CN108601203A - A kind of PCB and PCBA - Google Patents
A kind of PCB and PCBA Download PDFInfo
- Publication number
- CN108601203A CN108601203A CN201810386091.5A CN201810386091A CN108601203A CN 108601203 A CN108601203 A CN 108601203A CN 201810386091 A CN201810386091 A CN 201810386091A CN 108601203 A CN108601203 A CN 108601203A
- Authority
- CN
- China
- Prior art keywords
- groove
- layers
- substrate
- solder cream
- conducting medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The present invention relates to PCB construction technical fields, disclose a kind of PCB and PCBA, which includes substrate, is provided with non-metallic groove；Conducting medium is set between two layers of layers of copper inside substrate, and the part cell wall of groove lower part is conducting medium, and solder cream is provided in groove；The PCBA includes component and above-mentioned PCB, and component is welded by solder cream and conducting medium to be set in groove, and solder cream is not higher than the base material at groove notch.The present invention by being arranged conducting medium in a substrate, realize conducting between substrate internal wiring figure, when the slot bottom of groove is conductive bond piece, welding carrier is provided for solder cream, ensure the adhesive property of solder cream, and then ensure the installation stability of component, while realizing conducting for component and substrate internal wiring figure；It is too fast and be easy to be spilled over to substrate surface layer along metallization cell wall climbing speed that non-metallic recess sidewall avoids solder cream, and caused short circuit phenomenon be connected to the line pattern on surface layer.
Description
Technical field
The present invention relates to PCB construction technical field more particularly to a kind of PCB and PCBA.
Background technology
Printed circuit board (Printed circuit board, abbreviation PCB) is the offer of electronic component electrical connection
Person.Before printed circuit board appearance, the interconnection between electronic component is all to be directly connected to by electric wire and form complete line
Road.In the present age, circuit board is intended only as effective experimental tool and exists, and printed circuit board has accounted in the electronics industry
According to the status of empery.
With the development of electronics techniques, to save space, the component on pcb board be developed to by surface-mount type it is embedded
Attachment.For the embedded attachment of certain components, it is desirable that separated (the different nets of certain two layers of line pattern of pasting area
Network), and certain two layers line pattern is connected (consolidated network).Normal practice is (to require the first and second sandwich circuit figure disconnected
Open, for the connection of second and third sandwich circuit figure, as shown in Figure 1-Figure 3) one metallization of making is recessed on the substrate 1 ' of PCB
Slot holds component, is realized and is connected to by the cell wall of metallization between second and third sandwich circuit figure, the first and second sandwich circuit figure
Pad is etched by surface layer and realizes disconnection to the copper between cell wall, referring to Fig. 1.Usually, there are following drawbacks for such structure：
Deep-controlled due to metallized groove has certain tolerance, and the distance of pad to groove sidewall is usually relatively close, and in fixed member
During device 5 ', the bad control of dosage of tin cream 4 ', the amount of tin cream 4 ' is few, can lead to 5 ' bottom failure welding of component, go out
Existing rosin joint and cavitation；The amount of tin cream 4 ' is more, referring to Fig. 2 and Fig. 3, extra tin cream 4 ' can be caused fast along the cell wall of metallization
Speed, which is climbed, to be spilled over to 1 ' surface layer of substrate and is contacted with the line pattern of non-consolidated network, and short circuit is caused.
Therefore, it is necessary to propose a kind of to prevent the PCB construction of solder shorts from solving the above problems.
Invention content
The purpose of the present invention is to provide a kind of PCB and PCBA, it can effectively solve the problem that existing PCB construction is easy to happen welding
The problem of short circuit phenomenon.
For this purpose, the present invention uses following technical scheme：
A kind of PCB, including：
Substrate is provided with non-metallic groove；
Conducting medium is set between two layers of layers of copper inside the substrate, the part cell wall of the lower part of the groove
For the conducting medium, solder cream is provided in the groove.
When the setting of non-metallic groove avoids mounting related components in metallized groove in the prior art, solder cream is along gold
Categoryization cell wall climbing speed is too fast and is easy to be spilled over to substrate surface layer, short circuit phenomenon caused by being connected to the line pattern on surface layer；
Between two layers of layers of copper that conducting medium is arranged inside substrate, therefore conducting medium conducts the line pattern of two layers of layers of copper.
Preferably, the slot bottom of the groove is the conducting medium.
The slot bottom of non-metallic groove is set as conducting medium, it is ensured that the component and above-mentioned two being arranged in groove
The line pattern realization of layer layers of copper conducts.
Preferably, the slot bottom of the groove is the layers of copper far from the groove notch among two layers of layers of copper.
Since conducting medium conducts the line pattern of two layers of layers of copper, which can equally ensure to set
The component and the line pattern realization of above-mentioned two layers of layers of copper set in groove conduct.
Preferably, subregion of the conducting medium between two layers of layers of copper.
Conducting medium is set as two layers of bronze medal as the conducting medium between substrate internal wiring figure, by its overlay area
Regional area between layer, on the one hand, the material materials for saving conducting medium reduce the production cost；On the other hand, according to
It is actually needed in the line pattern of two layers of layers of copper between only having part line pattern and needs to conduct, therefore conducting medium is arranged in portion
Subregion.
Preferably, the solder cream is tin cream.
The selection of solder cream needs to take into account electric conductivity and cohesive stability simultaneously, and tin cream meets these requirements, and due to
The fusing point of tin cream is higher, about 150 DEG C -220 DEG C, and this temperature, therefore tin cream conduct is not achieved in the heating temperature of component
The problems such as solder cream is not in melting in use.
Preferably, the conducting medium is conductive bond piece.
Conductive bond piece is sheet monolithic construction, has excellent electric conductivity and caking property, on the one hand, when the slot of groove
When bottom is conductive bond piece, conductive bond piece provides welding carrier for setting solder cream in groove, realizes that the bonding of solder cream is solid
It is set for using, and then realizes the firm bonding of component；On the other hand, conductive bond piece is arranged between layers of copper realizes in substrate
The conducting of portion's line pattern is buried conductive viscous in the pcb for the conventional processing technology for opening up groove and metallization
The technique of sheeting have handling ease, technological process is simple, the process-cycle is short, save processing materials cost and relevant device etc. it is excellent
Gesture；The third aspect, since conductive bond piece itself has certain viscosity, with the copper-plated side of recess sidewall in the prior art
Formula is compared, and the solder cream dosage in welding component can be reduced suitably, is easy to be spilled over to further reduced solder cream
Substrate surface layer is connected to the risk for leading to short circuit with surface line figure.
Preferably, two layers of layers of copper is the second layers of copper and third layers of copper of the substrate.
Existing PCB majorities on the market are that the second layers of copper line pattern and third layers of copper line pattern is needed to realize conductance
It is logical, therefore the structure setting has more practicability.
A kind of PCBA, including component and above-described PCB, the component pass through the solder cream and the conduction
Medium welding is to be set in the groove, and the solder cream is not higher than the base material at the groove notch.
Preferably, the surface line figure electrical communication of the component and the substrate.
Compared with prior art, advantages of the present invention and advantageous effect are：
1) by the way that conducting medium is arranged in a substrate, conducting between substrate internal wiring figure is realized, groove is worked as
Slot bottom when being conductive bond piece, provide welding carrier for solder cream, ensure the adhesive property of solder cream, and then guarantee component
Installation stability, while realizing conducting for component and substrate internal wiring figure；Non-metallic recess sidewall is kept away
It is too fast and be easy to be spilled over to substrate surface layer along metallization cell wall climbing speed solder cream in the prior art is exempted from, the circuit with surface layer
Short circuit phenomenon caused by figure connection.
2) it is sheet monoblock type knot that the conducting medium in PCB provided by the invention, which selects conductive bond piece, conductive bond piece,
There is structure excellent electric conductivity and caking property, one side to provide welding carrier for setting solder cream, realize the bonding of solder cream
Fixed function, and then realize the firm bonding of component；On the other hand, conductive bond piece is arranged between layers of copper realizes substrate
The conducting of the line pattern of internal copper layer is buried in the pcb for the conventional processing technology for opening up groove and metallization
If the technique of conductive bond piece has, handling ease, technological process is simple, the process-cycle is short, saves processing materials cost and correlation
The advantages such as equipment；The third aspect, since conductive bond piece itself has certain viscosity, with recess sidewall in the prior art
Copper-plated mode is compared, and the solder cream dosage in welding component can be reduced suitably, is held to further reduced solder cream
Easily it is spilled over to the risk that short circuit occurs for substrate surface layer.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram for PCBA that the prior art provides；
Fig. 2 is the schematic diagram that short circuit occurs for a kind of PCBA that the prior art provides；
Fig. 3 is the vertical view of Fig. 2；
Fig. 4 is the structural schematic diagram for the PCBA that the embodiment of the present invention one provides；
Fig. 5 is the structural schematic diagram when PCBA solder cream amounts of the offer of the embodiment of the present invention one are few；
Fig. 6 is the structural schematic diagram when PCBA solder cream amounts of the offer of the embodiment of the present invention one are more；
Fig. 7 is the structural schematic diagram of PCBA provided by Embodiment 2 of the present invention；
Fig. 8 is structural schematic diagram when PCBA solder creams amount provided by Embodiment 2 of the present invention is few；
Fig. 9 is structural schematic diagram when PCBA solder creams amount provided by Embodiment 2 of the present invention is more.
In figure：
1 '-substrate；4 '-tin creams；5 '-components；
1- substrates；2- grooves；3- conducting mediums；4- solder creams；5- components.
Specific implementation mode
The technical solution further illustrated the present invention below in conjunction with the accompanying drawings with embodiment.It is understood that this place
The specific embodiment of description is used only for explaining the present invention rather than limitation of the invention.It also should be noted that in order to
Convenient for description, in attached drawing, only the parts related to the present invention are shown and it is not all.
Embodiment one
The present embodiment provides a kind of PCB, which is pressed by three core plates, but quantitatively without being limited thereto, such as also
Can be that multiple core plates such as two or four press.PCB provided in this embodiment includes substrate 1, is provided on substrate 1 non-
The groove 2 of metallization is provided with conducting medium 3, the part of the lower part of groove 2 between the second layers of copper and third layers of copper of substrate 1
Cell wall is the conducting medium 3, and solder cream 4 is provided in groove 2.The above structure make the second layers of copper line pattern of substrate 1 with
Third layers of copper line pattern is conducted by the realization of conducting medium 3；Groove 2 is non-metallic groove, and solder cream 4 is non-metallic
Cell wall on climb difficulty, therefore under normal operation, the dosage of solder cream 4 is appropriate, is difficult the surface layer for being spilled over to substrate 1,
And then avoid the line pattern on surface layer and the line pattern generation short circuit phenomenon inside substrate 1.
The present embodiment also provides a kind of PCBA (Printed Circuit Board+Assembly), as shown in Figure 4-Figure 6,
The PCBA includes PCB and component 5 provided in this embodiment, component 5 by above-mentioned solder cream 4 and conducting medium 3 weld with
It is set in groove 2, solder cream 4 is not higher than the base material at 2 notch of groove, the top of component 5 and the surface line figure of substrate 1
Shape electrical communication.Component is conducted by solder cream 4 and conducting medium 3, so with the second layers of copper line pattern of substrate 1 and
Third layers of copper line pattern conducts.It should be noted that PCBA is the letter of Printed Circuit Board+Assembly
Claim, i.e., PCB hollow plates pass through SMT piece uploadings, using the entire processing procedure of DIP plug-in units, abbreviation PCBA.
Further, subregion of the conducting medium 3 between the second layers of copper and third layers of copper, the slot bottom of groove 2
Conducting medium 3 between the second layers of copper and third layers of copper.
Conducting medium 3 is as the conducting medium between the line pattern of 1 internal copper layer of substrate, and overlay area is according to reality
Border needs to be configured, and specifically, 1 inside of substrate needs to conduct between only having part line pattern, therefore in line map
Shape needs that conducting medium 3 is arranged between the part layers of copper conducted, and prepreg is still arranged in other parts that need not be conducted.
Therefore the regional area between the second layers of copper and third layers of copper, a side is arranged in the overlay area of conducting medium 3 in the present embodiment
Face is on the other hand to save the material materials of conducting medium 3 according to the setting for needing to carry out that is actually turned on of line pattern,
It reduces the production cost.The conducting medium slot bottom of non-metallic groove 2 set between the second layers of copper and third layers of copper
3, since conducting medium 3 conducts the part line pattern between 1 the second layers of copper of inside of PCB substrate and third layers of copper, because
This makes the component being arranged in groove 25 also be conducted with the line pattern realization inside aforesaid substrate 1.
The selection of solder cream 4 needs while taking into account electric conductivity and bonds stability, and the solder cream 4 in the present embodiment is preferably
Tin cream, but not limited to this.Since the fusing point of tin cream is higher, about 150 DEG C -220 DEG C, and the heating temperature of component 5 is not up to
To this temperature, therefore the problems such as tin cream as solder cream 4 is not in melting in use.
Conducting medium 3 in the present embodiment is preferably conductive bond piece, but not limited to this.Conductive bond piece is that sheet is whole
Body formula structure, with excellent electric conductivity and caking property, on the one hand, can when the slot bottom of groove 2 is conductive bond piece
Good welding carrier is provided for setting solder cream 4 in groove 2, that preferably realizes solder cream 4 is adhesively fixed effect, Jin Ershi
The firm bonding of existing component 5；On the other hand, compared to the conventional processing for opening up groove 2 in PCB substrate 1 and metallize
For technique, the mode of the embedded conductive bond piece in the present embodiment can disposably be completed at the same time pressing and the substrate of substrate 1
1 internal wiring figure conducts, have handling ease, technological process is simple, the process-cycle is short, save processing materials cost and
The advantages such as relevant device；The third aspect, since conductive bond piece itself has certain viscosity, with prior art further groove
The copper-plated mode of 2 side walls is compared, and 4 dosage of solder cream in welding component 5 can be reduced suitably, to further reduced weldering
Material cream 4 is easy to be spilled over to 1 surface layer of substrate, and the risk for leading to short circuit is connected to surface line figure.
As shown in figure 5, the structural schematic diagram for 4 dosage of solder cream when less, the at this time non-metallic side wall offer of groove 2
The minimal amount of solder cream 4 of enough spaces, the minimal amount of solder cream 4 are in fixed component 5 due to extruding force
Act on the excess solder cream 4 squeezed out.
As shown in fig. 6, the structural schematic diagram for 4 dosage of solder cream when more, for normal operating, solder cream 4 is at most only
Sidewall spaces can be filled up, and be unlikely to be spilled over to 1 surface layer of substrate and be connect with surface line figure, lead to short circuit, this also with non-gold
The cell wall of categoryization is related, solder cream 4 climb on non-metallic cell wall it is relatively difficult, therefore be also greatly lowered short circuit
Risk.
It should be noted that the dosage of solder cream 4 is to guarantee to cement component 5 for baseline, therefore in normal operating
Under, the dosage of solder cream 4 normally only can fill part sidewall spaces.
Embodiment two
The present embodiment provides a kind of PCB and PCBA, which is pressed by three core plates, but quantitatively without being limited thereto,
Such as can also be that multiple core plates such as two or four press.For simplicity, embodiment two and embodiment one are only described
Distinctive points.Difference place is：
Referring to Fig. 7-Fig. 9, the slot bottom of groove 2 is third layers of copper.
Setting the slot bottom of non-metallic groove 2 to third layers of copper so that groove 2 is in direct contact with third layers of copper, and by
The part line pattern between 1 the second layers of copper of inside of PCB substrate and third layers of copper is conducted in conducting medium 3, therefore should
It is arranged so that the component 5 being arranged in groove 2 is also conducted with the line pattern realization inside aforesaid substrate 1.
Fig. 8 and Fig. 9 respectively illustrate 4 dosage of solder cream it is less and more when structural schematic diagram, due in the PCB construction
In, the slot bottom of groove 2 is third layers of copper, i.e., under equal conditions, 2 depth of groove in the present embodiment is deeper, for same
4 dosage of solder cream, extra solder cream 4 is more difficult to climb to rise and is spilled over to 1 surface layer of substrate and is connect with surface line figure,
Lead to short circuit, that is to say, that PCB substrate 1 provided in this embodiment have more preferably prevent short-circuit advantage.
The manufacturing process of the PCBA provided below above example one and embodiment two is illustrated：
First, substrate 1, wherein conducting medium 3 is made in the pressing of core plate, prepreg and 3 high temperature and pressure of conducting medium
The regional area conducted is needed between the second layers of copper and third layers of copper.
Then, groove 2, the position for opening up position and default mounting related components 5 of groove 2 are milled out by milling machine on substrate 1
It sets corresponding.2 bottom of groove could be provided as conductive bond piece, may be set to be third layers of copper.
Finally, solder cream 4 is laid in groove 2, and component 5 is welded on by solder cream 4 in groove 2, is made
PCBA。
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating examples made by the present invention, and it is pair to be not
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
All any modification, equivalent and improvement etc., should be included in the claims in the present invention made by within the spirit and principle of invention
Protection domain within.
Claims (9)
1. a kind of PCB, which is characterized in that including：
Substrate is provided with non-metallic groove；
Conducting medium is set between two layers of layers of copper inside the substrate, and the part cell wall of the groove lower part is described
Conducting medium is provided with solder cream in the groove.
2. PCB according to claim 1, which is characterized in that the slot bottom of the groove is the conducting medium.
3. PCB according to claim 1, which is characterized in that the slot bottom of the groove is separate among two layers of layers of copper
The layers of copper of the groove notch.
4. PCB according to claim 1, which is characterized in that portion of the conducting medium between two layers of layers of copper
Subregion.
5. PCB according to claim 1, which is characterized in that the solder cream is tin cream.
6. PCB according to claim 1, which is characterized in that the conducting medium is conductive bond piece.
7. according to claim 1-6 any one of them PCB, which is characterized in that two layers of layers of copper is the second of the substrate
Layers of copper and third layers of copper.
8. a kind of PCBA, which is characterized in that including component and such as claim 1-7 any one of them PCB, the component
It is welded by the solder cream and the conducting medium to be set in the groove, the solder cream is not higher than the groove slot
Base material at mouthful.
9. PCBA according to claim 8, which is characterized in that the surface line figure electricity of the component and the substrate
Gas is connected to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810386091.5A CN108601203B (en) | 2018-04-26 | 2018-04-26 | PCB and PCBA |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810386091.5A CN108601203B (en) | 2018-04-26 | 2018-04-26 | PCB and PCBA |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108601203A true CN108601203A (en) | 2018-09-28 |
| CN108601203B CN108601203B (en) | 2020-10-09 |
Family
ID=63610286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810386091.5A Active CN108601203B (en) | 2018-04-26 | 2018-04-26 | PCB and PCBA |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108601203B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110798975A (en) * | 2019-10-22 | 2020-02-14 | 江门市华浦照明有限公司 | Surface-mounted device |
| CN111278213A (en) * | 2020-02-10 | 2020-06-12 | 文柏新 | Flexible printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734839A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN107896423A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN107896421A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
-
2018
- 2018-04-26 CN CN201810386091.5A patent/CN108601203B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734839A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN107896423A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN107896421A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110798975A (en) * | 2019-10-22 | 2020-02-14 | 江门市华浦照明有限公司 | Surface-mounted device |
| CN110798975B (en) * | 2019-10-22 | 2024-05-07 | 江门市华浦照明有限公司 | Surface-mounted device |
| CN111278213A (en) * | 2020-02-10 | 2020-06-12 | 文柏新 | Flexible printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108601203B (en) | 2020-10-09 |
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