JPS63262227A - Correcting method of laminate plate - Google Patents
Correcting method of laminate plateInfo
- Publication number
- JPS63262227A JPS63262227A JP9617487A JP9617487A JPS63262227A JP S63262227 A JPS63262227 A JP S63262227A JP 9617487 A JP9617487 A JP 9617487A JP 9617487 A JP9617487 A JP 9617487A JP S63262227 A JPS63262227 A JP S63262227A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- heating
- temperature
- cooling
- roll
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 17
- 238000001816 cooling Methods 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000004593 Epoxy Substances 0.000 abstract description 7
- 239000011521 glass Substances 0.000 abstract description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 4
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 abstract description 2
- 239000012774 insulation material Substances 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明はプリント配線板又は絶縁板等に使用する積層板
のそりやねじれ等の変形を矯正する方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for correcting deformations such as warping and twisting of a laminated board used for printed wiring boards, insulating boards, etc.
[従来の技術]
フェノール系、エポキシ系、ポリイミド系の樹脂をもっ
て紙、コンポジット、ガラス布等の基材を接合積層して
なる積層板は、例えば銅箔を貼着するなどして印刷回路
用基板として・用いられている。かかる積層板にそりや
ね・じれ等があると種々の問題が生じる。すなわち積層
板を使って印刷配線板を製造する場合はほとんど自動化
された工程で行われるから、積層板のそり、ねじれによ
る変形量が自動機械の許容公差を外れると自動製造がで
きなくなる。通常、ワーキングサイズで2.0mm以下
が要求されている。又、スクリーン印刷法でレジストを
塗布するときにくそりやねじれがあると、インクのにじ
みを誘い不良品発生の原因となる。ざらに印刷配線板に
部品を搭載するとき、そりやねじれによる変形量が機械
の許容公差を外れると自動搭載ができない。この場合ワ
ーキングサイズで1.2mm以下が要求される。[Prior Art] Laminated boards made by bonding and laminating base materials such as paper, composites, and glass cloth with phenolic, epoxy, and polyimide resins can be used to create printed circuit boards by pasting copper foil, for example. It is used as. If such a laminated board has warpage, twists, twists, etc., various problems occur. In other words, when manufacturing printed wiring boards using laminates, most of the process is automated, so if the amount of deformation due to warping or twisting of the laminate exceeds the tolerance of the automatic machine, automatic manufacturing will no longer be possible. Usually, a working size of 2.0 mm or less is required. Furthermore, if there is a curvature or twist when applying the resist using the screen printing method, the ink may bleed and cause defective products. When mounting components on a printed wiring board, if the amount of deformation due to warpage or twisting exceeds the machine's allowable tolerances, automatic mounting will not be possible. In this case, a working size of 1.2 mm or less is required.
なお、上記のそりやねじれについてはJISC6484
、同C6485等が参照される。Regarding the warping and twisting mentioned above, please refer to JISC6484.
, C6485, etc. are referred to.
そこで従来は積層板の矯正方法として逆そらせ法や加熱
加圧法が知られている。Therefore, the reverse deflection method and the heating and pressing method are conventionally known as methods for straightening laminated plates.
逆そらせ法は、一方向にそりのある材料を逆の方向にそ
りをかけることによりそりを解消する方法で、この方法
には予め材料を加熱して操作する方法もある。加熱加圧
法は、そり、ねじれのある材料を2枚の平板間に静置し
、加熱しながら加圧して矯正する方法である。The reverse deflection method is a method in which a material that is warped in one direction is warped in the opposite direction to eliminate the warp.This method also includes a method in which the material is heated in advance. The heating and pressing method is a method in which a warped or twisted material is placed between two flat plates and heated and pressed to straighten the material.
[発明が解決しようとする問題点]
上記従来法における逆そらせ法は、ねじれに対して効果
が小さく、又、矯正機への積層板の投入方向が限定され
る。すなわち、積層板を反対向に投入するとそりをかえ
って増加させることとなる。ざらにそりの大きざによっ
て与える逆そりの大きさを一々加減しなければならず、
操作が不便である。[Problems to be Solved by the Invention] The conventional reverse deflection method described above has little effect on torsion, and the direction in which the laminate is introduced into the straightening machine is limited. That is, if the laminate is loaded in the opposite direction, the warpage will increase. It is necessary to adjust the size of the reverse warp depending on the size of the warp.
It is inconvenient to operate.
加熱h口圧法は基本的にバッチ式となるので生産性が悪
い。又、接着剤付積層板のように互いに付着する積層板
の矯正には適さない。Since the heating h-mouth pressure method is basically a batch method, productivity is poor. Furthermore, it is not suitable for straightening laminates that adhere to each other, such as laminates with adhesive.
本発明はかかる従来の問題点を解消した比較的簡単な操
作でできる連続式矯正方法である。The present invention is a continuous straightening method that solves these conventional problems and can be performed with relatively simple operations.
[問題点を解決するための手段]
本発明は積層板をその主材が軟化する温度以上に加熱し
、矯正ロールの間を通過させることによって変形を矯正
しながら冷却硬化させることを¥FI徴とする積層板の
矯正方法である。[Means for Solving the Problems] The present invention involves heating a laminate to a temperature higher than the temperature at which its main material softens, and then cooling and hardening it while correcting deformation by passing it between straightening rolls. This is a method for straightening a laminate.
本発明に適用される積層板としては、一般に有機系絶縁
物といわれている紙フェノール積層板、紙エポキシ積層
板、ガラスエポキシ積層板、コンポジット積層板、ガラ
スポリイミド積層板、カラスポリエステル積層板、テト
ロンエポキシ積層板等が挙げられる。これらの表面に銅
箔や接着剤が付着されているものでも差支えない。Examples of laminates applicable to the present invention include paper phenol laminates, which are generally referred to as organic insulators, paper epoxy laminates, glass epoxy laminates, composite laminates, glass polyimide laminates, glass polyester laminates, and Tetron. Examples include epoxy laminates. These may have copper foil or adhesive attached to their surfaces.
主材が軟化する温度以上に加熱するということは前述の
有機系絶縁物の場合、主材でおる高分子樹脂が軟化する
温度以上ということになる。In the case of the above-mentioned organic insulator, heating to a temperature higher than the temperature at which the main material softens means that the temperature is higher than the temperature at which the polymer resin, which is the main material, softens.
この場合、当該高分子樹脂のガラス転位点が目安となる
。すなわち加熱によって一部の分子がガラス転位を起こ
ぜば、多少軟化がはじまるので矯正に効果がでる。そし
てガラス転移点以上の温度でおれば確実に軟化し、有効
である。In this case, the glass transition point of the polymer resin is the standard. In other words, if some molecules undergo glass transition due to heating, they will begin to soften to some extent, which will be effective in straightening. If the temperature is above the glass transition point, it will definitely soften and be effective.
加熱温度の上限はハンドリングに支障をきたさない程度
に軟化する温度である。ロール搬送ができる程度の剛性
を保つ温度である。The upper limit of the heating temperature is the temperature at which the material is softened to the extent that handling is not affected. This is the temperature at which the rigidity is maintained to the extent that it can be transported by roll.
矯正ロールは所定間隔をもって平行に対向する複数のロ
ール対よりなるものである。各ロール径はロールのピッ
チによって決まる。ピッチを小ざくするためにはロール
径を小さくしなければならない。坦実的には許されるた
わみ以上のたわみを出さない機械強度をもつ径であれば
良い。ロールピッチは限りなくゼロに近い方が良い。上
限は目標とするそり、ねじれ率で決まる。そり、ねじれ
率1%を目標として実施した場合には、被矯正板500
mmの長さに対し、80mmのピッチで良い結果が得ら
れた。しかしこれは上限ということではない。The straightening roll is composed of a plurality of pairs of rolls facing each other in parallel with a predetermined interval. The diameter of each roll is determined by the pitch of the rolls. In order to reduce the pitch, the roll diameter must be reduced. Practically speaking, any diameter is sufficient as long as it has mechanical strength that does not cause more deflection than is allowed. It is better for the roll pitch to be as close to zero as possible. The upper limit is determined by the target warpage and twist rate. When the warpage and twisting rate is 1% as the target, the plate to be straightened is 500
Good results were obtained with a pitch of 80 mm for a length of mm. But this is not the upper limit.
矯正ロールの圧力は軟化した積層板を平坦に変形させる
荷重を有すればよい。例えば500mmx 300mm
x 1.6mmtのサイズのガラスエポキシ樹脂板では
、せいぜい1oogの線荷重で充分であった。It is sufficient that the pressure of the straightening roll has a load capable of flattening the softened laminate. For example, 500mm x 300mm
For a glass epoxy resin plate with a size of x 1.6 mmt, a line load of at most 10og was sufficient.
搬送速度は加熱、冷却の手段と条件によって決まり、加
熱冷却の条件が整えばよい。ただ冷却硬化は、確率的に
構成分子のガラス転移がゼロとなる完全な硬化となるま
では水平保持を必要とする。この意味では急冷した方が
設備の負担は小さくなる。冷却手段は空冷と水冷とがあ
るが、冷却速度の調整は空冷の場合には空気温度と風量
により、水冷の場合は水温と水量による。The conveyance speed is determined by the heating and cooling means and conditions, and it is sufficient if the heating and cooling conditions are set. However, cooling hardening requires horizontal maintenance until complete hardening is achieved, at which the glass transition of the constituent molecules is stochastically zero. In this sense, rapid cooling reduces the burden on equipment. Cooling means include air cooling and water cooling, and the cooling rate is adjusted by air temperature and air volume in the case of air cooling, and by water temperature and water volume in the case of water cooling.
[実施例] 以下に本発明の実施例を図面に基づいて説明する。[Example] Embodiments of the present invention will be described below based on the drawings.
第1図において一連の工程は加熱ゾーンと冷却ゾーンと
に分かれ、加熱ゾーンには加熱炉1の中に一定間隔をも
って対置された複数の搬送ロール2が設けられ、その上
下にヒーター3が設けられている。冷却ゾーンには一定
間隔において積層板を挟圧する複数の矯正ロール4が設
けられている。水冷式の場合は冷却ゾーンでスプレー水
等をかける。In FIG. 1, the series of steps is divided into a heating zone and a cooling zone, and the heating zone is provided with a plurality of conveyor rolls 2 placed in opposition at regular intervals in a heating furnace 1, and heaters 3 are provided above and below the conveyor rolls 2. ing. The cooling zone is provided with a plurality of straightening rolls 4 that pinch the laminate at regular intervals. If it is a water-cooled type, spray water, etc. in the cooling zone.
A−1、A−2、A−3の被処理材の積層板で、A−1
は搬送されながら加熱される状態にあるもの、A−2は
主材が軟化した状態にあるもの、A−3は搬送されなが
ら矯正、冷却される状態におるものをそれぞれ示す。A-1 is a laminated plate of treated materials A-1, A-2, and A-3.
A-2 shows a material whose main material is in a softened state, and A-3 shows a material which is being straightened and cooled while being transported.
かかる装置を用いてそり、ねじれの大きさが10mm以
上ある500mm (長さ) x 333mm (巾)
×1.0mm(厚さ)の寸法の紙/フェノール基板(A
)とガラス/エポキシ基板(B)の2種のアンクラッド
積層板について矯正を行った。Using such a device, warp and twist 500mm (length) x 333mm (width) with a twist size of 10mm or more.
Paper/phenol substrate (A
) and glass/epoxy substrate (B), two types of unclad laminates were corrected.
又、比較のため第2図に示すように、3個のロール5.
6.7を図のように配設し、ロール6と7との間にはガ
イドロール8.9を用いてベルト1o@巻回し、その一
部はロール5の下面に密接させてなる逆そらせ試験機を
用いて矯正を行った。ロール6.7の上面とロール5の
下面との差が圧下量で、圧下量は80mmとした。For comparison, as shown in FIG. 2, three rolls 5.
6.7 is arranged as shown in the figure, and a guide roll 8.9 is used between the rolls 6 and 7 to wind the belt 1o@, a part of which is brought into close contact with the lower surface of the roll 5. Correction was performed using a testing machine. The difference between the upper surface of the roll 6.7 and the lower surface of the roll 5 was the amount of reduction, and the amount of reduction was 80 mm.
かかる逆そらせ試験機の基板投入方向11より、ロール
5とベルト10との間に、前記実施例で用いた基板A、
Bと同じ基板を投入し逆そらせ矯正をした。From the substrate input direction 11 of this reverse deflection tester, between the roll 5 and the belt 10, the substrate A used in the above example,
The same board as B was used and the reverse deflection was corrected.
上記実施例と比較例の試験結果を表に示す。The test results of the above examples and comparative examples are shown in the table.
上記表から明らかなとおり1.実施例の場合そり、ねじ
れが5mm以下になった割合はA、Bいずれも100%
であり、しかもそり率およびねじれ率は1%以下となっ
た。比較例に比して効果は顕著であった。As is clear from the table above, 1. In the case of the example, the percentage of warpage and twisting of 5 mm or less was 100% for both A and B.
Moreover, the warpage rate and twist rate were 1% or less. The effect was remarkable compared to the comparative example.
[発明の効果]
本発明によれば、そり、ねじれ等のある積層板を連続的
に精度よく矯正することができる。[Effects of the Invention] According to the present invention, it is possible to continuously and accurately correct a warped, twisted, etc. laminate.
銅箔や接着剤付の積層板でもトラブルなく矯正すること
ができる。Even copper foil or adhesive-coated laminates can be corrected without any trouble.
したがって、プリント配線板、絶縁板等に使って精度の
高い製品を得ることができる。Therefore, highly accurate products can be obtained by using it for printed wiring boards, insulating boards, etc.
第1図は本発明の実施に適した装置の一例の説明図、第
2図は逆そらせ試験機の説明図である。
1・・・加熱炉、2・・・搬送ロール、3・・・ヒータ
ー、4・・・矯正ロール、5,6.7・・・ロール、8
.9・・・ガイドロール、10・・・ベルト、11・・
・基板投入方向。FIG. 1 is an explanatory diagram of an example of an apparatus suitable for implementing the present invention, and FIG. 2 is an explanatory diagram of a reverse deflection tester. DESCRIPTION OF SYMBOLS 1... Heating furnace, 2... Conveyance roll, 3... Heater, 4... Straightening roll, 5, 6.7... Roll, 8
.. 9...Guide roll, 10...Belt, 11...
- Board loading direction.
Claims (1)
ールの間を通過させることによって変形を矯正しながら
冷却硬化させることを特徴とする積層板の矯正方法。A method for straightening a laminate, which comprises heating the laminate to a temperature higher than that at which the main material of the laminate softens, and passing it between straightening rolls to correct deformation while cooling and hardening.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9617487A JPS63262227A (en) | 1987-04-21 | 1987-04-21 | Correcting method of laminate plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9617487A JPS63262227A (en) | 1987-04-21 | 1987-04-21 | Correcting method of laminate plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63262227A true JPS63262227A (en) | 1988-10-28 |
Family
ID=14157960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9617487A Pending JPS63262227A (en) | 1987-04-21 | 1987-04-21 | Correcting method of laminate plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63262227A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01152684A (en) * | 1987-12-09 | 1989-06-15 | Sumitomo Bakelite Co Ltd | Method of correcting warpage of printed circuit board |
JPH01272188A (en) * | 1988-04-25 | 1989-10-31 | Matsushita Electric Works Ltd | Method of correcting warpage of printed circuit board |
EP0514915A2 (en) * | 1991-05-24 | 1992-11-25 | GAO Gesellschaft für Automation und Organisation mbH | Process and device for post-treatment of a multilayered, curved laminate |
JP2002283470A (en) * | 2001-03-26 | 2002-10-03 | Sumitomo Bakelite Co Ltd | Method for producing laminated plate |
WO2007059413A1 (en) * | 2005-11-10 | 2007-05-24 | Datacard Corporation | De-bowing personalized cards |
JP2010203546A (en) * | 2009-03-04 | 2010-09-16 | Nok Corp | Seal ring reforming method, seal ring reforming device and seal ring |
US9381695B2 (en) | 2013-05-23 | 2016-07-05 | Entrust Datacard Corporation | Card de-bowing mechanism |
-
1987
- 1987-04-21 JP JP9617487A patent/JPS63262227A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01152684A (en) * | 1987-12-09 | 1989-06-15 | Sumitomo Bakelite Co Ltd | Method of correcting warpage of printed circuit board |
JPH01272188A (en) * | 1988-04-25 | 1989-10-31 | Matsushita Electric Works Ltd | Method of correcting warpage of printed circuit board |
EP0514915A2 (en) * | 1991-05-24 | 1992-11-25 | GAO Gesellschaft für Automation und Organisation mbH | Process and device for post-treatment of a multilayered, curved laminate |
JP2002283470A (en) * | 2001-03-26 | 2002-10-03 | Sumitomo Bakelite Co Ltd | Method for producing laminated plate |
WO2007059413A1 (en) * | 2005-11-10 | 2007-05-24 | Datacard Corporation | De-bowing personalized cards |
US7784700B2 (en) | 2005-11-10 | 2010-08-31 | Datacard Corporation | De-bowing personalized cards |
JP2010203546A (en) * | 2009-03-04 | 2010-09-16 | Nok Corp | Seal ring reforming method, seal ring reforming device and seal ring |
US9381695B2 (en) | 2013-05-23 | 2016-07-05 | Entrust Datacard Corporation | Card de-bowing mechanism |
US9751253B2 (en) | 2013-05-23 | 2017-09-05 | Entrust Datacard Corporation | Card de-bowing mechanism |
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