CN104320929B - A kind of preparation method for the printed board that multilayer rigid-flex combines and has resistance requirements - Google Patents
A kind of preparation method for the printed board that multilayer rigid-flex combines and has resistance requirements Download PDFInfo
- Publication number
- CN104320929B CN104320929B CN201410621646.1A CN201410621646A CN104320929B CN 104320929 B CN104320929 B CN 104320929B CN 201410621646 A CN201410621646 A CN 201410621646A CN 104320929 B CN104320929 B CN 104320929B
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- China
- Prior art keywords
- soft board
- copper foil
- circuit
- preparation
- resistance requirements
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A kind of preparation method for the printed board for being combined the present invention relates to multilayer rigid-flex and having resistance requirements, its step includes：Internal layer soft board circuit makes, and presses cover layer on the soft board two sides made;The processing of PP pieces, copper foil and soft board surface treatment;By soft board, the PP pieces and copper foil lamination handled well, and using false sticker precompressed positioning；The PP pieces and copper foil for soft board is pressed using pressing machine, handling well；Outer-layer circuit makes, and is removed being etched at the outer copper foil that need not make circuit.Plate-making method of the present invention is greatly improved product yield by Row control, reaches more than 90%, product rejection rate is reduced to 8% or so.
Description
Technical field
The present invention relates to FPC soft board technical fields, and in particular to a kind of rigid-flex combines and has the printing of resistance requirements
The preparation method of plate.
Background technology
Current electronic product is less and less, needs to use multilayer soft board on increasing electronic product and is combined simultaneously with hardboard
Printed board with resistance requirements, the particularly communications field.Current multilayer soft board is combined with hardboard and has the print of resistance requirements
Making sheet, its softness and reliability requirement are very strict, and core manufacturing technology is by the state monopolies such as Japan, South Korea, Europe, state
Interior FPC manufacturing enterprises produce that this type plate technique is also immature, and quality is unstable, and production qualification rate is only 50% or so, scrappage
Up to more than 30%, cost is manufactured very high, it is impossible to reach volume production.The most of dependence on import of such template, significantly increases at present
Plus business burden, cause entreprise cost to rise, profit margin is relatively low.
The content of the invention
In view of the above-mentioned problems, the present invention provides a kind of system for the printed board that multilayer rigid-flex combines and has resistance requirements
Make method, its step includes：
（1）Internal layer soft board circuit makes, and presses cover layer on the soft board two sides made;
（2）The processing of PP pieces:PP according to design requirement in the outer copper foil corresponding position by that need not make circuit is removed;
(3) by soft board, the PP pieces and copper foil lamination handled well, and using false sticker precompressed positioning；
(4) the PP pieces and copper foil for soft board is pressed using pressing machine, handling well；
(5) outer-layer circuit makes, and is removed being etched at the outer copper foil that need not make circuit.
It is preferred that, the inner figure transfer is can be controlled in using the identification production of automatic exposure machine CCD para-position, precision
Within 0.02MM, manual alignment is controlled within 0.1MM.
It is preferred that, step（3）The step of also including carrying out surface coarsening processing to copper foil before lamination.
It is preferred that, step（3）Also include the soft board for pressing cover layer is carried out removing silicone oil before lamination and be roughened cover layer
Process.
Specifically, reducing 0.01-0.02MM than set-point to that should there is the circuit line width of resistance requirements to set in step (5).
It is preferred that, outer-layer circuit is made in solder mask, printing-ink process using printing-ink mode after completing and adopted
Recognized with automatic exposure machine CCD para-position.
It is preferred that, contraposition is recognized using automatic exposure machine CCD when the internal layer soft board circuit makes, two sides circuit weight is controlled
Right deviation is less than 0.02MM.
It is preferred that, internal layer circuit and outer-layer circuit are equipped with after completing to be checked plate using optical detecting instrument
The step of.
Compared with prior art, plate-making method of the present invention is controlled in each critical process, it is ensured that finished product
The q＆r of wiring board, through experiment, can improve 1 yield 90% or so of production, scrappage is reduced to 8% or so, and it has
Beneficial effect is embodied in：
（1）PP pieces locally wash out part using mould, it is ensured that product has good bending performance, increase the softness of product
Effect；
（2）Internal layer soft board two sides circuit registration is ensured using CCD para-position identification during pattern transfer and the inclined of drilling is reduced
Shifting degree, also ensure that the registration of outer layer string holes ring and internal layer circuit；
（3）Precompressed is carried out first when outer copper foil, PP and internal layer soft board overlapping, and disposable overlapping in place, reduces PP, copper foil
With the drift rate of internal layer soft board, accomplish the perfect disposable combination of three, reduce the deviation that the windowing of PP pieces and internal layer soft board are combined;
（4）Before outer stack PP pieces, cross and move back film process, increase PP and internal layer cover layer adhesion, it is ensured that wiring board is crossed back
It will not be layered, alveolate will not produce after fluid welding.
Embodiment
For convenience it will be understood by those skilled in the art that the present invention, makees further with reference to specific embodiment to the present invention
Detailed description.
The preparation method for the printed board that rigid-flex of the present invention combines and has resistance requirements, its idiographic flow is as follows：
（1）Internal layer soft board circuit makes, and presses cover layer on the soft board two sides made.The step is specifically included：Open
Drilled after material, for automatic exposure machine contraposition；CCD automatic identifications are aligned, and carry out needing to ensure plate two sides in pattern transfer, this step
Registration tolerance is less than:±0.02mm；Developed in DES lines, etch and finally make internal layer soft board circuit.
After internal layer soft board circuit is made, quality examination need to be carried out using automatic optical detecting instrument inspection.
（2）The processing of PP pieces:PP according to design requirement in the outer copper foil corresponding position by that need not make circuit is removed.
(3) by soft board, the PP pieces and copper foil lamination handled well, and using false sticker precompressed positioning.Soft board and copper before precompressed
Paper tinsel surface is both needed to processing.Nog plate, microetch need to be carried out to copper foil to increase the adhesion of copper face roughness, increase copper foil and PP；It is right
The cover layer on soft board surface is roughened, the adhesion of increase PP and cover layer.
(4) the PP pieces and copper foil for soft board is pressed using pressing machine, handling well；Need to carry out fastness inspection after pressing.
(5) when outer-layer circuit makes, target goes out positioning hole first, then intercommunicating pore between spitting drill plate, and copper facing is connected in hole
Inside and outside sandwich circuit, then outer-layer circuit figure is made, outer-layer circuit is also etched using DES lines, according to the figure of making, during etching
Removed being etched at the outer copper foil that need not make circuit, it is corresponding with the position that internal layer removes PP, increase the softness of whole plate
Degree.It can be reduced because circuit does impedance value after welding resistance, impedance value is first more than by the method for adjusted design line width in the present invention
Setting value, after such welding resistance makes, meets the impedance design requirement of wiring board.General circuit line width is set to be reduced than set-point
0.01-0.02MM。
Finally also need to carry out wiring board post-processing, including printing solder mask, impedance detection, plating nickel gold increase
Solderability, silk-screen etc..
Above-described embodiment is only the one of which implementation of the present invention, and it describes more specific and detailed, it is impossible to therefore
And it is interpreted as the limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, not
On the premise of departing from present inventive concept, various modifications and improvements can be made, these obvious alternative forms are belonged to
Protection scope of the present invention.
Claims (6)
1. a kind of preparation method for the printed board that multilayer rigid-flex combines and has resistance requirements, its step includes：
（1）Internal layer soft board circuit makes, and presses cover layer on the soft board two sides made;
（2）The processing of PP pieces:PP pieces according to design requirement in the outer copper foil corresponding position by that need not make circuit are removed;
（3）By soft board, the PP pieces and copper foil lamination handled well, and using false sticker precompressed positioning；
（4）The PP pieces and copper foil for soft board is pressed using pressing machine, handling well；
（5）Outer-layer circuit makes, and is removed being etched at the outer copper foil that need not make circuit；
In step (5) 0.01-0.02mm is reduced to that there should be the circuit line width of resistance requirements to set than set-point.
2. the preparation method that the multilayer rigid-flex according to claim 1 combined and had the printed board of resistance requirements, it is special
Levy and be, step（3）The step of also including carrying out surface coarsening processing to copper foil before lamination.
3. the preparation method that the multilayer rigid-flex according to claim 1 combined and had the printed board of resistance requirements, its
It is characterised by, step（3）Also include the soft board for pressing cover layer is carried out removing silicone oil before lamination and be roughened the process of cover layer.
4. the preparation method that the multilayer rigid-flex according to claim 1 combined and had the printed board of resistance requirements, it is special
Levy and be, outer-layer circuit is made in solder mask, printing-ink process using automatic exposure after completing using printing-ink mode
Ray machine CCD contraposition identifications.
5. the preparation method that the multilayer rigid-flex according to claim 1 combined and had the printed board of resistance requirements, it is special
Levy and be, contraposition is recognized using automatic exposure machine CCD when the internal layer soft board circuit makes, control two sides circuit registration
Deviation is less than 0.02mm.
6. the preparation method that the multilayer rigid-flex according to claim 1 combined and had the printed board of resistance requirements, it is special
Levy and be, internal layer circuit and outer-layer circuit are equipped with the step of being checked using optical detecting instrument plate after completing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410621646.1A CN104320929B (en) | 2014-11-07 | 2014-11-07 | A kind of preparation method for the printed board that multilayer rigid-flex combines and has resistance requirements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410621646.1A CN104320929B (en) | 2014-11-07 | 2014-11-07 | A kind of preparation method for the printed board that multilayer rigid-flex combines and has resistance requirements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104320929A CN104320929A (en) | 2015-01-28 |
| CN104320929B true CN104320929B (en) | 2017-08-25 |
Family
ID=52376072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410621646.1A Expired - Fee Related CN104320929B (en) | 2014-11-07 | 2014-11-07 | A kind of preparation method for the printed board that multilayer rigid-flex combines and has resistance requirements |
Country Status (1)
| Country | Link |
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| CN (1) | CN104320929B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304660A (en) * | 2016-08-30 | 2017-01-04 | 惠州新联兴实业有限公司 | Outer layer thin copper foil circuit board pressing method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704908B (en) * | 2016-02-25 | 2018-01-19 | 广东欧珀移动通信有限公司 | Mobile terminal, Rigid Flex and its manufacture method |
| CN107415484B (en) * | 2017-06-09 | 2023-09-01 | 东莞市威力固电路板设备有限公司 | Prestack ink jet numbering machine |
| CN109493799B (en) | 2018-11-29 | 2020-09-29 | 昆山国显光电有限公司 | Auxiliary method and device for one-time programmable (OTP) adjustment of display panel |
| CN115666010B (en) * | 2022-11-21 | 2023-03-21 | 惠州市金百泽电路科技有限公司 | Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
| JP2013138124A (en) * | 2011-12-28 | 2013-07-11 | Taiyo Ink Mfg Ltd | Multilayer printed board manufacturing method, multilayer printed board manufactured by the manufacturing method, and curable resin composition used in the manufacturing method |
-
2014
- 2014-11-07 CN CN201410621646.1A patent/CN104320929B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
| JP2013138124A (en) * | 2011-12-28 | 2013-07-11 | Taiyo Ink Mfg Ltd | Multilayer printed board manufacturing method, multilayer printed board manufactured by the manufacturing method, and curable resin composition used in the manufacturing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304660A (en) * | 2016-08-30 | 2017-01-04 | 惠州新联兴实业有限公司 | Outer layer thin copper foil circuit board pressing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104320929A (en) | 2015-01-28 |
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Granted publication date: 20170825 Termination date: 20201107 |