JPH01160080A - Correction of warpage of printed circuit board - Google Patents
Correction of warpage of printed circuit boardInfo
- Publication number
- JPH01160080A JPH01160080A JP31733987A JP31733987A JPH01160080A JP H01160080 A JPH01160080 A JP H01160080A JP 31733987 A JP31733987 A JP 31733987A JP 31733987 A JP31733987 A JP 31733987A JP H01160080 A JPH01160080 A JP H01160080A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- press
- pressure
- heating
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000013007 heat curing Methods 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、プリント回路板の反り直し方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for straightening a printed circuit board.
熱硬化性樹脂積層板からプリント回路板に加等
工する際、加熱処理や化学的処理中を受けるため、反り
が発生する。When processing a thermosetting resin laminate into a printed circuit board, warping occurs due to heat treatment and chemical treatment.
従来、プリント回路板の反りは、長辺の１％まで認めら
れていた。Conventionally, printed circuit boards were allowed to warp up to 1% of their long sides.
なっており、回路板の大きさに関係なく、±０．５論以
下が要求されている。Therefore, regardless of the size of the circuit board, ±0.5 theory or less is required.
反り直し方法としては、（１）手で曲げて修正する、（
２）熱盤間で加熱加圧する、等の方法が行われているが
、これらの方法では、時間がかかる、■カット等の加工
を施した回路板の場合修正しにくい、更に（１）の場合
修正が不完全となる、（２）の場合修正はある程度よい
が、挿入取出しに手間がかかる等の欠点がある。There are two ways to correct the warp: (1) bend it by hand to correct it;
2) Methods such as heating and pressurizing between hot plates have been used, but these methods are time-consuming, difficult to repair if the circuit board has been cut or otherwise processed, and also suffers from (1). In case (2), the correction will be incomplete; in case (2), although the correction is good to some extent, there are drawbacks such as the need for time and effort for insertion and removal.
本発明は、０．５ ｍｍ以下に反り直しができ、自動化
も可能な回路板の反り直し方法を提供することを目的と
する。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for rewarping a circuit board that can be rewarped to 0.5 mm or less and can be automated.
本発明は、第１図に一例を示すごとく、熱硬化性樹脂積
層板から得られたプリント回路板（１）の反りを修正す
るために、直列に配置された２台の加圧プレス（４）、
（５）とプリント回路板を移動させるベルト（２）か
らなり、一台の加圧プレス（４）がプリント回路板を加
熱し、他の一台（５）が冷却することを特徴とするプリ
ント回路板の反り直し方法である。As an example shown in FIG. 1, the present invention utilizes two pressure presses (4 presses) arranged in series in order to correct the warping of a printed circuit board (1) obtained from a thermosetting resin laminate. ),
(5) and a belt (2) for moving the printed circuit board, one pressure press (4) heats the printed circuit board and the other (5) cools it. This is a method for straightening a circuit board.
加熱プレス（４）の加熱温度は熱硬化性樹脂のガラス転
移温度（Ｔｇ）以上がよく、概ね１４０〜１７０°Ｃで
ある。プリント回路板のパターンにはんだめっきがある
場合、はんだが溶融しないため１８０°Ｃ以下が好まし
い。加熱後、常温〜５０°Ｃまで冷却する冷却プレス（
５）を設ける。The heating temperature of the hot press (4) is preferably higher than the glass transition temperature (Tg) of the thermosetting resin, and is approximately 140 to 170°C. If the printed circuit board pattern has solder plating, the temperature is preferably 180° C. or lower because the solder will not melt. After heating, cooling press (cools from room temperature to 50°C)
5).
プリント回路板（１）の加熱プレス（４）から冷却プレ
ス（５）への移動は駆動ローラー（３）で駆動されるベ
ルト（２）により行われる。The movement of the printed circuit board (1) from the hot press (4) to the cold press (5) is effected by a belt (2) driven by drive rollers (3).
が好ましく、特に０１〜１０ｋｇ／ｃＪが好ましい。is preferable, and particularly preferably 01 to 10 kg/cJ.
加熱時間は１５〜１２０秒が好ましいが、これより長く
なってもさしつかえない。The heating time is preferably 15 to 120 seconds, but may be longer.
本発明は、プリント回路板の反り直しのために加圧しな
がら、加熱つづいて冷却を行うので、短時間で反り直し
ができ、連続工程に組み込むことも可能である。In the present invention, the printed circuit board is heated and then cooled while being pressurized to correct the warpage, so that the printed circuit board can be corrected in a short time and can be incorporated into a continuous process.
更に、プリント回路板に■カット、ミシン目があると、
手直しでは割れることが多かったが、本発明による反り
直しにおいては首尾よく行うことができる。Furthermore, if there are cuts or perforations on the printed circuit board,
Although cracking often occurred during reworking, the warping according to the present invention can be successfully performed.
以下に、実施例、比較例を示す。Examples and comparative examples are shown below.
長さ５００×幅６００の加熱プレスと同サイズの冷却プ
レスを直列に並べ、それぞれのプレスの上下加圧盤の間
を移動するベルトを設置し、このヘルドを間歇点に移動
させることによりプリント回路板を加熱冷却するプリン
ト回路板の反り直し装置を製作した。A heating press with a length of 500mm x width of 600mm and a cooling press of the same size are arranged in series, a belt is installed that moves between the upper and lower pressure plates of each press, and the printed circuit board is moved by moving this heald to an intermittent point. We have created a device for straightening printed circuit boards that heats and cools them.
加熱プレスの熱盤の温度を１７０°Ｃ１冷却プレスの熱
盤の温度を２０°Ｃ、プレス圧力はｌ ｋｇ ／ ｃ＋
ｌ、プレス圧締時間を３０秒に設定した。The temperature of the heating plate of the heating press is 170°C1 The temperature of the heating plate of the cooling press is 20°C, the press pressure is l kg/c+
l. The press clamping time was set to 30 seconds.
３００ Ｘ ３００ Ｘ １．２ ｍｍの回路板（反り
１．５〜３．０＋ｎｍ）２００枚について反り直しを行
った。200 circuit boards measuring 300 x 300 x 1.2 mm (curvature 1.5 to 3.0+nm) were recurved.
結果は次の通りである。The results are as follows.
処理速度は４枚／分であった。The processing speed was 4 sheets/min.
上記と同じ大きさの回路板（反り１．５〜５．０ｍｍ）
２００枚を５枚毎熱盤間に挟み、圧力１０ｋｇ／分、熱
盤温度１７０°Ｃとした。回路板の最高温度が１５０°
Ｃとなるよう加熱時間を５分間とし、圧力解放時回路板
の温度５０゛ｃとなるよう冷却時間を５分間として、反
り直しを行った。結果は次の通りである。Circuit board of the same size as above (warpage 1.5-5.0mm)
200 sheets were placed between five heating plates at a pressure of 10 kg/min and a heating plate temperature of 170°C. The maximum temperature of the circuit board is 150°
The heating time was set to 5 minutes so that the temperature of the circuit board reached 50 °C, and the cooling time was set to 5 minutes so that the temperature of the circuit board at the time of pressure release was 50 °C. The results are as follows.
第１図は本発明に係るプリント回路板の反り直し装置の
一例を示す概略断面図である。FIG. 1 is a schematic cross-sectional view showing an example of a printed circuit board straightening device according to the present invention.
Claims (1)
を修正するために、直列に配置された２台の加圧プレス
とプリント回路板を移動させるベルトからなり、一台の
加圧プレスがプリント回路板を加熱し、他の一台が冷却
することを特徴とするプリント回路板の反り直し方法。In order to correct the warping of printed circuit boards obtained from thermosetting resin laminates, the system consists of two pressure presses arranged in series and a belt for moving the printed circuit boards, and one pressure press A method for unwarping a printed circuit board, characterized by heating the printed circuit board and cooling the other board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31733987A JPH01160080A (en) | 1987-12-17 | 1987-12-17 | Correction of warpage of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31733987A JPH01160080A (en) | 1987-12-17 | 1987-12-17 | Correction of warpage of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160080A true JPH01160080A (en) | 1989-06-22 |
Family
ID=18087113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31733987A Pending JPH01160080A (en) | 1987-12-17 | 1987-12-17 | Correction of warpage of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160080A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018518044A (en) * | 2015-04-29 | 2018-07-05 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Method and apparatus for correcting deformation of substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6189694A (en) * | 1984-10-09 | 1986-05-07 | ソニー株式会社 | Method and apparatus for correcting shape of printed circuitboard |
-
1987
- 1987-12-17 JP JP31733987A patent/JPH01160080A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6189694A (en) * | 1984-10-09 | 1986-05-07 | ソニー株式会社 | Method and apparatus for correcting shape of printed circuitboard |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018518044A (en) * | 2015-04-29 | 2018-07-05 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Method and apparatus for correcting deformation of substrate |
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