin, the pins are arranged on the circuit board, and the other end of each electronic device passes through the through holes and extends towards one side of the circuit board different from the LED lamp beads.
The invention provides a surface-mounted device, which comprises a main body and pins arranged at one end of the main body, wherein the inner diameter of a through hole is larger than the outer diameter of the main body.
The top end of the main body is level with the top surface of the circuit board.
The invention provides a surface-mounted device, wherein the connection part of a pin and a circuit board is arranged at a certain distance from the edge of a through hole.
The pin comprises a vertical extension part and an inclined part connected to the top end of the vertical extension part and extending towards the circuit board, and a first horizontal part connected with the circuit board is connected to the inclined part.
The distance between the first horizontal part and the edge of the through hole is 1-2mm.
According to the surface-mounted device provided by the invention, the inclined part and the vertical extension part are provided with the second horizontal part.
According to the surface-mounted device provided by the invention, the included angle between the inclined part and the circuit board is 45 degrees.
The technical scheme of the invention has the following advantages:
1. The surface-mounted device provided by the invention comprises: the circuit board is provided with a plurality of through holes; the LED lamp beads are arranged on one side of the circuit board; and the electronic devices are consistent with the layout of the through holes, one end of each electronic device is provided with a pin, the pins are arranged on the circuit board, and the other end of each electronic device passes through the through holes and extends towards one side of the circuit board different from the LED lamp beads.
In the invention, the other end of the electronic device passes through the through hole and extends towards one side of the circuit board different from the LED lamp beads, and at the moment, the electronic device will not appear in the area where the light rays of the LED lamp beads radiate, so that the light rays emitted by the LED lamp beads are not blocked. Therefore, the defects that the LED optical drive integrated lamp is easy to generate dark areas, low in light efficiency and even shadows are overcome.
Meanwhile, the electronic devices are arranged on different sides of the LED lamp beads, so that uniformity of one side of the integrated light source of the LED CD driver is facilitated, and further light efficiency and attractiveness of the lamp are facilitated.
2. The surface-mounted device provided by the invention comprises the main body and the pins arranged at one end of the main body, wherein the inner diameter of the through hole is larger than the outer diameter of the main body, so that the main body of the electronic device can conveniently and smoothly pass through the through hole on the circuit board, and meanwhile, a short circuit phenomenon between the main body and the circuit board can be avoided by arranging a certain gap between the main body and the through hole.
3. According to the surface-mounted device provided by the invention, the connection part of the pins and the circuit board is arranged at a certain distance from the edge of the through hole.
For the circuit board, the circuit board comprises a circuit layer connected with the pins, an insulating layer positioned at the central part and an aluminum layer positioned at the bottom layer, if the pins are directly contacted with the edges of the through holes, the pins are likely to contact with the bottom aluminum layer, and at the moment, short circuits occur between the pins and the aluminum layer.
4. The pin comprises a vertical extension part and an inclined part which is connected to the top end of the vertical extension part and extends towards the circuit board, and a first horizontal part connected with the circuit board is connected to the inclined part.
Through setting up the slope, be favorable to the pin to keeping away from the direction emergence extension at through-hole edge, and then be favorable to avoiding taking place the short circuit phenomenon between pin and the aluminium layer.
5. According to the surface-mounted device provided by the invention, the inclined part and the vertical extension part are provided with the second horizontal part.
The second horizontal part is arranged, so that the pins can extend towards the direction away from the edges of the through holes, and the short circuit phenomenon between the pins and the aluminum layer can be avoided.
6. According to the surface-mounted device provided by the invention, the grooves are formed in the main body, and after the main body is connected to the circuit board through the pins, the grooves of the main body correspond to the inner diameter positions of the through holes, and at the moment, certain gaps exist between the main body and the through holes due to the existence of the grooves, so that the short circuit phenomenon between the main body and the circuit board is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a device provided in the background of the invention;
FIG. 2 is a schematic structural diagram of a surface mount device according to the present application;
FIG. 3 is a schematic structural view of a first electronic device according to the present application;
FIG. 4 is a schematic top view of a first electronic device provided by the present application;
FIG. 5 is a schematic top view of a second electronic device provided by the present application;
FIG. 6 is a schematic top view of a third electronic device provided by the present application;
FIG. 7 is a schematic top view of a fourth electronic device provided by the present application;
FIG. 8 is a schematic top view of a fifth electronic device provided by the present application;
FIG. 9 is a schematic structural view of a sixth electronic device according to the present application;
FIG. 10 is a schematic top view of a sixth electronic device according to the present application;
fig. 11 is a schematic structural diagram of a seventh electronic device according to the present application.
Reference numerals illustrate:
1-a circuit board; 11-through holes; 2-LED lamp beads; 3-electronic devices; 31-a body; 32-pins; 321-a vertical extension; 322-inclined portion; 323-a first horizontal portion; 324-second horizontal portion.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
The embodiment provides a surface mount device, as shown in fig. 2, which is characterized by comprising: a circuit board 1 on which a plurality of through holes 11 are provided; the LED lamp beads 2 are arranged on one side of the circuit board 1; the layout of the electronic devices 3 is consistent with that of the through holes 11, pins 32 are arranged at one end of each electronic device 3, the pins 32 are arranged on the circuit board 1, and the other end of each electronic device 3 extends towards one side, different from the LED lamp beads 2, of the circuit board 1 through the through holes 11.
In this embodiment, the circuit board is made by adopting a three-layer structure, and comprises a conductive layer, an insulating layer and an aluminum layer from top to bottom, wherein the LED lamp beads and the electronic devices are arranged on the conductive layer.
In this embodiment, the other end of the electronic device passes through the through hole and faces the circuit board and is different from the side where the LED lamp beads are located, and at this time, the electronic device will not appear in the area where the light of the LED lamp beads radiates, so that the light emitted by the LED lamp beads will not be blocked. Therefore, the defects that the LED optical drive integrated lamp is easy to generate dark areas, low in light efficiency and even shadows are overcome.
Meanwhile, the electronic devices are arranged on different sides of the LED lamp beads, so that uniformity of one side of the integrated light source of the LED CD driver is facilitated, and further light efficiency and attractiveness of the lamp are facilitated.
Specifically, the pins are connected to the circuit board in a welding manner, meanwhile, as shown in fig. 10, the pins can be multiple groups, and the specific number can be adjusted according to actual requirements.
In this embodiment, the through hole 11 may be a circular hole or a rectangular hole. The shape of the through hole 11 may be adjusted according to specific requirements.
In this embodiment, the electrical component may be one or more of an electrolytic capacitor, an inductor, a transformer, and other electronic devices that can be applied to the LED light driver integrated light source, which is not described in detail in this embodiment.
In the surface mount device provided in this embodiment, as shown in fig. 3, the electronic device 3 includes a main body 31, and the pins 32 disposed at one end of the main body 31, where the inner diameter of the through hole 11 is greater than the outer diameter of the main body 31. Specifically, the distance between the inner diameter of the through hole 11 and the outer diameter of the main body 31 is 1mm.
As a modification, a groove may be directly formed on the main body 31, and when the main body is connected to the circuit board through the pin 32, the groove of the main body corresponds to the inner diameter of the through hole 11, and at this time, due to the existence of the groove, a certain gap exists between the main body and the through hole, so that a short circuit phenomenon between the main body and the circuit board is avoided.
In this embodiment, as shown in fig. 2, the top end of the main body 31 is flush with the top surface of the circuit board 1. As a modification, the tip of the main body 31 may be protruded from the top surface of the wiring board 1 or disposed lower than the top surface of the wiring board 1.
In the surface mount device provided in this embodiment, as shown in fig. 2, a portion of the pin 32 connected to the circuit board 1 is disposed at a certain distance from an edge of the through hole 11. In particular, the distance is often chosen to be 1-4mm. However, the specific numerical values may be adjusted according to the actual working conditions, and are not limited in this embodiment too much.
In this embodiment, the pin 32 includes a vertical extension portion 321 and an inclined portion 322 connected to the top end of the vertical extension portion 321 and extending toward the circuit board 1, and a first horizontal portion 323 connected to the circuit board 1 is connected to the inclined portion 322. By arranging the inclined part 322, the pins 32 can extend towards the direction far away from the edge of the through holes 11, and the short circuit phenomenon between the pins 32 and the aluminum layer can be avoided. In this embodiment, the distance between the first horizontal portion 323 and the edge of the through hole 11 is 1-2mm. The angle between the inclined portion 322 and the circuit board 1 is 45 degrees. As a variant, the included angle can be set to other degrees and can be adjusted according to the working conditions.
In particular, as shown in fig. 3-11, a plurality of different electrical components are schematically illustrated in the present embodiment.
In the surface mount device provided in this embodiment, as shown in fig. 2, the inclined portion 322 and the vertical extending portion 321 are provided with a second horizontal portion 324. By providing the second horizontal portion 324, it is further advantageous for the pins 32 to extend in a direction away from the edge of the through hole 11, so as to avoid a short circuit phenomenon between the pins 32 and the aluminum layer.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.
Claims (5)
1. A surface mount device, comprising:
a circuit board (1) provided with a plurality of through holes (11);
the LED lamp beads (2) are arranged on one side of the circuit board (1);
A plurality of electronic devices (3) which are consistent with the layout of the through holes (11), pins (32) are arranged at one end of each electronic device (3), the pins (32) are arranged on the circuit board (1), the other ends of the electronic devices (3) extend through the through holes (11) and face to one side of the circuit board (1) where the LED lamp beads (2) are located, each electronic device (3) comprises a main body (31) and pins (32) arranged at one end of the main body (31), the inner diameter of each through hole (11) is larger than the outer diameter of the main body (31), grooves are formed in the main body (31), after the main body (31) is connected to the circuit board (1) through the pins (32), the grooves of the main body correspond to the inner diameter of the through holes (11) and are arranged at a certain distance from the inner edge of the through holes (11), the positions of the pins (32) connected with the circuit board (1) are arranged at a certain distance from the edge of the through holes (11), the pins (32) comprise vertical portions 321 and a first inclined portions (322) which extend towards the upper inclined portions (323) of the circuit board (1), the circuit board is made of a three-layer structure and comprises a conducting layer, an insulating layer and an aluminum layer from top to bottom, and the LED lamp beads and the electronic devices are arranged on the conducting layer.
2. The surface mount device according to claim 1, wherein the top end of the main body (31) and the top surface of the wiring board (1) are flush with each other.
3. A surface mount device according to claim 1, characterized in that the distance between the first horizontal portion (323) and the edge of the through hole (11) is 1-2mm.
4. The surface mount device according to claim 1, wherein the inclined portion (322) and the vertically extending portion (321) are provided with a second horizontal portion (324).
5. The surface mount device according to claim 1, wherein an angle between the inclined portion (322) and the wiring board (1) is 45 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911006852.0A CN110798975B (en) | 2019-10-22 | 2019-10-22 | Surface-mounted device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911006852.0A CN110798975B (en) | 2019-10-22 | 2019-10-22 | Surface-mounted device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110798975A CN110798975A (en) | 2020-02-14 |
| CN110798975B true CN110798975B (en) | 2024-05-07 |
Family
ID=69440638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911006852.0A Active CN110798975B (en) | 2019-10-22 | 2019-10-22 | Surface-mounted device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110798975B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10150178A (en) * | 1996-11-19 | 1998-06-02 | Matsushita Electron Corp | Solid-state image sensing device and its manufacture |
| CN103404242A (en) * | 2011-03-09 | 2013-11-20 | 大陆汽车有限责任公司 | Assembly having substrate, SMD component, and lead frame part |
| CN108601203A (en) * | 2018-04-26 | 2018-09-28 | 生益电子股份有限公司 | A kind of PCB and PCBA |
| CN109084216A (en) * | 2017-07-19 | 2018-12-25 | 广州超维光电科技有限责任公司 | Integrally packaged type row unit based on class stage structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5766593B2 (en) * | 2011-12-09 | 2015-08-19 | 日本特殊陶業株式会社 | Light-emitting element mounting wiring board |
-
2019
- 2019-10-22 CN CN201911006852.0A patent/CN110798975B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10150178A (en) * | 1996-11-19 | 1998-06-02 | Matsushita Electron Corp | Solid-state image sensing device and its manufacture |
| CN103404242A (en) * | 2011-03-09 | 2013-11-20 | 大陆汽车有限责任公司 | Assembly having substrate, SMD component, and lead frame part |
| CN109084216A (en) * | 2017-07-19 | 2018-12-25 | 广州超维光电科技有限责任公司 | Integrally packaged type row unit based on class stage structure |
| CN108601203A (en) * | 2018-04-26 | 2018-09-28 | 生益电子股份有限公司 | A kind of PCB and PCBA |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110798975A (en) | 2020-02-14 |
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| SE01 | Entry into force of request for substantive examination | ||
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A surface mount device Granted publication date: 20240507 Pledgee: Jiangmen Rural Commercial Bank Co.,Ltd. Muzhou Branch Pledgor: Jiangmen Huapu Lighting Co.,Ltd. Registration number: Y2024980041886 |