JP7022509B2 - Light emitting device, mounting board, light emitting body - Google Patents

Light emitting device, mounting board, light emitting body Download PDF

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JP7022509B2
JP7022509B2 JP2017024736A JP2017024736A JP7022509B2 JP 7022509 B2 JP7022509 B2 JP 7022509B2 JP 2017024736 A JP2017024736 A JP 2017024736A JP 2017024736 A JP2017024736 A JP 2017024736A JP 7022509 B2 JP7022509 B2 JP 7022509B2
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light emitting
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pair
emitting body
emitting device
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JP2018133385A (en
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高史 飯野
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Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Citizen Watch Co Ltd
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Description

本発明は、発光装置、実装基板、及び発光体に関する。 The present invention relates to a light emitting device, a mounting substrate, and a light emitting body.

従来、発光部を有する発光体と、発光体を実装する実装基板とを有する発光装置が知られている。このような発光装置として、実装基板が開口を有し、その開口から発光部が露出するように、実装基板の下面に発光体の上面が接合されるものがある（例えば、特許文献１）。このように実装基板の開口から発光部が露出するような構成を採用することにより、実装基板の上面に発光体を実装する構成と比較して、発光装置全体の厚みを薄くすることが可能となる。 Conventionally, a light emitting device having a light emitting body having a light emitting unit and a mounting substrate on which the light emitting body is mounted is known. As such a light emitting device, there is one in which the upper surface of the light emitting body is bonded to the lower surface of the mounting substrate so that the mounting substrate has an opening and the light emitting portion is exposed from the opening (for example, Patent Document 1). By adopting a configuration in which the light emitting portion is exposed from the opening of the mounting board in this way, it is possible to reduce the thickness of the entire light emitting device as compared with the configuration in which the light emitting body is mounted on the upper surface of the mounting board. Become.

国際公開第２０１１／１０５４０９号International Publication No. 2011/105409

ここで、実装基板と発光体とは、半田付けを行うことにより、実装基板に設けられる一対の電極と、発光体に設けられる一対の電極とが導通するように接合される。一対の電極をそれぞれ半田付けにより接合する構成においては、半田付けにより形成される一対の半田接合部を結ぶ直線を軸として、実装基板に対して発光体が傾いた状態で実装されるおそれがある。実装基板に対して発光体が傾いた状態で実装されると、発光部から出射される光の光軸が傾いてしまう。 Here, the mounting board and the light emitting body are joined so that the pair of electrodes provided on the mounting board and the pair of electrodes provided on the light emitting body are electrically connected by soldering. In a configuration in which a pair of electrodes are joined by soldering, the light emitter may be mounted in a state of being tilted with respect to the mounting substrate with a straight line connecting the pair of solder joints formed by soldering as an axis. .. If the light emitter is mounted in a state of being tilted with respect to the mounting substrate, the optical axis of the light emitted from the light emitting portion is tilted.

本発明はかかる事情に鑑みてなされたものであり、その目的は、実装基板に対して発光体が傾いた状態で実装されることを抑制することにある。 The present invention has been made in view of such circumstances, and an object of the present invention is to prevent the light emitter from being mounted in a state of being tilted with respect to the mounting substrate.

上記課題を解決すべく本出願において開示される発明は種々の側面を有しており、それら側面の代表的なものの概要は以下の通りである。 The invention disclosed in the present application in order to solve the above problems has various aspects, and the outline of typical ones of these aspects is as follows.

（１）開口と、前記開口を挟む位置であって下面に設けられた少なくとも一対の第１電極とを有する実装基板と、発光部と、前記発光部を挟む位置であって上面に設けられた少なくとも一対の第２電極とを有する発光体と、前記開口から前記発光部が露出すると共に、前記第１電極と前記第２電極を導通するように接合する一対の半田接合部と、前記実装基板と前記発光体の間に設けられるスペーサと、を有し、前記発光部は、前記スペーサの厚み方向に突出するように設けられており、前記スペーサは、平面視において前記一対の半田接合部が対向する方向に直交すると共に前記発光部を通過する直線上に配置されており、前記スペーサは、弾性を有する樹脂から成り、前記一対の半田接合部は、前記スペーサと共に前記実装基板と前記発光体のと隙間を決めるように設けられており、前記スペーサの数は、前記半田接合部の数以下である、発光装置。 (1) A mounting substrate having an opening and at least a pair of first electrodes provided on the lower surface at a position sandwiching the opening, a light emitting portion, and a position sandwiching the light emitting portion provided on the upper surface. A light emitting body having at least a pair of second electrodes, a pair of solder joints for bonding the first electrode and the second electrode so as to be exposed from the opening, and the mounting substrate. The light emitting portion is provided so as to project in the thickness direction of the spacer, and the spacer is provided with the pair of solder joint portions in a plan view. The spacers are arranged on a straight line that is orthogonal to the opposite direction and passes through the light emitting portion, the spacer is made of an elastic resin, and the pair of solder joints are the mounting substrate and the light emitting body together with the spacer. A light emitting device that is provided so as to determine a gap between the two, and the number of the spacers is equal to or less than the number of the solder joints .

（２）（１）において、前記スペーサは、前記一対の半田接合部を結ぶ直線を介して一方側に設けられる第１スペーサと、他方側に設けられる第２スペーサとを含む、発光装置。 (2) In (1), the spacer is a light emitting device including a first spacer provided on one side via a straight line connecting the pair of solder joints and a second spacer provided on the other side .

（３）（２）において、前記第１スペーサと前記第２スペーサ平面形状は互いに異なる形状である発光装置。 (3) In (2) , the light emitting device in which the first spacer and the second spacer plane shape are different from each other.

（４）（２）又は（３）において、前記第１スペーサと前記第２スペーサとは、前記一対の半田接合部を結ぶ直線を中心として対称の位置に設けられている、発光装置。 (4) In (2) or (3) , the first spacer and the second spacer are provided at symmetrical positions about a straight line connecting the pair of solder joints .

（５）（１）～（４）のいずれかにおいて、前記実装基板と前記発光体の少なくともいずれかの平面形状は矩形であり、前記一対の半田接合部のうち一方は前記矩形の第１角部に設けられており、他方は前記第１角部の対角にある前記矩形の第２角部に設けられており、前記スペーサは、前記矩形のうち前記第１角部及び前記第２角部以外の角部に設けられている発光装置。 (5) In any of (1) to (4), the planar shape of at least one of the mounting substrate and the light emitter is rectangular, and one of the pair of solder joints is the first angle of the rectangle. The other is provided in the second corner of the rectangle on the diagonal of the first corner, and the spacer is provided in the first corner and the second corner of the rectangle. A light emitting device provided at a corner other than the part.

（６）（５）において、前記スペーサの平面形状が前記矩形の角部の形状に沿うＬ字状である発光装置。 (6) In (5), the light emitting device whose planar shape of the spacer is L-shaped along the shape of the corner portion of the rectangle .

（７）（１）において、前記スペーサが前記発光部の全周を囲むように設けられる発光装置。 (7) In (1) , the light emitting device is provided so that the spacer surrounds the entire circumference of the light emitting portion.

（８）（１）～（７）のいずれかにおいて、前記スペーサが前記発光体に固定して設けられる発光装置。 (8) In any of (1) to (7), the light emitting device provided with the spacer fixed to the light emitting body.

（９）（８）において、前記発光部は、発光素子を封止する封止樹脂部と、前記封止樹脂部を囲むダム部とを有し、前記ダム部と前記スペーサとは同じ材料からなる発光装置。 (9) In (8), the light emitting portion has a sealing resin portion for sealing the light emitting element and a dam portion surrounding the sealing resin portion, and the dam portion and the spacer are made of the same material. Light emitting device.

（１０）（１）～（７）のいずれかにおいて、前記スペーサが前記実装基板に固定して設けられる発光装置。 (10) In any one of (1) to (7), the light emitting device provided with the spacer fixed to the mounting substrate.

（１１）開口と、前記開口を挟む位置に設けられる少なくとも一対の電極と、を含む実装基板であって、前記実装基板の面のうち前記一対の電極が設けられる面と同じ面に設けられるスペーサを有し、前記スペーサは、平面視において前記一対の電極が対向する方向に直交すると共に前記開口を通過する直線上に配置されており、前記スペーサは、弾性を有する樹脂から成り、前記スペーサは、前記実装基板に実装されると共に前記スペーサの厚み方向に突出する発光部を有する発光体と、前記実装基板との隙間を決める部材の一部を構成するものであり、前記スペーサの数は、前記電極の数以下である、実装基板。 (11) A spacer provided on a mounting substrate including an opening and at least a pair of electrodes provided at positions sandwiching the opening, which is the same surface as the surface of the mounting substrate on which the pair of electrodes is provided. The spacer is arranged on a straight line passing through the opening while being orthogonal to the direction in which the pair of electrodes face each other in a plan view. The spacer is made of an elastic resin, and the spacer is It constitutes a part of a member that determines a gap between a light emitting body that is mounted on the mounting board and has a light emitting portion that protrudes in the thickness direction of the spacer and the mounting board, and the number of the spacers is determined by the number of the spacers. A mounting substrate having a number of electrodes or less .

（１２）発光部と、前記発光部を挟む位置に設けられる少なくとも一対の電極と、スペーサと、を含む発光体であって、前記発光部は、前記スペーサの厚み方向に突出するように設けられており、前記スペーサは、平面視において前記一対の電極が対向する方向に直交すると共に前記発光部を通過する直線上に配置されており、前記スペーサは、弾性を有する樹脂から成り、前記スペーサは、前記発光体と、前記発光体が実装される実装基板との隙間を決める部材の一部を構成するものであり、前記スペーサの数は、前記電極の数以下である、発光体。 (12) A light emitting body including a light emitting portion, at least a pair of electrodes provided at positions sandwiching the light emitting portion, and a spacer, and the light emitting portion is provided so as to project in the thickness direction of the spacer. The spacer is arranged on a straight line passing through the light emitting portion while being orthogonal to the direction in which the pair of electrodes face each other in a plan view. The spacer is made of an elastic resin, and the spacer is A light emitter that constitutes a part of a member that determines a gap between the light emitting body and a mounting substrate on which the light emitting body is mounted, and the number of spacers is equal to or less than the number of electrodes .

上記本発明の（１）、（８）、（１０）～（１２）の側面によれば、実装基板に対して発光体が傾いた状態で実装されることを抑制することができる。 According to the aspects (1), (8), (10) to (12) of the present invention, it is possible to prevent the light emitter from being mounted in a state of being tilted with respect to the mounting substrate.

また、上記本発明の（２）、（４）～（７）の側面によれば、実装基板に対して発光体をより安定した姿勢で実装させることができる。 Further, according to the aspects (2), (4) to (7) of the present invention, the light emitting body can be mounted on the mounting substrate in a more stable posture.

また、上記本発明の（３）の側面によれば、極性マークを設けることなく電極の極性を識別可能となる。 Further, according to the aspect of (3) of the present invention, the polarity of the electrode can be identified without providing the polarity mark.

また、上記本発明の（９）の側面によれば、製造工程の工数の削減を可能とする発光装置を提供することができる。 Further, according to the aspect (9) of the present invention, it is possible to provide a light emitting device capable of reducing the man-hours in the manufacturing process.

本実施形態において、実装基板に対して発光体が実装される前の状態を示す斜視図である。In this embodiment, it is a perspective view which shows the state before the light emitting body is mounted on the mounting board. 発光体の上面を示す平面図である。It is a top view which shows the upper surface of a light emitting body. 第２電極を通る切断線で切断した発光体の断面図である。It is sectional drawing of the light emitting body cut by the cutting line passing through the 2nd electrode. スペーサを通る切断線で切断した発光体の断面図である。It is sectional drawing of the light emitting body cut by the cutting line passing through a spacer. 第１電極及び第２電極を通る切断線で切断した発光装置の断面図である。It is sectional drawing of the light emitting device cut by the cutting line passing through the 1st electrode and the 2nd electrode. スペーサを通る切断線で切断した発光装置の断面図である。It is sectional drawing of the light emitting device cut by the cutting line passing through a spacer. 第１電極及び第２電極を通る切断線で切断した断面を示す断面図であって、実装基板に対して発光体を実装する前の状態を示す図である。It is sectional drawing which shows the cross section cut by the cutting line passing through the 1st electrode and the 2nd electrode, and is the figure which shows the state before mounting a light emitting body on a mounting substrate. スペーサを通る切断線で切断した断面を示す断面図であって、実装基板に対して発光体を実装する前の状態を示す図である。It is sectional drawing which shows the cross section cut by the cutting line passing through a spacer, and is the figure which shows the state before mounting a light emitting body on a mounting substrate. 第１電極及び第２電極を通る切断線で切断した断面を示す断面図であって、半田接合部を溶融する前の状態を示す図である。It is sectional drawing which shows the cross section cut by the cutting line passing through the 1st electrode and the 2nd electrode, and is the figure which shows the state before melting the solder joint part. スペーサを通る切断線で切断した断面を示す断面図であって、半田接合部を溶融する前の状態を示す図である。It is sectional drawing which shows the cross section cut by the cutting line passing through a spacer, and is the figure which shows the state before melting the solder joint part. 第１変形例のスペーサを有する発光体の上面を示す平面図である。It is a top view which shows the upper surface of the light emitting body which has a spacer of 1st modification. 第２変形例のスペーサを有する発光体の上面を示す平面図である。It is a top view which shows the upper surface of the light emitting body which has a spacer of 2nd modification. 第３変形例のスペーサを有する発光体の上面を示す平面図である。It is a top view which shows the upper surface of the light emitting body which has a spacer of 3rd modification. 第４変形例のスペーサを有する発光体の上面を示す平面図である。It is a top view which shows the upper surface of the light emitting body which has a spacer of 4th modification.

まず、図１～図６を参照して、本実施形態に係る発光装置１００の構成について説明する。 First, the configuration of the light emitting device 100 according to the present embodiment will be described with reference to FIGS. 1 to 6.

図１は、本実施形態において、実装基板に対して発光体が実装される前の状態を示す斜視図である。図２は、発光体の上面を示す平面図である。図３は、第２電極を通る切断線（図２のＡ－Ａ切断線）で切断した発光体の断面図である。図４は、スペーサを通る切断線（図２のＢ－Ｂ切断線）で切断した発光体の断面図である。図５は、第１電極及び第２電極を通る切断線で切断した発光装置の断面図である。図６は、スペーサを通る切断線で切断した発光装置の断面図である。 FIG. 1 is a perspective view showing a state before a light emitting body is mounted on a mounting substrate in the present embodiment. FIG. 2 is a plan view showing the upper surface of the light emitting body. FIG. 3 is a cross-sectional view of a light emitter cut along a cutting line passing through the second electrode (AA cutting line in FIG. 2). FIG. 4 is a cross-sectional view of a light emitter cut along a cutting line passing through the spacer (BB cutting line in FIG. 2). FIG. 5 is a cross-sectional view of a light emitting device cut along a cutting line passing through the first electrode and the second electrode. FIG. 6 is a cross-sectional view of a light emitting device cut along a cutting line passing through a spacer.

発光装置１００は、投光器やイルミネーションなどの各種照明機器として用いられる装置である。発光装置１００は、実装基板１０と、実装基板１０に実装される発光体２０とを有する。発光体２０は、半田接合部３０（図５参照）により実装基板１０の下面に接合される。 The light emitting device 100 is a device used as various lighting devices such as a floodlight and illuminations. The light emitting device 100 includes a mounting board 10 and a light emitting body 20 mounted on the mounting board 10. The light emitting body 20 is bonded to the lower surface of the mounting substrate 10 by a solder bonding portion 30 (see FIG. 5).

図１に示すように、実装基板１０は、平面形状が矩形の基板であり、その中央部に円形の開口１１を有する。開口１１は、実装基板１０の上面と下面を貫通するように設けられている。実装基板１０は、外形が発光体２０よりも大きい絶縁基板からなる。また、実装基板１０は、開口１１を挟む位置に設けられた一対の第１電極１２（図１の破線参照）を下面に有する。なお、図１においては平面形状が略三角形の第１電極１２を示すが、この形状に限られるものではない。 As shown in FIG. 1, the mounting substrate 10 is a substrate having a rectangular planar shape, and has a circular opening 11 at the center thereof. The openings 11 are provided so as to penetrate the upper surface and the lower surface of the mounting substrate 10. The mounting substrate 10 is made of an insulating substrate having an outer shape larger than that of the light emitter 20. Further, the mounting substrate 10 has a pair of first electrodes 12 (see the broken line in FIG. 1) provided at positions sandwiching the opening 11 on the lower surface. Although FIG. 1 shows the first electrode 12 having a substantially triangular planar shape, the shape is not limited to this.

図２に示すように、発光体２０は、平面形状が矩形であり、その中央部に発光部２１を有する。また、発光体２０は、発光部２１を挟む位置に設けられた一対の第２電極２２ａ、２２ｂを上面に有する。さらに、発光体２０は、極性マークＭを上面に有する。極性マークＭと第２電極２２ａとは一体に構成される。すなわち、極性マークＭと第２電極２２ａとは１枚の電極基板で構成されており、その電極基板は第２絶縁層２５（図５等参照）に覆われており、第２絶縁層２５に形成される開口から露出する部分が第２電極２２ａ及び極性マークＭとなっている。一方、第２電極２２ｂと、極性マークＭ及び第２電極２２ａとは互いに分離して構成される。第２電極２２ｂを構成する電極基板と、極性マークＭ及び第２電極２２ａを構成する電極基板とは同層に設けられる。なお、以下の説明において、第２電極２２ａと第２電極２２ｂとを区別して説明する必要がない場合は、単に第２電極２２ともいうこととする。 As shown in FIG. 2, the light emitting body 20 has a rectangular planar shape and has a light emitting unit 21 at the center thereof. Further, the light emitting body 20 has a pair of second electrodes 22a and 22b provided on the upper surface at positions sandwiching the light emitting portion 21. Further, the light emitter 20 has a polarity mark M on the upper surface. The polarity mark M and the second electrode 22a are integrally configured. That is, the polarity mark M and the second electrode 22a are composed of one electrode substrate, and the electrode substrate is covered with the second insulating layer 25 (see FIG. 5 and the like), and the second insulating layer 25 is covered with the second insulating layer 25. The portion exposed from the formed opening is the second electrode 22a and the polarity mark M. On the other hand, the second electrode 22b and the polarity mark M and the second electrode 22a are configured to be separated from each other. The electrode substrate constituting the second electrode 22b and the electrode substrate constituting the polarity mark M and the second electrode 22a are provided in the same layer. In the following description, when it is not necessary to distinguish between the second electrode 22a and the second electrode 22b, it is simply referred to as the second electrode 22.

図３、図４に示すように、発光体２０は、アルミ基台２３、第１絶縁層２４、第２電極２２及び極性マークＭを構成する電極基板、第２絶縁層２５がこの順で積層してなる。なお、アルミ基台２３の下面にさらに放熱用の基板等を設けてもよい。また、アルミ基台２３の代わりに、銅（Ｃｕ）等を材料とする他の金属基台を用いてもよい。 As shown in FIGS. 3 and 4, in the light emitting body 20, the aluminum base 23, the first insulating layer 24, the second electrode 22, the electrode substrate constituting the polarity mark M, and the second insulating layer 25 are laminated in this order. It will be. A substrate for heat dissipation may be further provided on the lower surface of the aluminum base 23. Further, instead of the aluminum base 23, another metal base made of copper (Cu) or the like may be used.

第２絶縁層２５は、一対の第２電極２２が露出するように一対の開口２５ａを有する。また、第２絶縁層２５は、極性マークＭが露出するように開口２５ｂを有する。極性マークＭは、第２電極２２ａがアノード又はカソードのいずれの電極であるかを識別するために設けられる識別マークである。ユーザは極性マークＭを視認することにより、図２等などで示す符号２２ａの電極がアノード（又はカソード）であることを認識することができる。なお、本実施形態においては、第２電極２２ａ、２２ｂの平面形状を略三角形とし、極性マークＭの平面形状を円形としたが、それらの形状はこれに限られるものではない。ただし、第２電極と極性マークＭの平面形状は異なる形状とすることが好ましい。 The second insulating layer 25 has a pair of openings 25a so that the pair of second electrodes 22 are exposed. Further, the second insulating layer 25 has an opening 25b so that the polarity mark M is exposed. The polarity mark M is an identification mark provided for identifying whether the second electrode 22a is an anode or a cathode electrode. By visually recognizing the polarity mark M, the user can recognize that the electrode of reference numeral 22a shown in FIG. 2 or the like is the anode (or cathode). In the present embodiment, the planar shapes of the second electrodes 22a and 22b are substantially triangular, and the planar shape of the polarity mark M is circular, but the shapes thereof are not limited to this. However, it is preferable that the second electrode and the polarity mark M have different planar shapes.

図１に示すように、発光部２１の形状は円柱状であり、発光体２０の発光体２０の上面側に突出するように設けられる。発光部２１は、発光素子（不図示）を有し、発光素子は透光性を有する封止樹脂部２１ａに封止されている。また、発光部２１は、封止樹脂部２１ａの全周を囲むように設けられるシリコン樹脂等からなるダム部２１ｂを有する。発光素子は、第２電極２２を通じて給電されることにより発光する。なお、発光素子は、発光体２０のサイズ等に応じて数個～数百個程度設けられるとよい。また、封止樹脂部２１ａには、発光素子からの光が所望の波長となるように蛍光体が含有されている。ダム部２１ｂは、封止樹脂部２１ａを成形する際に樹脂が流出するのをせき止めるために設けられる。 As shown in FIG. 1, the shape of the light emitting portion 21 is cylindrical and is provided so as to project toward the upper surface side of the light emitting body 20 of the light emitting body 20. The light emitting unit 21 has a light emitting element (not shown), and the light emitting element is sealed in a translucent sealing resin unit 21a. Further, the light emitting portion 21 has a dam portion 21b made of silicon resin or the like provided so as to surround the entire circumference of the sealing resin portion 21a. The light emitting element emits light by being fed through the second electrode 22. It is preferable that several to several hundred light emitting elements are provided depending on the size of the light emitting body 20 and the like. Further, the sealing resin portion 21a contains a phosphor so that the light from the light emitting element has a desired wavelength. The dam portion 21b is provided to prevent the resin from flowing out when the sealing resin portion 21a is molded.

図５に示すように、半田接合部３０は、実装基板１０の下面と発光体２０の上面とを、発光部２１が開口１１から露出すると共に、第１電極１２と第２電極２２とが導通するように一対設けられる。実装基板１０の開口１１から発光部２１が露出するような構成を採用することにより、実装基板の上面に発光体を実装する構成と比較して、発光装置全体の厚みを薄くすることが可能となる。 As shown in FIG. 5, in the solder joint portion 30, the lower surface of the mounting substrate 10 and the upper surface of the light emitting body 20 are exposed from the opening 11, and the first electrode 12 and the second electrode 22 are electrically connected to each other. A pair is provided so as to do so. By adopting a configuration in which the light emitting portion 21 is exposed from the opening 11 of the mounting board 10, it is possible to reduce the thickness of the entire light emitting device as compared with the configuration in which the light emitting body is mounted on the upper surface of the mounting board. Become.

本実施形態においては、一対の第１電極１２と一対の第２電極２２に対応するように、半田接合部３０を２箇所に設けた。実装基板１０と発光体２０とが２箇所に設けられる半田接合部３０のみによって互いに支持される構成においては、一対の半田接合部３０を結ぶ直線を軸として、実装基板１０に対して発光体２０が傾いた状態で実装されるおそれがある。実装基板１０に対して発光体１０が傾いた状態で実装されると、発光体２０が備える発光部２１から出射される光の光軸が傾いてしまう。 In the present embodiment, solder joints 30 are provided at two locations so as to correspond to the pair of first electrodes 12 and the pair of second electrodes 22. In a configuration in which the mounting board 10 and the light emitting body 20 are supported by only the solder joints 30 provided at two locations, the light emitting body 20 is supported with respect to the mounting board 10 with a straight line connecting the pair of solder joints 30 as an axis. May be mounted in a tilted state. If the light emitting body 10 is mounted in a state of being tilted with respect to the mounting substrate 10, the optical axis of the light emitted from the light emitting unit 21 included in the light emitting body 20 is tilted.

そこで、本実施形態においては、一対の半田接合部３０を結ぶ直線（図２のＡ－Ａ切断線と同じ直線）を中心として対称の位置に一対のスペーサＳを設けた。スペーサＳは、発光体２０の上面に固定して設けられる。一対のスペーサＳとしては、少なくともその高さが同じものを用いるとよい。また、スペーサＳの材料としては弾性を有する樹脂等を用いるとよい。 Therefore, in the present embodiment, the pair of spacers S are provided at symmetrical positions about the straight line connecting the pair of solder joints 30 (the same straight line as the AA cutting line in FIG. 2). The spacer S is fixedly provided on the upper surface of the light emitting body 20. As the pair of spacers S, those having at least the same height may be used. Further, as the material of the spacer S, an elastic resin or the like may be used.

図５に示すように、半田接合部３０により実装基板１０と発光体２０を接合した状態で、スペーサＳは、図６に示すように、実装基板１０と発光体２０の隙間を決定するように設けられる。すなわち、スペーサＳは、実装基板１０に対して発光体２０が実装された状態において、実装基板１０の下面に接するように発光体２０の上面に設けられる。 As shown in FIG. 5, in a state where the mounting substrate 10 and the light emitting body 20 are bonded by the solder joint portion 30, the spacer S determines the gap between the mounting board 10 and the light emitting body 20 as shown in FIG. It will be provided. That is, the spacer S is provided on the upper surface of the light emitting body 20 so as to be in contact with the lower surface of the mounting board 10 in a state where the light emitting body 20 is mounted on the mounting board 10.

以上のような構成を採用するため、発光体１０は実装基板２０に対して、半田接合部３０のある２点、及びスペーサＳのある２点の計４点で支持されることとなる。そのため、発光体２０は実装基板１０に対して、実装基板１０の下面と発光体２０の上面とが略平行になった状態で実装される。このように、本実施形態の発光装置１００においては、一対の半田接合部３０を結ぶ直線を軸として、実装基板１０に対して発光体２０が傾いた状態で実装されることが抑制される。そのため、発光体２０が備える発光部２１から出射される光の光軸が傾くことが抑制される。 In order to adopt the above configuration, the light emitting body 10 is supported by the mounting substrate 20 at two points having the solder joint portion 30 and two points having the spacer S, for a total of four points. Therefore, the light emitting body 20 is mounted in a state where the lower surface of the mounting board 10 and the upper surface of the light emitting body 20 are substantially parallel to the mounting board 10. As described above, in the light emitting device 100 of the present embodiment, it is suppressed that the light emitting body 20 is mounted in an inclined state with respect to the mounting substrate 10 with the straight line connecting the pair of solder joints 30 as the axis. Therefore, the optical axis of the light emitted from the light emitting unit 21 included in the light emitting body 20 is suppressed from tilting.

本実施形態においては、図２等に示すように、スペーサＳの平面形状を略Ｌ字状とした。そして、略Ｌ字状の角部が、矩形の発光体２０の角部に沿うようにスペーサＳを配置した。このような形状のスペーサＳを採用することにより、狭い領域においてもスペーサＳを配置でき、かつスペーサＳと実装基板１０との接触面を広くすることができる。そのため、小型の発光装置１００においても、実装基板１０に対して発光体２０を安定した姿勢で実装することが可能となる。 In the present embodiment, as shown in FIG. 2 and the like, the planar shape of the spacer S is substantially L-shaped. Then, the spacer S is arranged so that the substantially L-shaped corner portion follows the corner portion of the rectangular light emitter 20. By adopting the spacer S having such a shape, the spacer S can be arranged even in a narrow region, and the contact surface between the spacer S and the mounting substrate 10 can be widened. Therefore, even in the small light emitting device 100, the light emitting body 20 can be mounted on the mounting substrate 10 in a stable posture.

また、本実施形態においては、スペーサＳは、一対の半田接合部３０を結ぶ直線を中心として対称の位置に一対設けられる構成について説明したが、これに限られるものではない。例えば、図１等に示すスペーサＳを一つのみ設ける構成としてもよい。その場合、一対の半田接合部３０と１つのスペーサＳとの３点で、実装基板１０と発光体２０が支持されることとなり、スペーサＳがない場合と比較して、実装基板１０に対して発光体２０が傾いて実装されることが抑制される。また、例えば、一対の半田接合部３０を結ぶ直線を中心として対称の位置に一対設けられる構成に限らず、一対の半田接合部３０を結ぶ直線に対して少なくとも反対の位置にスペーサ３０が一対設けられる構成であってもよい。また、矩形の発光体２０の角部に設けられるものに限られるものでもなく、発光体２０と実装基板１０の間のいずれかの位置に少なくとも設けられるものであればよい。 Further, in the present embodiment, a configuration in which a pair of spacers S are provided at symmetrical positions about a straight line connecting the pair of solder joints 30 has been described, but the present invention is not limited to this. For example, only one spacer S shown in FIG. 1 or the like may be provided. In that case, the mounting substrate 10 and the light emitting body 20 are supported at three points of the pair of solder joints 30 and one spacer S, and the mounting substrate 10 is compared with the case where the spacer S is not provided. It is suppressed that the light emitting body 20 is mounted at an angle. Further, for example, the configuration is not limited to the configuration in which a pair of spacers 30 are provided at symmetrical positions about a straight line connecting the pair of solder joints 30, and a pair of spacers 30 are provided at least at positions opposite to the straight line connecting the pair of solder joints 30. It may be configured to be. Further, the present invention is not limited to the one provided at the corner of the rectangular light emitting body 20, and may be provided at least at any position between the light emitting body 20 and the mounting substrate 10.

なお、図５等に示すように、実装基板１０の下面に設けられる第１電極１２は、下面側に突出するよう設けられる構成としたが、これに限られるものではない。例えば、第２電極２２と同様に、第１電極１２を構成する電極基板を覆う絶縁層から電極基板を露出させ、露出した領域が第１電極１２となるように構成してもよい。 As shown in FIG. 5 and the like, the first electrode 12 provided on the lower surface of the mounting substrate 10 is configured to be provided so as to project toward the lower surface side, but the present invention is not limited to this. For example, similarly to the second electrode 22, the electrode substrate may be exposed from the insulating layer covering the electrode substrate constituting the first electrode 12, and the exposed region may be the first electrode 12.

次に、図５～図１０を参照して、発光装置の製造方法の概要について説明する。 Next, an outline of a method for manufacturing a light emitting device will be described with reference to FIGS. 5 to 10.

図７は、第１電極及び第２電極を通る切断線で切断した断面を示す断面図であって、実装基板に対して発光体を実装する前の状態を示す図である。図８は、スペーサを通る切断線で切断した断面を示す断面図であって、実装基板に対して発光体を実装する前の状態を示す図である。なお、図７と図８とは、図示する断面が異なるが、同じ状態にある実装基板及び発光体を示すものである。 FIG. 7 is a cross-sectional view showing a cross section cut along a cutting line passing through the first electrode and the second electrode, and is a diagram showing a state before mounting the light emitting body on the mounting substrate. FIG. 8 is a cross-sectional view showing a cross section cut along a cutting line passing through a spacer, and is a diagram showing a state before mounting a light emitting body on a mounting substrate. Note that FIGS. 7 and 8 show a mounting substrate and a light emitting body in the same state, although the cross sections shown in the drawings are different.

図９は、第１電極及び第２電極を通る切断線で切断した断面を示す断面図であって、半田接合部を溶融する前の状態を示す図である。図１０は、スペーサを通る切断線で切断した断面を示す断面図であって、半田接合部を溶融する前の状態を示す図である。なお、図９と図１０とは、図示する断面が異なるが、同じ状態にある実装基板及び発光体を示すものである。 FIG. 9 is a cross-sectional view showing a cross section cut along a cutting line passing through the first electrode and the second electrode, and is a view showing a state before melting the solder joint portion. FIG. 10 is a cross-sectional view showing a cross section cut along a cutting line passing through a spacer, and is a diagram showing a state before melting the solder joint portion. Note that FIGS. 9 and 10 show a mounting substrate and a light emitting body in the same state, although the cross sections shown in the drawings are different.

まず、中央部に円形の開口１１と、開口１１を挟む位置に設けられる一対の第１電極１２とを有する実装基板１０を用意する。そして、図７に示すように、第１電極１２の下面に半田接合部３０を形成する。 First, a mounting substrate 10 having a circular opening 11 at the center and a pair of first electrodes 12 provided at positions sandwiching the opening 11 is prepared. Then, as shown in FIG. 7, a solder joint portion 30 is formed on the lower surface of the first electrode 12.

次に、発光体２０を用意する。発光体２０は以下のような工程により形成される。まず、アルミ基台２３上に、中央部に開口を有する第１絶縁層２４を形成する。そして、第１絶縁層２４上に、第２電極２２ａ及び極性マークＭを構成する電極基板と、第２電極２２ｂを構成する電極基板を形成する。さらに、それら電極基板上に、絶縁層２５を形成する。この際、第２電極２２ａ、２２ｂ及び極性マークＭが発光体２０の上面に露出するように絶縁層２５を形成する。例えば、絶縁層２５をベタ成形した後、開口２５ａ及び開口２５ｂを形成するとよい。すなわち、第２電極２２ａ、２２ｂ及び極性マークＭが露出するように絶縁層２５を型抜きするとよい。 Next, the light emitter 20 is prepared. The illuminant 20 is formed by the following steps. First, a first insulating layer 24 having an opening in the center is formed on the aluminum base 23. Then, on the first insulating layer 24, an electrode substrate constituting the second electrode 22a and the polarity mark M and an electrode substrate constituting the second electrode 22b are formed. Further, an insulating layer 25 is formed on these electrode substrates. At this time, the insulating layer 25 is formed so that the second electrodes 22a and 22b and the polarity mark M are exposed on the upper surface of the light emitting body 20. For example, the opening 25a and the opening 25b may be formed after the insulating layer 25 is solidly molded. That is, the insulating layer 25 may be die-cut so that the second electrodes 22a and 22b and the polarity mark M are exposed.

さらに、アルミ基台２３上の中央部に１又は複数の発光素子を配置し、発光素子を囲むように円環状のダム部２１ｂを形成する。さらに、流動性を有する樹脂を、円環状のダム部２１ｂの内側に注入する。この際、ダム部２１ｂが、ダム部２１ｂよりも外側に樹脂が漏れ出してしまうことを抑制する。その後、樹脂が固化することにより、発光素子を封止する封止樹脂部２１ａが形成される。 Further, one or a plurality of light emitting elements are arranged in the central portion on the aluminum base 23, and an annular dam portion 21b is formed so as to surround the light emitting elements. Further, the fluid resin is injected into the inside of the annular dam portion 21b. At this time, the dam portion 21b suppresses the resin from leaking to the outside of the dam portion 21b. After that, the resin solidifies to form a sealing resin portion 21a that seals the light emitting element.

また、一対の第２電極２２を結ぶ直線を中心として対称の位置に一対のスペーサＳを、発光体２０の上面に固定されるように設ける。なお、スペーサＳは、ダム部２１ｂと同じ材料で形成し、ダム部２１ｂを形成する工程と同じ工程で形成してもよい。それにより、ダム部２１ｂとスペーサＳとを異なる工程で形成する場合と比較して、製造工程の工数を削減でき、製造効率が向上する。 Further, a pair of spacers S are provided at symmetrical positions about the straight line connecting the pair of second electrodes 22 so as to be fixed to the upper surface of the light emitter 20. The spacer S may be formed of the same material as the dam portion 21b and may be formed in the same step as the step of forming the dam portion 21b. As a result, the number of man-hours in the manufacturing process can be reduced and the manufacturing efficiency is improved as compared with the case where the dam portion 21b and the spacer S are formed in different processes.

次に、図７、図８に示すように、実装基板１０の開口１１から発光体２０の発光部２１が露出すると共に、第１電極１２と第２電極２２とが対向する位置にくるように、発光体２０の上方に実装基板１０を配置する。そして、図９に示すように、実装基板１０に設けられる半田接合部３０の下面が、発光体２０の第２電極２２の上面に接するように、実装基板１０を移動する。なお、この状態においては、図１０に示すように、実装基板１０の下面と、スペーサＳの上面とは離間している。 Next, as shown in FIGS. 7 and 8, the light emitting portion 21 of the light emitting body 20 is exposed from the opening 11 of the mounting substrate 10, and the first electrode 12 and the second electrode 22 are located at opposite positions. , The mounting substrate 10 is arranged above the light emitting body 20. Then, as shown in FIG. 9, the mounting substrate 10 is moved so that the lower surface of the solder joint portion 30 provided on the mounting substrate 10 is in contact with the upper surface of the second electrode 22 of the light emitter 20. In this state, as shown in FIG. 10, the lower surface of the mounting substrate 10 and the upper surface of the spacer S are separated from each other.

さらに、図９に示す状態で、半田接合部３０を加熱することにより溶融させる。半田接合部３０が溶融することにより、実装基板１０が発光体２０に近づき、図５に示す状態となる。この状態においては、図６に示すように、実装基板１０の下面とスペーサＳの上面とが接触している。その後、溶融した半田接合部３０が固まることにより、第１電極１２と第２電極２２とが導通すると共に、実装基板１０と発光体２０とが接合される。以上のような工程を経て発光装置１００の製造が完了する。 Further, in the state shown in FIG. 9, the solder joint portion 30 is melted by heating. When the solder joint portion 30 is melted, the mounting substrate 10 approaches the light emitting body 20 and is in the state shown in FIG. In this state, as shown in FIG. 6, the lower surface of the mounting substrate 10 and the upper surface of the spacer S are in contact with each other. After that, the molten solder joint portion 30 is solidified, so that the first electrode 12 and the second electrode 22 are electrically connected, and the mounting substrate 10 and the light emitting body 20 are joined. The production of the light emitting device 100 is completed through the above steps.

次に、図１１～図１４を参照して、スペーサの変形例について説明する。図１１は、第１変形例のスペーサを有する発光体の上面を示す平面図である。図１２は、第２変形例のスペーサを有する発光体の上面を示す平面図である。図１３は、第３変形例のスペーサを有する発光体の上面を示す平面図である。図１４は、第４変形例のスペーサを有する発光体の上面を示す平面図である。なお、図１～図１０で示した構成と同じ構成については同じ符号を付してその説明について省略する。 Next, a modification of the spacer will be described with reference to FIGS. 11 to 14. FIG. 11 is a plan view showing the upper surface of the light emitting body having the spacer of the first modification. FIG. 12 is a plan view showing the upper surface of the light emitting body having the spacer of the second modification. FIG. 13 is a plan view showing the upper surface of the light emitting body having the spacer of the third modification. FIG. 14 is a plan view showing the upper surface of the light emitting body having the spacer of the fourth modification. The same configurations as those shown in FIGS. 1 to 10 are designated by the same reference numerals, and the description thereof will be omitted.

図１１に示すように、第１変形例のスペーサＳａの平面形状は、図２等で示したスペーサＳと同様に略Ｌ字状である。一方で、図２等においては２つのスペーサＳが設けられる発光体２０について説明したが、図１１に示す発光体１２０においては４つのスペーサＳａを設けた。具体的には、矩形の発光体１２０の４つの角部の全てに、それら角部に沿う形状のスペーサＳａを設けた。発光体１２０においては、４つのスペーサＳａにより実装基板１０を支持することとなるため、２つのスペーサＳと２つの半田接合部３０により実装基板１０を支持する発光体２０と比較して、実装基板１０に対する発光体２０の姿勢がより安定することとなる。半田接合部３０は材料となる半田の量、溶融の程度によりその高さにバラツキがでる可能性があるのに対して、スペーサＳａの高さは揃っているためである。なお、図１１においては、スペーサＳａの大きさを図２に示すスペーサＳよりも大きくして図示したが、スペーサの大きさは図示するものに限られない。 As shown in FIG. 11, the planar shape of the spacer Sa of the first modification is substantially L-shaped like the spacer S shown in FIG. 2 and the like. On the other hand, in FIG. 2 and the like, the light emitting body 20 provided with the two spacers S has been described, but in the light emitting body 120 shown in FIG. 11, four spacers Sa are provided. Specifically, spacers Sa having a shape along the corners are provided on all four corners of the rectangular illuminant 120. In the light emitting body 120, since the mounting board 10 is supported by the four spacers Sa, the mounting board is compared with the light emitting body 20 in which the mounting board 10 is supported by the two spacers S and the two solder joints 30. The posture of the light emitter 20 with respect to 10 becomes more stable. This is because the height of the solder joint portion 30 may vary depending on the amount of solder used as a material and the degree of melting, whereas the heights of the spacers Sa are the same. In FIG. 11, the size of the spacer Sa is shown to be larger than that of the spacer S shown in FIG. 2, but the size of the spacer is not limited to that shown.

図１２に示すように、第２変形例のスペーサＳｂの平面形状は円形である。すなわち、スペーサＳｂの形状は円柱状である。発光体２２０は、一対の第２電極２２を結ぶ直線を中心として対称の位置にスペーサＳｂを一対有する。すなわち、スペーサＳｂの配置は、図２で示したスペーサＳの配置と同様である。発光体２０のサイズが小型の場合、スペーサを配置する領域を十分に確保することが難しいところ、Ｌ字状のスペーサＳ、Ｓａと比較して、平面形状が円形のスペーサＳｂの方が狭い領域に配置しやすく、発光体２２０上への配置が容易である。 As shown in FIG. 12, the planar shape of the spacer Sb of the second modification is circular. That is, the shape of the spacer Sb is cylindrical. The light emitter 220 has a pair of spacers Sb at symmetrical positions about a straight line connecting the pair of second electrodes 22. That is, the arrangement of the spacer Sb is the same as the arrangement of the spacer S shown in FIG. When the size of the light emitter 20 is small, it is difficult to secure a sufficient area for arranging the spacers. However, the spacer Sb having a circular planar shape is narrower than the L-shaped spacers S and Sa. It is easy to arrange it on the light emitter 220.

図１３においては、異なる形状のスペーサＳａ及びスペーサＳｂを有する発光体３２０を示す。このように、異なる形状のスペーサを用いることにより、図２等で示した極性マークＭを設けることなく、第２電極２２の極性を識別することが可能となる。例えば、平面形状が円形のスペーサＳｂが配置される側の電極がアノード電極であって、平面形状がＬ字状のスペーサＳａが配置される側の電極がカソード電極である等の識別が可能となる。このような構成においては、極性マークＭを形成する必要がないため、製造工程の工数を削減できるメリットがある。 FIG. 13 shows a light emitter 320 having spacers Sa and spacers Sb having different shapes. As described above, by using spacers having different shapes, it is possible to identify the polarity of the second electrode 22 without providing the polarity mark M shown in FIG. 2 or the like. For example, it is possible to identify that the electrode on the side where the spacer Sb having a circular planar shape is arranged is the anode electrode, and the electrode on the side where the spacer Sa having an L-shaped planar shape is arranged is the cathode electrode. Become. In such a configuration, since it is not necessary to form the polarity mark M, there is an advantage that the man-hours in the manufacturing process can be reduced.

図１４においては、発光部２１の全周を囲むように設けられる１つのスペーサＳｃを有する発光体４２０を示す。このような構成を採用することにより、図２等で示した４点（一対のスペーサＳ、一対の半田接合部３０）で実装基板と発光体が支持される構成よりも、さらに安定した姿勢で発光体４２０を実装基板１０に実装することができる。 FIG. 14 shows a light emitting body 420 having one spacer Sc provided so as to surround the entire circumference of the light emitting unit 21. By adopting such a configuration, the posture is more stable than the configuration in which the mounting substrate and the light emitting body are supported by the four points (a pair of spacers S and a pair of solder joints 30) shown in FIG. 2 and the like. The light emitter 420 can be mounted on the mounting board 10.

なお、本実施形態及び変形例においては、第１電極１２及び第２電極２２がそれぞれ一対設けられる構成について説明したが、これに限られるものではなく、それら電極が３以上設けられる構成でもよい。その場合においても、半田接合部３０は、２つの第１電極１２と２つの第２電極２２とをそれぞれ導通するように２つ（一対）設けられるとよい。 In the present embodiment and the modified examples, the configuration in which the first electrode 12 and the second electrode 22 are provided in pairs has been described, but the present invention is not limited to this, and a configuration in which three or more of these electrodes are provided may be used. Even in that case, it is preferable that two solder joint portions 30 are provided so as to conduct the two first electrodes 12 and the two second electrodes 22 respectively.

また、本実施形態及び変形例においては、発光体がスペーサを有する構成について説明したが、スペーサは実装基板と発光体の間に設けられるものであればよい。すなわち、発光体ではなく、実装基板の下面に固定して設けられる構成でもよい。その場合、実装基板に対して発光体を実装した際、スペーサの下面が発光体の上面に接触することとなる。 Further, in the present embodiment and the modified examples, the configuration in which the light emitting body has a spacer has been described, but the spacer may be provided between the mounting substrate and the light emitting body. That is, it may be configured to be fixedly provided on the lower surface of the mounting substrate instead of the light emitting body. In that case, when the light emitting body is mounted on the mounting substrate, the lower surface of the spacer comes into contact with the upper surface of the light emitting body.

なお、発光装置１００は、外部の電子機器に組み込まれて使用されるとよい。発光装置１００は、外部の電子機器等と第１電極１２、第２電極２２が電気的に接続されることにより駆動するが、その詳細の説明については省略する。 The light emitting device 100 may be used by being incorporated in an external electronic device. The light emitting device 100 is driven by electrically connecting the first electrode 12 and the second electrode 22 to an external electronic device or the like, but the detailed description thereof will be omitted.

以上、本発明に係る実施形態について説明したが、この実施形態に示した具体的な構成は一例として示したものであり、本発明の技術的範囲をこれに限定することは意図されていない。当業者は、これら開示された実施形態を適宜変形してもよく、本明細書にて開示される発明の技術的範囲は、そのようになされた変形をも含むものと理解すべきである。 Although the embodiment of the present invention has been described above, the specific configuration shown in this embodiment is shown as an example, and it is not intended to limit the technical scope of the present invention to this. Those skilled in the art may appropriately modify these disclosed embodiments, and it should be understood that the technical scope of the invention disclosed herein also includes such modifications.

１０ 実装基板、１１ 開口、１２ 第１電極、２０ 発光体、２１ 発光部、２１ａ 封止樹脂部、２１ｂ ダム部、２２，２２ａ，２２ｂ 第２電極、２３ アルミ基台、２４ 第１絶縁層、２５ 第２絶縁層、２５ａ 開口、２５ｂ 開口、３０ 半田接合部、１００ 発光装置、Ｓ，Ｓａ，Ｓｂ，Ｓｃ スペーサ、Ｍ 極性マーク。 10 mounting board, 11 openings, 12 first electrode, 20 light emitter, 21 light emitting part, 21a encapsulating resin part, 21b dam part, 22, 22a, 22b second electrode, 23 aluminum base, 24 first insulating layer, 25 Second insulating layer, 25a opening, 25b opening, 30 solder joint, 100 light emitting device, S, Sa, Sb, Sc spacer, M polarity mark.

Claims (12)

開口と、前記開口を挟む位置であって下面に設けられた少なくとも一対の第１電極とを有する実装基板と、
発光部と、前記発光部を挟む位置であって上面に設けられた少なくとも一対の第２電極とを有する発光体と、
前記開口から前記発光部が露出すると共に、前記第１電極と前記第２電極を導通するように接合する一対の半田接合部と、
前記実装基板と前記発光体の間に設けられるスペーサと、
を有し、
前記発光部は、前記スペーサの厚み方向に突出するように設けられており、
前記スペーサは、平面視において前記一対の半田接合部が対向する方向に直交すると共に前記発光部を通過する直線上に配置されており、
前記スペーサは、弾性を有する樹脂から成り、
前記一対の半田接合部は、前記スペーサと共に前記実装基板と前記発光体との隙間を決めるように設けられており、
前記スペーサの数は、前記半田接合部の数以下である、
発光装置。 A mounting substrate having an opening and at least a pair of first electrodes provided on the lower surface at a position sandwiching the opening.
A light emitting body having a light emitting portion and at least a pair of second electrodes provided on the upper surface at a position sandwiching the light emitting portion, and a light emitting body.
A pair of solder joints for connecting the first electrode and the second electrode so as to be conductive while the light emitting portion is exposed from the opening.
A spacer provided between the mounting board and the light emitting body,
Have,
The light emitting portion is provided so as to project in the thickness direction of the spacer.
The spacer is arranged on a straight line passing through the light emitting portion while being orthogonal to the direction in which the pair of solder joint portions face each other in a plan view .
The spacer is made of an elastic resin and is made of an elastic resin.
The pair of solder joints are provided together with the spacer so as to determine a gap between the mounting substrate and the light emitting body.
The number of spacers is less than or equal to the number of solder joints.
Light emitting device. 前記スペーサは、前記一対の半田接合部を結ぶ直線を介して一方側に設けられる第１スペーサと、他方側に設けられる第２スペーサとを含む、
請求項１に記載の発光装置。 The spacer includes a first spacer provided on one side via a straight line connecting the pair of solder joints and a second spacer provided on the other side.
The light emitting device according to claim 1. 前記第１スペーサと前記第２スペーサの平面形状は互いに異なる形状である請求項２に記載の発光装置 The light emitting device according to claim 2, wherein the first spacer and the second spacer have different planar shapes. 前記第１スペーサと前記第２スペーサとは、前記一対の半田接合部を結ぶ直線を中心として対称の位置に設けられている、
請求項２又は３に記載の発光装置。 The first spacer and the second spacer are provided at symmetrical positions about a straight line connecting the pair of solder joints.
The light emitting device according to claim 2 or 3. 前記実装基板と前記発光体の少なくともいずれかの平面形状は矩形であり、
前記一対の半田接合部のうち一方は前記矩形の第１角部に設けられており、他方は前記第１角部の対角にある前記矩形の第２角部に設けられており、
前記スペーサは、前記矩形のうち前記第１角部及び前記第２角部以外の角部に設けられている請求項１～４のいずれか１項に記載の発光装置。 The planar shape of at least one of the mounting board and the light emitting body is rectangular.
One of the pair of solder joints is provided at the first corner of the rectangle, and the other is provided at the second corner of the rectangle diagonal to the first corner.
The light emitting device according to any one of claims 1 to 4, wherein the spacer is provided in a corner portion other than the first corner portion and the second corner portion of the rectangle. 前記スペーサの平面形状が前記矩形の角部の形状に沿うＬ字状である請求項５に記載の発光装置。 The light emitting device according to claim 5, wherein the planar shape of the spacer is an L shape that follows the shape of the corner portion of the rectangle. 前記スペーサが前記発光部の全周を囲むように設けられる請求項１に記載の発光装置。 The light emitting device according to claim 1, wherein the spacer is provided so as to surround the entire circumference of the light emitting unit. 前記スペーサが前記発光体に固定して設けられる請求項１～７のいずれか１項に記載の発光装置。 The light emitting device according to any one of claims 1 to 7, wherein the spacer is fixedly provided to the light emitting body. 前記発光部は、発光素子を封止する封止樹脂部と、前記封止樹脂部を囲むダム部とを有し、
前記ダム部と前記スペーサとは同じ材料からなる請求項８に記載の発光装置。 The light emitting portion has a sealing resin portion that seals the light emitting element and a dam portion that surrounds the sealing resin portion.
The light emitting device according to claim 8, wherein the dam portion and the spacer are made of the same material. 前記スペーサが前記実装基板に固定して設けられる請求項１～７のいずれか１項に記載の発光装置。 The light emitting device according to any one of claims 1 to 7, wherein the spacer is fixedly provided on the mounting substrate. 開口と、
前記開口を挟む位置に設けられる少なくとも一対の電極と、
を含む実装基板であって、
前記実装基板の面のうち前記一対の電極が設けられる面と同じ面に設けられるスペーサを有し、
前記スペーサは、平面視において前記一対の電極が対向する方向に直交すると共に前記開口を通過する直線上に配置されており、
前記スペーサは、弾性を有する樹脂から成り、
前記スペーサは、前記実装基板に実装されると共に前記スペーサの厚み方向に突出する発光部を有する発光体と、前記実装基板との隙間を決める部材の一部を構成するものであり、
前記スペーサの数は、前記電極の数以下である、
実装基板。 With the opening
At least a pair of electrodes provided at positions sandwiching the opening,
It is a mounting board including
It has a spacer provided on the same surface as the surface of the mounting substrate on which the pair of electrodes is provided.
The spacer is arranged on a straight line passing through the opening while being orthogonal to the direction in which the pair of electrodes face each other in a plan view .
The spacer is made of an elastic resin and is made of an elastic resin.
The spacer constitutes a part of a member that determines a gap between a light emitting body that is mounted on the mounting board and has a light emitting portion that protrudes in the thickness direction of the spacer and the mounting board.
The number of spacers is less than or equal to the number of electrodes.
Mounting board. 発光部と、
前記発光部を挟む位置に設けられる少なくとも一対の電極と、
スペーサと、
を含む発光体であって、
前記発光部は、前記スペーサの厚み方向に突出するように設けられており、
前記スペーサは、平面視において前記一対の電極が対向する方向に直交すると共に前記発光部を通過する直線上に配置されており、
前記スペーサは、弾性を有する樹脂から成り、
前記スペーサは、前記発光体と、前記発光体が実装される実装基板との隙間を決める部材の一部を構成するものであり、
前記スペーサの数は、前記電極の数以下である、
発光体。 Light emitting part and
At least a pair of electrodes provided at positions sandwiching the light emitting portion,
With spacers
It is a luminous body containing
The light emitting portion is provided so as to project in the thickness direction of the spacer.
The spacer is arranged on a straight line passing through the light emitting portion while being orthogonal to the direction in which the pair of electrodes face each other in a plan view .
The spacer is made of an elastic resin and is made of an elastic resin.
The spacer constitutes a part of a member that determines a gap between the light emitting body and the mounting substrate on which the light emitting body is mounted.
The number of spacers is less than or equal to the number of electrodes.
Luminous body.
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