JP2015192062A - Light-emitting device and embossed carrier tape for housing light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device having a lens extending to the outside of a mounting board in the plan view, and inclined mounting of which can be suppressed.SOLUTION: A light-emitting device includes a light-emitting element, a substrate mounting the light-emitting element on the upper surface thereof, and a lens sealing the upper surface of the light-emitting element and the substrate. The lower surface of the substrate is exposed from the bottom surface of a lens, having an outside extension extending to the outside of the substrate, in the top view from a direction perpendicular to the upper surface of the substrate, and the outside extension of the bottom surface has a protrusion.

Description

  The present invention relates to a method for manufacturing a light emitting device, in particular, a light emitting device having a lens for sealing a light emitting element. The present invention also relates to an embossed carrier tape for housing the light emitting device.

A light-emitting device using a semiconductor chip (light-emitting element) such as a light-emitting diode is widely used because it can be easily miniaturized and has high luminous efficiency.
In such a light emitting device, for example, a lens (functions as a lens) that refracts light from a semiconductor chip in a desired direction in order to obtain a larger amount of light in a specific direction such as a direction on the upper surface side of the mounting substrate. Some have sealing portions. This type of light emitting device including a lens is used in many applications including lighting and backlighting.

A lens used in such a light emitting device is usually disposed on a mounting substrate so as to cover the light emitting element. Of the light emitted from the light emitting element, most of the light is refracted by the lens and travels in a desired direction from the upper surface of the lens.
However, when the lens is arranged in this way, most of the lower surface of the lens comes into contact with the surface of the mounting substrate. As a result, a part of the light emitted from the light emitting element, in particular, the downward light exits the lens and reaches the mounting substrate. This is because total reflection does not occur because n ₂ is larger than n _{1 with} respect to the refractive index n ₁ of the transparent material such as glass or resin forming the lens and the refractive index n ₂ of the material forming the substrate. or even towards the n ₁ is greater than n ₂ by the critical angle total internal reflection occurs because the difference is small it becomes large.

A part of the light reaching the mounting board is reflected and returns to the lens again, but a considerable part of the light reaching the mounting board is absorbed by the mounting board. The absorption by the mounting substrate can be mitigated by increasing the reflectance of the surface of the mounting substrate. However, even if such a known mitigation measure is taken, a considerable amount of light is absorbed by the mounting substrate, which causes a problem that the light extraction efficiency is lowered.
Therefore, for example, as disclosed in Patent Document 1, a light emitting device is known in which a lens (particularly, the bottom surface of a lens) extends to the outside of a substrate in a plan view. 12A is a schematic top view showing a conventional light emitting device 1000 in which the bottom surface of the lens extends to the outside of the mounting substrate in plan view, and FIG. 12B is a schematic top view of FIG. It is a schematic cross section which shows a XIb-XIb cross section. In the light emitting device 1000, the bottom surface 129 of the lens 109 extends to the outside of the mounting substrate 4 in a top view from a direction perpendicular to the mounting substrate 4 (a top view from the Z direction in FIGS. 12A and 12B). Exist.

  In the light emitting device 1000, the light emitting element 2 is mounted on the mounting substrate 4. The upper surfaces of the light emitting element 2 and the mounting substrate 4 are disposed inside the lens 109, and the lower surface of the mounting substrate 4 is exposed from the bottom surface 129 of the lens 109.

As can be seen from FIGS. 12A and 12B, a portion of the bottom surface 129 of the lens 109 that extends to the outside of the mounting substrate 4 (hereinafter referred to as an “outer extending portion”). ) Is in contact with air. The light emitting device 1000 is used by mounting the lower surface of the mounting substrate 4 on yet another substrate (secondary substrate). Then, the bottom surface 129 of the lens 109 and the upper surface of the secondary substrate are separated from each other, and the outer extending portion of the lens bottom surface 129 can come into contact with air.
Since air has a small refractive index, the difference between the refractive index n1 of the light-transmitting material such as glass or resin forming the lens 109 and the refractive index n _{air of air} is a large value, and the critical angle at which total reflection occurs is Small value. As a result, most of the light reaching the bottom surface 129 from the light-emitting element 2 is reflected, and the amount of light exiting from the bottom surface 129 can be suppressed.
Thereby, the light emitting device 1000 can obtain high extraction efficiency, particularly high extraction efficiency from the lens upper surface 128.

JP 2007-273964 A

When the light emitting device 1000 is mounted on the secondary substrate or the like as described above, the light emitting device 1000 is tilted and mounted because the lower part of the outer extending portion of the bottom surface 129 of the lens 109 is a space. There was a case.
For example, if the light emitting device 1000 is tilted before contacting the secondary substrate, the light emitting device 1000 remains tilted, that is, a part of the outer peripheral portion of the bottom surface 129 and the lower surface of the mounting substrate 4 (for example, a part of the lower surface) are secondary. In some cases, the light-emitting device 1000 is mounted (fixed) on the secondary substrate in contact with the substrate.
In addition, the light emitting device 1000 is easy even when an unintended load (force) is applied to a part of the outer peripheral portion of the lens 109 of the light emitting device 1000 after the lower surface of the mounting substrate 4 of the light emitting device 1000 contacts the secondary substrate. In some cases, the light emitting device 1000 is mounted (fixed) on the secondary substrate in a state where a part of the outer peripheral portion of the bottom surface 129 and a lower surface (for example, a part of the lower surface) of the mounting substrate 4 are in contact with the secondary substrate. there were.

As described above, when the light emitting device 1000 is mounted on the secondary substrate in an inclined state, for example, the electrical connection between the wiring pattern on the lower surface of the mounting substrate 4 and the wiring pattern disposed on the upper surface of the secondary substrate is insufficient. For some reason, there is a problem that power is not supplied to the light emitting device 1000.
Further, in analogy, even if the continuity between the mounting substrate 4 and the secondary substrate can be ensured and the light emitting device 1000 can emit light, the light emitting device 1000 is inclined, and therefore the intended direction (intended angle range). There was a problem that a sufficient amount of light could not be irradiated.

  Accordingly, an object of the present invention is to provide a light emitting device having a lens that extends to the outside of a mounting substrate in a plan view and that can be prevented from being tilted during mounting.

  A light-emitting device according to the present invention includes a light-emitting element, a substrate on which the light-emitting element is mounted, and a lens that seals the light-emitting element and the upper surface of the substrate. The bottom surface of the lens is exposed, and the bottom surface of the lens extends to the outside of the substrate in a top view from a direction perpendicular to the bottom surface of the substrate. The part has a convex part.

  The lens of the light emitting device according to the present invention seals the light emitting element and the upper surface of the mounting substrate, and has an outer extending portion that extends to the outside of the mounting substrate in a top view. By providing a convex portion on the outer extending portion of the bottom surface of the lens, the light emitting device can be prevented from tilting when the light emitting device is mounted on a secondary substrate or the like.

FIG. 1A is a schematic top view of a light-emitting device 100 according to one embodiment of the present invention, and FIG. 1B is a schematic cross-sectional view showing a Ib-Ib cross section of FIG. 2A is a schematic top view of a light emitting device 100A according to Modification 1 of the light emitting device 100, and FIG. 2B is a schematic cross sectional view showing a IIb-IIb cross section of FIG. FIG. 3A is a schematic top view of a light emitting device 100B according to Modification 2 of the light emitting device 100, and FIG. 3B is a schematic cross sectional view showing a IIIb-IIIb cross section of FIG. FIG. 4A is a schematic top view of a light emitting device 100C according to Modification 3 of the light emitting device 100, and FIG. 4B is a schematic cross sectional view showing a IVb-IVb cross section of FIG. FIG. 5 is a perspective view schematically showing a conventional embossed carrier tape 500 used to transport the light emitting device before mounting. FIG. 6 is a perspective view schematically showing an embossed carrier tape 50 according to one embodiment of the present invention. FIG. 7A is a schematic top view showing a state in which the light emitting device 100 is inserted into the housing portion 60, and FIG. 7B is a schematic cross-sectional view showing a VIIb-VIIb cross section in FIG. . FIG. 8 is a schematic top view showing a state in which the light emitting device 100 </ b> A ′ is inserted into the housing portion 60 </ b> A which is one of the modified examples of the housing portion 60. FIG. 9 is a schematic top view showing a state in which the light emitting device 100B is inserted into the housing part 60B which is one of other modified examples of the housing part 60. FIG. FIG. 10A is a schematic top view showing a state in which the light emitting device 100C is inserted into the accommodating portion 60C which is one of still another modified example of the accommodating portion 60, and FIG. It is a schematic cross section which shows the Xb-Xb cross section of a). FIG. 11 is a schematic top view showing the reason why it is preferable that one vertex of the triangle, which is the shape of the convex portion as viewed from above, is located closest to the center of the light emitting element 2, and FIG. FIG. 11B shows a case where the portion closest to the center of the light emitting element 2 is one triangular vertex of the convex portion 32, and FIG. 11B shows a triangular shape where the portion closest to the center of the light emitting element 2 is the convex portion 32D. The case is a portion other than the vertex of. 12A is a schematic top view showing a conventional light emitting device 1000 in which the bottom surface of the lens extends to the outside of the mounting substrate in plan view, and FIG. 12B is a schematic top view of FIG. It is a schematic cross section which shows a XIb-XIb cross section.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating a specific direction and position (for example, “up”, “down”, “right”, “left” and other terms including those terms) are used as necessary. These terms are used for easy understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. Parts denoted by the same reference numerals in a plurality of drawings indicate the same parts or members.
These drawings may be exaggerated in part in order to facilitate understanding of the present invention. Therefore, it should be noted that the scale, relative arrangement, and the like may differ from the actual light emitting device according to the present invention.

1. Embodiment 1
FIG. 1A is a schematic top view of a light-emitting device 100 according to one embodiment of the present invention, and FIG. 1B is a schematic cross-sectional view showing a Ib-Ib cross section of FIG. In FIG. 1A, the upper wiring pattern 8a is not shown (the same applies to FIGS. 2A, 3A, and 4A described later).
First, the entire light emitting device 100 will be described, and then the details of the convex portion 32 will be described.
The light emitting device 100 includes a mounting substrate 4, a light emitting element 2 mounted (mounted) on the mounting substrate 4, and a lens 9.
The light emitting element 2 includes a semiconductor layer, and includes a phosphor layer 6 that covers the outer surface of the semiconductor layer as necessary. The semiconductor layer includes a p-type semiconductor layer and an n-type semiconductor layer, and emits light therebetween. Further, the semiconductor layer may include an active layer (light emitting layer) between the p-type semiconductor layer and the n-type semiconductor layer as necessary.
As can be seen from FIG. 1B, the light emitting element 2, the mounting substrate 4 and the phosphor layer 6 are located below the lens 9 (in particular, below the upper surface 28 of the lens 9). In the top view of a) (the same applies to other top views), the light emitting element 2, the mounting substrate 4 and the phosphor layer 6 are shown in a state where they are transmitted through the lens 9.

A wiring pattern 8 for supplying power to the light emitting element 2 is formed on the surface and inside of the mounting substrate 4.
More specifically, two upper surface wiring patterns 8a are arranged on the upper surface (the main surface on the Z direction side in FIG. 1) of the mounting substrate 4, and one of the two upper surface wiring patterns 8a is a p-type semiconductor of the light emitting element 2. The other layer is electrically connected to the n-type semiconductor layer of the light-emitting element 2.
In the present specification, as shown in FIG. 1A and FIG. 1B, figures having the same numerals and different lower-case alphabets in parentheses after the numerals are collectively referred to as “FIG. ", Sometimes it is called by that number.
The two upper surface wiring patterns 8a can be electrically connected to wirings provided outside the light emitting device 100, for example, via a substrate through wiring 8b such as a through via and a lower surface wiring pattern 8c.
Examples of such external wiring include a wiring pattern provided on a secondary substrate (second substrate) (not shown). For example, by mounting the lower surface of the mounting substrate 4 on the upper surface of the secondary substrate, the lower surface wiring pattern 8c of the mounting substrate 4 and the wiring pattern of the secondary substrate can be electrically connected. Thereby, it becomes possible to supply electric power to the light emitting element 2 from an external power supply.

  The lens 9 has an upper surface 28 and a bottom surface 29, and from the bottom surface 29 to the inside of the lens 9, the light emitting element 2 and the upper surface of the mounting substrate 4 (in FIG. 1, two main parallel to the XY plane of the mounting substrate 4). Among the surfaces, the Z-side main surface) is embedded in the inside (that is, the light emitting element 2 and the upper surface of the mounting substrate 4 are sealed inside the lens 9). Further, from the bottom surface 29 of the lens 9, the lower surface of the mounting substrate 4 (the surface on the −Z side of two main surfaces parallel to the XY plane of the mounting substrate 4 in FIG. 1) is exposed.

In the embodiment shown in FIG. 1, the entire light emitting element 2 is sealed inside the lens 9. The entire top surface of the mounting substrate 4 is sealed inside the lens 9, and a part of each of the four side surfaces is disposed inside the lens 9. As a result, the lower surface of the mounting substrate 4 is exposed from the bottom surface 29 of the lens 9.
By having such a configuration, the light emission from the light emitting element 2 can be reliably guided to the inside of the lens 9. Further, for example, even when the lower surface of the mounting substrate 4 is placed on a mounting surface such as the upper surface of the secondary substrate (that is, when the light emitting device 100 is disposed on the upper surface of a wide substrate or the like) A portion extending to the outside of the mounting substrate 4 (hereinafter referred to as an “outer extending portion”) in a top view (a top view from a direction perpendicular to the bottom surface of the mounting substrate 4 (Z direction in FIG. 1)). Can be reliably brought into contact with air having a lower refractive index than that of the substrate material or the like.

In FIG. 1, the lens 9 extends upward from the center in the height direction (the Z direction in FIG. 1) of the side surface of the mounting substrate (substrate) 4 (a surface parallel to the XZ plane and a plane parallel to the YZ plane in FIG. 1). The bottom surface 29 is in contact with the side surface of the mounting substrate 4 at the approximate center in the height direction thereof. However, for example, when the wettability between the lens forming material before curing such as a resin before curing and the side surface of the substrate is good, the lens 9 may extend along the side surface of the mounting substrate 4 depending on the formation conditions of the lens 9. In some cases, a drooping portion 79 extending downward (in the −Z direction in FIG. 1) is formed.
Since the drooping portion 79 has a short width (length in the X direction in FIG. 1) of about 50 μm (for example, 0.2 mm or less), the presence of the drooping portion 79 may be generally ignored. In this case, even if the analogy hanging part 79 exists, the hanging part 79 is ignored, and the illustrated bottom surface 29 (extending parallel to the X direction in FIG. 1) is extended to extend the side surface of the mounting substrate 4. A portion that intersects with the mounting substrate 4 and the bottom surface 29 may be used as a boundary.

The lens 9 has a bottom surface 29 extending to the outside of the mounting substrate 4 in a top view from a direction (Z direction) perpendicular to the lower surface of the mounting substrate 4 (that is, the bottom surface 29 is formed on the mounting substrate 4). It has an “outside extension” that extends outward).
In the embodiment shown in FIG. 1, the lens 9 has a hemispherical shape. For this reason, the upper surface 28 is a spherical surface (hemispherical surface), and the bottom surface 29 is a flat surface (except for the portion where the mounting substrate 4 and the light emitting element 2 are embedded. That is, the outer extending portion is a flat surface. .)
Preferably, the mounting board 4 has a length in the horizontal direction (X direction in FIG. 1) and a length in the vertical direction (the Y direction) shorter than the outer diameter of the lens 9, so that the mounting board as shown in FIG. 4, the bottom surface 29 of the lens 9 extends to the outside of the mounting substrate 4 (that is, the outer extending portion of the bottom surface 29 of the lens 9 is formed on the entire outer periphery of the mounting substrate 4). .
However, the present invention is not limited to this. For example, one of the horizontal length and the vertical length of the mounting substrate 4 is longer than the outer diameter of the lens 9 and the other is shorter than the outer diameter of the lens 9. For example, the bottom surface 29 of the lens 9 may extend to the outside of the mounting substrate 4 in a part of the outer periphery of the mounting substrate 4.

Of the bottom surface 29 of the lens 9, the portion extending to the outside of the mounting substrate 4 (outside extending portion) comes into contact with air having a low refractive index as described above. For this reason, the critical angle of total reflection is reduced in this portion, and most of the light reaching this portion from the light emitting element 2 is reflected and travels inside the lens 9.
Thereby, high extraction efficiency can be obtained.
In addition, it is preferable that the mounting substrate 4 and the light emitting element 2 are located in the approximate center of the lens 9 in the top view. This is because light exiting from the lens 9 (in particular, the upper surface 28 of the lens 9) becomes uniform.

The lens 9 has a convex portion 32 that is convex downward (in the −Z direction in FIG. 1) on the outer extending portion of the bottom surface 29.
Details of the convex portion 32 will be described below.
By having the convex part 32 in the outer side extension part, it can suppress that the light-emitting device 100 inclines at the time of mounting.
That is, for example, when the light emitting device 100 is mounted (mounted) on a mounting surface such as the upper surface of the secondary substrate, the light emitting device 100 emits light even if the light emitting device 100 is tilted before contacting the mounting surface such as the upper surface of the secondary substrate. When the device 100 is in contact with the mounting surface, the convex portion 32 (or at least one convex portion 32 when there are a plurality of convex portions 32) is in contact with the mounting surface, thereby correcting the inclination of the light emitting device 100. Or it can be mitigated.
Further, after the light emitting device 100 comes into contact with the upper surface of the secondary substrate, for example, an unintended force for tilting the light emitting device 100 such as a downward force acting on a part of the outer peripheral portion of the upper surface 28 of the lens 9 is applied. Even if it acts, it can suppress that the light-emitting device 100 inclines because the convex part 32 (when there are several convex parts 32, at least one convex part 32) contacts the said mounting surface.

The convex portion 32 can correct, reduce, or suppress the inclination of the light emitting device 100 by contacting the mounting surface such as the upper surface of the secondary substrate (the mounting surface of the substrate on which the light emitting device 100 is mounted) in this way. As a result, it is possible to prevent the light emitting device 100 from being inclined and mounted. For this reason, the height of the convex portion 32 (the distance between the bottom surface 29 and the tip of the convex portion 32 in the Z direction in FIG. 1) is the mounting surface of the substrate on which the light emitting device 100 is mounted from the bottom surface 29 (of the secondary substrate). It is preferable that the distance is substantially equal to the distance to the upper surface or slightly shorter than the distance from the bottom surface 29 to the mounting surface of the substrate on which the light emitting device 100 is mounted (for example, 100 to 300 μm shorter).
Accordingly, when viewed as the light emitting device 100 alone, the preferred form of the height of the convex portion 32 can be exemplified by one of two forms.
1) The height of the convex portion 32 is substantially equal to the distance from the bottom surface 29 of the lens 9 to the bottom surface of the mounting substrate 4 (in the case of having the lower surface wiring pattern 8c, the surface (lower surface in FIG. 1) of the lower surface wiring pattern 8c). (For example, the difference between the height of the convex portion 32 and the distance from the bottom surface of the lens 9 to the mounting substrate 4 is within 100 μm).
2) The height of the convex portion 32 is slightly smaller than the distance from the bottom surface of the lens 9 to the bottom surface of the mounting substrate 4 (in the case of having the lower surface wiring pattern 8c, the surface of the lower surface wiring pattern 8c (the lower surface in FIG. 1)). 100-300 μm) short.

If one or more convex portions 32 are arranged, it is possible to obtain an effect of suppressing the above-described light emitting device 100 from being inclined and mounted.
However, it is preferable to arrange two or more, more preferably three or more (four in the embodiment of FIG. 1) convex portions 32. This is because the light emitting device 100 can be prevented from being inclined and mounted in more directions.

As one of preferred embodiments, the convex portion 32 is made of the same material as the lens 9 and is integral with the lens 9 (for example, without a seam visible between the bottom surface 29 of the lens 9 and the convex portion 32). To be formed.
This is because, for example, the convex portion 32 can be formed by a simple process by providing a concave portion corresponding to the convex portion 32 in the mold for forming the lens 9.

When the convex portion 32 is formed of the same material as the lens 9, the convex portion 32 emits light emitted from the light emitting element 2 (in the case where the light emitting element 2 has the phosphor layer 6, light that is wavelength-converted by the phosphor layer 6 is also included). It will have translucency.
In this case, the light emitted from the light emitting element 2 is reflected on the convex portion 32 and returned into the lens 9 for the purpose of suppressing the light entering the convex portion 32 from going out downward from the convex portion 32. A reflective member may be included. Such a reflecting member may be, for example, any light-reflective inorganic or organic material, and may have any shape such as a particle shape, a filler shape, or a film shape.
For example, after a particulate reflective material is arranged in advance in the concave portion for forming the convex portion 32 of the mold, the lens forming material is supplied to the mold, etc., so that the lens 9 is integrated with the lens 9. A reflection member can be contained in the formed convex portion 32.

The convex portion 32 may be formed on the bottom surface 29 of the lens 9 after being formed separately from the lens 9. Further, the convex portion 32 may be formed on the bottom surface 29 of the lens 9 formed in advance.
The convex portion 32 may be formed of the same material as the lens 9 or may be formed of an arbitrary material different from that of the lens 9.
Also in this case, the light emitted from the light emitting element 2 is reflected on the convex portion 32 and returned into the lens 9 for the purpose of suppressing the light that has entered the convex portion 32 from going out downward from the convex portion 32. In addition, a reflective member may be included.
The convex part 32 may contain a reflective member by adding a reflective member separately from the material which forms the convex part 32. FIG. For example, the convex part 32 may contain a reflective member by forming the convex part 32 using light reflecting resin like white resin (it makes convex part 32 itself into a reflective member).

  The convex portion 32 may have any shape including a prism (for example, a triangular prism, a quadrangular prism), a pyramid, a truncated pyramid, a cylinder, a cone and a truncated cone. That is, in the top view as shown in FIG. 1 (top view from the Z direction), the convex portion may have any shape including a polygon and a circle.

In the embodiment shown in FIG. 1, the convex portion 32 has a triangular prism shape. That is, as shown in FIG. 1A, the convex portion 32 has a triangular shape in a top view. In this case, it is preferable that one of the triangle vertices is located on the side closest to the light emitting element 2 and the portion other than the vertex (side connecting the two vertices) is located on the far side.
More specifically, in the top view, out of the triangular outer periphery that is the shape of the convex portion 32, the center of the light emitting element 2 (in FIG. 1A, the intersection of the two diagonal lines of the light emitting element on the quadrangle emits light. The portion closest to the intersection of the elements 2) is one of the three vertices (three corners) of the triangle.
FIG. 11 is a schematic top view showing the reason why it is preferable that one vertex of the triangle, which is the shape of the convex portion as viewed from above, is located closest to the center of the light emitting element 2, and FIG. FIG. 11B shows a case where the portion closest to the center of the light emitting element 2 is one triangular vertex of the convex portion 32, and FIG. 11B shows a triangular shape where the portion closest to the center of the light emitting element 2 is the convex portion 32D. The case is a portion other than the vertex of.
FIG. 11A is a view corresponding to FIG. 1A, but shows a case where a convex portion 32 larger than FIG. 1A is arranged for easy understanding.
One convex portion 32-1 of the four convex portions 32 shown in FIG. 11A and one convex portion 32D-1 of the four convex portions 32D shown in FIG. Explained as an example. The convex portion 32 and each corresponding convex portion 32D (that is, the convex portion 32-1 and the convex portion 32D-1) have different apex positions when viewed from above (the convex portion 32-1 is in the Z-axis direction). The position of the vertex is the same as that of the convex portion 32D-1).
Of the light L emitted from the center of the light emitting element 2, the light emitted in the direction within the range of the angle θ1 may enter the convex portion 32-1. On the other hand, out of the light L emitted from the center of the light emitting element 2, the light emitted in the direction within the range of the angle θ2 may enter the convex portion 32D-1. In order to obtain higher luminous efficiency, it is better that the amount of light entering the convex portions 32 and 32D is small. As is apparent from FIG. 11, θ1 is smaller than θ2. For this reason, the light-emitting device which has the convex part 32 can obtain higher luminous efficiency than the light-emitting device which has the convex part 32D.
It should be noted that the suppression of the light entering the convex portion 32 from the light emitting element 2 by such a mechanism can be applied not only to the case where the shape viewed from above is a triangle but also to a polygon including a quadrangle. That is, the convex portion 32 having a polygonal shape when viewed from the top is such that the portion of the outer periphery of the polygon that is the shape that is closest to the center of the light emitting element 2 is the vertex (corner) of the polygon. ) Is preferable.

・ Modification 1
2A is a schematic top view of a light emitting device 100A according to Modification 1 of the light emitting device 100, and FIG. 2B is a schematic cross sectional view showing a IIb-IIb cross section of FIG. In addition, about the member to which the code | symbol described in this specification and accompanying drawing was attached | subjected, like "100A" of "light-emitting device 100A", the member corresponding to the code | symbol which attached the capital letter of the alphabet after the number is About the structure which there is no notice of special, it may have the same structure as the member corresponding to the code | symbol with which the number is the same and an alphabet is not attached | subjected or a different alphabet was attached | subjected.

In the light emitting device 100A shown in FIG. 2, the convex portion 32A has a cylindrical shape. That is, as shown in FIG. 2A, the convex portion 32A has a circular shape when viewed from above.
Since the convex portion 32A having such a shape does not have a corner portion, it has an advantage that it is easy to form and release in the mold.

・ Modification 2
FIG. 3A is a schematic top view of a light emitting device 100B according to Modification 2 of the light emitting device 100, and FIG. 3B is a schematic cross sectional view showing a IIIb-IIIb cross section of FIG.
In the light emitting device 100 </ b> B shown in FIG. 3, the shape of the convex portion 32 </ b> B is a cuboid whose longitudinal direction extends in a direction parallel to the bottom surface of the lens 9.
That is, as shown in FIG. 3A, the convex portion 32 </ b> B has a rectangular shape whose long side is different from the radial direction of the lens 9 when viewed from above.
With the convex portion 32B having such a shape, in the embodiment shown in FIG. 3, the light emitting device can be used in more directions (angle range in the XZ plane) in spite of the small number of the two convex portions. It can suppress that 100B inclines and is mounted.

・ Modification 3
FIG. 4A is a schematic top view of a light emitting device 100C according to Modification 3 of the light emitting device 100, and FIG. 4B is a schematic cross sectional view showing a IVb-IVb cross section of FIG.
The bottom surface 29 </ b> C of the lens 9 </ b> C of the light emitting device 100 </ b> C has an inclined portion that is inclined with respect to a direction parallel to the upper surface of the mounting substrate 4 (X direction in FIG. 4) on the outer peripheral portion (end portion). .
In the embodiment shown in FIG. 4, the entire outer extending portion of the bottom surface 29 </ b> C is an inclined portion, but is not limited to this embodiment. For example, the side (base end side) close to the mounting substrate 4 in the outer extending portion of the bottom surface 29 </ b> C is a plane (planar portion) parallel to the upper surface of the mounting substrate 4, and the outer peripheral side (the side far from the mounting substrate 4). You may have an inclination part only in (terminal side).
In addition, although the inclined part is shown as a straight line in the cross-sectional view shown in FIG. 4, it is a curved surface (smooth curved surface) obtained by rotating this straight line around an axis parallel to the Z-axis direction in FIG.

  The inclined portion of the bottom surface 29C is located on the upper side (the Z direction in FIG. 4) on the end side (the side far from the mounting substrate 4) compared to the base end side.

When the bottom surface 29 is flat like the light emitting device 100, the light that is emitted obliquely downward from the light emitting element 2 and reaches the boundary portion between the bottom surface 29 and the top surface 28 may go out of the lens 9 as it is. However, in the lens 9C, the light emitted from the boundary between the upper surface and the bottom surface of the lens 9 hits the inclined portion and is reflected upward. Thereby, in the light emitting device 100C, the extraction efficiency can be further improved.
The other configuration of the lens 9C may be the same as that of the lens 9.

Such a lens 9 </ b> C of the light emitting device 100 </ b> C is provided with a convex portion 32 </ b> C on the outer extending portion of the bottom surface 29 </ b> C. The configuration of the convex portion 32C may have the same configuration as the convex portions 32, 32A, and 32B described above.
As described above, when the outer extending portion of the bottom surface 29C has both the flat portion and the inclined portion, the convex portion 32C may be formed only on either the flat portion or the inclined portion. You may form in both a plane part and an inclination part.

Below, the material used for the lens 9 (the lens 9C is also the same) is demonstrated.
The lens 9 may be formed of an arbitrary material having translucency with respect to the light emitted from the light emitting element 2 and the light emitted from the phosphor layer 6 (when the phosphor layer 6 is used). For example, the lens 9 is made of transparent resin or glass. Examples of such a resin include a hard silicone resin and an epoxy resin.
Examples of the lens forming material used for forming the lens 9 include a liquid resin containing a curing agent and molten glass. Moreover, as a preferable lens forming material, a silicone resin containing a curing agent and an epoxy resin containing a curing agent can be exemplified.

Below, the detail of the light emitting element 2 and the mounting substrate 4 is shown.
The light emitting element 2 is a semiconductor element such as an LED chip, for example. As a specific example of the semiconductor layer included in the light-emitting element 2, there can be given a configuration in which an n-type semiconductor layer, an active layer (light-emitting layer), and a p-type semiconductor layer are stacked in this order from the substrate side such as sapphire. As the semiconductor to be used, for example, a GaN compound semiconductor which is a nitride semiconductor can be exemplified.
Note that the light-emitting element 2 is not limited to these configurations, and may be configured using other semiconductor materials, and may include a protective layer, a reflective layer, and the like as appropriate.

Also, when the light emitting element 2 has a phosphor layer 6, as a phosphor used in the phosphor layer 6, to yellow light, it activated YAG-based with cerium, LAG-based _{phosphor, (Sr, Ba) 2 SiO} 4: Examples thereof include silicate phosphors such as Eu and combinations thereof.
Further, the phosphor is not limited to the yellow phosphor, and a phosphor having a desired emission spectrum may be used. For example, nitride, oxynitride phosphors (CASN, SCASN, α sialon, β sialon), halogen phosphors (chlorosilicate, KSF), sulfide phosphors, etc. Alternatively, the phosphor may be used. Moreover, you may use a quantum dot.

For the mounting substrate 4, for example, ceramics such as aluminum nitride and alumina, and resin can be used.
As the metal film used for the upper surface wiring pattern 8a and the lower surface wiring pattern 8c, the mounting substrate 4 is preferably made of a material having good conductivity and high reflectance of light having a wavelength emitted from the light emitting element 2. For example, a wiring layer is formed using Ti / Pt / Au or the like in order to ensure conductivity, and a single layer film or a multilayer film further including Ag, Al, Rh, etc. on the surface layer in order to improve reflectivity May be provided.
Further, the through wiring 8b of the mounting substrate 4 may be a via formed by, for example, copper plating.
The light emitting element 2 may be mounted (mounted) on the mounting substrate 4 by a known method such as flip chip mounting.

The light-emitting device 100 described above (the same applies to the light-emitting devices 100A, 100B, and 100C) is an arbitrary method known as a method for manufacturing the conventional light-emitting device 1000, including a manufacturing method disclosed in Patent Document 1, for example. Can be used. More specifically, the lens 9 having the convex portion 32 can be obtained by providing a mold used for forming a conventional lens with a concave portion (cavity) corresponding to the convex portion 32.
Further, the inclined portion of the bottom surface 29C of the lens 9C of the light emitting device 100C may be formed, for example, by providing a convex portion corresponding to the inclined portion on a mold that forms the lens 9C.

2. Embodiment 2
As Embodiment 2, the light emitting devices 100, 100A, 100B, and 100C according to the present invention (hereinafter, the “light emitting devices 100, 100A, 100B, and 100C” may be collectively referred to as “light emitting device 100 and the like” in some cases) are transported. The embossed carrier tape to be transported will be described.
FIG. 5 is a perspective view schematically showing a conventional embossed carrier tape 500 used to transport the light emitting device before mounting.
The light emitting device is housed and transported in a housing portion 560 which is a recess having a predetermined shape provided on a tape (base) 52 made of resin or the like by embossing or the like. Then, for example, using the positioning hole 54 provided in the tape 52, the light emitting device is taken out from the accommodating portion 560 disposed at a predetermined position of the automatic mounting line by an automatic insertion machine or the like, and the light emitting device is removed from the predetermined portion of the secondary substrate. The light emitting device is mounted (fixed) on the secondary substrate by being disposed at the position.

In many cases, the conventional housing portion 560 has a square shape or a rectangular shape (outer shape) in a top view (a top view from the Z direction in FIG. 5), and a bottom surface 566 (XY plane in FIG. 5). Is a plane.
Many light-emitting devices that do not have a lens having an outer extending portion such as the lens 9 are generally square or rectangular because their top-view shape is determined by the shape of the light-emitting element and the mounting substrate.
On the other hand, as can be seen from FIG. 1 and the like, the shape of the light emitting device according to the present invention as viewed from above is circular.

When such a light emitting device 100 having a circular shape when viewed from the top is transported using the conventional embossed carrier tape 500, the light emitting device 100 is rotated (Z direction in FIG. 6) due to vibration caused by the transport. Rotate around an axis parallel to the axis.
That is, if the light emitting device has a square or rectangular shape when viewed from above, the side surface of the housing portion 560 whose shape when viewed from the top is square or rectangular and the side surface of the light emitting device are in contact with each other over a relatively large area. Rotation can be prevented. On the other hand, the light emitting device 100 or the like having a circular shape when viewed from the top has a small contact area with the side surface of the housing portion 560 and cannot prevent the light emitting device 100 or the like from rotating.

  If the light emitting device 100 or the like is rotated, the lower surface wiring pattern 8c is also rotated accordingly. As a result, when the rotated light emitting device 100 or the like is taken out of the embossed carrier tape 500 by using, for example, an automatic insertion device or the like and mounted on the secondary substrate, the lower surface wiring pattern 8c and the upper surface of the secondary substrate are mounted. The provided wiring pattern is not connected at a predetermined position. As a result, the light emitting device 100 or the like cannot be made conductive.

However, by using the embossed carrier tape 50 according to the present invention, the rotation of the light emitting device 100 or the like being conveyed can be suppressed.
FIG. 6 is a perspective view schematically showing an embossed carrier tape 50 according to one embodiment of the present invention. FIG. 7A is a schematic top view showing a state in which the light emitting device 100 is inserted into the housing portion 60, and FIG. 7B is a schematic cross-sectional view showing a VIIb-VIIb cross section in FIG. .
In FIG. 7A, only the lens 9, the convex portion 32, and the substrate 4 of the light emitting device 100 are shown by dotted lines for easy understanding.

The embossed carrier tape 50 is an accommodation of a recess having a predetermined shape (a recess having a convex shape in the lower surface direction of the tape 52 (the −Z direction in FIG. 6)) provided on a tape (base) 52 made of resin or the like by embossing or the like. Part 60. The shape of the accommodation unit 60 viewed from above may be, for example, a square or a rectangle, or may be a circle.
The bottom surface of the housing part 60 has a first recess 64 that houses at least a part of the mounting substrate 4 and a second recess 62 that houses at least a part of the convex part.
The embossed carrier tape 50 may have a positioning hole 54 in a portion where the accommodating portion 60 of the tape 52 is not formed.

In the embodiment shown in FIG. 7, the lower portion of the mounting substrate 4 is accommodated in the first concave portion 64, and the respective lower portions of all the four convex portions 32 are accommodated in any of the four second concave portions 62. Thereby, rotation of the light emitting device 100 (rotation around an axis parallel to the Z direction in FIG. 7) can be suppressed.
In the embodiment shown in FIG. 7, the shape of the second recess 62 as viewed from the top is a circle, which is different from the shape of the protrusion 32 as viewed from above. The shape of the second recess 62 viewed from above may have any shape, and may be the same as or different from the shape of the protrusion 32 viewed from above.

FIG. 8 is a schematic top view showing a state in which the light emitting device 100A ′ is inserted into the housing part 60A which is one of the modifications of the housing part 60. FIG.
The light emitting device 100A ′ has the same configuration as the light emitting device 100A except that the light emitting device 100A ′ has only two convex portions 32A as shown in FIG. In FIG. 9, only the lens 9, the convex portion 32 </ b> A, and the substrate 4 are indicated by dotted lines in the light emitting device 100 </ b> A ′ for easy understanding.

  In the embodiment shown in FIG. 8, the second recess 62A is provided at a corner portion of the bottom surface 66A of the housing portion 60A. Further, in the top view, the area of the second recess 62A is considerably larger than the area of the protrusion 32A (for example, 5 times or more, preferably 10 times or more). When the second concave portion 62A having such a large area is provided, many types of light emitting devices having different shapes or positions where the convex portions 32 are provided are accommodated by the single embossed carrier tape 50 (accommodated in the accommodating portion 60A). ), And can be transported while suppressing the rotation of the light emitting device.

FIG. 9 is a schematic top view showing a state in which the light emitting device 100B is inserted into the housing part 60B which is one of other modified examples of the housing part 60. FIG.
In FIG. 9, only the lens 9, the convex portion 32 </ b> B, and the substrate 4 are shown by dotted lines in the light emitting device 100 </ b> B for easy understanding.
The second concave portion 62B of the bottom surface 66C of the accommodating portion 60B has a rectangular shape (a rectangle corresponding to the convex portion 32B) when viewed from above so that at least a part of the convex portion 32B can be accommodated.

FIG. 10A is a schematic top view showing a state in which the light emitting device 100C is inserted into the accommodating portion 60C which is one of still another modified example of the accommodating portion 60, and FIG. It is a schematic cross section which shows the Xb-Xb cross section of a).
In FIG. 10A, only the lens 9C, the convex portion 32C, and the substrate 4 of the light emitting device 100C are shown by dotted lines for easy understanding.
The bottom surface of the accommodating portion 60C is an inclined portion corresponding to the inclined portion of the bottom surface 29C of the lens 9C of the light emitting device 100C (an inclined portion inclined with respect to a portion of the main surface of the tape 52 where the accommodating portion 60C is not formed). You may have.
In the embodiment shown in FIG. 10B, the second recess 62C is provided on the inclined bottom surface 60C.

2 Light emitting element 4 Mounting substrate 6 Phosphor layer 8 Wiring 8a Upper surface wiring pattern 8b Substrate through wiring 8c Lower surface wiring pattern 9, 9C Lens 28, 28C Lens upper surface 29, 29C Lens bottom surface 32, 32A, 32B, 32C, 32D Protrusion 50 Embossed carrier tape 52 Tape (base)
54 Positioning hole 60 Housing part 64 1st recessed part 62, 62A, 62B, 62C 2nd recessed part 66, 66A, 66B, 66C Bottom surface 79 of housing part Hanging part 100, 100A, 100B, 100C Light-emitting device 500 Conventional embossed carrier tape 1000 Conventional light emitting device

Claims (10)

A light emitting element;
A substrate on which the light emitting element is mounted;
Including a lens that seals the upper surface of the light emitting element and the substrate,
The lower surface of the substrate is exposed from the bottom surface of the lens;
An outer extending portion in which a bottom surface of the lens extends to the outside of the substrate in a top view from a direction perpendicular to the upper surface of the substrate;
A light emitting device having a convex portion in the outer extending portion of the bottom surface.   The light emitting device according to claim 1, wherein the light emitting device has two or more of the convex portions.   The light emitting device according to claim 1, wherein a shape of the convex portion as viewed from above is a circle or a polygon.   The shape of the convex portion as viewed from above is a triangle, and when viewed from above, the portion of the outer periphery of the triangle that is closest to the center of the light emitting element is one of three vertices. The light emitting device according to claim 3.   The light emitting device according to claim 3, wherein a shape of the convex portion as viewed from above is a rectangle.   The light-emitting device according to claim 1, wherein the convex portion is made of the same material as that of the lens.   The light emitting device according to claim 1, wherein the convex portion includes a reflecting member that reflects light of the light emitting element.   The light emitting device according to claim 1, wherein a height of the convex portion is substantially equal to a distance from a bottom surface of the lens to a bottom surface of the substrate.   9. The lens according to claim 1, wherein the lens has an inclined portion that is inclined with respect to a direction parallel to the upper surface of the substrate at an outer peripheral portion of the bottom surface. 10. Light emitting device. An embossed carrier tape for transporting the light emitting device according to any one of claims 1 to 9,
On the bottom for housing the light emitting device,
A first recess for receiving at least a portion of the substrate;
A second recess for accommodating at least a portion of the protrusion;
An embossed carrier tape comprising:

Images