CN114274249A - Processing method of FPC die punch - Google Patents
Processing method of FPC die punch Download PDFInfo
- Publication number
- CN114274249A CN114274249A CN202111596969.6A CN202111596969A CN114274249A CN 114274249 A CN114274249 A CN 114274249A CN 202111596969 A CN202111596969 A CN 202111596969A CN 114274249 A CN114274249 A CN 114274249A
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- grinding
- punch
- die
- processing
- machining
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Links
- 238000003672 processing method Methods 0.000 title claims abstract description 9
- 238000003754 machining Methods 0.000 claims abstract description 30
- 238000005530 etching Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000005520 cutting process Methods 0.000 claims abstract description 7
- 230000003287 optical effect Effects 0.000 claims abstract description 4
- 239000002761 deinking Substances 0.000 claims description 4
- 238000000137 annealing Methods 0.000 abstract description 7
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The invention discloses a processing method of a punch of an FPC (flexible printed circuit) die, which comprises the steps of printing photosensitive resist on the surface of a material after cutting, removing most of residual materials except the target size of the punch of the die in an exposure and etching mode, roughly processing and grinding the punch of the die to the rough processing size in an optical curve grinding mode, and finely processing and grinding the punch to the target size. According to the invention, most of excess materials of the material are removed by printing photosensitive resist, exposing and etching, rough machining grinding is carried out again, and finish machining grinding is carried out finally, so that the grinding amount required during finish machining grinding is greatly reduced, the phenomenon of workpiece annealing is avoided, the yield strength of the finally machined punch is ensured, and the machining precision of the punch is improved; in addition, when the punch manufactured by the method is applied to a die, the service life of the die is greatly prolonged, the high-frequency needle breakage phenomenon is avoided, and the purpose of windowing the FPC0.2mm limit by using the die can be realized.
Description
Technical Field
The invention relates to the technical field of FPC (flexible printed circuit) die processing, in particular to a processing method of a punch of an FPC die.
Background
With the volume requirement of various products at present becoming smaller and smaller, the size requirement of the FPC is also becoming higher and higher. With the reduction of the volume of the FPC, the challenges of the prior art are how to further improve the windowing processing limit, precision and operating efficiency of the FPC.
The window-opening processing limit of the FPC depends on the size of the punch, and the smaller the upper punch is theoretically, the smaller the punched hole of the FPC can be processed. However, in the existing processing mode of the punch in the industry, a workpiece rough blank is directly processed and ground to the processing size of the punch, and the annealing phenomenon caused by excessive processing amount, particularly easy heat accumulation at a local position of 0.2mm, is found in the grinding processing process, so that the punch is softened and the yield strength of the punch is damaged.
Disclosure of Invention
The invention aims to provide a processing method of a punch of an FPC (flexible printed circuit) die, which improves the processing precision of the punch and avoids an annealing phenomenon to keep the strength of the punch.
In order to achieve the above purpose, the solution of the invention is:
a method for processing a punch of an FPC die comprises the steps of printing photosensitive resist on the surface of a material after cutting, removing most of residual materials except the target size of the punch of the FPC die in an exposure and etching mode, roughly processing and grinding the punch of the FPC die to the rough processing size in an optical curve grinding mode, and finely processing and grinding the punch of the FPC die to the target size.
After rough machining and grinding to the rough machining size, a margin of 0.1mm is reserved.
The processing method of the FPC die punch comprises the following steps: 1. cutting; 2. printing a photosensitive resist; 3. baking; 4. exposing; 5. developing; 6. etching; 7. deinking; 8. rough machining and grinding; 9. and (7) finishing and grinding.
In the step 8, a 40-mesh grinding wheel is used for rough machining and grinding, the set rotating speed is 2000 revolutions per minute, the Z-axis feeding is 0.01mm each time, and finally, a margin of 0.1mm is reserved from the target size.
In the step 9, a 80-mesh grinding wheel is used for finish machining grinding, the set rotating speed is 1500 rpm, and the Z-axis feeding is 0.005mm each time until the machining size is +/-0.005 mm.
After the technical scheme is adopted, most of excess materials of the material are removed in the modes of printing photosensitive resist, exposing and etching, rough machining grinding is performed again, and finish machining grinding is performed finally, so that the grinding amount required during finish machining grinding is greatly reduced, the phenomenon of workpiece annealing is avoided, the yield strength of the finally machined punch is ensured, and the machining precision of the punch is improved; in addition, when the punch manufactured by the method is applied to a die, the service life of the die is greatly prolonged, the high-frequency needle breakage phenomenon is avoided, and the purpose of windowing the FPC0.2mm limit by using the die can be realized.
Detailed Description
In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following specific examples.
The invention relates to a processing method of a punch of an FPC (flexible printed circuit) die, which is characterized in that photosensitive resist is printed on the surface of a material after cutting, most of residual materials except the target size of the punch of the die are removed in an exposure and etching mode, the punch of the die is roughly processed and ground to the rough processing size in an optical curve grinding mode, and then the punch of the die is finely processed and ground to the target size.
The processing method of the FPC die punch specifically comprises the following steps:
1. cutting, wherein the size of the workpiece is 52 x 52.5 mm;
2. printing photosensitive resist, wherein the photosensitive resist is P2109, and the printing thickness is 0.05 mm;
3. baking at 90 + -5 deg.C for 30 + -3 min;
4. exposing, wherein the resistance welding power of an exposure machine is 8KW, the mold is an exposure film, and the exposure machine stands for 15min after exposure;
5. developing, wherein the used developer is liquid sodium carbonate, the volume concentration of the liquid sodium carbonate is 1.0 +/-0.2%, and the developing speed is 2.0-3.0 m/min;
6. etching, wherein the used etching solution is liquid sulfuric acid, the volume concentration of the liquid sulfuric acid is 50 +/-0.5%, and the immersion time is 0.5mm etching amount per minute;
7. deinking, wherein the deinking speed is 2.5-3.0m/min by using sodium hydroxide with the volume concentration of 4 +/-1%;
8. rough machining and grinding, namely performing rough machining and grinding by using a 40-mesh grinding wheel, setting the rotating speed to be 2000 revolutions per minute, feeding the Z axis by 0.01mm each time, and finally reserving a margin of 0.1mm away from the target size;
9. finish grinding, namely finish grinding is carried out by using a 80-mesh grinding wheel, the set rotating speed is 1500 rpm, and the Z-axis feed is 0.005mm each time until the machining size is +/-0.005 mm.
The technical effects of the invention are illustrated by experimental data below:
| accuracy of measurement | Tensile strength | Impact toughness | Degree of annealing | Service life | |
| Grinding process | 0.003mm | 260Mpa | Ak110 | 80% | 150 number of strokes |
| Etching process | 0.003mm | 380Mpa | Ak150 | 0% | 1300 number of strokes |
Through the experimental data, compared with a conventional processing mode (namely grinding processing), the processing mode of firstly etching and then grinding for the second time improves the tensile strength and the impact toughness of the punch, avoids the annealing phenomenon, enables the final service life to reach 1300+ punching times, and greatly improves the service life of the punch compared with the punch obtained by the conventional processing mode.
According to the scheme, most of excess materials of the material are removed in the modes of printing photosensitive resist, exposing and etching, rough machining grinding is performed again, and finish machining grinding is performed finally, so that the grinding amount required during finish machining grinding is greatly reduced, the phenomenon of workpiece annealing is avoided, the yield strength of the finally machined punch is ensured, and the machining precision of the punch is improved; in addition, when the punch manufactured by the method is applied to a die, the service life of the die is greatly prolonged, the high-frequency needle breakage phenomenon is avoided, and the purpose of windowing the FPC0.2mm limit by using the die can be realized.
The above embodiments are not intended to limit the form and style of the present invention, and any suitable changes or modifications made by those skilled in the art should be considered as not departing from the scope of the present invention.
Claims (5)
1. A processing method of a punch of an FPC die is characterized by comprising the following steps:
printing photosensitive resist on the surface of the material after cutting, removing most of the excess material except the target size of the die punch head in an exposure and etching mode, performing rough machining and grinding on the die punch head to a rough machining size in an optical curve grinding mode, and performing finish machining and grinding to the target size.
2. The method for processing the punch of the FPC die as recited in claim 1, wherein:
after rough machining and grinding to the rough machining size, a margin of 0.1mm is reserved.
3. The method for processing the punch of the FPC die as recited in claim 1, comprising the steps of:
1. cutting; 2. printing a photosensitive resist; 3. baking; 4. exposing; 5. developing; 6. etching; 7. deinking; 8. rough machining and grinding; 9. and (7) finishing and grinding.
4. The method for processing the FPC die punch as recited in claim 3, wherein:
in the step 8, a 40-mesh grinding wheel is used for rough machining and grinding, the set rotating speed is 2000 revolutions per minute, the Z-axis feeding is 0.01mm each time, and finally, a margin of 0.1mm is reserved from the target size.
5. The method for processing the FPC die punch as recited in claim 3, wherein:
in the step 9, a 80-mesh grinding wheel is used for finish machining grinding, the set rotating speed is 1500 rpm, and the Z-axis feeding is 0.005mm each time until the machining size is +/-0.005 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111596969.6A CN114274249B (en) | 2021-12-24 | 2021-12-24 | Processing method of FPC die punch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111596969.6A CN114274249B (en) | 2021-12-24 | 2021-12-24 | Processing method of FPC die punch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114274249A true CN114274249A (en) | 2022-04-05 |
| CN114274249B CN114274249B (en) | 2024-02-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111596969.6A Active CN114274249B (en) | 2021-12-24 | 2021-12-24 | Processing method of FPC die punch |
Country Status (1)
| Country | Link |
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| CN (1) | CN114274249B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11277543A (en) * | 1998-03-27 | 1999-10-12 | Sharp Corp | Production of mold for molding micro-lens array |
| JP2001110854A (en) * | 1999-10-06 | 2001-04-20 | Mitsui Mining & Smelting Co Ltd | Punching die for manufacturing film carrier tape and method of manufacturing film carrier tape by use thereof |
| TW450863B (en) * | 1999-05-21 | 2001-08-21 | Ind Tech Res Inst | Method for producing high precision tiny component with energy beam |
| TWM274221U (en) * | 2004-09-23 | 2005-09-01 | Chia-Shun Lee | Compound etching forming die |
| TWI252537B (en) * | 2004-09-23 | 2006-04-01 | Chia-Shun Lee | Method for directly forming a cutter mould with double etching and apparatus thereof |
| CN1840260A (en) * | 2005-03-29 | 2006-10-04 | 兄弟工业株式会社 | Punch |
| JP2014109044A (en) * | 2012-11-30 | 2014-06-12 | National Institute For Materials Science | Conductive punch for high temperature and method of producing the same |
| CN104786275A (en) * | 2015-04-27 | 2015-07-22 | 惠州美锐电子科技有限公司 | PCB stamping bottom die |
| CN110023052A (en) * | 2016-11-28 | 2019-07-16 | 日立金属株式会社 | Mold and its manufacturing method |
| CN111107717A (en) * | 2019-12-02 | 2020-05-05 | 欣强电子（清远）有限公司 | Processing method of PCB capable of preventing finger from scratching |
-
2021
- 2021-12-24 CN CN202111596969.6A patent/CN114274249B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11277543A (en) * | 1998-03-27 | 1999-10-12 | Sharp Corp | Production of mold for molding micro-lens array |
| TW450863B (en) * | 1999-05-21 | 2001-08-21 | Ind Tech Res Inst | Method for producing high precision tiny component with energy beam |
| JP2001110854A (en) * | 1999-10-06 | 2001-04-20 | Mitsui Mining & Smelting Co Ltd | Punching die for manufacturing film carrier tape and method of manufacturing film carrier tape by use thereof |
| TWM274221U (en) * | 2004-09-23 | 2005-09-01 | Chia-Shun Lee | Compound etching forming die |
| TWI252537B (en) * | 2004-09-23 | 2006-04-01 | Chia-Shun Lee | Method for directly forming a cutter mould with double etching and apparatus thereof |
| CN1840260A (en) * | 2005-03-29 | 2006-10-04 | 兄弟工业株式会社 | Punch |
| JP2014109044A (en) * | 2012-11-30 | 2014-06-12 | National Institute For Materials Science | Conductive punch for high temperature and method of producing the same |
| CN104786275A (en) * | 2015-04-27 | 2015-07-22 | 惠州美锐电子科技有限公司 | PCB stamping bottom die |
| CN110023052A (en) * | 2016-11-28 | 2019-07-16 | 日立金属株式会社 | Mold and its manufacturing method |
| CN111107717A (en) * | 2019-12-02 | 2020-05-05 | 欣强电子（清远）有限公司 | Processing method of PCB capable of preventing finger from scratching |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114274249B (en) | 2024-02-02 |
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