JPH01272189A - Method of correcting warpage of printed circuit board - Google Patents

Method of correcting warpage of printed circuit board

Info

Publication number
JPH01272189A
JPH01272189A JP10164688A JP10164688A JPH01272189A JP H01272189 A JPH01272189 A JP H01272189A JP 10164688 A JP10164688 A JP 10164688A JP 10164688 A JP10164688 A JP 10164688A JP H01272189 A JPH01272189 A JP H01272189A
Authority
JP
Japan
Prior art keywords
printed wiring
printed circuit
circuit board
temperature
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10164688A
Other languages
Japanese (ja)
Other versions
JPH0658990B2 (en
Inventor
Takafumi Arai
新井　啓文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP63101646A priority Critical patent/JPH0658990B2/en
Publication of JPH01272189A publication Critical patent/JPH01272189A/en
Publication of JPH0658990B2 publication Critical patent/JPH0658990B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To correct warpage of a printed circuit board surely by heating the printed circuit board such that a temperature of the obverse side of the board on which the board is warped is higher than that of the reverse side thereof. CONSTITUTION:A printed circuit board is heated such that the temperature on the obverse side 1a on which the board is warped, is higher than that of the reverse side 1b. A heat medium is supplied by circulation to heating plates 2. In the heating process, the obverse side 1a on which the printed circuit board 1 is warped is subjected to tensile stress while the reverse side 16 is subjected to contraction stress, whereby the warpage is corrected considerably. The printed circuit board 1 thus heated is then disposed between cooling plates 4 and cooled thereby. During the cooling process, a temperature on the obverse side 1a of the printed circuit board 1 is higher than that of the reverse side 1b, whereby the obverse side 1a of the printed circuit board 1 is quenched and subjected to tension stress while the reverse side 1b is cooled gradually and subjected to contraction stress. Thus the warpage can be corrected.

Description

【発明の詳細な説明】[Detailed description of the invention] 【産業上の利用分野】[Industrial application field]

本発明はプリント配線板の加熱温度及び冷却温度を表面
側と裏面側とで異ならせて反りを矯正する方法に関する
。The present invention relates to a method for correcting warpage by varying the heating temperature and cooling temperature of a printed wiring board between the front side and the back side.

【従来技術】[Prior art]

従来からプリント配線板は、たとえば銅張積層板に導体
パターンが形成され、スルーホールめっきなどが施され
て製造されている。Conventionally, printed wiring boards have been manufactured by, for example, forming a conductor pattern on a copper-clad laminate and subjecting it to through-hole plating.

【発明が解決しようとする課題】[Problem to be solved by the invention]

プリント配線板の製造工程において、加熱や加湿、加圧
など種々の外的要因によりプリント配線板に反りが発生
してしまっていた。又、反りはプリント配線板の機械的
な歪みに起因するものもあり、導体パターンの表裏の差
や、多層板にあっては、例えば左右のバランスの異なる
ものがあり、これらが反りの原因になっている。 この反りはプリント配線板への実装がリードで行なわれ
る場合にはたいした問題とはならないが、表面実装が増
加するにつれてプリント配線板の反りが大きな問題とな
ってきている。 プリント配線板の反りは、−枚毎に乾燥、冷却を施して
残留応力を除去することにより矯正されているが、不充
分なものであった。 本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、プリント配線板の反りを確実に矯正
することにある。 ［？ｓ題を解決するための手段］ 本発明のプリント配線板の反り矯正方法は、プリント配
線板を加熱し、次いで冷却するプリント配線板の反り矯
正方法であって、加熱工程においてプリント配線板１の
反りが発生している表面側１ａの温度を裏面側１ｂより
も高くし、冷却工程においてプリント配線板１の表面８
１　ａの温度を裏面側１ｂよりも低くすることを特徴と
するものであり、この構成により上記技術的課題が解決
されたものである。 ［作用］ 加熱工程においてプリント配線板１の反りが発生してい
る表面側１ａの温度を裏面側１ｂよりも高くしているの
で、収縮して反りが発生している表面（ｉ９１１　ａに
引張応力が働き反りが矯正されるものであり、又、冷却
工程においてプリント配線板１の表面側１ａの温度を裏
面側１ｂよりも低くするので、表面側ＩＬが急冷され、
引張応力が働くことになり、反りが矯正されるものであ
り、このように加熱工程及び冷却工程において反りが矯
正され、反りの確実な矯正が可能となるものである。 ［実施例］ プリント配線板１とは電気絶縁性基板の外層あるいは内
層に電気良導体金属で転写再現された電気配線図形（導
体パターン）を有し、通常スルーホールめっきにより相
互接続され、かつ搭載される回路部品との接続と支持体
を具備した総てのものを含む概念である。 このプリント配線板１がまず乾燥炉内で加熱される。加
熱温度は電気絶縁性基板のガラス転位温度前後であるの
が好ましい０例えば、電気絶縁性基板を構成する樹脂が
エポキシ樹脂の場合にはそのガラス転位温度である１２
０〜１８０℃前後である。この加熱は第１図に示すよう
に加熱板２間にプリント配線板１を配置して行なわれる
。具体的には、第２図に示すような加熱装置Ａにより行
なわれる。加熱装ｆｉＡは複数の加熱板２が所定の間隔
を置いて加圧モータ３の正逆駆動により近接離間自在に
配置されて構成されており、加熱板２間にプリント配線
板１が挿入され加熱される。加熱温度は加熱工程におい
てプリント配線板の反りが発生している表面側１ａの温
度を裏面側１ｂよりも高くしている１例えば高温側の加
熱板２ａが１６０℃、低温側の加熱板２ｂの温度が１０
０℃に設定される。加熱板２には熱媒が循環供給される
。 この加熱工程において、反りが発生しているプリント配
線板１の表面側１ａには引張り応力が働き、裏面側１ｂ
には収縮応力が働き、かなりの程度に反りが矯正される
。 次に、このように加熱されたプリント配線板１が冷却板
４間配置され冷却される。この冷却も、具体的には、加
熱装置Ａにおいて加熱板２の変わりに冷却板４を配置し
て構成される冷却装置（図示しない）により行なわれる
。冷却工程においてプリント配線板１の表面側１ａの温
度を裏面側１ｂよりも低くする０例えば、低温側の冷却
板４ａの温度が一２０〜３０℃、高温側の冷却板４ｂの
温度が１０〜１００℃に設定される。この冷却工程にお
いてプリント配線板１の表面側１ａが急冷され、引張応
力が憎さ、裏面１１１１ｂが徐冷されて収縮応力が働く
ことになり、反り、が矯正されるものである。In the manufacturing process of printed wiring boards, warpage has occurred in printed wiring boards due to various external factors such as heating, humidification, and pressurization. In addition, warpage can also be caused by mechanical distortion of printed wiring boards, such as differences between the front and back sides of conductor patterns, or differences in the left and right balance of multilayer boards, for example, which can cause warpage. It has become. This warpage is not a major problem when mounting on a printed wiring board is performed using leads, but as surface mounting increases, warping of printed wiring boards has become a major problem. Warpage in printed wiring boards has been corrected by drying and cooling each board to remove residual stress, but this has not been sufficient. The present invention has been made in view of the above circumstances, and its purpose is to reliably correct the warpage of printed wiring boards. [? Means for Solving Problem S] The printed wiring board warpage correction method of the present invention is a printed wiring board warp correction method in which the printed wiring board is heated and then cooled, and the printed wiring board 1 is heated in the heating step. The temperature of the front side 1a where the warpage has occurred is made higher than the back side 1b, and the front side 8 of the printed wiring board 1 is heated in the cooling process.
This structure is characterized in that the temperature on the back side 1a is lower than that on the back side 1b, and the above technical problem is solved by this configuration. [Function] In the heating process, the temperature of the front side 1a where the printed wiring board 1 is warped is made higher than the back side 1b, so that tensile stress is applied to the surface (i911a) where the warp occurs due to shrinkage. In addition, since the temperature of the front side 1a of the printed wiring board 1 is made lower than that of the back side 1b in the cooling process, the front side IL is rapidly cooled.
Tensile stress is applied to correct the warp. In this way, the warp is corrected in the heating process and the cooling process, making it possible to reliably correct the warp. [Example] A printed wiring board 1 has an electrical wiring pattern (conductor pattern) transferred and reproduced with an electrically conductive metal on the outer layer or inner layer of an electrically insulating board, and is usually interconnected by through-hole plating and mounted. The concept includes all devices that have connections and supports for circuit components. This printed wiring board 1 is first heated in a drying oven. The heating temperature is preferably around the glass transition temperature of the electrically insulating substrate. For example, if the resin constituting the electrically insulating substrate is an epoxy resin, the heating temperature is the glass transition temperature of the electrically insulating substrate.
The temperature is around 0 to 180°C. This heating is performed by placing a printed wiring board 1 between heating plates 2 as shown in FIG. Specifically, this is carried out using a heating device A as shown in FIG. The heating device fiA is composed of a plurality of heating plates 2 arranged at predetermined intervals so as to be able to approach and separate from each other by forward and reverse driving of a pressurizing motor 3. A printed wiring board 1 is inserted between the heating plates 2 and heated. be done. The heating temperature is such that the temperature of the front side 1a where the printed wiring board is warped in the heating process is higher than the back side 1b.1 For example, the heating plate 2a on the high temperature side is 160°C, and the heating plate 2b on the low temperature side is temperature is 10
Set to 0°C. A heating medium is circulated and supplied to the heating plate 2 . In this heating process, tensile stress acts on the front side 1a of the printed wiring board 1 where the warp has occurred, and the back side 1b
Shrinkage stress acts on the material, and the warpage is corrected to a considerable extent. Next, the thus heated printed wiring board 1 is placed between the cooling plates 4 and cooled. This cooling is also specifically performed by a cooling device (not shown) configured by disposing a cooling plate 4 instead of the heating plate 2 in the heating device A. In the cooling process, the temperature of the front side 1a of the printed wiring board 1 is lower than the back side 1b. For example, the temperature of the cooling plate 4a on the low temperature side is 120 to 30 °C, and the temperature of the cooling plate 4b on the high temperature side is 10 to 30 °C. The temperature is set at 100°C. In this cooling process, the front side 1a of the printed wiring board 1 is rapidly cooled, causing tensile stress, and the back side 1111b is slowly cooled, causing shrinkage stress to be applied, thereby correcting warping.

【発明の効果】【Effect of the invention】

本発明は、プリント配線板を加熱し、次いで冷却するプ
リント配線板の反り矯正方法であって、加熱工程におい
てプリント配線板の反りが発生しでいる表面側の温度を
裏面側よりも高くしているので、収縮して反りが発生し
ている表面側に引張応力が働き、裏面側には収縮応力が
働くことにより、反りが矯正されるものであり、又、冷
却工程においでプリント配線板の表面側の温度を裏面側
よりも低５（するので、表面側が急冷され、引張応■ 力が働き、裏面側が徐冷され収縮応力が働くことになり
、反りが矯正されるものであり、このように加熱工程及
び冷却工程において反りが矯正され、反りの確実な矯正
が可能となるものである。The present invention is a printed wiring board warpage correction method in which the printed wiring board is heated and then cooled, and the temperature of the front side where the printed wiring board is warped is made higher than that of the back side in the heating process. Therefore, tensile stress acts on the front side where the printed wiring board is shrinking and warping, and shrinkage stress acts on the back side to correct the warping. Since the temperature on the front side is lower than that on the back side, the front side is rapidly cooled and tensile stress acts, and the back side is slowly cooled and shrinkage stress acts, which corrects the warpage. In this way, the warpage is corrected in the heating process and the cooling process, making it possible to reliably correct the warp.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図（ａ）（ｂ）は本発明の加熱工程及び冷却工程を
示す概略図、第２図は同上における加熱装置を示す概略
図であって、Ａは加熱装置、１はプリント配線板、１ａ
は表面側、１ｂは裏面側、２は加熱板、４は冷却板であ
る。 代理人　弁理士　石　１）艮　七 （（１）　　　　　　　　　　　（ｂ）第２図FIGS. 1(a) and 1(b) are schematic diagrams showing the heating process and cooling process of the present invention, and FIG. 2 is a schematic diagram showing the heating device in the same as above, where A is the heating device, 1 is a printed wiring board, 1a
1b is the front side, 1b is the back side, 2 is a heating plate, and 4 is a cooling plate. Agent Patent Attorney Ishi 1) Ai Shichi ((1) (b) Figure 2

Claims (1)

【特許請求の範囲】[Claims] （１）プリント配線板を加熱し、次いで冷却するプリン
ト配線板の反り矯正方法であって、加熱工程においてプ
リント配線板の反りが発生している表面側の温度を裏面
側よりも高くし、冷却工程においてプリント配線板の表
面側の温度を裏面側よりも低くすることを特徴とするプ
リント配線板の反り矯正方法。(1) A printed wiring board warping method in which the printed wiring board is heated and then cooled, in which the temperature of the front side where the printed wiring board is warped is made higher than the back side in the heating process, and then the printed wiring board is cooled. A method for correcting warpage of a printed wiring board, which comprises lowering the temperature of the front side of the printed wiring board lower than the back side during the process.
JP63101646A 1988-04-25 1988-04-25 Warpage correction method for printed wiring board Expired - Fee Related JPH0658990B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63101646A JPH0658990B2 (en) 1988-04-25 1988-04-25 Warpage correction method for printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63101646A JPH0658990B2 (en) 1988-04-25 1988-04-25 Warpage correction method for printed wiring board

Publications (2)

Publication Number Publication Date
JPH01272189A true JPH01272189A (en) 1989-10-31
JPH0658990B2 JPH0658990B2 (en) 1994-08-03

Family

ID=14306143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63101646A Expired - Fee Related JPH0658990B2 (en) 1988-04-25 1988-04-25 Warpage correction method for printed wiring board

Country Status (1)

Country Link
JP (1) JPH0658990B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9048245B2 (en) 2012-06-05 2015-06-02 International Business Machines Corporation Method for shaping a laminate substrate
US9059240B2 (en) 2012-06-05 2015-06-16 International Business Machines Corporation Fixture for shaping a laminate substrate
US9129942B2 (en) 2012-06-05 2015-09-08 International Business Machines Corporation Method for shaping a laminate substrate
JP2015226020A (en) * 2014-05-29 2015-12-14 富士通株式会社 Manufacturing apparatus of circuit board and manufacturing method of circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6189694A (en) * 1984-10-09 1986-05-07 ソニー株式会社 Method and apparatus for correcting shape of printed circuitboard

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6189694A (en) * 1984-10-09 1986-05-07 ソニー株式会社 Method and apparatus for correcting shape of printed circuitboard

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9048245B2 (en) 2012-06-05 2015-06-02 International Business Machines Corporation Method for shaping a laminate substrate
US9059240B2 (en) 2012-06-05 2015-06-16 International Business Machines Corporation Fixture for shaping a laminate substrate
US9129942B2 (en) 2012-06-05 2015-09-08 International Business Machines Corporation Method for shaping a laminate substrate
US9543253B2 (en) 2012-06-05 2017-01-10 Globalfoundries Inc. Method for shaping a laminate substrate
JP2015226020A (en) * 2014-05-29 2015-12-14 富士通株式会社 Manufacturing apparatus of circuit board and manufacturing method of circuit board

Also Published As

Publication number Publication date
JPH0658990B2 (en) 1994-08-03

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