JPH032357B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for correcting the shape of a printed circuit board for correcting irregularities in shape such as warpage and twisting of the printed circuit board, and a shape correction apparatus for implementing this method.

[Conventional technology]

There are various types of printed circuit boards, both in terms of materials and manufacturing methods. Due to the complexity of the materials and manufacturing processes of these various types of printed circuit boards, irregularities in shape such as warping and twisting often occur in the final product as a board. Since it is assumed that the printed circuit board will be processed later in the form of a flat plate, such irregularities in shape are the cause of various problems. For example, in recent years, automatic component insertion and automatic component mounting have rapidly become popular, but in this case, warping or twisting of the printed circuit board can cause component mounting errors, poor insertion, poor transportation, board cracking, and other defects on the automatic line. is being caused. Therefore, the irregular shape of printed circuit boards is a major obstacle to process automation.

Conventionally, such warpage and twisting of printed circuit boards has been corrected manually, or by using rubber rolls,
The shape was corrected using a leveler using metal rolls, etc. However, manual work is extremely disadvantageous in terms of time and effort, and goes against the call for line automation. On the other hand, correction using a leveler involves sandwiching a printed circuit board between rolls and rotating the rolls.
This is intended to flatten the shape, so even if it is sufficient for printed circuit boards with a certain shape, it may not be applicable to circuit boards with various external shapes, so-called irregularly shaped circuit boards, and its versatility is limited. Missing. In addition, if the printed circuit board is thin, it may break when it is sandwiched between rolls. Furthermore, there is a problem that uniform shape correction is difficult.

These problems have become even more prevalent today as many new technologies have been adopted in the field of printed circuit boards. In other words, today there is a demand for high-density packaging, and in order to efficiently achieve this high-density packaging, efficient board division methods such as V-cuts and bushbacks are increasingly being adopted, and the desired products can be manufactured in a small space. Moreover, in order to achieve lightweight and compact size, printed circuit boards have been made into irregular shapes and thinner boards. A V-cut is a method in which a V-shaped groove is formed in advance so that the wiring can be routed to the very edge of the board, and the V-shaped groove is used to cut the wire.
When such a V-groove is present, the V-groove may break in conventional roll-type levelers.
Similarly, in order to achieve high-density mounting, pushbags are punched out in advance into the required shape, and then mounted while being inserted into the punched area, and then the printed circuit board is punched out according to the original punching process. Straightening using rolls sometimes caused omissions or cracks during straightening. For this reason, there are limits to increasing density and efficiency, and the production of defective products is disadvantageous in terms of cost. Furthermore, as mentioned above, irregularly shaped printed circuit boards and thin ones are difficult to straighten with a leveler that uses rolls.
As a result, there are limits to the shape of printed circuit boards, etc.
There is also a lack of freedom in designing various substrates.

Against this background, it has become almost impossible to use conventional shape correction methods for today's various printed circuit boards, and since there is no appropriate shape correction method, high-density However, there are limits to increasing efficiency, there are problems in reducing costs, and the degree of freedom in board design is limited.

[Purpose of the invention]

The present invention was made to deal with the above-mentioned situation, and its purpose is to improve the thickness, shape, and
Regardless of the board division method or material, it is highly versatile as it can correct irregularities such as warpage and twisting that occur on printed circuit boards, and it offers a degree of freedom in design, resulting in higher density and higher efficiency. It is an object of the present invention to provide a shape correction method and apparatus that can efficiently perform desired uniform correction without causing cracks or deformation after correction, and which can also be expected to improve productivity. be.

[Structure of the invention]

In order to achieve the above object, the method for correcting the shape of a printed circuit board of the present invention is a method for correcting the shape of a printed circuit board having an electric circuit pattern (for example, the pattern indicated by reference numeral 20 in FIG. 11) formed on one or both sides of the printed circuit board. It comprises a first step of heating and holding the board, and a second step of rapidly cooling and pressurizing the heated printed circuit board, and in the second step, the upper and lower surfaces of the printed board are heated. The configuration is such that pressurized cooling is performed with a difference.

Further, the printed circuit board shape correction device of the present invention includes:
A shape correction device for printed circuit boards with electrical circuit patterns formed on one or both sides includes a pressure heating mechanism that heats the printed circuit board under pressure, a pressure cooling mechanism that cools the printed circuit board under pressure, and a pressure cooling mechanism that applies pressure to the printed circuit board. a conveyance mechanism that automatically sends from the heating mechanism to the pressurized cooling mechanism, the pressurized cooling mechanism is adjacent to the pressurized heating mechanism and is integrally combined with the pressurized heating mechanism, and the pressurized cooling mechanism is characterized in that it is provided in a configuration that causes a difference in heat conduction between the upper surface and the lower surface of the printed circuit board.

In the present invention, the "top surface" of a printed circuit board refers to the surface on one side of the printed circuit board, and the "bottom surface"
refers to the opposite side. The “top surface” is
When placed horizontally, this can be an upwardly facing surface, but it does not necessarily have to be an actual upwardly facing surface.

In a preferred embodiment of the present invention, in order to provide a temperature difference or a difference in heat conduction between the upper surface and the lower surface of the printed circuit board during pressurized cooling, a portion of at least one surface of the printed circuit board is provided. It is possible to adopt a means of providing a concave-convex absorber that comes into contact with the concavo-convex absorber. As the uneven absorber, one made of felt, nonwoven fabric, Japanese paper, etc. can be preferably used.

In the present invention, the material of the pressure plate used for pressure cooling or the pressure plate used for applying pressure during heating is copper material (or copper-based material) for both heating and cooling purposes. It is preferable to use

[Action of the invention]

As a result of the above configuration, in the printed circuit board straightening method of the present invention, the printed circuit board is heated and held in the first step, so that the printed circuit board becomes in a state suitable for shape correction in the next step. Next, in the second step, this heated printed circuit board is rapidly cooled and held under pressure, so that the shape can be easily and uniformly corrected by the pressure applied here. Since it is rapidly cooled, the time required for straightening can be shortened and productivity can be increased. It is also possible to prevent deformation after correction. The reason why deformation after straightening can be prevented is considered to be because localization of strain is avoided as a result of rapid cooling, and therefore no deformation occurs after straightening. If pressure is applied under slow cooling, strain will be localized in one part during cooling, stress will remain in that part, and deformation will occur from this part after straightening. However, in the present invention, rapid cooling is performed. This kind of deformation after correction can be avoided.

Since the present invention consists of the heating and holding process as described above and the rapid cooling and pressurizing process, there is no particular limitation on the target board, and it can be used universally regardless of the thickness, shape, board division method, or material of the printed circuit board. can. Therefore, it does not hinder high density or high efficiency,
The present invention can be applied to various printed circuit boards, and as a result, the degree of freedom in board design is greatly improved, and it is also advantageous in terms of cost. In addition, shape correction can be performed accurately, and as mentioned above, no deformation occurs after correction.

Furthermore, in the printed circuit board straightening method of the present invention, in the second step of rapidly cooling and pressurizing the printed circuit board, pressure cooling is performed with a temperature difference between the top and bottom surfaces of the printed circuit board. , the desired correction for distortion can be easily and correctly achieved.

That is, for example, FIG. 12 shows an example in which temperature changes are measured regarding the cooling state of the top and bottom surfaces of a printed circuit board, with time plotted on the horizontal axis and temperature plotted on the vertical axis. In the figure, the numbers 1-1 and 1-2 indicate comparisons in which no temperature difference is given between the top and bottom surfaces, and the solid line 1-1 indicates the temperature change on the top surface, and the broken line indicates the temperature change. 1-2 is the temperature change on the lower surface. As shown in the figure, there is almost no temperature difference, and the temperature changes are 1-1 and 1-2, and curves are drawn in the same state.

On the other hand, reference numerals 2-1 and 2-2 indicate cases of the present invention in which a temperature difference is provided between the upper surface and the lower surface. In this example, by bringing the uneven absorber, which will be described in detail in the description of the embodiment below, into contact with the lower surface, a difference is created in heat conduction between the upper surface and the lower surface, and thereby the temperature between the upper and lower surfaces is I tried to make a difference. As is clear from the figure, when comparing the temperature change curve 2-1 shown by the solid line and the lower surface temperature change curve 2-2 shown by the broken line, there is a significant temperature difference between the two. As a result, the temperature change characteristics also change from the upper surface 2-
1 and the lower surface 2-2 are completely different.

In the present invention, desired shape correction can be achieved by creating a temperature difference between the top and bottom surfaces of the printed circuit board. For example, the desired warpage can be corrected by rapidly cooling the top surface of the printed circuit board to cause the top surface to shrink, while slowly cooling the bottom surface to cause the shrinkage to occur gradually. In that case, as explained using FIG. 12 above, by lowering the temperature of the upper surface 1-1 and performing pressure cooling, it is possible to obtain a printed circuit board with the undesirable warpage corrected. Can be done.

Further, in the printed circuit board shape correction device of the present invention, the pressure cooling mechanism for cooling the printed circuit board under pressure is provided in a configuration that causes a difference in heat conduction between the upper surface and the lower surface of the printed circuit board. , a transfer mechanism that automatically transports the printed circuit board from the pressure heating mechanism that presses and heats the printed circuit board to the pressure cooling mechanism, and the pressure cooling mechanism is adjacent to the pressure heating mechanism. Since the shape correction method of the printed circuit board according to the present invention can be achieved easily and effectively.

In addition, this heating/cooling mechanism is provided with an uneven absorber that comes into contact with a portion of at least one surface of the printed circuit board, thereby creating a difference in heat conduction between the upper surface and the lower surface of the printed circuit board. With this configuration, it is possible to easily bring about the difference in heat conduction, and furthermore, even if there are irregularities on the board surface due to wiring or other factors, the correct shape correction can be performed without hindering the shape correction. It can be achieved.

[Embodiments of the invention]

An embodiment of the present invention will be described below.

In this embodiment, the shape of the printed circuit board is corrected in the steps shown in FIG. That is, the first step is to heat and hold the printed circuit board, and the second step is to rapidly cool and hold the heated printed circuit board under pressure, and perform pressure cooling with a temperature difference between the top and bottom surfaces of the printed circuit board. By the process of
To correct the shape of a printed circuit board and to correct warpage and twisting of the printed circuit board. In this example, an annealing step was further provided to make the printed circuit board easier to handle in the next step.

In the first printed circuit board heating and holding step, the printed circuit board is heated to a temperature that is suitable for straightening in the next pressurizing step, depending on its base material, board thickness, size (planar size), etc. Keep heated for hours. As the heater, a far-infrared furnace/hot blast furnace a as shown in FIG. 2 can be used. In this case, the printed circuit board 1 is heated by the heat source 3 while being conveyed by the belt 2 or the like. Alternatively, it is possible to use a vertical heater-equipped autopress b that presses the printed circuit board 1 in the vertical direction as shown in FIG. In this case, the printed circuit board 1 is placed on the lower press plate 4, the upper press plate 5 is pressed from above, and the printed circuit board 1 is heated and held by the heater 6 provided in each of the press plates 4 and 5. Or the fourth
As shown in the figure, it is also possible to use a horizontal autopress c with a heater that presses the printed circuit board 1 in the horizontal direction. In this case, the printed circuit board 1 is supported and sandwiched between the left and right press plates 7 and 8, and the printed circuit board 1 is heated and held by the heaters 6 in each of the press plates 7 and 8.

In this example, the thickness is 0.8 mm and the size is 114 x 156 mm.
Using a printed circuit board made of a composite material as a target board, a first heating and holding step was performed using a vertical autopress heater as shown in FIG. The heating temperature is
The heating time was 120°C and 10 seconds. As mentioned above, there are no particular limitations on the target board to which the present invention can be applied, and any board that is commonly used as a printed circuit board can be used as the target board. paper polyester, paper epoxy (also FR-3, etc.), composite base materials (CEM1, CEM3, etc.), glass epoxy (FR-3, etc.),
4) and others, and the heating temperature can be appropriately selected within the range of 50 to 150°C for paper phenol, paper polyester, and paper epoxy, and 90 to 180°C for composite and glass epoxy. Select an appropriate heating time depending on the material, shape, and size.

As described above, when the printed circuit board is heated and held at an appropriate temperature and time to a state suitable for shape correction, the process moves to the second pressure holding step. In this step, the printed circuit board heated in the first step is rapidly cooled under pressure while maintaining a temperature difference between the top and bottom surfaces of the printed circuit board.

In this step, for example, a shape correction pressurizer a shown in FIG. 5 can be used. This pressurizer a is of a vertical type that presses the printed circuit board 1 in the vertical direction to correct its shape. The substrate 1 is rapidly cooled. Each cooling plate 9, 10 is provided with a cooling mechanism. Specifically, the cooling plates 9 and 10 are cooled by introducing a cooling medium 11 from the outside. Cooling media include water, ammonia,
Freon, oil, or anything else that can be used as a cooling medium can be used. In this example, water was used as cooling water at 20°C. Also,
The cooling plates 9 and 10 were made of metal (copper, aluminum, iron, stainless steel, brass, or other appropriate material).

During pressure quenching, the printed circuit board 1 heated in the first step is placed on the lower cooling plate 10,
The upper cooling plate 9 is lowered and the printed circuit board 1 is pressurized. At this time, the cooling medium 11 is allowed to flow and is rapidly cooled while being pressurized. In this example, this vertical pressurizer a was used to pressurize and cool for 5 seconds. As described above, cooling was performed using cooling water at 20°C. The pressure to be applied may be large enough to press down the printed circuit board 1, but in this embodiment, the pressure is
It was set to 0.24Kg/ ^cm2 . Although composite material was used in this example, substrates made of other materials can also be used at approximately 1 kg/kg.
It is preferable to cool under pressure at an appropriate pressure of cm ² or less.

During such pressurized cooling, various means can be used to create a temperature difference between the top and bottom surfaces of the printed circuit board. For example, in this example, a cooling plate 9 that pressurizes and cools the upper surface of the printed circuit board is used.
and the cooling plate 10, which similarly cools the lower surface under pressure, by creating a temperature difference between the cooling medium 11 flowing through each of them,
This makes it possible to create a temperature difference between the top and bottom surfaces of the printed circuit boards that come into contact with each other.

By the second pressurizing and cooling process as described above, warpage and twisting of the printed circuit board 1 are corrected and the printed circuit board 1 is corrected into a flat plate shape.

As another example of the pressurizer, a horizontal type (pressure is applied from the side) type pressurizer b for shape correction as shown in FIG. 6 can be used. This supports the printed circuit board 1 and pressurizes the printed circuit board 1 with the left and right cooling plates 12 and 13. Similarly, the cooling medium 11 is used to pressurize and rapidly cool.

By the above first and second steps, the printed circuit board 1
The shape is corrected. According to this technique, the thickness and shape of the printed circuit board 1 can be set arbitrarily, and it can be suitably used even for thin ones, and since the shape does not matter, it can be used to correct the shape of even irregularly shaped boards. Any method of dividing the substrate can be applied, such as V-cutting or push-back, whereby the shape can be corrected without fear of cracking or other problems. In addition, this technology heats the printed circuit board and cools it under pressure to release internal strains that cause warping and twisting, so it can easily and uniformly flatten the printed circuit board, and localized distortion can be achieved. Deformation after correction due to remaining particles is also less likely to occur. Moreover, since the process is rapidly cooled, the process time is shortened, and productivity can be improved.

In this example, a slow cooling step is added, which is to cool down to room temperature when the temperature is still higher than room temperature even after being rapidly cooled under pressure in the second step. This may be used if cooling to room temperature is more convenient for subsequent handling. This step may be omitted if there is no practical problem. The slow cooling can be performed, for example, by attaching a small fan 15 below the metal mesh belt 14 and performing forced air cooling while conveying the printed circuit board 1 with the belt 14, as shown in FIG.

For example, by combining the heater a in Figure 2 and the pressurizer a in Figure 5 with their lines L aligned, and further combining the slow cooling device in Figure 7 with their lines L aligned, it is possible to create a system on a continuous line. Can be automated. In the printed circuit board shape correction device of the present invention, the printed circuit board is automatically conveyed from the pressurized heating mechanism to the pressurized cooling mechanism, and both mechanisms are combined into one unit. Similarly to the above, a line L (not shown in FIG. 3) is connected between heater b in FIG. 3, which constitutes a pressure heating mechanism, and pressurizer b, for example, in FIG. This can be achieved by combining them into one piece by matching them, and by configuring the printed circuit board to be automatically conveyed along this line L.

Next, the effects of this embodiment will be explained with reference to FIG. The sample was made of CEM3, a type of composite material, with a thickness of 0.8 mm and a size of 114 ×
A 156 mm double-sided substrate was used and its warpage was corrected according to the above example. FIG. 8 shows the results of warpage correction using a plurality of samples, in which data A represents the distribution of warpage before correction, and data B represents the distribution of warpage after correction. The amount of warpage d in FIG. 8 represents the deformation shown in FIG. As can be seen from the comparison of data A and B, it can be seen that the amount of warpage has been reduced and correction has been achieved.

Next, another embodiment of the present invention will be described.
In this embodiment, a pressurizer for pressurizing and cooling the printed circuit board in the second step is provided with an uneven absorber that comes into contact with at least a part of the surface of the printed circuit board 1. This is an example in which the upper surface and the lower surface of 1 are configured to have a difference in heat conduction.

That is, as shown in FIG. 10, the pressurizer c in this example has an uneven absorber 17 attached to its cooling plate 16 (lower cooling plate). Since the unevenness absorber 17 is attached, even if the surface unevenness of the substrate 1 is large, the unevenness is absorbed by the unevenness absorber 17, and a sufficient shape correction effect can be obtained. As the unevenness absorber, any material can be used as long as it is flexible and can absorb unevenness, but it is desirable that it has some degree of heat insulation. For example, felt,
Cloth, paper, sponge, rubber, etc. are preferably used. In this example, the unevenness absorber was not provided on the other cooling plate 18, but it is of course possible to provide it on both sides.

Except for the installation of the unevenness absorber 17, the configuration was exactly the same as that of the embodiment described above. The effect of this example is shown in the 8th section.
This will be explained using figures. Data C in FIG. 8 is the result when this example is used. The test conditions are the same as described above. From the comparison with data A, it can be seen that the amount of warpage is extremely small. A more preferable result than data B was obtained, and it can be seen that the effect of this example is good.

The reason why good results are obtained in this example is that the unevenness absorber effectively creates a difference in heat conduction between the top and bottom surfaces of the printed circuit board 1, and as a result, the cooling effect changes between the top and bottom surfaces. This is because the desired shape correction can be achieved satisfactorily. This is considered to be because the cooling characteristics of the printed circuit board change due to the heat insulating effect of the uneven absorber. It is thought that this effect and the unevenness absorbing effect of the unevenness absorber combine to provide good results. That is, whether a printed circuit board is printed on one side or on both sides, the patterns are often concentrated in the center, and when viewed in side section, the pattern is uneven. Therefore, if this is sandwiched between the cooling plates, the cooling plates will come into contact with the convex portions of the pattern and sandwich them, making it impossible to hold the peripheral portions of the printed circuit board. As a result, cooling of the substrate becomes uneven, and uniform shape correction may not be possible. In addition, since the peripheral portion of the printed circuit board is not pinched, it becomes a free end and can be bent in any direction. However, the above problem can be solved by using an uneven absorber. First, due to the heat insulating effect of the uneven absorber, there is a difference in heat conduction between the top and bottom surfaces of the printed circuit board, which changes the degree of cooling between the top and bottom surfaces, leading to a direction in which the desired shape correction can be achieved. Pressurized cooling can be achieved. In addition, the unevenness absorber can absorb unevenness, allowing uniform cooling of the substrate. And it becomes possible to sandwich the whole thing.

In this way, in this example, by using the unevenness absorber, particularly effective shape correction is achieved. The unevenness absorber can be provided on both sides to adjust the heat conduction between the top and bottom surfaces of the printed circuit board by adjusting the thickness difference, or the unevenness absorber can be configured to adjust the heat conduction between the top and bottom surfaces of the printed circuit board depending on the material or installation method. It can be done. Further, it is also possible to provide a difference in heat conduction by providing it only on one side. Even one side can provide sufficient unevenness absorption effect.

What is shown in FIG. 11 is that the printed circuit board is
This is a case where the upper and lower surfaces of the device are made to have different thermal conductivity. In this case, the cooling temperature curves of the upper and lower surfaces were measured using a thermocouple 19. Substrate 1 as a sample was made of composite material (CEM3) with a thickness of 0.8 mm and a size of 114 x 156 mm.
As the uneven absorber 17, felt was used. FIG. 12 shows the results in comparison with the case where the uneven absorber is not used. As shown in the figure, in the case of direct cooling without an uneven absorber, both the upper surface 1-1 and the lower surface 1-2 of the substrate are rapidly cooled in 2 to 3 seconds after being heated. On the other hand, in the case where the uneven absorber 17 is laid, a difference in heat conduction occurs, and the cooling temperature curve of one side, that is, the bottom surface 2-2 of the substrate in contact with the uneven absorber 17, is gentle. The curve of the upper surface of the substrate 2-1 also has slightly different characteristics from that of 1-1 in the case of direct cooling. In this way, the temperature curve 2-2 on the uneven absorber 17 side is slower than the temperature curve 2-1 on the other side, and there is a difference in characteristics.

By using the unevenness absorber as described above, it is possible to provide a difference in heat conduction between the upper surface and the lower surface of the printed circuit board, thereby providing a difference in cooling temperature characteristics. This plays an effective role in shape correction.

Due to the temperature difference between the upper and lower surfaces of the printed circuit board and the difference in heat conduction, it is possible to cause the printed circuit board to warp in a desired direction and with a desired magnitude. This effect can also be promoted by changing the thickness of the uneven absorber. For example, since the surface of the circuit board that the unevenness absorber comes into contact with is likely to become concave, the unevenness absorber can be provided on the surface that is desired to be concave, or the thicker the unevenness absorber is, the more the printed circuit board will warp, so the installation position By adjusting the thickness and the thickness, it is possible to give the substrate a desired warpage.

It goes without saying that the present invention is not limited to the embodiments described above.

〔Effect of the invention〕

As described above, the printed circuit board straightening method of the present invention includes the step of heating and holding the printed circuit board, and the step of rapidly cooling and pressurizing the heated printed circuit board. Since shape correction is performed by creating a temperature difference between the upper and lower surfaces of the substrate, desired shape correction can be effectively realized. Moreover, there are no particular restrictions on the substrates that can be applied, and irregularities in the printed circuit board shape can be corrected regardless of the board thickness, shape, board division method, or material, making it extremely versatile. Furthermore, since there are no such restrictions, the printed circuit board can be formed to have any thickness or shape, and the degree of freedom in design is greatly improved. This allows for free design, making it possible to achieve even higher density and higher efficiency. Furthermore, since pressurization is performed under rapid cooling, the time required is short, productivity is improved, and costs can be reduced in this respect as well. In addition, not only cracks but also deformation after straightening do not occur because the pressure is applied under rapid cooling, and the desired uniform straightening can be efficiently achieved.

Further, the printed circuit board straightening device of the present invention can effectively implement the above method.

[Brief explanation of the drawing]

FIG. 1 is a process diagram showing the procedure of an embodiment of the present invention. FIG. 2 is a diagram showing an example of a heater that can be used in this embodiment, FIG. 3 is a diagram showing another example thereof, and FIG. 4 is a diagram showing still another example thereof. FIG. 5 is a diagram showing an example of a pressurizer that can be used in this embodiment, and FIG. 6 is a diagram showing another example thereof. FIG. 7 is a diagram showing an annealing device used in this example. FIG. 8 and FIG. 9 are explanatory diagrams for showing the effects of the present invention. FIG. 10 is a diagram showing an example of a pressurizer that can be used in another embodiment of the present invention, and FIG.
12 and 12 are explanatory diagrams for showing the operation of this embodiment. ...first process, ...second process. 1...
Printed circuit board, a, b, c...heater,
a, b, c...pressurizer, 17... unevenness absorber.

Claims (1)

[Claims] 1. A method for correcting the shape of a printed circuit board having an electric circuit pattern formed on one or both sides, comprising: a first step of heating and holding the printed circuit board; and rapidly cooling and holding the heated printed circuit board under pressure. a second step of correcting the shape of a printed circuit board, and in the second step, pressure cooling is performed with a temperature difference between the upper surface and the lower surface of the printed circuit board. 2. A shape correction device for a printed circuit board having an electric circuit pattern formed on one or both sides, comprising: a pressure heating mechanism that presses and heats the printed circuit board;
It is equipped with a pressure cooling mechanism that cools the printed circuit board under pressure, and a transfer mechanism that automatically transports the printed circuit board from the pressure heating mechanism to the pressure cooling mechanism, and the pressure cooling mechanism is located adjacent to the pressure heating mechanism. A printed circuit board, which is integrally combined with a pressurized heating mechanism, and the pressurized cooling mechanism is provided in a configuration that causes a difference in heat conduction between an upper surface and a lower surface of the printed circuit board. shape correction device. 3. The printed circuit board shape correction apparatus according to claim 2, wherein the heating and cooling mechanism includes an unevenness absorber that abuts a portion of at least one surface of the printed circuit board.