CN102510670B - Method and tool for manufacturing flexible PCB (printed circuit board) - Google Patents
Method and tool for manufacturing flexible PCB (printed circuit board) Download PDFInfo
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- CN102510670B CN102510670B CN201110432045.2A CN201110432045A CN102510670B CN 102510670 B CN102510670 B CN 102510670B CN 201110432045 A CN201110432045 A CN 201110432045A CN 102510670 B CN102510670 B CN 102510670B
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- lamina membranacea
- reference column
- internal layer
- soft board
- board
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Abstract
The invention provides a method for manufacturing a flexible PCB (printed circuit board). The method comprises the following steps: A. respectively tapping three inner-layer two-sided flexible boards, six covering film boards and adhesive boards, and sequentially carrying out film pasting, exposing and circuit etching on the inner-layer two-sided flexible boards, wherein the six covering film boards are respectively first, second, third, fourth, fifth and sixth covering film boards, the three inner-layer two-sided flexible boards are respectively first, second and third two-sided flexible boards, the two adhesive boards are respectively first and second adhesive boards; and B, sleeving the holes tapped on each inner-layer two-sided flexible board, each covering film board and each adhesive board onto the outer surface of a positioning column, sequentially arranging the first covering film board, the first inner-layer two-sided flexible board, the second covering film board, the first adhesive board, the third covering film board, the second inner-layer two-sided flexible board, the fourth covering film board, the second adhesive board, the fifth covering film board, the third inner-layer two-sided flexible board and the sixth covering film board in a laminated manner from the top of the positioning column to the bottom of the positioning column, and then laminating each inner-layer two-sided flexible board, each covering film board and each adhesive board on the positioning column.
Description
Technical field
The present invention relates to manufacture method and the instrument of flexible PCB, relate in particular to multilayer soft board layer and layer contraposition laminating method in the multilayer soft board of flexible PCB or the internal layer of multilayer Rigid Flex.
Background technology
Multilayer soft board separation lamination method in the internal layer of production multilayer soft board or multilayer Rigid Flex in industry at present, technological process is: 3 internal layer double surface soft boards carry out respectively blanking → pad pasting, exposure → circuit etching → paste epiphragma → lamination, plate face roughening treatment → rubberizing → lamination contraposition → lamination after lamination.There are several large control difficult points that affect quality in such a production procedure: the one, and the quality of roughening treatment, the distortion of plate in roughening treatment; The 2nd, the internal layer double surface soft board shrink ratio after lamination is different, in the time of folded contraposition between layers, very difficult control is the accuracy of contraposition between layers, so just has adhesion between layers and the deviation of contraposition between layers, can hold because hole off normal causes, short circuit; And cause not plate bursting, foaming, hole obstructed because of adhesion; Such production procedure must affect production yield.
Summary of the invention
In order to solve the problems of the prior art, the invention provides a kind of method of manufacturing flexible PCB.
The invention provides a kind of method of manufacturing flexible PCB, comprise the steps:
A. respectively internal layer double surface soft board, covering lamina membranacea, bonding offset plate are carried out to perforate, internal layer double surface soft board is carried out to pad pasting, exposure, circuit etching successively;
B. described covering lamina membranacea is six, is respectively first to the 6th and covers lamina membranacea; Described internal layer double surface soft board is three, is respectively the first to the 3rd internal layer double surface soft board; Described bonding offset plate is two, is respectively the first to second bonding offset plate; By the perforate of each internal layer double surface soft board, respectively cover the perforate of lamina membranacea and the perforate of each bonding offset plate is all enclosed within reference column outer surface; First there are the first covering lamina membranacea, the first internal layer double surface soft board, second to cover lamina membranacea, the first bonding offset plate, the 3rd covering lamina membranacea, the second internal layer double surface soft board, the 4th covering lamina membranacea, the second bonding offset plate, the 5th covering lamina membranacea, the 3rd internal layer double surface soft board, the 6th covering lamina membranacea from reference column top to reference column bottom successively stacked arrangement; Then the each internal layer double surface soft board on reference column, covering lamina membranacea, bonding offset plate are carried out to lamination.
As a further improvement on the present invention, reference column is two, and two reference column at right angle settings are on fixture, and reference column bottom is clamped by described fixture; Each internal layer double surface soft board, the perforate that respectively covers lamina membranacea and each bonding offset plate are two, and two perforates of each internal layer double surface soft board are enclosed within respectively two reference column outer surfaces, each two perforates that cover lamina membranacea are enclosed within respectively two reference column outer surfaces, and two perforates of each bonding offset plate are enclosed within respectively two reference column outer surfaces.
As a further improvement on the present invention, described reference column is pin.
As a further improvement on the present invention, in described steps A, carry out plasma cleaning to covering lamina membranacea.
The present invention also provides a kind of instrument of manufacturing flexible PCB, comprises fixture and reference column, and described fixture clamps described reference column bottom.
As a further improvement on the present invention, described reference column is two, and two described reference column at right angle settings are on described fixture.
As a further improvement on the present invention, described reference column is pin.
The invention has the beneficial effects as follows: effectively solve multilayer soft board layer and a layer aligning accuracy in the internal layer of multilayer soft board or multilayer Rigid Flex, avoid in a large number because hole off normal causes out, short circuit; Avoid causing plate bursting, foaming, hole obstructed because of adhesion.Improve the qualification rate of producing, reduced production cost.
Brief description of the drawings
Fig. 1 is lamination schematic diagram of the present invention.
Embodiment
As shown in Figure 1, the invention discloses a kind of method of manufacturing flexible PCB, comprise following two steps: in first step, respectively internal layer double surface soft board, covering lamina membranacea, bonding offset plate are carried out to perforate, internal layer double surface soft board is carried out to pad pasting, exposure, circuit etching successively.In second step, described covering lamina membranacea is six, is respectively first to the 6th and covers lamina membranacea 1,3,5,7,9,11; Described internal layer double surface soft board is three, is respectively the first to the 3rd internal layer double surface soft board 2,6,10; Described bonding offset plate is two, is respectively the first to second bonding offset plate 4,8; By the perforate of each internal layer double surface soft board, respectively cover the perforate of lamina membranacea and the perforate of each bonding offset plate and be all enclosed within reference column 12 outer surfaces; First there are the first covering lamina membranacea 1, the first internal layer double surface soft board 2, the second covering lamina membranacea 3, the first bonding offset plate 4, the 3rd covering lamina membranacea 5, the second internal layer double surface soft board 6, the 4th covering lamina membranacea 7, the second bonding offset plate 8, the 5th covering lamina membranacea 9, the 3rd internal layer double surface soft board 10, the 6th covering lamina membranacea 11 from reference column 12 tops to reference column 12 bottoms successively stacked arrangement; Then by the each internal layer double surface soft board on reference column 12 2,6,10 with cover lamina membranacea 1,3,5,7,9,11 and bonding offset plate 4,8 and carry out lamination.
Reference column 12 is two, and two reference column 12 at right angle settings are on fixture 13, and reference column 12 bottoms are clamped by described fixture 13; Each internal layer double surface soft board 2,6,10, the perforate that respectively covers lamina membranacea 1,3,5,7,9,11 and each bonding offset plate 4,8 are two, and two perforates of each internal layer double surface soft board 2,6,10 are enclosed within respectively two reference column 12 outer surfaces, each two perforates that cover lamina membranacea 1,3,5,7,9,11 are enclosed within respectively two reference column 12 outer surfaces, and two perforates of each bonding offset plate 4,8 are enclosed within respectively two reference column 12 outer surfaces.Described reference column 12 is pin.
In described first step, carry out plasma cleaning to covering lamina membranacea 1,3,5,7,9,11.
Lamination again by internal layer double surface soft board 2,6,10 and after covering lamina membranacea 1,3,5,7,9,11 and bonding offset plate 4,8 and being stacked on reference column 12, improves adhesion between layers, thereby improves yields.
Press with pin and fixture 13 contrapositions, vacation, plank itself is distortion not, then uses pin and fixture 13 contrapositions, improves greatly contraposition accuracy between layers.Improve adhesion and contraposition accuracy between layers between layers, thereby improve the yields of producing.
Effectively the multilayer soft board layer in the internal layer of solution multilayer soft board or multilayer Rigid Flex and a layer aligning accuracy, avoid in a large number because hole off normal causes out, short circuit; Avoid causing plate bursting, foaming, hole obstructed because of adhesion.Improve the qualification rate of producing, reduced production cost.Layer refers to that with layer each internal layer double surface soft board 2,6,10 and covering lamina membranacea 1,3,5,7,9,11 and bonding offset plate 4,8 are laminated on together.
The invention also discloses a kind of instrument of manufacturing flexible PCB, comprise fixture 13 and reference column 12, described fixture 13 clamps described reference column 12 bottoms.
Described reference column 12 is two, and two described reference column at right angle settings are on described fixture.Described reference column 12 is pin.Reference column 12 can be at the enterprising line displacement of fixture 13, and can be by fixture 13 clampings.
Instrument of the present invention can improve adhesion and contraposition accuracy between layers between layers, thereby improves the yields of producing.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (4)
1. a method of manufacturing flexible PCB, is characterized in that, comprises the steps:
A. respectively internal layer double surface soft board, covering lamina membranacea, bonding offset plate are carried out to perforate, internal layer double surface soft board is carried out to pad pasting, exposure, circuit etching successively;
B. described covering lamina membranacea is six, is respectively first to the 6th and covers lamina membranacea; Described internal layer double surface soft board is three, is respectively the first to the 3rd internal layer double surface soft board; Described bonding offset plate is two, is respectively the first to second bonding offset plate; By the perforate of each internal layer double surface soft board, respectively cover the perforate of lamina membranacea and the perforate of each bonding offset plate is all enclosed within reference column outer surface; First there are the first covering lamina membranacea, the first internal layer double surface soft board, second to cover lamina membranacea, the first bonding offset plate, the 3rd covering lamina membranacea, the second internal layer double surface soft board, the 4th covering lamina membranacea, the second bonding offset plate, the 5th covering lamina membranacea, the 3rd internal layer double surface soft board, the 6th covering lamina membranacea from reference column top to reference column bottom successively stacked arrangement; Then the each internal layer double surface soft board on reference column, covering lamina membranacea, bonding offset plate are carried out to lamination.
2. method according to claim 1, is characterized in that: reference column is two, and two reference column at right angle settings are on fixture, and reference column bottom is clamped by described fixture; Each internal layer double surface soft board, the perforate that respectively covers lamina membranacea and each bonding offset plate are two, and two perforates of each internal layer double surface soft board are enclosed within respectively two reference column outer surfaces, each two perforates that cover lamina membranacea are enclosed within respectively two reference column outer surfaces, and two perforates of each bonding offset plate are enclosed within respectively two reference column outer surfaces.
3. method according to claim 2, is characterized in that: described reference column is pin.
4. according to the method described in claims 1 to 3 any one, it is characterized in that: in described steps A, carry out plasma cleaning to covering lamina membranacea.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110432045.2A CN102510670B (en) | 2011-12-21 | 2011-12-21 | Method and tool for manufacturing flexible PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110432045.2A CN102510670B (en) | 2011-12-21 | 2011-12-21 | Method and tool for manufacturing flexible PCB (printed circuit board) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102510670A CN102510670A (en) | 2012-06-20 |
| CN102510670B true CN102510670B (en) | 2014-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110432045.2A Active CN102510670B (en) | 2011-12-21 | 2011-12-21 | Method and tool for manufacturing flexible PCB (printed circuit board) |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025086B (en) * | 2012-12-28 | 2015-03-25 | 广州杰赛科技股份有限公司 | PCB (printed circuit board) plasma treatment method |
| CN104125727A (en) * | 2014-07-31 | 2014-10-29 | 高德（无锡）电子有限公司 | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards |
| CN106385761A (en) * | 2016-11-29 | 2017-02-08 | 珠海杰赛科技有限公司 | Manufacture method for multilayer flexible circuit board and multilayer flexible circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201774744U (en) * | 2010-08-03 | 2011-03-23 | 厦门新福莱科斯电子有限公司 | Auxiliary tool clamp for gluing supplementary material on flexible printed circuit (FPC) |
| CN102083273A (en) * | 2009-11-28 | 2011-06-01 | 比亚迪股份有限公司 | Method for laminating covering film of flexible printed circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007324473A (en) * | 2006-06-02 | 2007-12-13 | Fujifilm Corp | Board transfer carrier |
| CN101203094B (en) * | 2006-12-12 | 2010-06-16 | 比亚迪股份有限公司 | Method for multi-layer board semi-curing glue transferring of flexible printed wiring board |
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- 2011-12-21 CN CN201110432045.2A patent/CN102510670B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102083273A (en) * | 2009-11-28 | 2011-06-01 | 比亚迪股份有限公司 | Method for laminating covering film of flexible printed circuit board |
| CN201774744U (en) * | 2010-08-03 | 2011-03-23 | 厦门新福莱科斯电子有限公司 | Auxiliary tool clamp for gluing supplementary material on flexible printed circuit (FPC) |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2007-324473A 2007.12.13 |
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| CN102510670A (en) | 2012-06-20 |
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