CN203733846U - Surface mounted LED having light black packaging colloid - Google Patents
Surface mounted LED having light black packaging colloid Download PDFInfo
- Publication number
- CN203733846U CN203733846U CN201420080222.4U CN201420080222U CN203733846U CN 203733846 U CN203733846 U CN 203733846U CN 201420080222 U CN201420080222 U CN 201420080222U CN 203733846 U CN203733846 U CN 203733846U
- Authority
- CN
- China
- Prior art keywords
- resin plate
- light
- packing colloid
- wafer
- surface mounted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000084 colloidal system Substances 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 title abstract 6
- 239000011347 resin Substances 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000000853 adhesive Substances 0.000 claims abstract description 4
- 230000001070 adhesive effect Effects 0.000 claims abstract description 4
- 238000012856 packing Methods 0.000 claims description 22
- 241000218202 Coptis Species 0.000 claims description 5
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a surface mounted LED having light black packaging colloid. The surface mounted LED comprises a black BT resin plate. The middle portion of the BT resin plate is provided with a light-emitting chip which is fixed on the BT resin plate through chip fixation adhesive. The light-emitting chip and the BT resin plate are connected through gold wires. The BT resin plate is provided with light black packaging colloid for sealing and protecting the light-emitting chip. The packaging colloid covers the upper portion of the light-emitting chip. The top portion of the packaging colloid has a matted surface structure. According to the utility model, the packaging colloid of the light-emitting chip is modified into light black, and the surface adopts the matted structure at the same time, so the advantages of simple structure can be realized, the size miniaturization can be realized, and the pixel and definition of the LED can be further improved.
Description
Technical field
The utility model relates to LED manufacturing technology field, particularly a kind of surface attaching type LED with light/dark balance packing colloid.
Background technology
LED(light-emitting diode) application very extensive, because full-color SMD (surface attaching type, the Surface Mounted Devices) size that prior art provides is relatively large, can only be applied to the less demanding LED display of definition.SMD LED size is larger, and the LED display pixel made from it is just lower, and the image definition of demonstration is also just lower.The small size full-color SMD of producing at present has the reflective phenomenon in side on screen because smooth surface is attached to, and high definition LED display, pixel request is higher.So this high definition of picture and the opaque LED display in side, existing full-color SMD LED cannot meet the demands.
Utility model content
The purpose of this utility model is the deficiency for prior art scheme, and a kind of surface attaching type LED with light/dark balance packing colloid is provided, and it has advantages of simple in structure, miniaturization, high definition, high-contrast.
For achieving the above object; the technical scheme that the utility model provides is: a kind of surface mounted type LED with light/dark balance packing colloid is provided; comprise the BT resin plate of black; described BT resin plate mid portion is provided with by crystal-bonding adhesive and is fixed on the luminescent wafer on BT resin plate; between described luminescent wafer and BT resin plate, use gold thread to connect; described BT resin plate is provided with the packing colloid that is light/dark balance for luminescent wafer described in seal protection; described packing colloid covers luminescent wafer top, and described packing colloid top has matte surface structure.
Described luminescent wafer is blue wafer, red wafer or green wafer.
Described multiple BT resin plate composition forms the combination BT resin plate of cuboid together, and the length of described combination BT resin plate is 1.0 millimeters, and broadband is 1.0 millimeters, is highly 0.51 millimeter.
The beneficial effects of the utility model are, surface attaching type LED is made up of packing colloid and the surface frosted structure of complete black BT resin plate, chip, gold thread and light/dark balance, and the packing colloid of lamp pearl is deployed into light/dark balance, surface adopts frosted to process structure simultaneously, simple in structure, realize compact in size, can further improve pixel and the definition of LED.
Brief description of the drawings
Fig. 1 is the encapsulating structure schematic diagram that the utility model embodiment has the surface attaching type LED of light/dark balance packing colloid.
Fig. 2 is the structural representation that the utility model embodiment combines BT resin plate.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Shown in figure 1 and Fig. 2, the utility model embodiment provides a kind of surface mounted type LED with light/dark balance packing colloid, comprise the BT resin plate 10 of black, the BT of institute resin plate 10 mid portions are provided with by crystal-bonding adhesive 14 and are fixed on the luminescent wafer 13 on BT resin plate 10, between described luminescent wafer 13 and BT resin plate 10, use gold thread 11 to connect, described BT resin plate 10 is provided with the packing colloid that is light/dark balance 15 for luminescent wafer described in seal protection 13, described packing colloid 15 covers luminescent wafer 13 tops, described packing colloid 15 tops have matte surface structure 16.
Wherein, described luminescent wafer 13 is blue wafer, red wafer or green wafer.
Shown in figure 2, described multiple BT resin plate compositions form the combination BT resin plate of cuboid together, and the length of described combination BT resin plate is 1.0 millimeters, and broadband is 1.0 millimeters, is highly 0.51 millimeter.
As can be seen here, surface attaching type LED described in the utility model is made up of packing colloid and the surface frosted structure of complete black BT resin plate, chip, gold thread and light/dark balance, and the packing colloid of lamp pearl is deployed into light/dark balance, surface adopts frosted to process structure simultaneously, simple in structure, realize compact in size, can further improve pixel and the definition of LED.
The above; it is only preferably embodiment of the utility model; but protection range of the present utility model is not limited to this; any be familiar with those skilled in the art the utility model disclose technical scope in; the variation that can expect easily or replacement, within all should being encompassed in protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the protection range of claim.
Claims (3)
1. one kind has the surface mounted type LED of light/dark balance packing colloid; it is characterized in that; comprise the BT resin plate of black; described BT resin plate mid portion is provided with by crystal-bonding adhesive and is fixed on the luminescent wafer on BT resin plate; between described luminescent wafer and BT resin plate, use gold thread to connect; described BT resin plate is provided with the packing colloid that is light/dark balance for luminescent wafer described in seal protection, and described packing colloid covers luminescent wafer top, and described packing colloid top has matte surface structure.
2. a kind of surface mounted type LED with light/dark balance packing colloid as claimed in claim 1, is characterized in that, described luminescent wafer is blue wafer, red wafer or green wafer.
3. a kind of surface mounted type LED with light/dark balance packing colloid as claimed in claim 1, it is characterized in that, described multiple BT resin plate composition forms the combination BT resin plate of cuboid together, the length of described combination BT resin plate is 1.0 millimeters, broadband is 1.0 millimeters, is highly 0.51 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420080222.4U CN203733846U (en) | 2014-02-25 | 2014-02-25 | Surface mounted LED having light black packaging colloid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420080222.4U CN203733846U (en) | 2014-02-25 | 2014-02-25 | Surface mounted LED having light black packaging colloid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203733846U true CN203733846U (en) | 2014-07-23 |
Family
ID=51203893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420080222.4U Expired - Lifetime CN203733846U (en) | 2014-02-25 | 2014-02-25 | Surface mounted LED having light black packaging colloid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203733846U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505447A (en) * | 2014-11-17 | 2015-04-08 | 浙江英特来光电科技有限公司 | High-grey matte SMD (Surface Mount Device) LED (Light Emitting Diode) and glue dispensing technology thereof |
| CN104518070A (en) * | 2014-11-17 | 2015-04-15 | 浙江英特来光电科技有限公司 | High-grayscale and high-contrast SMD (surface-mounted) LED (light emitting diode) and adhesive dispensing technology thereof |
| CN104821366A (en) * | 2015-04-09 | 2015-08-05 | 苏州君耀光电有限公司 | LED packaging structure and LED packaging material thereof |
| CN104900791A (en) * | 2015-04-09 | 2015-09-09 | 苏州君耀光电有限公司 | LED encapsulation structure |
| CN112447897A (en) * | 2019-09-03 | 2021-03-05 | 李家铭 | RGB light-emitting diode module with shading film |
-
2014
- 2014-02-25 CN CN201420080222.4U patent/CN203733846U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505447A (en) * | 2014-11-17 | 2015-04-08 | 浙江英特来光电科技有限公司 | High-grey matte SMD (Surface Mount Device) LED (Light Emitting Diode) and glue dispensing technology thereof |
| CN104518070A (en) * | 2014-11-17 | 2015-04-15 | 浙江英特来光电科技有限公司 | High-grayscale and high-contrast SMD (surface-mounted) LED (light emitting diode) and adhesive dispensing technology thereof |
| CN104505447B (en) * | 2014-11-17 | 2017-08-25 | 浙江英特来光电科技有限公司 | One kind height ash matt SMD LED and its gluing process |
| CN104518070B (en) * | 2014-11-17 | 2018-09-07 | 浙江英特来光电科技有限公司 | A kind of high gray scale high contrast SMD LED and its gluing process |
| CN104821366A (en) * | 2015-04-09 | 2015-08-05 | 苏州君耀光电有限公司 | LED packaging structure and LED packaging material thereof |
| CN104900791A (en) * | 2015-04-09 | 2015-09-09 | 苏州君耀光电有限公司 | LED encapsulation structure |
| CN112447897A (en) * | 2019-09-03 | 2021-03-05 | 李家铭 | RGB light-emitting diode module with shading film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140723 |
|
| CX01 | Expiry of patent term |