JP2002283470A - Method for producing laminated plate - Google Patents
Method for producing laminated plateInfo
- Publication number
- JP2002283470A JP2002283470A JP2001087831A JP2001087831A JP2002283470A JP 2002283470 A JP2002283470 A JP 2002283470A JP 2001087831 A JP2001087831 A JP 2001087831A JP 2001087831 A JP2001087831 A JP 2001087831A JP 2002283470 A JP2002283470 A JP 2002283470A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- laminated plate
- heat
- rolls
- roll
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、内部歪みの少ない
積層板の製造方法に関するものである。本発明の製造方
法は特に、寸法変化率の小さなガラス織布基材エポキシ
樹脂銅張積層板あるいはガラス織布／ガラス不織布基材
エポキシ樹脂銅張積層板の製造に好適に用いられる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated board having less internal distortion. The production method of the present invention is particularly suitably used for producing a glass woven substrate epoxy resin copper-clad laminate or a glass woven / glass nonwoven substrate epoxy resin copper-clad laminate having a small dimensional change rate.
【０００２】[0002]
【従来の技術】積層板は、プリント配線板用、構造用、
重電機器用などに用いられており、特にプリント配線板
は、家庭用民生機器から高機能産業用機器に至るまで非
常に広範な分野の電気製品に使用されている。一般にプ
リント配線板材料として用いられる積層板は、熱硬化性
樹脂、硬化剤を主成分とする樹脂組成物を、ガラス繊維
織布等の基材に含浸・乾燥させて得られるプリプレグを
銅箔などの金属箔とともに積層し、加熱加圧して製造さ
れる。これらは使用される基材や熱硬化性樹脂の種類な
どによって様々なグレードが存在し、用途によって使い
分けが行われている。2. Description of the Related Art Laminates are used for printed wiring boards, structures,
It is used for heavy electrical equipment and the like, and in particular, printed wiring boards are used for electrical products in a very wide range of fields from household consumer equipment to high-performance industrial equipment. Laminates generally used as a printed wiring board material include a thermosetting resin, a prepreg obtained by impregnating and drying a resin composition containing a curing agent as a main component into a base material such as a glass fiber woven cloth, and a copper foil or the like. It is manufactured by laminating with metal foil and heating and pressing. There are various grades of these depending on the type of base material and thermosetting resin used, and they are used properly depending on the application.
【０００３】産業用分野において主に用いられるプリン
ト配線板材料はガラス織布基材エポキシ樹脂銅張積層板
あるいはガラス織布／ガラス不織布基材エポキシ樹脂銅
張積層板であるが、コンピュータや携帯電話などの搭載
機器の普及と高機能化により、製品の小型化、高密度化
が進んでいるため、プリント配線板の加工工程における
寸法安定性の向上が要求され、回路加工時や部品実装時
の位置ずれを小さく抑えられるような、内部歪みの少な
い材料が求められている。[0003] The printed wiring board material mainly used in the industrial field is a glass woven base epoxy resin copper-clad laminate or a glass woven / glass nonwoven base epoxy resin copper-clad laminate. Due to the spread and high functionality of on-board equipment such as products, product miniaturization and densification are progressing, so it is required to improve dimensional stability in the processing process of printed wiring boards, There is a need for a material having a small internal distortion so that the displacement can be kept small.
【０００４】上記のようなプリント配線板に用いられる
積層板を積層成形する場合には、熱盤間に銅箔、プリプ
レグ、鏡面板等を複数枚積層し加熱加圧成形する多段型
のバッチプレスを使用するのが一般的である。しかし、
積層成型時に積層板に作用する応力や、プリプレグに用
いられている基材、樹脂に起因する歪み、あるいは金属
箔と積層板との熱膨張係数差による影響など、成形後の
積層板には様々な要因による歪みが残留している。しか
も、このような多段プレスでは、熱盤間あるいは多段プ
レス内での位置により、積層成形時に各積層板に作用す
る熱や応力の履歴が異なるため、積層板内部の残留歪み
にもバラツキを生じる。従って、これらの内部歪みに起
因する反り、寸法変化率などの特性をバラツキを抑えか
つ良好なものにするために、内部歪みを低減させる手段
が必要になる。[0004] In the case of laminating a laminate used for a printed wiring board as described above, a multi-stage batch press in which a plurality of copper foils, prepregs, mirror plates, etc. are laminated between hot plates and heated and pressed. It is common to use But,
There are various types of laminates after molding, such as the stress acting on the laminate during lamination molding, the strain caused by the base material and resin used for the prepreg, or the effect of the difference in the thermal expansion coefficient between the metal foil and the laminate. Distortion due to various factors remains. Moreover, in such a multi-stage press, the history of heat and stress acting on each laminated plate at the time of laminating differs depending on the position between the hot plates or in the multi-stage press, so that the residual strain inside the laminated plate also varies. . Therefore, means for reducing the internal strain is required in order to suppress variations in the characteristics such as the warpage and the dimensional change rate due to the internal strain and to make the characteristics good.
【０００５】このような積層板の内部歪みを低減させる
ために、従来から様々な手法が試みられてきた。まず積
層成形工程における手法として、成形工程中での加圧圧
力解放、あるいは一旦成形を終えた積層板を再度低圧で
加熱加圧・冷却する２回加圧法などが挙げられる。しか
し前者は、積層成形に用いる鏡面板と積層板とが密着し
たままの状態であることや、積層板が自重による応力か
ら解放されていない状態であることなどから、歪み低減
効果は充分でなく、後者は、それに加えて生産性が大き
く低下するという問題点があった。[0005] In order to reduce the internal strain of such a laminated plate, various methods have been conventionally attempted. First, as a technique in the lamination molding step, there are a pressure release during the molding step, and a two-pressure method in which the laminated plate once molded is heated and pressurized and cooled again at a low pressure. However, in the former, the mirror plate used for laminating and the laminated plate remain in close contact with each other, or the laminated plate is not released from the stress due to its own weight, etc. However, the latter has a problem that productivity is greatly reduced.
【０００６】また、積層成形後に積層板を処理する方法
としては、熱風方式による加熱、ベルトプレス、ロール
プレス等により再加熱を行うものなどが挙げられる。し
かし、熱風方式による加熱では、気相伝熱に依存するた
め処理時間が長くかかり、また、処理設備内部全体を加
温する必要があるため熱効率が低いという問題点があっ
た。また、ベルトプレス、ロールプレスによる方式で
は、熱効率は改善されるものの、積層板の厚み寸法のバ
ラツキ等に起因する作用効果のバラツキが発生するこ
と、積層板表面に打痕等外観上の欠点を生ずることなど
の問題があった。Further, as a method of treating the laminated plate after the lamination molding, a method of heating by a hot air system, a method of reheating by a belt press, a roll press, or the like can be mentioned. However, the heating by the hot air method has a problem that it takes a long processing time because it depends on gas phase heat transfer, and has a low thermal efficiency because it is necessary to heat the entire inside of the processing equipment. In the method using a belt press or a roll press, although the thermal efficiency is improved, variations in the function and effect due to variations in the thickness of the laminate, etc., and appearance defects such as dents on the laminate surface are caused. There were problems such as what would happen.
【０００７】[0007]
【発明が解決しようとする課題】本発明は、金属箔張積
層板の特性や外観に影響を与えることなく、残留してい
る内部歪みを効率よく低減する方法を提供するものであ
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for efficiently reducing residual internal strain without affecting the characteristics and appearance of a metal-clad laminate.
【０００８】[0008]
【課題を解決するための手段】本特許は、（１）加熱加
圧成形後の積層板が移動する通路の上下に、ロール間隙
（Ｘ）を前記積層板の厚み寸法（Ｙ）以上に設定した少
なくとも一対の加熱ロールを配置し、前記積層板を該ロ
ール間に通し上下のロールに順次接触させることを特徴
とする積層板の製造方法、（２）積層板移動方向におけ
るロールの軸間距離（Ｚ）が、０＜Ｚ≦２００ｍｍであ
ることを特徴とする請求項１記載の積層板の製造方法、
（３）ロールに接触させる積層板の方向を、基材方向又
は基材と直交方向、あるいはこれらの組み合わせとする
ことを特徴とする請求項１又は２記載の積層板の製造方
法、（４）ロールに接触させる前に、積層板を予熱する
ことを特徴とする請求項１乃至３のいずれかに記載の積
層板の製造方法、である。According to the present invention, (1) the roll gap (X) is set to be equal to or greater than the thickness dimension (Y) of the laminated plate above and below the path in which the laminated plate after heating and pressing is moved. Wherein at least one pair of heating rolls is disposed, and the laminate is passed between the rolls and is sequentially brought into contact with upper and lower rolls. (2) Distance between roll axes in the laminate moving direction The method of claim 1, wherein (Z) is 0 <Z ≦ 200 mm,
(3) The method for producing a laminate according to claim 1 or 2, wherein the direction of the laminate to be brought into contact with the roll is a substrate direction, a direction orthogonal to the substrate, or a combination thereof. The method for producing a laminate according to any one of claims 1 to 3, wherein the laminate is preheated before the laminate is brought into contact with the roll.
【０００９】[0009]
【発明の実施の形態】本発明は、積層板の通路の上下に
配した１対以上の熱ロールを設置し、この熱ロール間に
積層板を通し、上下熱ロール表面に連続的に接触させて
積層板を加熱することを特徴とする。BEST MODE FOR CARRYING OUT THE INVENTION According to the present invention, one or more pairs of heat rolls are provided above and below a passage of a laminated plate, and the laminated plate is passed between the heated rolls so as to continuously contact the surfaces of the upper and lower heat rolls. And heating the laminate.
【００１０】積層板の内部歪みは、その製造工程におい
て積層板に種々の熱や応力が作用し、これらによる歪み
がその状態のまま冷却され保持されていることに起因す
る。従って、この歪みを低減させるためには、積層板に
用いている樹脂のガラス転移温度や軟化温度付近もしく
はそれ以上に積層板の温度を上げることが必要であり、
この操作により歪みが解放され、積層板としての内部歪
を低減させることが出来る。[0010] The internal distortion of the laminated plate is caused by various heats and stresses acting on the laminated plate in the manufacturing process, and the distortion due to these is cooled and held as it is. Therefore, in order to reduce this distortion, it is necessary to raise the temperature of the laminate near or above the glass transition temperature and softening temperature of the resin used for the laminate,
By this operation, the strain is released, and the internal strain as a laminate can be reduced.
【００１１】本発明においては、熱ロールと積層板を接
触させることにより伝熱を行い、積層板を昇温する。こ
の方法では、熱風加熱による気相伝熱と比較し、数十倍
もしくはそれ以上の速度で昇温が可能であるが、熱ロー
ルと積層板の接触面積は小さく、接触時間も短いので、
必要な温度に昇温させるためには、２対以上の熱ロール
を用いることが好ましい。熱ロールの温度については、
積層板に用いている基材、樹脂等の種類や、必要とされ
る歪の低減度により適宜設定すればよい。一例を挙げる
と、エポキシ樹脂積層板を処理する場合は８０〜２３０
℃であり、ポリイミド樹脂積層板の場合は１３０〜２８
０℃が好ましい。In the present invention, heat transfer is performed by bringing a hot roll into contact with a laminate, and the temperature of the laminate is raised. In this method, the temperature can be raised at a speed of several tens or more times as compared with the gas phase heat transfer by hot air heating, but since the contact area between the hot roll and the laminate is small and the contact time is short,
In order to raise the temperature to a required temperature, it is preferable to use two or more pairs of hot rolls. For the temperature of the heat roll,
What is necessary is just to set suitably according to the kind of base material, resin, etc. used for a laminated board, and the required degree of distortion reduction. For example, when processing an epoxy resin laminate, 80 to 230
° C and 130 to 28 in the case of a polyimide resin laminate.
0 ° C. is preferred.
【００１２】熱ロール表面と積層板との温度差は、３０
〜２００℃とすることが好ましい。温度差は大きい方が
積層板の昇温速度は速いが、２００℃を越えると、金属
箔表面の変質や急激な温度上昇による積層板の変形等が
起こることがある。また、温度差が３０℃未満では昇温
速度が小さく実用的でない。従って、積層板温度に対し
て段階的に熱ロールの温度や温度差を設定することによ
り効率的な昇温が可能となり、この点でも複数対の熱ロ
ールを用いることが好ましい。The temperature difference between the hot roll surface and the laminate is 30
The temperature is preferably set to 200 ° C. The larger the temperature difference, the faster the rate of temperature rise of the laminate. However, if the temperature exceeds 200 ° C., the metal foil surface may be altered or the laminate may be deformed due to a rapid temperature rise. On the other hand, if the temperature difference is less than 30 ° C., the rate of temperature rise is too small to be practical. Therefore, by setting the temperature and the temperature difference of the heat roll stepwise with respect to the temperature of the laminate, it is possible to efficiently raise the temperature. In this respect, it is preferable to use a plurality of pairs of heat rolls.
【００１３】また、積層板を熱ロールで加熱する直前に
予熱し、積層板を適当な温度まで昇温することもでき
る。積層板を予熱することにより、歪みの低減に必要な
熱ロールの数を減らすことができる。予熱方法として
は、熱風あるいは遠赤外線等の電熱ヒーターを用いるの
が一般的である。予熱工程の有無については特に限定せ
ず、設備能力、処理枚数、積層板の特性、設備の設置ス
ペース等を勘案した上で適宜選択すればよい。Further, the laminate may be preheated just before being heated by the hot roll, and the temperature of the laminate may be raised to an appropriate temperature. Preheating the laminate can reduce the number of hot rolls required to reduce distortion. As a preheating method, it is common to use an electric heater such as hot air or far infrared rays. The presence or absence of the preheating step is not particularly limited, and may be appropriately selected in consideration of the facility capacity, the number of sheets to be processed, the characteristics of the laminate, the installation space of the facility, and the like.
【００１４】また、複数対の熱ロールを用いる場合、熱
ロール間で積層板からの熱放出が起こり熱効率が低下す
ることがあるので、熱ロールが設置された部位を断熱素
材で囲むなどして外部への熱放散を防いだり、熱ロール
間で熱風や遠赤外線ヒーターなどを用いて積層板を補助
的に加温することもできる。When a plurality of pairs of heat rolls are used, heat may be released from the laminate between the heat rolls and the heat efficiency may be reduced. Therefore, a portion where the heat rolls are installed is surrounded by a heat insulating material. It is also possible to prevent heat dissipation to the outside, or to supplementarily heat the laminate using hot air or a far-infrared heater between hot rolls.
【００１５】本発明において用いられる熱ロールの間隙
（Ｘ）は、処理する積層板の厚み寸法（Ｙ）以上に設定
する。熱ロールの間隙（Ｘ）が積層板の厚み寸法（Ｙ）
より小さいと、処理時に積層板に圧力が作用し、内部歪
みの低減を行うことが難しくなるばかりでなく、新たな
歪みを積層板に加えることになる場合があり、積層板表
面の外観にも悪影響を及ぼす。一方、熱ロールの間隙
（Ｘ）を大きくしすぎると、積層板の上下表面から伝熱
するタイミングのズレが大きくなる。このため、２本の
熱ロールの水平方向の軸間距離（Ｚ）は０＜Ｚ≦２００
ｍｍであることが好ましい。２００ｍｍを越えると、特
に積層板の厚み寸法（Ｙ）が小さい場合には、片側面接
触直後に積層板の形状が変形しやすくなるため、積層板
を上下の熱ロール表面に確実に接触させることが難しく
なる場合がある。より好ましくは５０ｍｍ≦Ｚ≦１００
ｍｍである。The gap (X) between the hot rolls used in the present invention is set to be equal to or larger than the thickness (Y) of the laminate to be processed. The gap between the hot rolls (X) is the thickness of the laminate (Y)
If it is smaller, pressure is applied to the laminate at the time of processing, not only is it difficult to reduce internal strain, but also new strain may be applied to the laminate, and the appearance of the laminate surface may also be reduced. Adversely affect. On the other hand, if the gap (X) between the heat rolls is too large, the deviation of the timing at which heat is transferred from the upper and lower surfaces of the laminate becomes large. Therefore, the horizontal center distance (Z) between the two heat rolls is 0 <Z ≦ 200.
mm. If the thickness exceeds 200 mm, especially when the thickness (Y) of the laminate is small, the shape of the laminate is likely to be deformed immediately after one side contact, so that the laminate is surely brought into contact with the upper and lower heat roll surfaces. Can be difficult. More preferably, 50 mm ≦ Z ≦ 100
mm.
【００１６】本発明においては、熱ロール間隙（Ｘ）を
積層板の厚み寸法（Ｙ）以上に設定し、熱ロールに接触
させることで積層板を加熱するため、この処理時に積層
板に二次的な歪みを生ずることなく、内部歪みを低減さ
せることが出来る。同時に、積層板表面に過圧が作用す
ることがないので、加熱により外観を悪化させることが
ない。なお、積層板の厚み寸法（Ｙ）のバラツキや、積
層板に反りなどの変形がある場合は、積層板を熱ロール
に確実に接触させる機能を有する補助的なロール等を熱
ロールの前後に設け、伝熱が効率よく行われるようにす
ればよい。In the present invention, the gap between the hot rolls (X) is set to be equal to or larger than the thickness (Y) of the laminate, and the laminate is heated by being brought into contact with the hot roll. The internal distortion can be reduced without causing any mechanical distortion. At the same time, since no overpressure acts on the surface of the laminate, the appearance does not deteriorate due to heating. If the thickness of the laminate (Y) varies or the laminate has deformation such as warpage, an auxiliary roll or the like having a function of securely contacting the laminate with the hot roll is placed before and after the hot roll. It is sufficient to provide heat transfer efficiently.
【００１７】本発明の製造方法では通常、積層板を１枚
ずつ連続的に処理する。処理速度については特に限定し
ないが、積層板の種類や要求される歪みの低減度、設備
の処理能力等を勘案し、かつ積層板が熱ロールから安定
した伝熱を受けられるような速度に設定すればよい。In the manufacturing method of the present invention, usually, the laminates are continuously processed one by one. The processing speed is not particularly limited, but is set to a speed that allows the laminated plate to receive stable heat transfer from the heat roll in consideration of the type of the laminated plate, the required degree of distortion reduction, the processing capacity of the equipment, and the like. do it.
【００１８】本発明の製造方法により、積層板は表裏両
側より熱ロールから伝熱され、歪みが開放される。加熱
後の積層板は取り扱いが可能な温度まで冷却する必要が
あるが、冷却方法としては、自然放冷、強制冷却のいず
れの方法を用いてもよい。ただし、加温後の積層板は剛
性が低下しているため、変形等が起こらないように積層
板を保持するなどしながら冷却することが好ましい。According to the manufacturing method of the present invention, the laminate is transferred from the heat roll from both the front and back sides to release the distortion. The heated laminated plate needs to be cooled to a temperature at which it can be handled. As a cooling method, any of natural cooling and forced cooling may be used. However, since the rigidity of the laminated plate after the heating is reduced, it is preferable to cool the laminated plate while holding the laminated plate so as not to deform.
【００１９】本発明で用いる熱ロールの材質は特に限定
しないが、熱容量、伝熱速度、耐摩耗性、耐腐食性等を
考慮すると、ステンレスのような金属を用いるのが好ま
しい。また、加熱に用いる熱媒としては、熱媒油、蒸
気、加圧水などが挙げられるが、熱容量が大きく熱ロー
ル表面温度を均一に保ちやすい、漏洩しにくい、などの
点で、熱媒油を用いるのが好ましい。熱ロールの径寸法
についても特に限定しないが、熱ロール径は大きい方が
積層板とのみかけの接触面積は大きくとれるものの、設
備が大型化すること等を考慮すると、３０〜５００ｍｍ
のものがよく、好ましくは２００〜３００ｍｍである。The material of the heat roll used in the present invention is not particularly limited, but it is preferable to use a metal such as stainless steel in consideration of heat capacity, heat transfer rate, wear resistance, corrosion resistance and the like. Examples of the heat medium used for heating include heat medium oil, steam, and pressurized water, and heat medium oil is used because heat capacity is large, it is easy to keep the heat roll surface temperature uniform, and it is difficult to leak. Is preferred. Although the diameter of the hot roll is not particularly limited, the larger the hot roll diameter is, the larger the apparent contact area with the laminated plate can be. However, considering that the equipment becomes large, it is 30 to 500 mm.
And preferably 200 to 300 mm.
【００２０】本発明における積層板の加熱処理において
は、熱ロールに接触させる積層板の方向を任意に選択
し、あるいは組み合わせることができる。本発明の処理
においては、ある一方向について処理を行うと、熱ロー
ルと積層板との接触線方向において顕著に内部歪みが低
減する。従って、積層板全体の内部歪みを低減させる場
合は、一方向について処理を行った後、その直交方向で
同様に処理を行うとよい。また、方向によって歪みの低
減具合を変えたい場合などは、処理を一方向のみ行う
か、あるいは処理方向によって熱ロールの数、処理速
度、温度条件を変更するなどによって対応することがで
きる。In the heat treatment of the laminate in the present invention, the direction of the laminate to be brought into contact with the hot roll can be arbitrarily selected or combined. In the process of the present invention, when the process is performed in one direction, the internal strain is significantly reduced in the direction of the contact line between the hot roll and the laminate. Therefore, in order to reduce the internal strain of the entire laminate, it is preferable to perform the processing in one direction and then perform the processing in the orthogonal direction. When it is desired to change the degree of distortion reduction depending on the direction, the processing can be performed only in one direction, or the number of heat rolls, the processing speed, and the temperature condition can be changed depending on the processing direction.
【００２１】本発明において用いられる積層板基材とし
ては、ガラス等の無機繊維、パルプやポリエステル等の
有機繊維からなる織布または不織布が挙げられる。樹脂
としては、熱硬化性樹脂、熱可塑性樹脂いずれも使用可
能であるが、プリント配線板用としては、エポキシ樹
脂、フェノール樹脂、ポリエステル樹脂、ポリイミド樹
脂などの熱硬化性樹脂が主に用いられる。これらの樹脂
に、硬化剤、硬化促進剤、溶剤、その他必要に応じて無
機充填材、着色剤等を配合して用いる。これらの樹脂組
成物を基材に含浸または塗工し、乾燥してプリプレグと
し、このプリプレグの１枚ないし複数枚を、必要に応じ
て金属箔と重ね合わせて加熱加圧成形することで積層板
が得られる。Examples of the laminate substrate used in the present invention include a woven or nonwoven fabric made of inorganic fibers such as glass and organic fibers such as pulp and polyester. As the resin, any of a thermosetting resin and a thermoplastic resin can be used, but for a printed wiring board, a thermosetting resin such as an epoxy resin, a phenol resin, a polyester resin, and a polyimide resin is mainly used. These resins are mixed with a curing agent, a curing accelerator, a solvent, and, if necessary, an inorganic filler, a coloring agent, and the like. A substrate is impregnated or coated with these resin compositions and dried to form a prepreg, and one or more of the prepregs are laminated with a metal foil, if necessary, and heated and pressed to form a laminate. Is obtained.
【００２２】次に、本発明の製造方法の一例について、
図を用いて説明する。図１は本発明の主要部であり、１
は上側熱ロール、２は下側熱ロール、３と４はそれぞれ
に付随した補助ロール、５は積層板搬送装置である。積
層板６は、７の方向から前側補助ロール３の作用により
上側熱ロール１に接触し、上側熱ロール１から積層板上
面８に伝熱を受ける。この後上下の熱ロールの間を経
て、次いで同様に加温された下側熱ロール２から積層板
下面９に伝熱を受ける。当該設備において、熱ロールの
間隙（Ｘ）が積層板の厚み寸法（Ｙ）以上に設定されて
いることが必要であり、さらには、２本の熱ロールの水
平方向の軸間距離（Ｚ）が上述した適切な値になってい
ることが好ましい。図１は本発明に係る製造設備の１ユ
ニットであり、前述したように、このユニットを複数設
置して処理してもよい。Next, an example of the production method of the present invention will be described.
This will be described with reference to the drawings. FIG. 1 shows the main part of the present invention.
Is an upper heat roll, 2 is a lower heat roll, 3 and 4 are auxiliary rolls respectively attached thereto, and 5 is a laminate conveying device. The laminated plate 6 comes into contact with the upper heat roll 1 by the action of the front auxiliary roll 3 from the direction of 7 and receives heat from the upper heat roll 1 to the laminated plate upper surface 8. Thereafter, heat passes through the space between the upper and lower heat rolls, and then receives heat from the similarly heated lower heat roll 2 to the lower surface 9 of the laminate. In the equipment, it is necessary that the gap (X) between the heat rolls is set to be equal to or larger than the thickness dimension (Y) of the laminate, and furthermore, the horizontal axial distance (Z) between the two heat rolls. Preferably has the appropriate value described above. FIG. 1 shows one unit of the manufacturing equipment according to the present invention. As described above, a plurality of units may be installed and processed.
【００２３】また、図２は、本発明の製造方法を適用し
た設備の一例の全体概要図である。１０は積層板供給設
備、１１は予熱設備、１２，１３は図１に示した装置の
各１ユニットであり、１４は冷却設備、１５は積層板搬
出設備である。積層板は、積層板供給設備１０、予熱設
備１１を経て、前記ユニットの熱ロールを通過して加熱
された後、冷却設備１４を経て、積層板搬出設備１５に
より一定単位毎に積載される。FIG. 2 is an overall schematic diagram of an example of equipment to which the manufacturing method of the present invention is applied. Reference numeral 10 denotes a laminated sheet supply facility, 11 denotes a preheating facility, 12 and 13 denote each unit of the apparatus shown in FIG. 1, 14 denotes a cooling facility, and 15 denotes a laminated board unloading facility. The laminates are passed through a laminate feeder 10 and a preheater 11, heated by passing through a heat roll of the unit, heated, cooled, and then stacked by a laminate unloading facility 15 by a fixed unit.
【００２４】[0024]
【実施例】以下、本発明の実施例を比較例とともに詳し
く説明する。Hereinafter, examples of the present invention will be described in detail together with comparative examples.
【００２５】＜積層板（１）の作成＞エポキシ樹脂（油
化シェルエポキシ株式会社製・臭素化エポキシ樹脂エピ
コート５０４８／７０重量％メチルエチルケトン溶液）
を固形分として１００重量部、硬化剤（ジシアンジアミ
ド）５重量部、硬化促進剤（２−エチル−４−メチルイ
ミダゾール）１重量部の比率で混合したものにメチルセ
ルソルブ６３重量部を加え、樹脂ワニスを得た。このワ
ニスに２００ｇ／ｍ2 のガラス織布（日東紡製７６２
８）を浸漬・含浸させた後、１７０℃の乾燥機で４分間
乾燥し、３５０ｇ／ｍ2 のプリプレグＡを得た。これを
８枚重ね、この両側に電解銅箔（日本電解株式会社製
ＦＧＨ−１８μ）を重ね合わせ、１７０℃で１２０分
間、４０ｋｇ／ｃｍ2 で加熱加圧成形し、厚さ１．６ｍ
ｍのガラス織布基材エポキシ樹脂両面銅張積層板を作製
し、１０２０×１０２０ｍｍに裁断した。<Preparation of Laminate (1)> Epoxy resin (Brominated epoxy resin epicoat 5048/70% by weight methyl ethyl ketone solution manufactured by Yuka Shell Epoxy Co., Ltd.)
Was mixed in a ratio of 100 parts by weight as a solid content, 5 parts by weight of a curing agent (dicyandiamide), and 1 part by weight of a curing accelerator (2-ethyl-4-methylimidazole), and 63 parts by weight of methylcellosolve was added. I got a varnish. This varnish was coated with a 200 g / m 2 glass woven fabric (Nitto Boss 762).
8) was immersed and impregnated, and dried in a dryer at 170 ° C. for 4 minutes to obtain 350 g / m 2 of prepreg A. Eight pieces of this are stacked, and electrolytic copper foil (manufactured by Nihon Denki
FGH-18μ), and heated and pressed at 170 ° C. for 120 minutes at 40 kg / cm 2 to a thickness of 1.6 m.
m glass woven substrate epoxy resin double-sided copper-clad laminate was prepared and cut to 1020 × 1020 mm.
【００２６】＜積層板（２）の作成＞エポキシ樹脂（油
化シェルエポキシ株式会社製・臭素化エポキシ樹脂エピ
コート５０４８／７０重量％メチルエチルケトン溶液）
を固形分として１００重量部、硬化剤（ジシアンジアミ
ド）５重量部、硬化促進剤（２−エチル−４−メチルイ
ミダゾール）１重量部の比率で混合したものにメチルセ
ルソルブ６３重量部を加え、樹脂ワニスを得た。このワ
ニスに２００ｇ／ｍ2 のガラス織布（日東紡製７６２
８）を浸漬・含浸させた後、１７０℃の乾燥機で３分間
乾燥し、３５０ｇ／ｍ2 のプリプレグＢを得た。これと
は別に、前記ワニスの固形分１００重量部に対して、無
機充填材として水酸化アルミニウム１００重量部と、コ
ロイダルシリカ５重量部を加えて均一分散したワニス
に、７５ｇ／ｍ2 のガラス不織布（キュムラス株式会社
製 ＥＰＭ−４０７５）を浸漬・含浸させた後、１７０
℃の乾燥機で６分間乾燥し、１４００ｇ／ｍ2 のプリプ
レグＣを得た。このプリプレグＣを３枚重ね、これを２
枚のプリプレグＢではさみ、更に、この両側に電解銅箔
（日本電解株式会社製 ＦＧＨ−１８μ）を重ね合わ
せ、１７０℃で１２０分間、４０ｋｇ／ｃｍ2 で加熱加
圧成形し、厚さ１．６ｍｍのガラス織布／ガラス不織布
基材エポキシ樹脂両面銅張積層板を作製し、１０２０×
１０２０ｍｍに裁断した。<Preparation of Laminated Plate (2)> Epoxy resin (Brominated epoxy resin epicoat 5048/70% by weight methyl ethyl ketone solution manufactured by Yuka Shell Epoxy Co., Ltd.)
Was mixed in a ratio of 100 parts by weight as a solid content, 5 parts by weight of a curing agent (dicyandiamide), and 1 part by weight of a curing accelerator (2-ethyl-4-methylimidazole), and 63 parts by weight of methylcellosolve was added. I got a varnish. This varnish was coated with a 200 g / m 2 glass woven fabric (Nitto Boss 762).
8) was immersed and impregnated, and dried in a dryer at 170 ° C. for 3 minutes to obtain 350 g / m 2 of prepreg B. Separately, 75 g / m 2 of glass non-woven fabric was added to a varnish uniformly dispersed by adding 100 parts by weight of aluminum hydroxide as an inorganic filler and 5 parts by weight of colloidal silica to 100 parts by weight of the solid content of the varnish. After immersion and impregnation (EPM-4075 manufactured by Cumulus Co., Ltd.), 170
Drying was carried out for 6 minutes in a dryer at a temperature of 1 ° C. to obtain prepreg C at 1400 g / m 2 . Three prepregs C are stacked, and two
A piece of prepreg B is sandwiched, and electrolytic copper foil (FGH-18μ manufactured by Nihon Denshi Co., Ltd.) is overlaid on both sides of the prepreg B, and heated and pressed at 170 ° C. for 120 minutes at 40 kg / cm 2 to obtain a thickness of 1. 6mm glass woven fabric / glass nonwoven fabric epoxy resin double-sided copper-clad laminate was prepared and 1020 ×
It was cut to 1020 mm.
【００２７】これらの積層板を用いて、それぞれ以下に
示す条件で加熱処理を行った。実施例及び比較例で示す
処理条件は以下の通りである。 （処理条件） （１）積層板の予熱：積層板の表裏両面から、１５０℃
の熱風で５分間行った。 （２）熱ロールＡ：径３００ｍｍ、長さ１３５０ｍｍ、
表面材質がステンレスであり、内部から熱媒油により１
６０℃に温度調節されているものを上下に１本ずつ配置
して使用した。 （３）熱ロールＢ：熱ロールＡと同様のものを２００℃
に温度調節して使用した。 （４）熱ロールＣ：熱ロールＡと同様のものを２３０℃
に温度調節して使用した。 （５）熱ロール間隙（Ｘ）：熱ロールＡ、Ｂ、Ｃいずれ
も１０ｍｍに設定した。 （６）熱ロールの水平方向の軸間距離（Ｚ）：熱ロール
Ａ、Ｂ、Ｃいずれも、７１．７ｍｍである。Using these laminates, a heat treatment was performed under the following conditions. The processing conditions shown in Examples and Comparative Examples are as follows. (Treatment conditions) (1) Preheating of laminate: 150 ° C. from both sides of laminate
For 5 minutes. (2) Heat roll A: diameter 300 mm, length 1350 mm,
The surface material is stainless steel.
Those whose temperature was controlled to 60 ° C. were used by arranging them one by one at the top and bottom. (3) Hot roll B: The same as hot roll A at 200 ° C.
The temperature was adjusted and used. (4) Hot roll C: 230 ° C. similar to hot roll A
The temperature was adjusted and used. (5) Hot roll gap (X): The hot rolls A, B, and C were all set to 10 mm. (6) Horizontal distance (Z) between the hot rolls in the horizontal direction: All of the hot rolls A, B, and C are 71.7 mm.
【００２８】＜実施例１＞積層板（１）を用い、積層板
の予熱処理は行わず、積層板基材方向（基材の縦糸方
向）に０．４ｍ／分の速度で熱ロールＡ、Ｂ、Ｃに順次
接触させて加熱処理を行った。その後、積層板基材方向
と直交方向に同様に処理を行った。 ＜実施例２＞積層板（１）を用い、予熱処理を行ったの
ち、積層板基材方向に０．４ｍ／分の速度で熱ロール
Ｂ、Ｃに順次接触させて処理を行った。その後、積層板
基材方向と直交方向に同様に処理を行った。 ＜実施例３＞積層板（２）を用いた以外は、実施例１と
同様の処理を行った。 ＜実施例４＞積層板（２）を用いた以外は、実施例２と
同様の処理を行った。<Example 1> Using the laminate (1), pre-heat treatment of the laminate was not performed, and the hot roll A was moved at a speed of 0.4 m / min in the direction of the laminate base material (the warp direction of the base material). Heat treatment was performed by sequentially contacting B and C. Thereafter, the same treatment was performed in the direction orthogonal to the direction of the laminate base material. <Example 2> A pre-heat treatment was performed using the laminated plate (1), and the treatment was performed by sequentially contacting the heat rolls B and C in the direction of the laminated substrate at a speed of 0.4 m / min. Thereafter, the same treatment was performed in the direction orthogonal to the direction of the laminate base material. <Example 3> The same processing as in Example 1 was performed except that the laminated plate (2) was used. <Example 4> The same processing as in Example 2 was performed except that the laminated plate (2) was used.
【００２９】次に、比較のために積層板に以下の処理を
行った。比較例３と比較例６は処理をしない場合であ
る。 ＜比較例１＞積層板（１）を用い、積層板の予熱処理は
行わず、積層板基材方向に０．４ｍ／分の速度で熱ロー
ルＡ、Ｂ、Ｃに順次接触させて処理を行った。各熱ロー
ルの上下間隙（Ｘ）は全て１．５ｍｍに設定した。処理
後、積層板基材方向と直交方向に同様に処理を行った。 ＜比較例２＞積層板（１）を用い、熱風乾燥機で処理を
行った。 熱風乾燥機処理条件：熱風乾燥機で、横置き型ラックに
１枚ずつのせた積層板を処理した。処理条件は１６０℃
４０分間である。 ＜比較例３＞積層板（１）を用い、処理を行わずに評価
した。 ＜比較例４＞積層板（２）を用いた以外は、比較例１と
同様の処理を行った。 ＜比較例５＞積層板（２）を用い、熱風乾燥機で処理を
行った。処理条件は比較例２と同じである。 ＜比較例６＞積層板（２）を用い、処理を行わずに評価
した。Next, the following treatment was performed on the laminate for comparison. Comparative Example 3 and Comparative Example 6 are cases where no processing is performed. <Comparative Example 1> Using the laminate (1), pre-heat treatment of the laminate was not performed, and the treatment was performed by sequentially contacting the heat rolls A, B, and C at a speed of 0.4 m / min in the laminate substrate direction. went. The upper and lower gaps (X) of each heat roll were all set to 1.5 mm. After the treatment, the same treatment was performed in the direction orthogonal to the direction of the laminate base material. <Comparative Example 2> The laminate (1) was treated with a hot air drier. Hot air dryer processing conditions: Laminated boards placed one by one on a horizontal rack were processed using a hot air dryer. Processing conditions are 160 ° C
40 minutes. <Comparative Example 3> The laminate (1) was evaluated without treatment. <Comparative Example 4> The same treatment as in Comparative Example 1 was performed except that the laminated plate (2) was used. <Comparative Example 5> The laminate (2) was treated with a hot air dryer. The processing conditions are the same as in Comparative Example 2. <Comparative Example 6> The laminate (2) was evaluated without treatment.
【００３０】以上のようにして得られた各銅張積層板に
ついて、表１の各項目について評価を行った。結果を表
１に示す。Each of the copper-clad laminates obtained as described above was evaluated for each item in Table 1. Table 1 shows the results.
【表１】 [Table 1]
【００３１】（測定方法） （ａ）銅箔表面の外観：目視により観察し、打痕の有無
を確認した。 ○：打痕なし ×：打痕あり （ｂ）成形性：銅張積層板の両面銅箔を全面エッチング
して、樹脂層／基材層間の剥がれの有無を目視で確認し
た。 ○：剥がれなし ×：剥がれあり （ｃ）積層板反り（最大）：１０２０ｍｍ×１０２０ｍ
ｍの積層板を定盤上に置き、１辺について８０ｍｍピッ
チで１２点で定盤から積層板下面までの高さを測定し、
これを４辺について同様に行い、合計４８点の値の最大
値を求めた。 （ｄ）積層板反り（平均）：上記で測定した反り値の平
均値を求めた。 （ｅ）寸法変化率（１）：処理後の積層板を３４０×３
４０ｍｍに裁断し、９枚の試料を作成した。この各々に
ついて、３００ｍｍ×３００ｍｍの正方形の４角部に相
当する点に１．０ｍｍφの穴をドリルであけ、基材方向
側の２辺について２点間距離を測定した。次に、この積
層板の銅箔を両面全面エッチング除去し、１７０℃の熱
風乾燥機で３０分間処理を行なった後、２点間距離を再
度測定し、初期値に対する変化率（％）を求め、この値
の平均値（９枚×２辺＝１８）を算出した。測定には、
５００ｍｍ×５００ｍｍまで測定可能で最小目盛が０．
００５ｍｍの二次元座標測定装置を用いた。 （ｆ）寸法変化率（２）：寸法変化率（１）と同様に、
基材直交側方向について実施した。 （ｇ）銅箔引き剥がし強さ：ＪＩＳ Ｃ ６４８１ に
準じて測定した。 （ｈ）半田耐熱性：５０×５０ｍｍの試験片を、片面全
面エッチングした試料（表裏面について各々用意した）
を、それぞれ（１）沸騰水処理２時間、（２）１２１℃
プレッシャークッカー処理１時間、を行い、次いで２６
０℃の半田浴に３０秒間浸漬し、ふくれの有無を観察し
た。 ○：ふくれなし ×：ふくれあり(Measurement Method) (a) Appearance of Copper Foil Surface: Visual observation was made to confirm the presence or absence of dents. ：: no dent ×: dent (b) Formability: Both surfaces of the copper-clad laminate were etched over the entire surface, and the presence or absence of peeling between the resin layer / base layer was visually checked. ：: No peeling ×: Peeling (c) Laminate warpage (maximum): 1020 mm × 1020 m
m on the platen, measure the height from the platen to the lower surface of the laminate at 12 points at 80 mm pitch on one side,
This was similarly performed for four sides, and the maximum value of a total of 48 points was obtained. (D) Laminate warpage (average): The average of the warpage values measured above was determined. (E) Dimensional change rate (1): Laminated plate after treatment is 340 × 3
The sample was cut into 40 mm, and nine samples were prepared. For each of these, a hole of 1.0 mmφ was drilled at a point corresponding to the four corners of a 300 mm × 300 mm square, and the distance between the two points on the two sides on the substrate direction side was measured. Next, the copper foil of this laminated board was etched and removed on both sides of the entire surface, and treated with a hot-air dryer at 170 ° C. for 30 minutes. The average value of these values (9 sheets × 2 sides = 18) was calculated. For the measurement,
It can measure up to 500mm x 500mm and the minimum scale is 0.
A 005 mm two-dimensional coordinate measuring device was used. (F) Dimensional change rate (2): Like dimensional change rate (1),
It carried out about the direction orthogonal to a base material. (G) Peeling strength of copper foil: Measured according to JIS C6481. (H) Solder heat resistance: A sample obtained by etching a test piece of 50 × 50 mm on one side and the entire surface (prepared on both sides).
(1) 2 hours of boiling water treatment, (2) 121 ° C.
1 hour pressure cooker treatment, then 26
It was immersed in a solder bath at 0 ° C. for 30 seconds, and the presence or absence of blisters was observed. ○: No blister ×: With blister
【００３２】表１の結果より、積層板１を用いた場合で
は、３対の熱ロールを使用した実施例１，積層板の予熱
を行い２対の熱ロールを使用した実施例２のいずれにお
いても、未処理の比較例３と比較して、他の特性に影響
を与えることなく寸法変化率が小さくなっており、内部
歪みの低減が認められた。比較例２は、熱ロールのかわ
りに熱風乾燥機を用いて処理を行ったが、寸法変化率に
低減効果はみられたものの反り値が増加した。一方、比
較例１は実施例１と同様に３対の熱ロールを使用してい
るが、熱ロールの間隙を積層板の厚みより小さく設定し
ているため、積層板外観、反りにおいて悪化する結果と
なった。また、実施例３，４及び比較例４，５，６は、
積層板２を用いたが、ほとんど同様の効果・傾向が確認
された。From the results shown in Table 1, when the laminated plate 1 is used, in any one of the first embodiment using three pairs of hot rolls and the second embodiment using two pairs of hot rolls after preheating the laminated plate. Also, as compared with the untreated Comparative Example 3, the dimensional change rate was reduced without affecting other characteristics, and a reduction in internal strain was observed. In Comparative Example 2, the treatment was performed using a hot-air dryer instead of the hot roll, but the warpage value was increased, although the dimensional change rate was reduced. On the other hand, Comparative Example 1 uses three pairs of heat rolls as in Example 1, but the gap between the heat rolls is set to be smaller than the thickness of the laminate, resulting in deterioration in the appearance and warpage of the laminate. It became. Examples 3 and 4 and Comparative Examples 4, 5, and 6
Although the laminate 2 was used, almost the same effect and tendency were confirmed.
【００３３】[0033]
【発明の効果】本発明は、積層板の内部歪みを低減させ
るために、積層板を上下の熱ロールに連続的に接触させ
ることにより、積層板の特性や外観に影響を与えること
なく、積層板に残留する内部歪みを効率よく低減するこ
とができる。従って、本発明は、寸法変化率の小さなガ
ラス織布基材エポキシ樹脂銅張積層板及びガラス織布／
ガラス不織布基材エポキシ樹脂銅張積層板の製造に好適
に用いることができる。According to the present invention, in order to reduce the internal distortion of the laminate, the laminate is continuously brought into contact with the upper and lower heat rolls, so that the laminate can be laminated without affecting its properties and appearance. Internal distortion remaining in the plate can be efficiently reduced. Accordingly, the present invention provides a glass woven substrate-based epoxy resin copper-clad laminate having a small dimensional change
It can be suitably used for manufacturing a glass nonwoven fabric base epoxy resin copper-clad laminate.
【図１】 本発明における要部の概略断面図。FIG. 1 is a schematic sectional view of a main part of the present invention.
【図２】 本発明を適用した工程の概略断面図。FIG. 2 is a schematic sectional view of a process to which the present invention is applied.
Ｘ 熱ロールの間隙 Ｙ 積層板の厚み寸法 Ｚ 熱ロールの水平方向の軸間距離 １ 上側熱ロール ２ 下側熱ロール ３ 補助ロール ４ 補助ロール ５ 積層板搬送装置 ６ 積層板 ７ 積層板の搬入方向 ８ 積層板上面 ９ 積層板下面 １０ 積層板供給設備 １１ 積層板予熱設備 １２ 図１の装置ユニット（１） １３ 図１の装置ユニット（２） １４ 積層板冷却設備 １５ 積層板搬出設備 X Heat roll gap Y Laminate board thickness dimension Z Heat roll horizontal axis distance 1 Upper heat roll 2 Lower heat roll 3 Auxiliary roll 4 Auxiliary roll 5 Laminate board transfer device 6 Laminate board 7 Laminate loading direction Reference Signs List 8 laminated plate upper surface 9 laminated plate lower surface 10 laminated plate supply equipment 11 laminated plate preheating equipment 12 equipment unit (1) in FIG. 1 13 equipment unit (2) in FIG. 1 14 laminated board cooling equipment 15 laminated board unloading equipment
Claims (4)
の上下に、ロール間隙（Ｘ）を前記積層板の厚み寸法
（Ｙ）以上に設定した少なくとも一対の加熱ロールを配
置し、前記積層板を該ロール間に通し上下のロールに順
次接触させることを特徴とする積層板の製造方法。At least one pair of heating rolls having a roll gap (X) set to be equal to or greater than a thickness dimension (Y) of the laminated plate is disposed above and below a passage in which the laminated plate after the heat and pressure molding moves. A method for manufacturing a laminate, comprising passing the laminate between the rolls and sequentially contacting the upper and lower rolls.
離（Ｚ）が、０＜Ｚ≦２００ｍｍであることを特徴とす
る請求項１記載の積層板の製造方法。2. The method for producing a laminate according to claim 1, wherein the center distance (Z) between the rolls in the laminate moving direction is 0 <Z ≦ 200 mm.
材方向又は基材と直交方向、あるいはこれらの組み合わ
せとすることを特徴とする請求項１又は２記載の積層板
の製造方法。3. The method for producing a laminate according to claim 1, wherein the direction of the laminate to be brought into contact with the roll is a substrate direction, a direction orthogonal to the substrate, or a combination thereof.
することを特徴とする請求項１乃至３のいずれかに記載
の積層板の製造方法。4. The method for producing a laminate according to claim 1, wherein the laminate is preheated before the laminate is brought into contact with the roll.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001087831A JP4238484B2 (en) | 2001-03-26 | 2001-03-26 | Laminate production method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001087831A JP4238484B2 (en) | 2001-03-26 | 2001-03-26 | Laminate production method |
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| Publication Number | Publication Date |
|---|---|
| JP2002283470A true JP2002283470A (en) | 2002-10-03 |
| JP4238484B2 JP4238484B2 (en) | 2009-03-18 |
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|---|---|---|---|
| JP2001087831A Expired - Fee Related JP4238484B2 (en) | 2001-03-26 | 2001-03-26 | Laminate production method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008041679A (en) * | 2006-08-01 | 2008-02-21 | Matsushita Electric Ind Co Ltd | Manufacturing method of circuit formation substrate |
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| JPS6189033A (en) * | 1985-10-04 | 1986-05-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminate |
| JPS6250135A (en) * | 1985-08-29 | 1987-03-04 | 川崎製鉄株式会社 | Method of correcting shape of composite laminated steel plate |
| JPS6256142A (en) * | 1985-09-06 | 1987-03-11 | 川崎製鉄株式会社 | Manufacture of composite laminated steel plate |
| JPS63262227A (en) * | 1987-04-21 | 1988-10-28 | Nippon Mining Co Ltd | Correcting method of laminate plate |
| JPH02133792A (en) * | 1988-11-15 | 1990-05-22 | Hitachi Chem Co Ltd | Warpage correction apparatus and method for metallic foil-clad laminated plate |
| JPH02269049A (en) * | 1989-04-11 | 1990-11-02 | Kawasaki Steel Corp | Press-bonding apparatus for damping steel plate |
| JPH08118540A (en) * | 1994-10-20 | 1996-05-14 | Toshiba Chem Corp | Production of copper clad laminated sheet |
| JPH09314738A (en) * | 1996-05-30 | 1997-12-09 | Matsushita Electric Works Ltd | Manufacture of laminated sheet |
| JPH106437A (en) * | 1996-06-21 | 1998-01-13 | Matsushita Electric Works Ltd | Manufacture of metal foil stuck laminated sheet |
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2001
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60260336A (en) * | 1984-06-08 | 1985-12-23 | 鐘淵化学工業株式会社 | Method and device for correcting warpage of one-side metallic-foil lined laminated board for printed circuit substrate |
| JPS6250135A (en) * | 1985-08-29 | 1987-03-04 | 川崎製鉄株式会社 | Method of correcting shape of composite laminated steel plate |
| JPS6256142A (en) * | 1985-09-06 | 1987-03-11 | 川崎製鉄株式会社 | Manufacture of composite laminated steel plate |
| JPS6189033A (en) * | 1985-10-04 | 1986-05-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminate |
| JPS63262227A (en) * | 1987-04-21 | 1988-10-28 | Nippon Mining Co Ltd | Correcting method of laminate plate |
| JPH02133792A (en) * | 1988-11-15 | 1990-05-22 | Hitachi Chem Co Ltd | Warpage correction apparatus and method for metallic foil-clad laminated plate |
| JPH02269049A (en) * | 1989-04-11 | 1990-11-02 | Kawasaki Steel Corp | Press-bonding apparatus for damping steel plate |
| JPH08118540A (en) * | 1994-10-20 | 1996-05-14 | Toshiba Chem Corp | Production of copper clad laminated sheet |
| JPH09314738A (en) * | 1996-05-30 | 1997-12-09 | Matsushita Electric Works Ltd | Manufacture of laminated sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008041679A (en) * | 2006-08-01 | 2008-02-21 | Matsushita Electric Ind Co Ltd | Manufacturing method of circuit formation substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4238484B2 (en) | 2009-03-18 |
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