JPS6416617A - Method and device for continuously manufacturing beltlike base material - Google Patents

Method and device for continuously manufacturing beltlike base material

Info

Publication number
JPS6416617A
JPS6416617A JP63085534A JP8553488A JPS6416617A JP S6416617 A JPS6416617 A JP S6416617A JP 63085534 A JP63085534 A JP 63085534A JP 8553488 A JP8553488 A JP 8553488A JP S6416617 A JPS6416617 A JP S6416617A
Authority
JP
Japan
Prior art keywords
section
press
prepreg
copper foil
belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63085534A
Other languages
Japanese (ja)
Inventor
Shieefuaa Hansuuyurugen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
A Ee G Isoriile & Kunsutoshiyu
A Ee G Isoriile & Kunsutoshiyutotsufu GmbH
Original Assignee
A Ee G Isoriile & Kunsutoshiyu
A Ee G Isoriile & Kunsutoshiyutotsufu GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by A Ee G Isoriile & Kunsutoshiyu, A Ee G Isoriile & Kunsutoshiyutotsufu GmbH filed Critical A Ee G Isoriile & Kunsutoshiyu
Publication of JPS6416617A publication Critical patent/JPS6416617A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
    • B29C43/30—Making multilayered or multicoloured articles
    • B29C43/305—Making multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/04—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band
    • B30B5/06—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band co-operating with another endless band
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1027—Pressing using at least one press band
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/44—Compression means for making articles of indefinite length
    • B29C43/48—Endless belts
    • B29C2043/483—Endless belts cooperating with a second endless belt, i.e. double band presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PURPOSE: To produce the belt substrate having uniform quality over all continuously by preheating under the melting point of the resin without applying a pressure, forming the laminated plates in the 1st press-section with thermally gelled resin, and hardening them in the 2nd press-section at the higher temperature than the 1st section. CONSTITUTION: A copper foil 1 and a prepreg 2 are introduced to the belt press 4 through the rolls 3, 3'. The copper foil and prepreg or laminated plates are passed through the belt press in between the rotating belt 5 and 5'. The distances between the roll 3 and 3' on the both sides are decided so that the copper foil and the prepreg are introduced without pressure and are not overlapped in the degassing section 9 next to the inlet. The copper foil and the prepreg are heated up to the maximum temperature of 170 deg.C in the 1st press section 6 to gelatinize the resin and laminated to the plates under pressure. In the next 2nd section 7, the laminated plates are hardened at the temperature 200-240 deg.C. Processing time in both sections must not exceed 60 seconds.
JP63085534A 1987-04-09 1988-04-08 Method and device for continuously manufacturing beltlike base material Pending JPS6416617A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3711969 1987-04-09
DE19873716531 DE3716531A1 (en) 1987-04-09 1987-05-16 Process for the continuous production of strip-shaped base material

Publications (1)

Publication Number Publication Date
JPS6416617A true JPS6416617A (en) 1989-01-20

Family

ID=25854476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63085534A Pending JPS6416617A (en) 1987-04-09 1988-04-08 Method and device for continuously manufacturing beltlike base material

Country Status (2)

Country Link
JP (1) JPS6416617A (en)
DE (1) DE3716531A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012132382A1 (en) * 2011-03-30 2012-10-04 住友ベークライト株式会社 Method and apparatus for fabricating laminate sheet

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3928849A1 (en) * 1989-08-31 1991-03-14 Siempelkamp Gmbh & Co Continuous prodn. from strip of laminated plates for circuit boards - comprising heating laminate before entry to continuous press to advance resin cure and prevent lateral flow
DE4036801A1 (en) * 1990-11-19 1992-05-21 Huels Troisdorf Copper@ covered circuit board continuous prodn. in double band press - at temp. no higher than glass transition temp. of cured prepreg resin to reduce undulation
US6488198B1 (en) 1999-07-01 2002-12-03 International Business Machines Corporation Wire bonding method and apparatus
DE102007040098A1 (en) * 2007-08-24 2009-02-26 Elringklinger Ag support film

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3413434A1 (en) * 1984-04-10 1985-10-17 Dielektra GmbH, 5000 Köln METHOD FOR CONTINUOUSLY PRODUCING COPPER-COATED BASE MATERIAL FOR CIRCUIT BOARDS

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012132382A1 (en) * 2011-03-30 2012-10-04 住友ベークライト株式会社 Method and apparatus for fabricating laminate sheet

Also Published As

Publication number Publication date
DE3716531A1 (en) 1988-10-27

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