JP5080843B2 - Surface mount stand, surface mount LED lamp and LED unit - Google Patents

Description

  The present invention relates to a surface mount stand for surface mounting an electrical element, a surface mount LED lamp and an LED unit including the surface mount stand.

  Compared to fluorescent lamps and incandescent lamps that have been used as light sources, LEDs are attracting attention as light sources because of their low power consumption and long life. Lighting switches, backlight light sources, illumination light sources, LED lamps have been used in a wide range of fields such as decoration.

Conventionally, when such an LED lamp is mounted on a printed circuit board, a manufacturing method in which the lead of the LED lamp is inserted into a pattern land through hole of the printed circuit board by an automatic component insertion machine and soldered is performed (Patent Document 1). reference).
JP 11-338384 A

  However, in an apparatus including a large number of LED lamps such as an LED unit, the apparatus tends to be large, and it is necessary to reduce the size and thickness of the apparatus. For this reason, an LED lamp that can be mounted on both sides of a printed circuit board is required to increase the mounting area.

  Further, in a mounting process for mounting a radial component such as an LED lamp on a printed circuit board, for example, it is necessary to make the LED lamp stable and independent even when the printed circuit board is conveyed.

  The present invention has been made in view of such circumstances, by providing a guide groove from the front surface side through the insertion hole and guiding the lead of the electric element bent along the back surface from the vicinity of the insertion hole to the side wall. An object of the present invention is to provide a surface mount stand capable of surface mounting an electric element, a surface mount LED lamp and an LED unit including the surface mount stand.

Surface mount stand according to the first invention, a plate-like body, an insertion hole for inserting the leads of the electrical element is provided in a central portion of the plate-like member, the lead was inserted from the surface side of the plate-like body in stand for surface mounting to a surface mount electrical element bent along the back side, Ri Oh provided a guide groove for guiding the leads bent to the sidewall of the plate member from the insertion hole near the guide groove, the insertion hole than in the vicinity is provided with a gap portion which is the depth of the said guide groove in said side wall near a feature tare Rukoto to visible soldering state of an end portion of the lead by the gap portion To do.

Surface mount stand according to the second invention is characterized in that it comprises Oite the first shot bright, a notch in the opening side wall by the guide groove.

The stand for surface mounting according to a third aspect is characterized in that, in the second aspect , the notch is a notch groove provided in the side wall along the depth direction of the guide groove.

A surface-mount LED lamp according to a fourth aspect of the invention includes an LED lamp having a lead and the surface-mounting stand according to any of the foregoing inventions, and the lead is bent into a guide groove of the surface-mounting stand. It is characterized by that.

An LED unit according to a fifth aspect is characterized in that a plurality of surface-mounted LED lamps according to the above-described invention are mounted on a substrate surface.

  In the first invention, the lead of the electric element is inserted into the insertion hole from the surface side of the surface-mounting stand of the plate-like body, and the inserted lead is bent along the guide groove on the back surface. For example, in the case of a radial component such as an LED lamp, two guide grooves for guiding each of the two bent leads are provided so as to be opposite to each other from the insertion hole toward the side wall. Since the LED lamp and the surface mounting stand are coupled by the bent lead, an electric element such as an LED lamp can be surface mounted. Further, it is not necessary to bond the electric element to the surface mounting stand with an adhesive, and the problem of insufficient adhesive strength due to the difference in material between the electric element and the surface mounting stand is eliminated. Further, there is no need for a protruding member or a locking member for coupling the electric element to the surface mounting stand, and it is possible to eliminate a coupling failure caused by a difference in strength or dimensions of the protruding member or the locking member itself. The electric element can be made stable and independent.

The guide groove is provided with a gap portion in which the depth of the guide groove is deeper in the vicinity of the side wall than in the vicinity of the insertion hole. When the lead inserted through the insertion hole is bent along the guide groove, since the guide groove is deep near the side wall, the gap between the guide groove and the lead becomes large near the side wall, and is soldered by reflow, for example. It is possible to easily confirm the soldered state of the lead end, and to realize surface mounting that can easily grasp the electrical connection of the electric element.

In the second invention, the side wall opened by the guide groove is provided with a notch. It becomes easier to visually observe the lead end portion in the vicinity of the side wall by the notch, and it is possible to realize surface mounting that can easily grasp the electrical connection of the electric element.

In the third invention, the notch groove is provided in the side wall along the depth direction of the guide groove. This makes it easier to see the end of the lead from the surface (upper side) of the board when mounted on the board, for example, and realizes surface mounting that makes it easy to grasp the electrical connection of the electrical elements. can do.

In the fourth invention, the LED lamp can be surface-mounted on the printed circuit board by bending the lead of the LED lamp into the guide groove of the surface mounting stand.

In the fifth invention, the LED unit can be reduced in size and thickness by mounting a plurality of surface-mounted LED lamps on the substrate surface.

  In the first invention, an electric element such as an LED lamp can be surface-mounted. In particular, the LED lamp can be mounted with a surface mounter, soldering by reflow is possible, and the LED lamp and other components can be mounted in a mixed manner, improving the production efficiency. Further, mounting on both sides of the printed circuit board is possible, and the mounting area can be increased. Further, it is not necessary to bond the electric element to the surface mounting stand with an adhesive, and the problem of insufficient adhesive strength due to the difference in material between the electric element and the surface mounting stand is eliminated. Further, there is no need for a protruding member or a locking member for coupling the electric element to the surface mounting stand, and it is possible to eliminate a coupling failure caused by a difference in strength or dimensions of the protruding member or the locking member itself. The electric element can be made stable and independent.

Further , it is possible to easily confirm the soldered state of the lead end portion soldered by reflow, and to realize surface mounting that can easily grasp the electrical connection of the electric element.

In the second invention, it is further easier to visually observe the end of the lead, and surface mounting that can easily grasp the electrical connection of the electric element can be realized.

According to the third aspect of the present invention, it is further easier to visually observe the end of the lead from the surface (upper side) of the substrate when mounted on the substrate, and the electrical connection of the electric element can be easily grasped. Implementation can be realized.

In the fourth invention, the LED lamp can be surface-mounted on the printed circuit board.

In the fifth invention, the LED unit can be reduced in size and thickness.

Embodiment 1
Hereinafter, the present invention will be described with reference to the drawings illustrating embodiments thereof. 1 is a front view of a surface mount LED lamp according to the present invention, FIG. 2 is a plan view of the surface mount LED lamp according to the present invention, and FIG. 3 is a bottom view of the surface mount LED lamp according to the present invention. FIG. The surface mount type LED lamp according to the present invention includes an LED lamp 10, a surface mount stand 20, and the like.

  The LED lamp 10 is a radial component and has two leads 11 and 12. An LED chip (not shown) is formed by die bonding on a concave reflecting portion (not shown) provided on the top of the lead 11. Bonded and fixed. Each electrode of the LED chip is connected to the leads 11 and 12 by a gold wire. Further, the upper portions of the LED chip and leads 11 and 12 are housed in a mold part made of epoxy resin whose tip part forms a convex lens part. In addition, the structure of the LED lamp 10 is an example, Comprising: It is not limited to this.

  The surface mounting stand 20 is made of a synthetic resin, for example, a heat resistant resin such as PPS (polyphenylene sulfide), and has a rectangular parallelepiped shape (plate-like body). Insertion holes 23 and 23 through which the leads 11 and 12 of the LED lamp 10 are inserted from the contact surface 201 that contacts the LED lamp 10 toward the bottom surface 202 are formed in the vicinity of the center portion in plan view. A cathode mark 204 is provided on the contact surface 201 to clarify the polarity of the LED lamp 10. Thereby, erroneous insertion of the LED lamp 10 can be prevented. Further, pedestals 205 having predetermined height dimensions are provided at the four corners of the bottom surface 202. As a result, the surface mounting stand 20 is easily stabilized and the surface mounting stand 20 is tilted by the bent leads 11 and 12 even when the bending angle of the leads 11 and 12 is slightly larger than the right angle. This can be prevented.

  The bottom surface 202 is formed with guide grooves 21 and 21 having a rectangular cross-sectional shape for guiding the leads 11 and 12 bent through the insertion holes 23 and 23. The directions of the guide grooves 21 and 21 are opposite to the side walls 203 and 203 from the insertion holes 23 and 23, respectively. As a result, the leads 11 and 12 of the LED lamp 10 are bent in opposite directions, so that the coupling between the LED lamp 10 and the surface mounting stand 20 is strengthened, and the LED lamp 10 is prevented from tilting or wobbling and stable. It can be self-supporting and surface mounted. The cross-sectional shape of the guide groove 21 is not limited to a rectangular shape, and can be appropriately set such as a curved shape, a V-shape, and a semicircular shape according to the cross-sectional shape and thickness of the leads 11 and 12. .

  The guide grooves 21 and 21 are provided with gap portions 211 and 211 in which the depth of the grooves is increased on the way from the insertion hole 23 to the side wall 203. That is, in the gap 211, the gap between the bent leads 11 and 12 and the guide grooves 21 and 21 is increased so that the ends of the leads 11 and 12 to be soldered by reflow are easily visible. As a result, it is possible to easily confirm the soldered state of the ends of the leads 11 and 12 soldered by reflow, and to realize surface mounting that can easily grasp the electrical connection of the electric elements. it can.

  The dimension of the gap 211 in the direction of the leads 11 and 12 can be set to such an extent that the ends of the leads 11 and 12 are visible. Further, it is preferable that the length of the guide groove 21 excluding the gap 211 in the lead 11 and 12 direction is as long as possible. This is because the guide groove 21 makes it easy to set the bending angle of the leads 11 and 12 to 90 degrees.

  Conventionally, when the lead of an electrical component is inserted into a surface mounting stand and the bent lead is soldered to a printed circuit board for surface mounting, the bent lead is attached to the stand so that the soldered portion of the lead can be visually observed. It was necessary to cut in a state of extending from the bottom edge. For this reason, there is a problem that not only the mounting area of the component is reduced only at the end portion of the lead to be soldered, but also the effective space of the stand on which the electrical component is mounted is increased only by the lead portion protruding from the stand. Further, due to the interference between the protruding leads, it is difficult to arrange the stands on which the electrical components are mounted, and there is a problem that, for example, a loading mechanism for mounting on a printed board with an automatic mounting apparatus becomes complicated.

  In the present invention, by providing the guide groove 21 with the gap portion 211 having a deeper groove depth, the leads 11 and 12 can be cut even when the bent leads 11 and 12 are cut at the side wall 203 or inside thereof. The soldered portion can be easily visually observed, and the above-mentioned problems can be solved.

  A cutout groove 24 having a semicircular cross-sectional shape is formed in the side wall 203 along the depth direction of the guide groove 21 in the portion of the side wall 203 where the guide groove 21 (gap 211) is formed. The cross-sectional shape of the cutout groove 24 is not limited to a semicircular shape, and can be set as appropriate, such as a rectangular shape, a curved shape, or a V shape. Thereby, for example, it becomes easier to visually observe the ends (soldered portions) of the leads 11 and 12 from the surface (upper side) of the printed circuit board when mounted on the printed circuit board. Surface mounting that can easily grasp the connection can be realized.

  FIG. 4 is a longitudinal sectional view of the surface mounting stand 20. As shown in FIG. 4, the lead 11 of the LED lamp 10 is inserted through the insertion hole 23 and bent along the guide groove 21 on the bottom surface 202 of the surface mounting stand 20. In the vicinity of the end of the lead 11, a gap 211 is formed in which the depth of the guide groove 21 is further increased and the gap with the lead 11 is further increased. Thereby, when the end part of the lead 11 is soldered to the printed circuit board 1, the state of soldering can be easily confirmed from the lateral direction. Furthermore, since the notch groove 24 is formed in the side wall 203 in the depth direction of the guide groove 21, the soldering state can be easily confirmed even from the upper side of the printed circuit board 1. The structure of the guide groove 21 of the other lead 12 is the same.

  FIG. 5 is a perspective view of an essential part of the LED unit according to the present invention. In FIG. 5, only one surface-mounted LED lamp surface-mounted on the printed circuit board 1 is shown, but the LED unit has a plurality of similar surface-mounted LED lamps mounted thereon. As shown in FIG. 5, the state of the soldered portion 30 between the lead 11 of the LED lamp 10 and the conductive pattern 2 on the printed circuit board 1 can be easily visually confirmed by forming the gap 211 and the cutout groove 24. Can do.

Embodiment 2
In the first embodiment, a structure in which a cutout groove 24 having a semicircular cross-sectional shape is formed in the side wall 203 along the depth direction of the guide groove 21 in the portion of the side wall 203 where the guide groove 21 (gap 211) is formed. However, the present invention is not limited to this, and any structure may be used as long as it is a structure for improving the visibility of the ends of the leads 11 and 12.

  FIG. 6 is a longitudinal sectional view of the surface mounting stand 20 according to the second embodiment. As shown in FIG. 6, the lead 11 of the LED lamp 10 passes through the insertion hole 23 and is bent along the guide groove 21 on the bottom surface 202 of the surface mounting stand 20. In the vicinity of the end of the lead 11, a gap 211 is formed in which the depth of the guide groove 21 is further increased and the gap with the lead 11 is further increased. Further, a notch 25 is formed in the side wall 203 in the depth direction of the guide groove 21. The depth of the notch 25 is formed in a tapered shape that decreases in depth from the bottom surface 202 toward the contact surface 201. Thereby, the state of soldering can be easily confirmed even from the upper oblique direction of the printed circuit board 1. Moreover, the cross-sectional shape of the notch 25 can be appropriately set such as a semicircular shape, a rectangular shape, a curved shape, or a V-shape.

Embodiment 3
In the first embodiment, the cutout groove 24 is provided, but a structure in which the cutout groove 24 is not provided in the side wall 203 may be employed.

  FIG. 7 is a longitudinal sectional view of the surface mounting stand 20 according to the third embodiment. As shown in FIG. 7, the lead 11 of the LED lamp 10 is bent along the guide groove 21 of the bottom surface 202 of the surface mounting stand 20 through the insertion hole 23. In the vicinity of the end of the lead 11, a gap 211 is formed in which the depth of the guide groove 21 is further increased and the gap with the lead 11 is further increased. Thereby, the state of soldering can be easily confirmed even from the lateral direction of the printed circuit board 1.

Embodiment 4
FIG. 8 is an external perspective view of the surface-mounted LED lamp according to the fourth embodiment that is surface-mounted. As shown in FIG. 8, in the fourth embodiment, the notch 26 is formed in the side wall 203 opened by the gap 211 (guide groove 21). The notch 26 has a structure in which the corner 202 of the bottom surface of the surface mounting stand 20 is cut out by a predetermined dimension. The length, width, and height of the notch 26 can be set as appropriate. Thereby, the state of soldering can be easily confirmed from the two lateral directions of the printed circuit board 1. Further, by appropriately setting the height dimension of the notch 26, it is possible to easily confirm the soldering state even from the upper oblique direction of the printed circuit board 1.

Embodiment 5
FIG. 9 is a front view of the surface-mounted LED lamp according to the fifth embodiment, and FIG. 10 is a bottom view of the surface-mounted LED lamp according to the fifth embodiment. As shown in FIGS. 9 and 10, in the fifth embodiment, a notch 27 is formed in the side wall 203 opened by the gap 211 (guide groove 21), in which the width direction of the gap 211 is widened. Thereby, the state of soldering can be easily confirmed from the wide range of the printed circuit board 1 in the lateral direction. In addition, although the cross-sectional shape of the notch part 27 is a rectangular shape, it is not limited to this, A semicircle shape, curved shape, V shape etc. can be suitably set. Further, the height dimension of the notch 27 can be made larger than the depth dimension of the gap 211.

  In the present invention, the notches for facilitating visual observation of the soldered state of the ends of the leads 11 and 12 are not limited to the notch grooves 24 and the notches 25, 26, and 27. These are merely examples, and other structures can be used.

  In the above-described embodiment, the dimensions of the surface mounting stand 20 can be appropriately set according to the shape and dimensions of the LED lamp 10. For example, if the outer diameter of the LED lamp 10 in practical use is 3 mm or 5 mm, all LED lamps can be handled as surface mount compatible parts by using a surface mount stand for 3 mm or 5 mm. it can.

  In the above-described embodiment, the surface mounting stand 20 has a rectangular parallelepiped shape, but the shape is not limited thereto, and may be a columnar shape or an elliptical shape in plan view. In addition, a plurality of LED lamps 10 can be mounted on one surface mounting stand.

  In the above-described embodiment, the contact surface 201 and the bottom surface 202 of the surface mounting stand 20 are parallel to each other. However, for example, the bottom surface 202 can be an inclined surface. Thereby, when a surface mount type LED lamp is mounted on a printed circuit board, the light distribution angle of the LED lamp with respect to the printed circuit board surface can be set to a required angle in advance. Thereby, it becomes easy to use as a light source for signal lamps, for example.

It is a front view of the surface mount type LED lamp which concerns on this invention. It is a top view of the surface mount type LED lamp which concerns on this invention. It is a bottom view of the surface mount type LED lamp which concerns on this invention. It is a longitudinal cross-sectional view of the stand for surface mounting. It is a principal part perspective view of the LED unit which concerns on this invention. FIG. 5 is a longitudinal sectional view of a surface mounting stand according to a second embodiment. 6 is a longitudinal sectional view of a surface mounting stand according to Embodiment 3. FIG. It is an external appearance perspective view of the surface mounted LED lamp of Embodiment 4 surface-mounted. FIG. 10 is a front view of a surface mount LED lamp according to a fifth embodiment. FIG. 10 is a bottom view of the surface-mounted LED lamp according to the fifth embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printed circuit board 10 LED lamp 11, 12 Lead 20 Surface mount stand 21 Guide groove 23 Insertion hole 24 Notch groove 25, 26, 27 Notch part 201 Contact surface 202 Bottom face 203 Side wall 211 Gap part

Claims (5)

A plate-like body, an insertion hole for inserting the leads of the electrical element is provided in a central portion of the plate-like member, surface-mounted electrical device by bending the lead was inserted from the surface side of the plate-like body along the rear surface In the surface mount stand
Ri a guide groove for guiding a bent the lead was Oh provided from the insertion hole near to the side wall of the plate-like body,
The guide groove is
A gap is formed in the guide wall near the side wall rather than in the vicinity of the insertion hole.
Stand for surface mounting, characterized in tare Rukoto to visible soldering state of an end portion of the lead by the gap portion. The surface mounting stand according to claim 1, further comprising a notch in a side wall opened by the guide groove. The notch is
The surface mounting stand according to claim 2 , wherein the stand is a notch groove provided in the side wall along a depth direction of the guide groove. An LED lamp having a lead and the surface mounting stand according to any one of claims 1 to 3 , wherein the lead is bent into a guide groove of the surface mounting stand. Type LED lamp. An LED unit comprising a plurality of surface-mounted LED lamps according to claim 4 mounted on a substrate surface.

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