CN105228380A - A kind of gross thickness is less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre - Google Patents
A kind of gross thickness is less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre Download PDFInfo
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- CN105228380A CN105228380A CN201510703156.0A CN201510703156A CN105228380A CN 105228380 A CN105228380 A CN 105228380A CN 201510703156 A CN201510703156 A CN 201510703156A CN 105228380 A CN105228380 A CN 105228380A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to a kind of gross thickness and be less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre, it comprises the steps: S1: lamination, S2:X-RAY practices shooting, S3: milling edges of boards, S4: thinning copper, S5: outer boring, S6: deburring, S7: de-smear, S8: heavy copper, S9: copper facing, S10: outer-layer circuit pre-treatment, S11: outer laminated film 1, S12: outer-layer circuit exposes, S13: development, S14: outer-layer circuit etching-DES, S15: outer AOI detects, S16: welding resistance pre-treatment, S17: welding resistance printing, S18: pre-baked, S19: welding resistance exposes, S20: welding resistance is developed, S21: bake afterwards, S22: groove milling, S23: take off lid, S24: change gold, S25: silk-screen for the first time, S26: first time baking, S27: second time silk-screen, S28: second time baking, S29: milling plate, S30: stamp, S31: flying probe, S32: product inspection-FQC, S33: packaging, S34: warehouse-in.The present invention has advantage simple to operate, to be easy to implementation and practicality and high efficiency.
Description
Technical field
The present invention relates to circuit board manufacture field, particularly gross thickness and be less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre.
Background technology
Along with electronic product is towards the development of frivolous, short and small, multifunction, the wiring board of needs should the welding stability of rigid printed board, and have flexible printed wiring flexible again, such rigid-flex combined board is main development trend.But flexible printed wiring board can be connected with other components and parts with plug finger usually.Plug finger just occurs because protecting the improper finger that causes etched or etch away part in the intermediate layer being positioned at Rotating fields, be less than 0.32mm grafting hand and just seem particularly important so design a kind of gross thickness in four layers of rigid-flex combined board manufacture method of centre.
Summary of the invention
Technical purpose of the present invention is by replacing outer field pure copper layer by one side flexible substrate, utilizes the polyimides of flexible substrate to do diaphragm.Utilize polyimides flexibility not easily to break in process of production, also utilize polyimides softness having under External Force Acting and can occur fracture at the edge of copper under the rigid effect of outer copper.The finger of such internal layer all can not touch liquid medicine all the time after pressing; A kind of manufacture craft with the rigid-flexible fish plate of superpower restoration is provided.
For solving above-mentioned technical problem, of the present inventionly a kind of gross thickness is provided to be less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre, it is characterized in that: comprise the steps: S1: lamination, S2:X-RAY practices shooting, S3: milling edges of boards, S4: thinning copper, S5: outer boring, S6: deburring, S7: de-smear, S8: heavy copper, S9: copper facing, S10: outer-layer circuit pre-treatment, S11: outer laminated film 1, S12: outer-layer circuit exposes, S13: development, S14: outer-layer circuit etching-DES, S15: outer AOI detects, S16: welding resistance pre-treatment, S17: welding resistance printing, S18: pre-baked, S19: welding resistance exposes, S20: welding resistance is developed, S21: bake afterwards, S22: groove milling, S23: take off lid and (tear together with flexible substrate and copper sheet, expose inner finger), S24: change gold, S25: first time silk-screen (character in the rigid plate of print front), S26: first time baking, S27: second time silk-screen (character in back up rigid plate), S28: second time baking, S29: milling plate, S30: stamp, S31: flying probe, S32: product inspection-FQC, S33: packaging, S34: warehouse-in.
Further: described step S1: lamination is undertaken hot-forming by upper and lower two block plates by four pieces of release films, two pieces of filling films, two pieces of flex plates, two pieces of prepregs and inner platings, the both sides up and down of described every block filling film are connected with one piece of release film, the both sides up and down of described inner plating are respectively connected with one piece of prepreg, the side of described prepreg pasting high temperature carrying tablet is connected with flex plate, and the outside of two pieces of described flex plates is respectively connected with one piece of release film.
Further again: the Making programme of described inner plating is as follows: step 1: internal layer sawing sheet, step 2: boring (boring lamination location hole and exposure location hole), step 3: circuit pre-treatment, step 4: interior laminated film, step 5: internal layer circuit exposes, step 6: internal layer circuit etches, step 7: internal layer AOI detects, step 8: alligatoring, step 9: lamination coverlay, step 10: laminated.
Further again: the Making programme of described prepreg is as follows: step 1: sawing sheet, step 2: boring (boring lamination location hole), step 3: groove milling (the prepreg mill off by soft board region).
Further again: described hot-forming method step is a successively: first to adopt the power of 1KG to carry out first time to it and press, it is 3min that first time presses the time, in the process that first time presses, first time heating is carried out to it, the temperature that first time heats controls at 130 DEG C, the duration of heat is 3min, b: then adopt the power of 2KG to carry out second time to it and press, the temperature of second time heating controls at 130 DEG C, the duration of heat is 15min, c: then adopt the power of 2KG to carry out third time to it and press, it is 22min that third time presses the time, in the process that third time presses, third time heating is carried out to it, the temperature that third time heats controls at 180 DEG C, the duration of heat is 5min, d: then adopt the power of 3KG to carry out the 4th time to it and press, the temperature of the 4th heating controls at 180 DEG C, the duration of heat is 60min, e: then adopt the power of 3KG to carry out the 5th time to it and press, pressing the time for 5th time is 70min, in the process of pressing for the 5th time, the 5th heating is carried out to it, the temperature of the 5th heating controls at 180 DEG C, the duration of heat is 72min, f: then adopt the power of 3KG to carry out the 6th time to it and press, pressing the time for 6th time is 60min, the temperature of the 6th heating controls 180 DEG C, the duration of heat is 55min, g: then adopt the power of 3KG to carry out the 7th time to it and press, pressing the time for 7th time is 50min, in the process of pressing for the 7th time, the 7th heating is carried out to it, the temperature of the 7th heating controls 20 DEG C, h: finally then adopt the power of 1KG to carry out the 8th time to it and press, pressing the time for 8th time is 5min.
Further again: described step S7: to need in the process of de-smear to adopt a kind of VCP upper grip, the structure of described VCP upper grip comprises the first jig arm, second jig arm, lead, spring and chuck, the first described jig arm is connected with the second jig arm by bearing pin, described spring is arranged between the first jig arm and the second jig arm, the first described jig arm and the lower end of the second jig arm are respectively fixedly connected with a lead, position relative to lead on described chuck offers through hole, described collet sleeve is contained on lead, retaining mechanism is provided with between described chuck and lead, the inner side of described chuck is also provided with two projections, the inner side being connected to chuck of two described projecting parallel.
Further again: described projection is that the inner side of described chuck offers the first screwed hole, and described threaded post is connected in the first screwed hole by holding out against termination and threaded post connects to form.
Further again: described retaining mechanism comprises and is opened in the second screwed hole outside chuck and clamping screw, and described clamping screw is through the second screwed hole and lead phase.
After adopting said structure, the present invention, by replacing outer field pure copper layer by one side flexible substrate, utilizes the polyimides of flexible substrate to do diaphragm.Utilize polyimides flexibility not easily to break in process of production, also utilize polyimides softness having under External Force Acting and can occur fracture at the edge of copper under the rigid effect of outer copper.The finger of such internal layer all can not touch liquid medicine all the time after pressing.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is step S1: the structural representation in lamination process.
Fig. 2 is the structural representation of VCP upper grip.
Embodiment
The invention provides a kind of gross thickness and be less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre, it comprises the steps: S1: lamination, S2:X-RAY practices shooting, S3: milling edges of boards, S4: thinning copper, S5: outer boring, S6: deburring, S7: de-smear, S8: heavy copper, S9: copper facing, S10: outer-layer circuit pre-treatment, S11: outer laminated film 1, S12: outer-layer circuit exposes, S13: development, S14: outer-layer circuit etching-DES, S15: outer AOI detects, S16: welding resistance pre-treatment, S17: welding resistance printing, S18: pre-baked, S19: welding resistance exposes, S20: welding resistance is developed, S21: bake afterwards, S22: groove milling, S23: take off lid and (tear together with flexible substrate and copper sheet, expose inner finger), S24: change gold, S25: first time silk-screen (character in the rigid plate of print front), S26: first time baking, S27: second time silk-screen (character in back up rigid plate), S28: second time baking, S29: milling plate, S30: stamp, S31: flying probe, S32: product inspection-FQC, S33: packaging, S34: warehouse-in.
As shown in Figure 1, described step S1: lamination is undertaken hot-forming by upper and lower two block plates by four pieces of release films, 9, two pieces of filling films, 10, two pieces of flex plates, 11, two pieces of prepregs 12 and inner plating 13, the both sides up and down of described every block filling film 10 are connected with one piece of release film 9, the both sides up and down of described inner plating 13 are respectively connected with one piece of prepreg 12, the side of described prepreg 12 pasting high temperature carrying tablet is connected with flex plate 11, and the outside of two pieces of described flex plates 11 is respectively connected with one piece of release film 9.
The Making programme of above-mentioned inner plating is as follows: step 1: internal layer sawing sheet, step 2: boring (boring lamination location hole and exposure location hole), step 3: circuit pre-treatment, step 4: interior laminated film, step 5: internal layer circuit exposes, step 6: internal layer circuit etches, step 7: internal layer AOI detects, step 8: alligatoring, step 9: lamination coverlay, step 10: laminated.
The Making programme of above-mentioned prepreg is as follows: step 1: sawing sheet, step 2: boring (boring lamination location hole), step 3: groove milling (the prepreg mill off by soft board region).
Above-mentioned hot-forming method step is a successively: first adopt the power of 1KG to carry out first time to it and press, it is 3min that first time presses the time, in the process that first time presses, first time heating is carried out to it, the temperature that first time heats controls at 130 DEG C, the duration of heat is 3min, b: then adopt the power of 2KG to carry out second time to it and press, the temperature of second time heating controls at 130 DEG C, the duration of heat is 15min, c: then adopt the power of 2KG to carry out third time to it and press, it is 22min that third time presses the time, in the process that third time presses, third time heating is carried out to it, the temperature that third time heats controls at 180 DEG C, the duration of heat is 5min, d: then adopt the power of 3KG to carry out the 4th time to it and press, the temperature of the 4th heating controls at 180 DEG C, the duration of heat is 60min, e: then adopt the power of 3KG to carry out the 5th time to it and press, pressing the time for 5th time is 70min, in the process of pressing for the 5th time, the 5th heating is carried out to it, the temperature of the 5th heating controls at 180 DEG C, the duration of heat is 72min, f: then adopt the power of 3KG to carry out the 6th time to it and press, pressing the time for 6th time is 60min, the temperature of the 6th heating controls 180 DEG C, the duration of heat is 55min, g: then adopt the power of 3KG to carry out the 7th time to it and press, pressing the time for 7th time is 50min, in the process of pressing for the 7th time, the 7th heating is carried out to it, the temperature of the 7th heating controls 20 DEG C, h: finally then adopt the power of 1KG to carry out the 8th time to it and press, pressing the time for 8th time is 5min.
The present invention, by replacing outer field pure copper layer by one side flexible substrate, utilizes the polyimides of flexible substrate to do diaphragm.Utilize polyimides flexibility not easily to break in process of production, also utilize polyimides softness having under External Force Acting and can occur fracture at the edge of copper under the rigid effect of outer copper.The finger of such internal layer all can not touch liquid medicine all the time after pressing.
Above-mentioned step S7: need in the process of de-smear to adopt a kind of VCP upper grip, described VCP upper grip as shown in Figure 2, its structure comprises the first jig arm 1, second jig arm 2, lead 5, spring 3 and chuck 6, the first described jig arm 1 is connected with the second jig arm 2 by bearing pin 4, described spring 3 is arranged between the first jig arm 1 and the second jig arm 2, the first described jig arm 1 and the lower end of the second jig arm 2 are respectively fixedly connected with a lead 5, described chuck 6 offers through hole relative to the position of lead 5, described chuck 6 is sleeved on lead 5, retaining mechanism is provided with between described chuck 6 and lead 5, the inner side of described chuck 6 is also provided with two projections 8, the inner side being connected to chuck 6 that two described projections 8 are parallel.During work, first unclamp retaining mechanism and stretch into length in chuck 6 according to the different adjustment lead 5 of the rigid-flexible fish plate thickness that will clamp, then again retaining mechanism is tightened, subsequently rigid-flexible fish plate is placed between two chucks 6, projection 8 by being oppositely arranged under the effect of spring 3 completes the clamping to rigid-flexible fish plate, the present invention can change the clamping force of upper grip by the length regulating lead to stretch into chuck, thus adds the Practical Performance of upper grip.
Projection 8 is as shown in Figure 2 that the inner side of described chuck 6 offers the first screwed hole, and described threaded post is connected in the first screwed hole by holding out against termination and threaded post connects to form.The design can connect into the length of the first screwed hole by changing threaded post, carried out the adjustment to upper grip clamping force, the length that threaded post stretches into is longer, and the clamping force of upper grip is larger.
Retaining mechanism as shown in Figure 2 comprises and is opened in the second screwed hole outside chuck 6 and clamping screw 7, and described clamping screw 7 is connected with lead 5 through the second screwed hole.When needing to regulate the clamping force of upper grip, unclamping clamping screw 7 regulates lead 5 to stretch into the length of chuck 6, then rotation lock bolt 7 makes it contact with lead 5, make chuck 6 and lead 5 no longer relative displacement occur by clamping screw 7, thus complete the adjustment to upper grip clamping force.The design also has the advantage that structure is simple, be easy to manufacture and practicality and high efficiency.
Claims (8)
1. a gross thickness is less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre, it is characterized in that: comprise the steps: S1: lamination, S2:X-RAY practices shooting, S3: milling edges of boards, S4: thinning copper, S5: outer boring, S6: deburring, S7: de-smear, S8: heavy copper, S9: copper facing, S10: outer-layer circuit pre-treatment, S11: outer laminated film 1, S12: outer-layer circuit exposes, S13: development, S14: outer-layer circuit etching-DES, S15: outer AOI detects, S16: welding resistance pre-treatment, S17: welding resistance printing, S18: pre-baked, S19: welding resistance exposes, S20: welding resistance is developed, S21: bake afterwards, S22: groove milling, S23: take off lid and (tear together with flexible substrate and copper sheet, expose inner finger), S24: change gold, S25: first time silk-screen (character in the rigid plate of print front), S26: first time baking, S27: second time silk-screen (character in back up rigid plate), S28: second time baking, S29: milling plate, S30: stamp, S31: flying probe, S32: product inspection-FQC, S33: packaging, S34: warehouse-in.
2. a kind of gross thickness according to claim 1 is less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre, it is characterized in that: described step S1: lamination is by four pieces of release films (9) by upper and lower two block plates, two pieces of filling films (10), two pieces of flex plates (11), two pieces of prepregs (12) and inner plating (13) carry out hot-forming, the both sides up and down of described every block filling film (10) are connected with one piece of release film (9), the both sides up and down of described inner plating (13) are respectively connected with one piece of prepreg (12), the upper side of pasting high temperature carrying tablet of described prepreg (12) is connected with flex plate (11), the outside of two pieces of described flex plates (11) is respectively connected with one piece of release film (9).
3. gross thickness according to claim 2 is less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre, it is characterized in that: the Making programme of described inner plating is as follows: step 1: internal layer sawing sheet, step 2: boring (boring lamination location hole and exposure location hole), step 3: circuit pre-treatment, step 4: interior laminated film, step 5: internal layer circuit exposes, step 6: internal layer circuit etches, step 7: internal layer AOI detects, step 8: alligatoring, step 9: lamination coverlay, step 10: laminated.
4. gross thickness according to claim 2 is less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre, it is characterized in that: the Making programme of described prepreg is as follows: step 1: sawing sheet, step 2: boring (boring lamination location hole), step 3: groove milling (the prepreg mill off by soft board region).
5. gross thickness according to claim 2 is less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre, it is characterized in that: described hot-forming method step is a successively: first adopt the power of 1KG to carry out first time to it and press, it is 3min that first time presses the time, in the process that first time presses, first time heating is carried out to it, the temperature that first time heats controls at 130 DEG C, the duration of heat is 3min, b: then adopt the power of 2KG to carry out second time to it and press, the temperature of second time heating controls at 130 DEG C, the duration of heat is 15min, c: then adopt the power of 2KG to carry out third time to it and press, it is 22min that third time presses the time, in the process that third time presses, third time heating is carried out to it, the temperature that third time heats controls at 180 DEG C, the duration of heat is 5min, d: then adopt the power of 3KG to carry out the 4th time to it and press, the temperature of the 4th heating controls at 180 DEG C, the duration of heat is 60min, e: then adopt the power of 3KG to carry out the 5th time to it and press, pressing the time for 5th time is 70min, in the process of pressing for the 5th time, the 5th heating is carried out to it, the temperature of the 5th heating controls at 180 DEG C, the duration of heat is 72min, f: then adopt the power of 3KG to carry out the 6th time to it and press, pressing the time for 6th time is 60min, the temperature of the 6th heating controls 180 DEG C, the duration of heat is 55min, g: then adopt the power of 3KG to carry out the 7th time to it and press, pressing the time for 7th time is 50min, in the process of pressing for the 7th time, the 7th heating is carried out to it, the temperature of the 7th heating controls 20 DEG C, h: finally then adopt the power of 1KG to carry out the 8th time to it and press, pressing the time for 8th time is 5min.
6. gross thickness according to claim 1 is less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre, it is characterized in that: described step S7: need in the process of de-smear to adopt a kind of VCP upper grip, the structure of described VCP upper grip comprises the first jig arm (1), second jig arm (2), lead (5), spring (3) and chuck (6), described the first jig arm (1) is connected with the second jig arm (2) by bearing pin (4), described spring (3) is arranged between the first jig arm (1) and the second jig arm (2), described the first jig arm (1) and the lower end of the second jig arm (2) are respectively fixedly connected with a lead (5), described chuck (6) offers through hole relative to the position of lead (5), described chuck (6) is sleeved on lead (5), retaining mechanism is provided with between described chuck (6) and lead (5), the inner side of described chuck (6) is also provided with two projections (8), the inner side being connected to chuck (6) that two described projections (8) are parallel.
7. gross thickness according to claim 6 is less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre, it is characterized in that: described projection (8) is by holding out against termination and threaded post connects to form, the inner side of described chuck (6) offers the first screwed hole, and described threaded post is connected in the first screwed hole.
8. gross thickness according to claim 6 is less than the four layer rigid-flex combined board manufacture method of 0.32mm grafting hand in centre, it is characterized in that: described retaining mechanism comprises the second screwed hole and clamping screw (7) that are opened in chuck (6) outside, and described clamping screw (7) is connected with lead (5) through the second screwed hole.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510703156.0A CN105228380B (en) | 2015-10-26 | 2015-10-26 | A kind of gross thickness is less than four layer rigid-flex combined board preparation method of the 0.32mm grafting hand in centre |
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|---|---|---|---|
| CN201510703156.0A CN105228380B (en) | 2015-10-26 | 2015-10-26 | A kind of gross thickness is less than four layer rigid-flex combined board preparation method of the 0.32mm grafting hand in centre |
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| CN105228380A true CN105228380A (en) | 2016-01-06 |
| CN105228380B CN105228380B (en) | 2018-04-06 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105657969A (en) * | 2016-02-02 | 2016-06-08 | 深圳市仁创艺电子有限公司 | Rigid-flexible combined board and laminating method thereof |
| CN109219273A (en) * | 2018-08-31 | 2019-01-15 | 安徽四创电子股份有限公司 | A kind of laminate structure and compression method of the PCB pressing based on padded coaming |
| CN110753450A (en) * | 2019-11-25 | 2020-02-04 | 深圳市景旺电子股份有限公司 | Manufacturing method of rigid-flex board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590756A (en) * | 1991-09-28 | 1993-04-09 | Ibiden Co Ltd | Production of rigid/flexible board |
| CN104470214A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board |
| CN104486911A (en) * | 2014-10-31 | 2015-04-01 | 镇江华印电路板有限公司 | Manufacturing technology for flex-rigid joint board having welding disc or golden finger at inner layer |
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2015
- 2015-10-26 CN CN201510703156.0A patent/CN105228380B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590756A (en) * | 1991-09-28 | 1993-04-09 | Ibiden Co Ltd | Production of rigid/flexible board |
| CN104486911A (en) * | 2014-10-31 | 2015-04-01 | 镇江华印电路板有限公司 | Manufacturing technology for flex-rigid joint board having welding disc or golden finger at inner layer |
| CN104470214A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105657969A (en) * | 2016-02-02 | 2016-06-08 | 深圳市仁创艺电子有限公司 | Rigid-flexible combined board and laminating method thereof |
| CN109219273A (en) * | 2018-08-31 | 2019-01-15 | 安徽四创电子股份有限公司 | A kind of laminate structure and compression method of the PCB pressing based on padded coaming |
| CN110753450A (en) * | 2019-11-25 | 2020-02-04 | 深圳市景旺电子股份有限公司 | Manufacturing method of rigid-flex board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105228380B (en) | 2018-04-06 |
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