JP2008041679A - Manufacturing method of circuit formation substrate - Google Patents

Manufacturing method of circuit formation substrate Download PDF

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Publication number
JP2008041679A
JP2008041679A JP2006209664A JP2006209664A JP2008041679A JP 2008041679 A JP2008041679 A JP 2008041679A JP 2006209664 A JP2006209664 A JP 2006209664A JP 2006209664 A JP2006209664 A JP 2006209664A JP 2008041679 A JP2008041679 A JP 2008041679A
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Japan
Prior art keywords
material
substrate
method
film
circuit
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Pending
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JP2006209664A
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Japanese (ja)
Inventor
Yukihiro Hiraishi
Toshihiro Nishii
Toshiaki Takenaka
幸弘 平石
敏昭 竹中
利浩 西井
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Matsushita Electric Ind Co Ltd
松下電器産業株式会社
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Priority to JP2006209664A priority Critical patent/JP2008041679A/en
Publication of JP2008041679A publication Critical patent/JP2008041679A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit formation substrate with largely improved reliability in electric connection, high density, and excellent quality by means of an interlayer connection means employing conductive paste or the like. <P>SOLUTION: A manufacturing method of the circuit formation substrate includes a sticking step of sticking a filmlike material to a substrate material, wherein a direction of a material flow during the manufacture of the substrate material is approximately parallel to a direction of a material flow during the manufacture of the circuit formation substrate, and a variation is reduced in thickness of the substrate material after the sticking step. This method can provide a high quality and high density circuit formation substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a circuit-formed substrate used in various electronic devices.

  As electronic devices have become smaller and higher in density in recent years, circuit formation boards on which electronic components are mounted have been increasingly adopted from both single-sided and double-sided and multilayered boards, and more circuits and components have been integrated on the board. Possible high-density substrates have been developed (for example, “Surface mounting technology” published by Nikkan Kogyo Shimbun, January 1997 issue, Kiyoshi Takagi: “Remarkable development trend of build-up multilayer PWB”).

  An example of manufacturing a conventional circuit forming substrate will be described below.

  The prepreg 1 shown in FIG. 4 is a sheet-like material in which a glass fiber woven fabric as a reinforcing material is impregnated with a thermosetting resin to be in a semi-cured state. The material flow direction (hereinafter referred to as the MD direction) at the time of manufacturing the glass fiber woven fabric is indicated as the MD direction in the drawing. MD is an abbreviation for Machine Direction. The prepreg 1 is cut into a prepreg sheet 2 for use in manufacturing a circuit forming substrate.

  As shown in FIG. 5, a film 3 is attached to the cut prepreg sheet 2 using a hot roll 4. Thereafter, it is cut into a single wafer state to obtain a laminated prepreg 5. This process is called a pasting process.

  In the manufacture of a normal circuit forming substrate, the prepreg 1 is often cut so that the longitudinal direction of the prepreg sheet 2 is orthogonal to the MD direction in the figure as shown in FIG. The reason is considered based on the size of the prepreg sheet 2 required by the manufacturer of the circuit forming board, that is, the size of the glass fiber woven fabric with the standardized work size divided into two. Each trader adjusts the length of the prepreg sheet 2 shown in FIG. 4 in the short direction so as to meet his process and customer needs.

  Further, in the attaching step shown in FIG. 5, there are problems such as the size of the heat roll 4 and the size of the equipment insulator. As shown in FIG. 5, the prepreg sheet 2 is put in the longitudinal direction and the film 3 is laminated. Was the standard. In addition, since it is relatively easy to increase the material flow rate, that is, the feed rate of the film 3, there has been no problem in improving the productivity of the process.

  Next, the manufacturing method of the glass fiber woven fabric as a reinforcing material is demonstrated using FIG. The glass fiber woven fabric 6 is obtained by weaving the weft yarn 8 with respect to the warp yarn 7 in the same manner as the production of a woven fabric generally known. The warp yarn 7 is tensioned in the MD direction in the drawing, and when the cross section of the glass fiber woven fabric 6 is viewed, the warp yarn 7 extends in a straight line and the weft yarn 8 is arranged vertically as shown in FIG. . As shown in FIG. 8, when the cross section perpendicular to the MD direction is observed, the weft 8 is bent so as to sew the upper and lower sides of the warp 7.

  The above description is an example of a general plain weave, but the same applies to other weaving methods.

  Next, the manufacturing process of a circuit formation board is demonstrated using FIG.

  The substrate material shown in FIG. 9A is a laminated prepreg 5 composed of a prepreg sheet 2 and a film 3.

  Next, as shown in FIG. 9B, the via hole 9 is processed by a method such as laser processing, and the paste 10 is filled into the via hole 9 as shown in FIG. 9C. The paste 10 is obtained by kneading metal particles such as copper into a thermosetting resin such as an epoxy resin in order to impart conductivity. As a filling method, a known printing method or the like can be used.

  Next, the film 3 is peeled off as shown in FIG. The film 3 can be easily peeled off because the resin content on the surface of the prepreg 2 is only slightly melted and bonded. As shown in FIG. 9 (d), the paste 10 protrudes by the thickness of the film 3.

  Next, as shown in FIG. 9 (e), the copper foils 11 are arranged above and below the prepreg sheet 2 and heated and pressurized using a vacuum hot press apparatus or the like to melt and mold and cure the prepreg sheet 2. FIG. The paste 10 is compressed and the two copper foils 11 above and below the prepreg sheet 2 are electrically connected by the paste 10.

  Next, as shown in FIG. 9 (g), the copper foil 11 is etched into a desired shape to form a circuit 12, and a double-sided circuit forming substrate is obtained.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-6-268345

  However, the above-described method for manufacturing a circuit formation substrate is disadvantageous for miniaturization of the design rules of the circuit formation substrate.

  That is, when the circuit 12 in FIG. 9G is miniaturized, it is difficult to align the via hole 9 and the circuit 12. Further, although the double-sided circuit forming substrate has been described with reference to FIG. 9, the level of difficulty is further increased in the production of the multilayer circuit forming substrate.

  The inventor found the following factors in the results of repeating the trial manufacture and analysis.

  In manufacturing a circuit forming substrate by a method as shown in FIG. 9, it is important to process the via hole 9 at a desired position with high accuracy and to control the dimensional change in the subsequent steps.

  What was found as an important factor by the inventor's investigation is a dimensional change of the prepreg sheet 2 in the attaching step shown in FIG.

  The details of the pasting process are shown in FIG. The prepreg sheet 2 is sandwiched between upper and lower films 3, and the surface of the prepreg sheet 2 is melted by the heat roll 4 so that the film 3 adheres. Although not shown, the heat roll 4 can adopt a multiple roll structure for the purpose of preheating, cooling and the like.

  FIG. 11 is an enlarged view of the vicinity of the heat roll 4. When the cross section of the prepreg sheet 2 is viewed, the weft yarn 8 is present in the flow direction in a form that follows the warp yarn 7 with a slack, and this is a disadvantageous form for maintaining the dimensional shape of the prepreg sheet 2 as a reinforcing material. It turned out to be. That is, the stress in the heat roll 4 and the heat shrinkage reaction of the film 3 are applied in the flow direction, whereas the film expands and contracts due to sagging of the weft.

  In order to stabilize the dimensions of the prepreg sheet 2 by such a manufacturing method, a reinforcing material that is rigid in the flow direction is required.

  The method for manufacturing a circuit-formed substrate of the present invention includes an attaching step of attaching a film-like material to the substrate material, and the MD direction in producing the reinforcing material of the substrate material is substantially parallel to the MD direction in the attaching step. It is set as the structure which is.

  According to the present invention, the dimensional stability of the prepreg sheet in the attaching process is remarkably improved, and a high-definition circuit-formed substrate can be easily manufactured.

  The method for manufacturing a circuit-formed substrate of the present invention includes an attaching step of attaching a film-like material to the substrate material, and the MD direction in producing the reinforcing material of the substrate material is substantially parallel to the MD direction in the attaching step. It is set as the structure which is.

  According to the present invention, the dimensional change of the prepreg sheet as the substrate material is improved, and the electrical connection by the interlayer connection means such as the conductive paste is excellent in conformity between the via hole and the circuit. It can be done with.

  As a result of the above, a high-quality high-density circuit forming substrate can be provided.

  The invention according to claim 1 of the present invention has an effect of improving the stability of the dimensional change of the prepreg sheet in the attaching process or the like due to the rigidity of the reinforcing material in the MD direction.

  The invention according to claim 2 of the present invention has an effect that, for example, the attaching process is efficient and the handling property is good even if the thickness of the prepreg sheet is reduced.

  The invention according to claim 3 of the present invention has an effect that the dimensional stability of the reinforcing material is much better than that of paper or the like.

  Invention of Claim 4 of this invention has the effect | actions which can stabilize the dimensional change stability in a sticking process etc., maintaining the cutting efficiency of the prepreg sheet | seat from a roll-shaped prepreg.

  The invention according to claim 5 of the present invention has an effect that variation in process conditions such as heating and pressurization in the bonding process can be reduced in the substrate material because the width of the substrate material in the bonding process can be shortened. .

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 3.

(Embodiment 1)
FIG. 1 shows a method for manufacturing the prepreg sheet 2 in the embodiment of the present invention.

  Since the outline of the manufacturing method as the prepreg sheet 2 is the same as the conventional one, the description thereof is omitted.

  Next, as shown in FIG. 2, the film 3 as a film-like material is temporarily bonded with a hot roll 4 as a film attaching step.

  In this case, as shown in the drawing, the short direction of the prepreg 3 is matched with the MD direction in the film attaching process.

  Compared to the conventional example, the size and the like of the heat roll 4 and the film 3 need to be enlarged. In view of the special effects of the present invention, the inventor made improvements and changes in equipment and materials and verified them.

  In the present embodiment, as described above, the MD direction at the time of manufacturing the glass cloth woven fabric 6 and the MD direction in the film attaching process are substantially parallel, that is, the same direction.

  In the inventor's trial production, when the film was attached by such a method, the variation in dimensional change of the prepreg sheet 2 which was a problem in the conventional example was improved.

  FIG. 3 shows an example of the result.

  That is, in the conventional example shown in FIG. 11, since the direction of the weft 8 with slack is the same as the flow direction at the time of film attachment, the dimensional change before and after the film attachment is large. In the embodiment, since the direction of the warp warp without slack is the same as the flow direction of the film application, the result that the change in size was small with respect to the heat shrinkage stress of the heat roll 4 and the film 3 was obtained.

  As an example of the material described as the substrate material, that is, the prepreg in the above-described embodiment, a normal glass fiber woven fabric or non-woven fabric impregnated with a thermosetting resin and made into a B-stage can be used in a wide range. Organic fibers such as aramid can be used instead of glass fibers. Even in the production of a nonwoven fabric, fibers oriented in the MD direction have a rigid structure without sagging, and the effects of the present invention can be obtained.

  It is also possible to use an inorganic material that becomes a rigid substrate by sintering other than the thermosetting resin.

  Further, a material in which a woven fabric and a nonwoven fabric are mixed, for example, a material in which a glass fiber nonwoven fabric is sandwiched between two glass fibers, can be used as a reinforcing material.

  In addition, examples of the thermosetting resin in the portion described as the thermosetting resin in the embodiment of the present invention include an epoxy resin, an epoxy / melamine resin, an unsaturated polyester resin, a phenol resin, and a polyimide resin. , Cyanate resin, cyanate ester resin, naphthalene resin, urea resin, amino resin, alkyd resin, silicon resin, furan resin, polyurethane resin, aminoalkyd resin, acrylic resin, fluorine resin Resin, polyphenylene ether resin, cyanate ester resin, etc. can be used alone, or two or more thermosetting resin compositions or thermosetting resin compositions modified with thermoplastic resins can be used as required. In addition, flame retardants and inorganic fillers can be added.

  Although the double-sided board has been described in the embodiment, it is also possible to manufacture a multilayer board by repeating the same steps as necessary, such as bonding a multilayer circuit forming substrate with a prepreg filled with paste. Construction methods can also be adopted.

  In addition, although the conductive paste has been described as the interlayer connection means, the conductive paste is not limited to the conductive particles such as copper powder kneaded with the thermosetting resin containing the curing agent, and the conductive particles and the hot press. Various compositions such as a polymer material having an appropriate viscosity that is sometimes discharged into the substrate material, or a kneaded solvent or the like can be used.

  In addition to the conductive paste, post-shaped conductive protrusions formed by plating or the like, or conductive particles having a relatively large particle size that are not made into a paste can be used alone as an interlayer connection means.

  Further, the present invention can also be applied to a part of a circuit-formed substrate in which a hole is formed after hot pressing to form an interlayer connection by plating like a normal multilayer printed wiring board.

  As described above, according to the method for manufacturing a circuit-formed substrate of the present invention, the dimensional change of the prepreg sheet as the substrate material is improved, and the interlayer connection such as the conductive paste having excellent matching between the via hole and the circuit. The electrical connection by means can be performed stably and with high quality.

  As a result, a high-quality high-density circuit forming substrate can be provided, and the industrial applicability of the present invention can be said to be great.

The perspective view which shows the manufacturing method of the prepreg sheet | seat of the 1st Embodiment of this invention The perspective view which shows the film sticking process of the 1st Embodiment of this invention The figure which shows the result of the dimensional change before and behind film sticking in this invention and a prior art example The perspective view which shows the manufacturing method of the prepreg sheet | seat in a prior art example The perspective view which shows the film sticking process in a prior art example The perspective view which shows the manufacturing method of the glass fiber woven fabric in a prior art example Cross section Cross section Sectional drawing which shows the manufacturing process of the circuit formation board in a prior art example Sectional drawing which shows the pasting process in a prior art example Enlarged sectional view of the same part

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Prepreg 2 Prepreg sheet 3 Film 4 Heat roll 5 Laminated prepreg 6 Glass fiber woven fabric 7 Warp yarn 8 Weft 9 Via hole 10 Paste 11 Copper foil 12 Circuit

Claims (6)

  1. A circuit-formed substrate manufacturing method comprising an attaching step of attaching a film-like material to a substrate material, wherein the MD direction in manufacturing the reinforcing material of the substrate material is substantially parallel to the MD direction in the attaching step Method.
  2. The method for manufacturing a circuit forming substrate according to claim 1, wherein the attaching method is a laminating method using a heating roll.
  3. The method for manufacturing a circuit-formed board according to claim 1, wherein the reinforcing material is a woven fabric.
  4. 2. The method for manufacturing a circuit-formed substrate according to claim 1, wherein the substrate material is substantially rectangular, and the short side direction thereof substantially coincides with the MD direction of the attaching step.
  5. After the step of attaching the film-like material to the substrate material, the step of processing the via hole in the substrate material to which the film-like material is attached, the step of filling the via hole with the paste, and the film-like material as the substrate material The method for producing a circuit-formed substrate according to claim 1, further comprising: a step of peeling from the substrate; and a step of placing and heating copper foil on the upper and lower sides of the substrate material.
  6. 2. The circuit forming substrate according to claim 1, wherein the reinforcing material is manufactured by weaving a weft into the warp, and when the reinforcing material is manufactured, a tension is applied to the warp in the MD direction. Manufacturing method.
JP2006209664A 2006-08-01 2006-08-01 Manufacturing method of circuit formation substrate Pending JP2008041679A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008300391A (en) * 2007-05-29 2008-12-11 Panasonic Corp Method of manufacturing circuit formation substrate
JP2014525671A (en) * 2011-08-09 2014-09-29 ソレクセル、インコーポレイテッド High efficiency solar photovoltaic cell and module using thin crystalline semiconductor absorber

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002283470A (en) * 2001-03-26 2002-10-03 Sumitomo Bakelite Co Ltd Method for producing laminated plate
JP2004338329A (en) * 2003-05-19 2004-12-02 Matsushita Electric Ind Co Ltd Method for manufacturing circuit formation substrate and material for manufacturing this substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002283470A (en) * 2001-03-26 2002-10-03 Sumitomo Bakelite Co Ltd Method for producing laminated plate
JP2004338329A (en) * 2003-05-19 2004-12-02 Matsushita Electric Ind Co Ltd Method for manufacturing circuit formation substrate and material for manufacturing this substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008300391A (en) * 2007-05-29 2008-12-11 Panasonic Corp Method of manufacturing circuit formation substrate
JP2014525671A (en) * 2011-08-09 2014-09-29 ソレクセル、インコーポレイテッド High efficiency solar photovoltaic cell and module using thin crystalline semiconductor absorber

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