CN206237670U - Metallization flexible base plate - Google Patents
Metallization flexible base plate Download PDFInfo
- Publication number
- CN206237670U CN206237670U CN201621115132.XU CN201621115132U CN206237670U CN 206237670 U CN206237670 U CN 206237670U CN 201621115132 U CN201621115132 U CN 201621115132U CN 206237670 U CN206237670 U CN 206237670U
- Authority
- CN
- China
- Prior art keywords
- base plate
- layer
- flexible base
- flexible
- metallization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
One kind metallization flexible base plate, it provides a flexible circuit board, and it includes a soft board and in being formed with internal layer circuit on the soft board；A metallization flexible base plate is provided, it includes a flexible substrate, and it is provided with a first surface and a second surface；One conduction material, its first surface for being formed at the flexible substrate；One laminating layer, its second surface for being attached to the flexible substrate；And a release layer, it is attached on the laminating layer；Release layer is removed, the metallization flexible base plate is attached on the internal layer circuit of the flexible circuit board by laminating layer；And in being patterned in the conduction material of the metallization flexible base plate, to form an outer circuit.
Description
Technical field
The utility model relates to a kind of metallization flexible base plate, and its dimensional stability is more preferable.
Background technology
The production method of conventional multilayer circuit board, be a single or double copper clad laminate complete internal layer circuit make after,
Fit again an one side copper clad laminate, by forming Multi-layer circuit board structure after pressing, then carry out dry film and make image transfer, profit
With etching mode in forming outer-layer circuit on one side copper clad laminate.But general copper clad laminate does not have glue-line, one must be first sticked pure
Glue, can again go and fit in one side copper clad laminate, and form multilayer circuit board.Many procedures in making, and easily because
Bisque or foreign matter cause to produce the bad phenomenon of bubble, quality is occurred abnormal and is reduced production yield.In addition, general Copper Foil base
Plate is because making relation, it is impossible to produce thin copper (below 6um), therefore, when outer-layer circuit is made, it is impossible to directly carry out increasing layer legal system
Make fine rule road, and need to subtract copper program together more, the raising of manufacturing cost will be caused.
Furthermore, after manufacturing process is completed, its outer circuit need to generally paste last layer cover layer and cover general multilayer circuit board
Lid, to avoid the circuit after patterning from easily being recognized with naked eyes, makes circuit layout to be difficult to be copied.Furthermore, cover layer can have
Effect ground protection circuit, it is to avoid circuit is scraped damage or made moist etc. and adversely affected.
And general cover layer is, in glue-line is formed on flexible base plate, in a release layer is formed on glue-line, to be covered when being intended to use
When epiphragma covers the outer circuit of multilayer circuit board, it is only necessary to remove release layer, glue-line is attached on outer circuit, you can to make
Flexible base plate covers outer circuit.
Therefore, how to make the making of multilayer circuit board more lightening simple with technique, and its size peace can be effectively improved
It is qualitative, actually industry important topic to be studied.
Utility model content
The utility model is a kind of metallization flexible base plate, and it includes a flexible substrate, its be provided with a first surface and
One second surface；One conduction material, its first surface for being formed at the flexible substrate；One laminating layer, it is attached to the flexible substrate
Second surface；And a release layer, it is attached on the laminating layer.
In this way, metallization flexible base plate of the present utility model, multilayer circuit board is made by using metallization flexible base plate
When, can directly carry out Layer increasing method and make relatively thin fine rule road, and when by flexible base plate substrate surfaces, its thickness is uniform, should
Power is low, and dimensional stability is preferable, and its technique can effectively reduce production cost, and operation is simple, and product yield is high.
Brief description of the drawings
Fig. 1 is the sectional view of the utility model metallization flexible base plate；
Fig. 2 is first schematic diagram of the utility model using the multilayer circuit board fabrication method of the substrate；
Fig. 3 is second schematic diagram of the utility model using the multilayer circuit board fabrication method of the substrate；
Fig. 4 is threeth schematic diagram of the utility model using the multilayer circuit board fabrication method of the substrate；
Fig. 5 is fourth schematic diagram of the utility model using the multilayer circuit board fabrication method of the substrate.
【Symbol description】
Flexible substrate 10
Seed Layer 12
Conduction material 14
Laminating layer 16
Release layer 18
Protective layer 20
First surface 22
Second surface 24
Double-sided printed-circuit board 26
Internal layer circuit 28,30
Glue material 32,40
Coating 34,38
Outer circuit 36
Specific embodiment
Fig. 1 is referred to, is the sectional view of the utility model metallization flexible base plate, it includes a flexible substrate 10,
Seed Layer 12, a conduction material 14, a laminating layer 16, a release layer 18 and a protective layer 20.
Flexible substrate 10 is polyimide film, and it includes a first surface 22 and a second surface 24.
Seed Layer 12, it is formed on the first surface 22 of flexible substrate 10, with chemical-electrical plating method formation nickel dam or can be splashed
Plating method forms ni cr layer.In an embodiment, carried out with Ni-P, it is preferred to use (phosphorus content is less than 5 weight % to low-phosphorous nickel
(wt%) phosphorus content of the nickel dam for), being formed is for about 2 to 4wt%.
Conduction material 14, is a bronze medal, and it is formed in Seed Layer 12 with plating or sputtering way, flexible substrate is formed metal
Change, and conduction material 14 can be made stronger with the adhesion of flexible substrate 10.
Laminating layer 16, its second surface 24 for being attached to flexible substrate 10 can be directly coated at flexible substrate for a glue material
On 10, making will not the alveolate generation because of bisque or foreign matter between laminating layer 14 and flexible substrate 10.
Release layer 18, it is attached on laminating layer 16, can be removed on self-bonding layer 16.
Protective layer 20, it is fitted in conduction material 14, may be used to protect conduction material 14 not damaged and protected by following process
Shield conduction material do not cause with air contact oxidation, can lifting process yield, and protective layer 20 have rigidity, can be applied to Bao Tongji
Relatively thin flexible base plate 10, the operability without influenceing whole technique.In addition, rigid protective layer 20 can allow pressing after material
It is difficult to form the concavo-convex of height fluctuating with the shape of conduction material.The conduction material of the present embodiment is copper.
Fig. 2 is referred to, is first signal of the utility model using the multilayer circuit board fabrication method of metallization property substrate
Figure, a double-sided printed-circuit board 26 is provided in the present embodiment, thereon, lower surface be formed with internal layer circuit 28,30, internal layer circuit 30
Coating 34 is posted by glue material 32.
A metallization flexible base plate is provided, it includes a flexible substrate 10, a Seed Layer 12, a conductive layer 14, a patch
Close layer 16, a release layer 18 and a protective layer 20.
Please refer to Fig. 3, being the utility model uses the of the multilayer circuit board fabrication method of metallization flexible base plate
Two schematic diagrames, will remove on the self-bonding of release layer 18 layer 16 of the flexible base plate that metallizes, and metallization flexible base plate is passed through laminating
Layer 16 is attached to the internal layer circuit 28 of double-sided printed-circuit board 22, then is cured pressing attaching, and its curing temperature is 160-180
DEG C/1-2 hours, because laminating layer 16 is directly formed on flexible substrate 10, without causing laminating layer 16 and flexible substrate 10
Between because bisque or foreign matter produce bubble or come off.
Please refer to Fig. 4, protective layer 20 is removed, expose conductive layer 14, image transfer is made using dry film, and with electricity
Plating mode is in formation outer circuit 36 on conductive layer 14, then dry film and the conductive layer for exposing 14 are removed.
Fig. 5 is referred to, is finally covered on outer circuit 36 by glue material 40 with a coating 38 again, and multilayer can be completed
The making of circuit board.
When the utility model makes multilayer circuit board by using metallization flexible base plate, have the following advantages：
1st, can directly carry out Layer increasing method and make relatively thin fine rule road, and when by flexible base plate substrate surfaces, its thickness
Uniformly, stress is low, and dimensional stability is preferable, and its technique can effectively reduce production cost, and operation is simple, and product yield is high.
2nd, laminating layer is directly coated on flexible base plate, will not be caused between laminating layer and flexible base plate because of bisque or foreign matter
Produce bubble or come off.
3rd, the utility model when forming outer circuit in conduction material, can directly enter in conduction material is formed on flexible base plate
Row Layer increasing method makes fine rule road, without subtracting copper program together more, can reduce manufacturing cost.
The content of above-mentioned specific embodiment is in order to describe the utility model in detail, however, the embodiment such as this is only for
Illustrate, be not intended to limit the utility model.Those skilled in the art are it is understood that attached claim is defined before not departing from
Under the scope of the various change that is carried out for the utility model or modification be to fall into a part of the present utility model.
Claims (8)
1. a kind of metallization flexible base plate, it is included：
One flexible substrate, it is provided with a first surface and a second surface；
One conduction material, its first surface for being formed at the flexible substrate；
One laminating layer, its second surface for being attached to the flexible substrate；And
One release layer, it is attached on the laminating layer.
2. metallize flexible base plate as claimed in claim 1, wherein, the flexible substrate is polyimide film.
3. metallize flexible base plate as claimed in claim 1, wherein, the conduction material is copper.
4. metallize flexible base plate as claimed in claim 1, wherein, the conduction material can be formed with sputter or plating.
5. metallize flexible base plate as claimed in claim 1, wherein, the first surface of the flexible substrate is formed with Seed Layer,
The conduction material is formed in the Seed Layer.
6. metallize flexible base plate as claimed in claim 5, wherein, the Seed Layer is nickel or nichrome.
7. metallize flexible base plate as claimed in claim 1, wherein, the laminating layer is glue material.
8. metallize flexible base plate as claimed in claim 1, wherein, also include a protective layer and fit in the conduction material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621115132.XU CN206237670U (en) | 2016-10-12 | 2016-10-12 | Metallization flexible base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621115132.XU CN206237670U (en) | 2016-10-12 | 2016-10-12 | Metallization flexible base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206237670U true CN206237670U (en) | 2017-06-09 |
Family
ID=58982221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621115132.XU Expired - Fee Related CN206237670U (en) | 2016-10-12 | 2016-10-12 | Metallization flexible base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206237670U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106888550A (en) * | 2016-10-12 | 2017-06-23 | 柏弥兰金属化研究股份有限公司 | Metallization flexible base plate and the multilayer circuit board fabrication method using the substrate |
-
2016
- 2016-10-12 CN CN201621115132.XU patent/CN206237670U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106888550A (en) * | 2016-10-12 | 2017-06-23 | 柏弥兰金属化研究股份有限公司 | Metallization flexible base plate and the multilayer circuit board fabrication method using the substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170609 Termination date: 20191012 |