CN107484363A - A kind of preparation method of unsymmetric structure rigid-flex combined board - Google Patents
A kind of preparation method of unsymmetric structure rigid-flex combined board Download PDFInfo
- Publication number
- CN107484363A CN107484363A CN201710965668.3A CN201710965668A CN107484363A CN 107484363 A CN107484363 A CN 107484363A CN 201710965668 A CN201710965668 A CN 201710965668A CN 107484363 A CN107484363 A CN 107484363A
- Authority
- CN
- China
- Prior art keywords
- rigid
- core plate
- unsymmetric structure
- combined board
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of preparation method of unsymmetric structure rigid-flex combined board, the preparation method on each the layer core plate and prepreg of unsymmetric structure rigid-flex combined board by being equipped with auxiliary frame；The rigid core plate for being higher by thin area part makes the inner figure of thick area part, and no inner figure extends partially into Bao Qu, as thin area with pressure auxiliary cover plate 7；Thin area is empty with prepreg milling corresponding to pressure auxiliary cover plate 7, thick area is extended into the rigid core plate of thin area part, milling side will be carried out to auxiliary frame after each rigid core plate, flexible core plate and prepreg gradually lamination pressing after milling out slotted eye along rigid-flexible joint portion, finally each layer core plate after pressing is drilled, produced after Kong Hua, outer-layer circuit, welding resistance and surface treatment.The present invention is handled by one step press, a photoimaging, welding resistance and one-time surface can prepare unsymmetric structure rigid-flex combined board, greatly simplify production technology, contribute to reduction, the lifting of product yield of production cost.
Description
Technical field
The present invention relates to a kind of pcb board, and in particular to a kind of preparation method of unsymmetric structure rigid-flex combined board.
Background technology
So-called unsymmetric structure rigid-flex combined board sets the thick one end of rigid-flex combined board because designer is limited by space
Meter turns into mainboard, and connecting one or more thin branches by flexible section is connected.Unsymmetric structure rigid-flex board presses common process
Need by multiple pressing, multiple photoimaging, welding resistance and surface treatment, complex manufacturing.
The manufacture craft of unsymmetric structure firm flexible printed board in the prior art：Using gradation process for pressing, stream is made
Journey is long, it is necessary to pressing at least twice, two secondary lines/welding resistance, be surface-treated twice；The thin area part of rigid-flex board is pressed first
Close, the drilling for the first time of thin area part, Kong Hua, circuit, welding resistance and surface treatment are completed after pressing；Then to Hou Qu and thin area part
Carry out second to press, complete the thick drilling of area part, Kong Hua, circuit, welding resistance and surface treatment after pressing again；Finally by rigid-flexible knot
Close region to uncap deeply using milling machine or laser machine control, then milling edge forming.The making of existing unsymmetric structure firm flexible printed board
Technique not only grown by the production cycle, and complex manufacturing, product yield is low, and the surface treatment of thin area is limited by process for pressing
System, produce limitation.
The content of the invention
In order to solve problems of the prior art, the invention provides a kind of system of unsymmetric structure rigid-flex combined board
Preparation Method, production technology is not only greatly simplify, widen surface treatment type so that thin area is no longer by the shadow of pressing high temperature
Ring, and the working ability of unsymmetric structure rigid-flex combined board is greatly improved.
In order to achieve the above object, the technical scheme that the present invention takes is as follows：
A kind of preparation method of unsymmetric structure rigid-flex combined board, the unsymmetric structure rigid-flex combined board include flexible core
Plate, and if dried layer rigid core plate and prepreg centered on flexible core plate, the unsymmetric structure rigid-flex combined board bag
Kuo Bao areas part and thick area part, the preparation method are as follows：
(1) auxiliary frame is equipped with first on each the layer core plate and prepreg 2 of unsymmetric structure rigid-flex combined board；
(2) the rigid core plate for being higher by thin area part makes the inner figure of thick area part, and no inner figure extends partially into
Thin area, as thin area with pressure auxiliary cover plate 7；
(3) it is thin area is empty with the milling of prepreg 2 corresponding to pressure auxiliary cover plate 7；
(4) thick area is extended into the rigid core plate of thin area part, slotted eye is milled out along rigid-flexible joint portion；
(5) by each rigid core plate, flexible core plate 3 and prepreg 2, gradually lamination presses；
(6) milling side is carried out to auxiliary frame after pressing；
(7) after drilling and removing thin area with pressure auxiliary cover plate 7, heavy copper hole, outer-layer circuit, welding resistance and surface treatment；
(8) cover plate of rigid-flexible joint portion is opened, milling edge forming, is produced.
Further, aid in frame to include the first auxiliary frame 5 and second described in the step (1) and aid in frame 6；Institute
State and several rivet holes 8 are offered on the first auxiliary frame 5, several described rivet holes 8 are evenly distributed in the first auxiliary side
On frame 5；Several tooling holes 9 are offered on the second auxiliary frame 6, the tooling hole 9 is evenly distributed in the second auxiliary
On frame 6.
Further, the rivet hole 8 is used for core plate pressing fixation；After the tooling hole 9 is fixed for core plate pressing
Drilling operation.
Further, slotted eye is milled out using milling cutter along rigid-flexible joint portion in the step (4), it is auxiliary that the milling cutter is milled into first
Help each 1mm-3mm in the both ends of frame 5.
Further, rigid-flexible joint portion described in the step (4) is specially that step (3) thin area is right with pressure auxiliary cover plate 7
During the prepreg milling vacancy reason answered, rigidity and flexible delivery position.
Further, the rigid-flexible joint portion is for taking thin area off with pressure auxiliary cover plate 7 after pressing, drilling.
Further, in the step (4) centered on flexible core plate 3 by prepreg 2 and rigid core plate from inside to outside
Spacer stack presses successively；The periphery of the flexible core plate 3 includes multiple prepregs 2 and rigid core plate, the flexible core plate 3
Also include cover layer 4 with the joint portion of prepreg 2.
Further, the rigid core plate is FR-4 copper-clad plates 1.
Further, milling side is carried out to the first auxiliary frame 5 after being pressed in the step (6), retains the second auxiliary frame
6。
Beneficial effect：Compared with prior art, the preparation side of a kind of unsymmetric structure rigid-flex combined board of the present invention
Method, the preparation method of unsymmetric structure rigid-flex combined board of the present invention pass through one step press, a photoimaging, welding resistance and once
Surface treatment can prepare unsymmetric structure rigid-flex combined board, greatly simplify production technology, abandoned in the past repeatedly pressing,
Multiple, welding resistance and the technique of surface treatment, using the process of one step press, production procedure simplification is realized, is helped
The lifting of reduction, product yield in production cost；Simultaneously, solves conventional tradition by the process of one step press
Technique is only the limitation of immersion Ni/Au to surface treatment, realizes the rigid-flex board one of process of surface treatment and ordinary construction
Cause, can diversified feature.
Brief description of the drawings
In order to illustrate more clearly of technical scheme, the required accompanying drawing used in embodiment will be made below
Simply introduce, it should be apparent that, drawings in the following description are only some embodiments of the present invention, general for this area
For logical technical staff, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is that frame schematic diagram is aided in a kind of preparation of unsymmetric structure rigid-flex combined board described in embodiment；
Fig. 2 is the prepreg machining sketch chart of the thin area's auxiliary cover plate part of embodiment；
Fig. 3 is the schematic diagram after embodiment unsymmetric structure core plate has finally made；
Fig. 4 is that lamination schematic diagram is pressed in a kind of unsymmetric structure rigid-flex combined board preparation process of embodiment；
Fig. 5 is product schematic diagram after being pressed in a kind of unsymmetric structure rigid-flex combined board preparation process of embodiment；
Fig. 6 is the schematic diagram that drilled in a kind of unsymmetric structure rigid-flex combined board preparation process of embodiment；
Fig. 7 is to take schematic diagram after auxiliary cover plate off in a kind of unsymmetric structure rigid-flex combined board preparation process of embodiment；
Fig. 8 is a kind of unsymmetric structure rigid-flex combined board schematic diagram of embodiment.
In figure：1-FR-4 copper-clad plates, 2- prepregs, 3- flexibility core plate, 4- cover layers, 5- first aid in frame, 6- the
Two auxiliary frames, 7- are with pressure auxiliary cover plate, 8- rivet holes, 9- tooling holes, 10- slotted eyes.
Embodiment
In the description of the invention, it is to be understood that term " first ", " second " are only used for describing purpose, and can not
It is interpreted as indicating or implies relative importance or imply the quantity of the technical characteristic indicated by indicating.Thus, define " the
One ", one or more this feature can be expressed or be implicitly included to the feature of " second ".In the description of the invention,
Unless otherwise indicated, " multiple " are meant that two or more.
The present invention is further elaborated with reference to Figure of description and embodiment.
Embodiment
With reference to figure 1-8, a kind of preparation method of unsymmetric structure rigid-flex combined board, the unsymmetric structure rigid-flex combined board
Including flexible core plate, and if dried layer rigid core plate and prepreg centered on flexible core plate, the unsymmetric structure it is firm
Flex combined board includes thin area part and thick area part, the preparation method are as follows：
(1) auxiliary frame is equipped with first on each the layer core plate and prepreg 2 of unsymmetric structure rigid-flex combined board；
(2) the rigid core plate for being higher by thin area part makes the inner figure of thick area part, and no inner figure extends partially into
Thin area, as thin area with pressure auxiliary cover plate 7；
(3) it is with reference to figure 2, thin area is empty with the milling of prepreg 2 corresponding to pressure auxiliary cover plate 7；
(4) with reference to figure 3, thick area is extended into the rigid core plate of thin area part, slotted eye is milled out along rigid-flexible joint portion；
(5) with reference to figure 4, by each rigid core plate, flexible core plate 3 and prepreg 2, gradually lamination presses；
(6) with reference to figure 5, milling side is carried out to auxiliary frame after pressing；
(7) after drilling and removing thin area with pressure auxiliary cover plate 7, heavy copper hole, outer-layer circuit, welding resistance and surface treatment；
(8) cover plate of rigid-flexible joint portion is opened, milling edge forming, is produced.
Further, aid in frame to include the first auxiliary frame 5 and second described in the step (1) and aid in frame 6；Institute
State and several rivet holes 8 are offered on the first auxiliary frame 5, several described rivet holes 8 are evenly distributed in the first auxiliary side
On frame 5；Several tooling holes 9 are offered on the second auxiliary frame 6, the tooling hole 9 is evenly distributed in the second auxiliary
On frame 6.Fixed it should be noted that rivet hole 8 described in the present embodiment is used for core plate pressing；The tooling hole 9 is used for core
Drilling operation after plate pressing is fixed.
Further, slotted eye is milled out using milling cutter along rigid-flexible joint portion in the step (4), it is auxiliary that the milling cutter is milled into first
Help each 1mm-3mm in the both ends of frame 5.
Match somebody with somebody it should be noted that rigid-flexible joint portion described in step described in the present embodiment (4) is specially step (3) thin area
When pressing the milling vacancy of prepreg 2 reason corresponding to auxiliary cover plate 7, rigidity and flexible delivery position.The rigid-flexible joint portion is used for
Thin area is taken after pressing, drilling off with pressure auxiliary cover plate 7.
Further, with reference to figure 4, by prepreg 2 and rigid core plate centered on flexible core plate 3 in the step (4)
Spacer stack presses successively from inside to outside；The periphery of the flexible core plate 3 includes multiple prepregs 2 and rigid core plate, described
The joint portion of flexible core plate 3 and prepreg 2 also includes cover layer.Further, rigid core plate described in the present embodiment is FR-
4 copper-clad plates 1.
It should be noted that with reference to figure 4, in the step (4) dotted portion be with pressure auxiliary cover plate 7, it is described auxiliary with pressing
Part corresponding to cover plate 7 is helped without prepreg 3.
Further, with reference to figure 5, milling side is carried out to the first auxiliary frame 5 after the middle pressing of the step (6), retains second
Aid in frame 6.
It should be noted that with reference to figure 5, the asymmetric region dotted line part of the second auxiliary frame 6 is without prepreg phase
With reference to.With reference to figure 6, during drilling, do not remove with pressure auxiliary cover plate 7, for ensureing that Bao Qu and thick area part are comparatively smooth, just
Just drill production operation.
It should be noted that with reference to figure 8, outer-layer circuit, welding resistance are completed using LDI exposure machines.Described in the present embodiment
It is 20mm-30mm that one auxiliary frame 5 and second, which aids in the wide cut of frame 6, and the present embodiment step (2) will be higher by the firm of thin area part
Property core plate produce thick area part inner figure be by routine pattern transfer technology complete.Rigidity described in the present embodiment
The making of core plate, flexible core plate and prepreg, is processed by prior art.To the heavy copper of progress after being drilled in the present embodiment
Kong Hua, outer-layer circuit, welding resistance and surface treatment belong to prior art.
Above is the preferred embodiment of the present invention, it is noted that for those skilled in the art,
Under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as this hair
Bright protection domain.
Claims (9)
1. a kind of preparation method of unsymmetric structure rigid-flex combined board, the unsymmetric structure rigid-flex combined board includes flexible core plate
(3), and by flexible core plate (3) if centered on dried layer rigid core plate and prepreg (2), the rigid-flexible knot of unsymmetric structure
Plywood includes thin area part and thick area part, it is characterised in that：The preparation method is as follows：
(1) auxiliary frame is equipped with first on each the layer core plate and prepreg (2) of unsymmetric structure rigid-flex combined board；
(2) the rigid core plate for being higher by thin area part makes the inner figure of thick area part, and no inner figure extends partially into Bao Qu,
As thin area with pressure auxiliary cover plate (7)；
(3) it is thin area is empty with prepreg (2) milling corresponding to pressure auxiliary cover plate (7)；
(4) thick area is extended into the rigid core plate of thin area part, slotted eye is milled out along rigid-flexible joint portion；
(5) by each rigid core plate, flexible core plate (3) and prepreg (2), gradually lamination presses；
(6) milling side is carried out to auxiliary frame after pressing；
(7) after drilling and removing thin area with pressure auxiliary cover plate (7), heavy copper hole, outer-layer circuit, welding resistance and surface treatment；
(8) cover plate of rigid-flexible joint portion is opened, milling edge forming, is produced.
A kind of 2. preparation method of unsymmetric structure rigid-flex combined board according to claim 1, it is characterised in that：The step
Suddenly frame is aided in include the first auxiliary frame (5) and the second auxiliary frame (6) described in (1)；On the first auxiliary frame (5)
Several rivet holes (8) are offered, several described rivet holes (8) are evenly distributed on the first auxiliary frame (5)；Described
Several tooling holes (9) are offered on two auxiliary frames (6), the tooling hole (9) is evenly distributed in the second auxiliary frame (6)
On.
A kind of 3. preparation method of unsymmetric structure rigid-flex combined board according to claim 2, it is characterised in that：The riveting
Close hole (8) and be used for core plate pressing fixation；The tooling hole (9) is used for the drilling operation after core plate pressing is fixed.
A kind of 4. preparation method of unsymmetric structure rigid-flex combined board according to claim 1, it is characterised in that：The step
Suddenly slotted eye is milled out using milling cutter along rigid-flexible joint portion in (4), the milling cutter is milled into first auxiliary frame (5) each 1mm-3mm in both ends.
A kind of 5. preparation method of unsymmetric structure rigid-flex combined board according to claim 1 or 4, it is characterised in that：Institute
It is specially that prepreg (2) milling corresponding to pressure auxiliary cover plate (7) is matched somebody with somebody in step (3) thin area to state rigid-flexible joint portion described in step (4)
When vacancy is managed, rigidity and flexible delivery position.
A kind of 6. preparation method of unsymmetric structure rigid-flex combined board according to claim 1 or 4, it is characterised in that：Institute
Rigid-flexible joint portion is stated for taking thin area after pressing, drilling off with pressure auxiliary cover plate (7).
A kind of 7. preparation method of unsymmetric structure rigid-flex combined board according to claim 1, it is characterised in that：The step
Suddenly by prepreg (2) and rigid core plate, spacer stack presses successively from inside to outside centered on flexible core plate (3) in (4)；Institute
Stating the periphery of flexible core plate (3) includes multiple prepregs (2) and rigid core plate, the flexible core plate (3) and prepreg (2)
Joint portion also include cover layer (4).
A kind of 8. preparation method of unsymmetric structure rigid-flex combined board according to claim 1 or 7, it is characterised in that：Institute
It is FR-4 copper-clad plates (1) to state rigid core plate.
A kind of 9. preparation method of unsymmetric structure rigid-flex combined board according to claim 1, it is characterised in that：The step
Suddenly milling side is carried out to the first auxiliary frame (5) after being pressed in (6), retains the second auxiliary frame (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710965668.3A CN107484363A (en) | 2017-10-17 | 2017-10-17 | A kind of preparation method of unsymmetric structure rigid-flex combined board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710965668.3A CN107484363A (en) | 2017-10-17 | 2017-10-17 | A kind of preparation method of unsymmetric structure rigid-flex combined board |
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| Publication Number | Publication Date |
|---|---|
| CN107484363A true CN107484363A (en) | 2017-12-15 |
Family
ID=60606506
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|---|---|---|---|
| CN201710965668.3A Pending CN107484363A (en) | 2017-10-17 | 2017-10-17 | A kind of preparation method of unsymmetric structure rigid-flex combined board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110012600A (en) * | 2019-03-29 | 2019-07-12 | 博敏电子股份有限公司 | A kind of high multi-layer rigid-flexible combined circuit board of asymmetry and preparation method |
| CN110785022A (en) * | 2019-11-06 | 2020-02-11 | 珠海杰赛科技有限公司 | Manufacturing process of asymmetric rigid-flex printed circuit board |
| CN112770535A (en) * | 2021-01-31 | 2021-05-07 | 惠州中京电子科技有限公司 | Method for processing rigid-flex board with main board structure and auxiliary board structure |
| CN113840480A (en) * | 2021-09-30 | 2021-12-24 | 珠海杰赛科技有限公司 | Manufacturing method of asymmetric rigid-flex printed circuit board |
| WO2022096000A1 (en) * | 2020-11-09 | 2022-05-12 | 广东科翔电子科技股份有限公司 | Process method for asymmetric multilayer rigid-flex board having air cavity |
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| CN202998677U (en) * | 2012-12-12 | 2013-06-12 | 广东生益科技股份有限公司 | Structural component for improving PCB edge delamination and PCB comprising the same |
| CN103687346A (en) * | 2013-11-18 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Rigid-flexible combined printed circuit board preparation method |
| CN106793587A (en) * | 2016-12-21 | 2017-05-31 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board with blind slot and preparation method thereof |
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| JP3888304B2 (en) * | 2002-12-25 | 2007-02-28 | 新神戸電機株式会社 | Shield plate for rigid flexible multilayer printed wiring board and manufacturing method thereof, and manufacturing method of rigid flexible multilayer printed wiring board |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110012600A (en) * | 2019-03-29 | 2019-07-12 | 博敏电子股份有限公司 | A kind of high multi-layer rigid-flexible combined circuit board of asymmetry and preparation method |
| CN110012600B (en) * | 2019-03-29 | 2024-05-07 | 博敏电子股份有限公司 | Asymmetric high multilayer rigid-flex circuit board and preparation method thereof |
| CN110785022A (en) * | 2019-11-06 | 2020-02-11 | 珠海杰赛科技有限公司 | Manufacturing process of asymmetric rigid-flex printed circuit board |
| CN110785022B (en) * | 2019-11-06 | 2021-10-08 | 珠海杰赛科技有限公司 | Manufacturing process of asymmetric rigid-flex printed circuit board |
| WO2022096000A1 (en) * | 2020-11-09 | 2022-05-12 | 广东科翔电子科技股份有限公司 | Process method for asymmetric multilayer rigid-flex board having air cavity |
| CN112770535A (en) * | 2021-01-31 | 2021-05-07 | 惠州中京电子科技有限公司 | Method for processing rigid-flex board with main board structure and auxiliary board structure |
| CN112770535B (en) * | 2021-01-31 | 2024-01-26 | 惠州中京电子科技有限公司 | Processing method of soft and hard combined plate with main plate structure and auxiliary plate structure |
| CN113840480A (en) * | 2021-09-30 | 2021-12-24 | 珠海杰赛科技有限公司 | Manufacturing method of asymmetric rigid-flex printed circuit board |
| CN113840480B (en) * | 2021-09-30 | 2023-03-17 | 珠海杰赛科技有限公司 | Manufacturing method of asymmetric rigid-flex printed circuit board |
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Application publication date: 20171215 |
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