CN110524980A - A kind of preparation process for the flexible copper-clad foil that no glue is compound - Google Patents
A kind of preparation process for the flexible copper-clad foil that no glue is compound Download PDFInfo
- Publication number
- CN110524980A CN110524980A CN201910815701.3A CN201910815701A CN110524980A CN 110524980 A CN110524980 A CN 110524980A CN 201910815701 A CN201910815701 A CN 201910815701A CN 110524980 A CN110524980 A CN 110524980A
- Authority
- CN
- China
- Prior art keywords
- flexible copper
- foil
- clad foil
- copper
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
- B29C66/7428—Transition metals or their alloys
- B29C66/74281—Copper or alloys of copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/08—Interconnection of layers by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of preparation processes of flexible copper-clad foil that no glue is compound.This preparation process, include: (1), one or both sides that copper foil is stacked in thermoplastic polyimide film obtain flexible copper-clad foil by two groups or more of hot-pressing roller high temperature roll-in, roll temperature is 250~380 DEG C, and rolling pressure is greater than 10.0MPa；(2), the flexible copper-clad foil after roll-in is batched by lapper, batching time control controlling rolling tension is 2.5~3.0Mpa；(3), finished product is packaged after the flexible copper-clad foil that step (2) obtains being passed through cross cutting.The present invention has rational design, and copper foil is stacked in the one or both sides of thermoplastic polyimide film, by two groups or more of hot-pressing roller high temperature roll-in, using the compound preparation process of this no glue, easy to operate, production cost is low, obtained product heat resistance is good, and mechanical performance is excellent.
Description
Technical field
The present invention relates to the preparation technical field of flexible copper-clad foil, especially a kind of system for the flexible copper-clad foil that no glue is compound
Standby technique.
Background technique
Flexible print wiring board is that the design and production of line pattern are carried out on flexible substrate in a manner of printing
Product.As the special function unit for being applied to electronic interconnection, due to lightweight, ultra-thin, small in size, flexible good, especially
It is that flexible, curling and folding outstanding advantages, flexible print wiring board have obtained widely in modern electronics industry
Using.Especially in recent years, the continuous improvement with people to electronic apparatus micromation, lightweight and integrated requirement, it is flexible
Circuit board has become one of essential component in all kinds of high-tech electronic product manufacturings, is widely used in notebook electricity
Brain, digital camera, foldable mobile phone, LCD TV and satellite positioning-terminal etc..In this context, as the flexible print of production and processing
The basic material of printed circuit board, the manufacture and application of flexible copper-clad foil have similarly obtained development at full speed.
Flexible copper-clad foil has been prepared as that glue is compound in the prior art, in the one or both sides of thermoplastic polyimide film
Copper foil is bonded with by hot melt adhesive or adhesive sticker.But this preparation process is cumbersome, production cost is big.
Summary of the invention
The technical problem to be solved by the present invention is overcome the deficiencies in the existing technology, provide a kind of simple process without glue
The preparation process of compound flexible copper-clad foil.
The technical solution adopted by the present invention to solve the technical problems is: a kind of preparation for the flexible copper-clad foil that no glue is compound
Technique has follow steps:
(1), copper foil is stacked in the one or both sides of thermoplastic polyimide film, it is high by two groups or more of hot-pressing rollers
Warm roll-in obtains flexible copper-clad foil, and roll temperature is 250~380 DEG C, and rolling pressure is greater than 10.0MPa；
(2), the flexible copper-clad foil after roll-in is batched by lapper, batch time control controlling rolling tension be 2.5~
3.0Mpa；
(3), finished product is packaged after the flexible copper-clad foil that step (2) obtains being passed through cross cutting.
Further, in the step (1) thermoplastic polyimide film with a thickness of 12.5 μm, 25 μm, 50 μm, 75 μ
M, 100 μm or 125 μm.
Further, in the step (1) copper foil with a thickness of 6~15 μm.
The beneficial effects of the present invention are: the present invention has rational design, copper foil is stacked in the one of thermoplastic polyimide film
Side or two sides, it is easy to operate using the compound preparation process of this no glue by two groups or more of hot-pressing roller high temperature roll-in, at
Produce at low cost, obtained product heat resistance is good, and mechanical performance is excellent.
Specific embodiment
The present invention is further illustrated for presently preferred embodiment.
Embodiment 1
A kind of preparation process for the flexible copper-clad foil that no glue is compound, has follow steps:
(1), copper foil is stacked in the side of thermoplastic polyimide film, by two groups or more of hot-pressing roller high-temperature roller
Pressure obtains flexible copper-clad foil, and roll temperature is 250 DEG C, rolling pressure 11.0Mpa, the thickness of thermoplastic polyimide film
Be 12.5 μm, copper foil with a thickness of 6 μm；
(2), the flexible copper-clad foil after roll-in is batched by lapper, batch time control controlling rolling tension be 2.5~
3.0Mpa；
(3), finished product is packaged after the flexible copper-clad foil that step (2) obtains being passed through cross cutting.
Embodiment 2
A kind of preparation process for the flexible copper-clad foil that no glue is compound, has follow steps:
(1), copper foil is stacked in the two sides of thermoplastic polyimide film, by two groups or more of hot-pressing roller high-temperature roller
Pressure obtains flexible copper-clad foil, and roll temperature is 300 DEG C, rolling pressure 11.0Mpa, the thickness of thermoplastic polyimide film
Be 75 μm, copper foil with a thickness of 12 μm；
(2), the flexible copper-clad foil after roll-in is batched by lapper, batch time control controlling rolling tension be 2.5~
3.0Mpa；
(3), finished product is packaged after the flexible copper-clad foil that step (2) obtains being passed through cross cutting.
Embodiment 3
A kind of preparation process for the flexible copper-clad foil that no glue is compound, has follow steps:
(1), copper foil is stacked in the side of thermoplastic polyimide film, by two groups or more of hot-pressing roller high-temperature roller
Pressure obtains flexible copper-clad foil, and roll temperature is 380 DEG C, rolling pressure 20.0Mpa, the thickness of thermoplastic polyimide film
Be 125 μm, copper foil with a thickness of 15 μm；
(2), the flexible copper-clad foil after roll-in is batched by lapper, batch time control controlling rolling tension be 2.5~
3.0Mpa；
(3), finished product is packaged after the flexible copper-clad foil that step (2) obtains being passed through cross cutting.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand the contents of the present invention and be implemented, and it is not intended to limit the scope of the present invention, it is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the scope of protection of the present invention.
Claims (3)
1. a kind of preparation process for the flexible copper-clad foil that no glue is compound, it is characterised in that: have follow steps:
(1), copper foil is stacked in the one or both sides of thermoplastic polyimide film, by two groups or more of hot-pressing roller high-temperature roller
Pressure obtains flexible copper-clad foil, and roll temperature is 250~380 DEG C, and rolling pressure is greater than 10.0MPa；
(2), the flexible copper-clad foil after roll-in is batched by lapper, batching time control controlling rolling tension is 2.5~3.0Mpa；
(3), finished product is packaged after the flexible copper-clad foil that step (2) obtains being passed through cross cutting.
2. the preparation process of the compound flexible copper-clad foil of no glue according to claim 1, it is characterised in that: the step
(1) thermoplastic polyimide film with a thickness of 12.5 μm, 25 μm, 50 μm, 75 μm, 100 μm or 125 μm in.
3. the preparation process of the compound flexible copper-clad foil of no glue according to claim 1, it is characterised in that: the step
(1) copper foil with a thickness of 6~15 μm in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910815701.3A CN110524980A (en) | 2019-08-30 | 2019-08-30 | A kind of preparation process for the flexible copper-clad foil that no glue is compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910815701.3A CN110524980A (en) | 2019-08-30 | 2019-08-30 | A kind of preparation process for the flexible copper-clad foil that no glue is compound |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110524980A true CN110524980A (en) | 2019-12-03 |
Family
ID=68665592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910815701.3A Pending CN110524980A (en) | 2019-08-30 | 2019-08-30 | A kind of preparation process for the flexible copper-clad foil that no glue is compound |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110524980A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114670530A (en) * | 2022-03-01 | 2022-06-28 | 信维通信（江苏）有限公司 | PI flexible copper-clad plate suitable for middle and high frequency bands and manufacturing process thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101494953A (en) * | 2008-12-30 | 2009-07-29 | 华烁科技股份有限公司 | Double-layer method flexibility two-side coated copper plate for multilayer flexibility printed circuit |
| CN102529231A (en) * | 2011-12-30 | 2012-07-04 | 广东生益科技股份有限公司 | Double-sided copper-clad plate and manufacturing method thereof |
| CN203844365U (en) * | 2014-05-21 | 2014-09-24 | 灵宝鸿宇电子有限责任公司 | Heat sealing device for producing flexible copper foil clad laminated board |
-
2019
- 2019-08-30 CN CN201910815701.3A patent/CN110524980A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101494953A (en) * | 2008-12-30 | 2009-07-29 | 华烁科技股份有限公司 | Double-layer method flexibility two-side coated copper plate for multilayer flexibility printed circuit |
| CN102529231A (en) * | 2011-12-30 | 2012-07-04 | 广东生益科技股份有限公司 | Double-sided copper-clad plate and manufacturing method thereof |
| CN203844365U (en) * | 2014-05-21 | 2014-09-24 | 灵宝鸿宇电子有限责任公司 | Heat sealing device for producing flexible copper foil clad laminated board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114670530A (en) * | 2022-03-01 | 2022-06-28 | 信维通信（江苏）有限公司 | PI flexible copper-clad plate suitable for middle and high frequency bands and manufacturing process thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191203 |