CN102164463B - Method for pressing multi-layer rigid-flexible combined circuit board - Google Patents
Method for pressing multi-layer rigid-flexible combined circuit board Download PDFInfo
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- CN102164463B CN102164463B CN2010105539443A CN201010553944A CN102164463B CN 102164463 B CN102164463 B CN 102164463B CN 2010105539443 A CN2010105539443 A CN 2010105539443A CN 201010553944 A CN201010553944 A CN 201010553944A CN 102164463 B CN102164463 B CN 102164463B
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- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000003825 pressing Methods 0.000 title claims abstract description 27
- 238000003475 lamination Methods 0.000 claims description 31
- 230000006835 compression Effects 0.000 claims description 26
- 238000007906 compression Methods 0.000 claims description 26
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 description 15
- 230000001360 synchronised effect Effects 0.000 description 6
- 230000002950 deficient Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
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Abstract
The method provides a method for pressing a multi-layer rigid-flexible combined circuit board, which comprises the following steps: grouping, superposing, clamping, pre-pressing, superposing and once pressing. Through the six steps, a plurality of rigid circuit boards and flexible circuit boards are made into a rigid-flexible combined circuit board. By using such a pressing method, the problems of bubbles, layering and inclined positioned board layers are reduced, and the rejection rate of the multi-layer rigid combined circuit board in the manufacturing process is reduced, thereby lowering the production cost.
Description
Technical field
The present invention relates to a kind of compression method of multilayered rigidity and flexibility combined circuit plate, particularly a kind of multilayered rigidity and flexibility combined circuit plate compression method superimposed, the substep pressurization that divides into groups that adopts.
Background technology
Rigid-flex combined board is claimed Rigid Flex again, and is superimposed and be pressed on one to be integrated into a rigid-flexible combined circuit plate that includes one or more rigid regions and one or more flexible region according to certain arrangement mode by rigid substrates and flexible substrate.Therefore, rigid-flex combined board has the characteristics of rigid plate and flex plate concurrently, is widely used in numerous areas such as computer, Communication Equipment, consumer electronics, automotive electronics, Industry Control, instrument and meter, medicine equipment, Aero-Space and military affairs.
Along with the continuous development of technology, the rigid substrates in the rigid-flex combined board and the flexible substrate number of plies are more and more, existing beginning one deck rigid plate and the two-layer combination altogether of one deck flex plate; Develop into four layers; Six layers, ten layers, 16 layers; Even the more combination of multilayer, generally the combination with rigid substrates more than six layers and flexible substrate is called multilayered rigidity and flexibility combined circuit plate.
Pressing is that whole multilayered rigidity and flexibility combined circuit plate is made a last step in the flow process, and can compression method determining mutual disjunct rigid substrates of polylith and flexible substrate finally be integrated into a rigid-flexible combined circuit plate.The compression method that prior art is made multilayered rigidity and flexibility combined circuit plate comprises two steps: superimposed step and synchronous high-temperature pressurizing step.Wherein, described superimposed step is meant polylith rigid substrates and flexible substrate is stacked into a lamination unit that wherein, be placed with bonding sheet between adjacent two-layer substrate, circuit on the substrate and through hole should align each other; Described high-temperature pressurizing step is meant utilizes the pressing machine that the described lamination unit that above-mentioned superimposed step forms is carried out high-temperature pressurizing; Through high temperature to melt described bonding sheet; And, make polylith rigid substrates and flexible substrate bonding to form a multilayered rigidity and flexibility combined circuit plate mutually to the disposable synchronous pressurization of described lamination unit.
The compression method that above-mentioned multilayered rigidity and flexibility combined circuit plate is made in the flow process has a defective that is difficult to overcome---and percent defective is high.The multilayered rigidity and flexibility combined circuit plate of processing through above-mentioned compression method often occurs that plate is recessed, bubble, white point, basket, internal layer contraposition not just, problems such as plate song, layering; Particularly bubble, internal layer contraposition are not just, layering is modal problem; And in a single day above-mentioned any one problem appears, just there are quality problems in whole multilayered rigidity and flexibility combined circuit plate, thus; When making multilayered rigidity and flexibility combined circuit plate, percent defective is very high through above-mentioned compression method.
Above-mentioned existing compression method owing to the circuit board at lamination unit described in the superimposed step is not very smooth lamellar body, adds that flaggy is many; There are a lot of spaces between plate and the plate, in the synchronous pressurization steps of ensuing high temperature, because the asynchronism(-nization) step of the marginal portion of described each sheet of bonding sheet and core fusing; It is very fast that the edge melts, and the center is slower, is synchronous but described lamination unit is pressurizeed; Thus, void edges is sealed after melting in the edge of said bonding sheet in advance; Cause portion gas to residue between plate and the plate, substrate will produce bubble once pressurization; It is same because the plate at said lamination unit two ends is asynchronous with the bonding sheet fusing time between the bonding sheet fusing time between the plate and said lamination unit mid portion plate and the plate; The physical property that adds rigid plate and flex plate differs greatly; Through disposable synchronous pressurization, the phenomenon of layering will appear easily; The main cause that the internal layer contraposition is not just producing is: flaggy is many more; The probability that contraposition is not just occurring is just big more; The physical property of rigid plate and flex plate differs greatly in addition, and in disposable synchronous high-temperature pressurizing process, rigid plate and flex plate are easy to occur relative displacement.
Summary of the invention
One of the object of the invention is to provide a kind of compression method of multilayered rigidity and flexibility combined circuit plate; It adopts grouping superimposed, and the substep pressing mode solves the bubble in the easy appearance of pressing process of multilayered rigidity and flexibility combined circuit plate with this; The internal layer contraposition is not just; Problems such as layering with the percent defective of reduction multilayered rigidity and flexibility combined circuit plate in the pressing process, thereby have reduced production cost.
Two of the object of the invention is to provide a kind of compression method of multilayered rigidity and flexibility combined circuit plate, and it comprises grouping step and superimposed step, has reduced the not probability that produces of direct problem of the internal layer contrapositions that cause owing to the number of plies with this.
Three of the object of the invention is to provide a kind of compression method of multilayered rigidity and flexibility combined circuit plate, it comprises false step and the precompressed step of pressing, and has reduced multilayered rigidity and flexibility combined circuit plate produces bubble and lamination problem in the pressing process probability with this.
In order to reach above-mentioned goal of the invention, the present invention's multilayered rigidity and flexibility combined circuit plate compression method may further comprise the steps:
Step 1: the circuit board set that will have at least six circuit boards is that a unit divides into groups with per three circuit boards, and to form at least two grouped elements, wherein, this circuit board set comprises at least one rigid circuit board and at least one flexible electric circuit board;
Step 2: between adjacent two circuit boards with each described grouped element a bonding sheet is set and carry out superimposed, to form a superimposed unit;
Step 3: each described superimposed unit is carried out vacation press, thereby form a false unit of pressing with the air of getting rid of in each described superimposed unit between two blocks of adjacent circuit plates;
Step 4: each described false unit of pressing is carried out precompressed to form a prepressing units;
Step 5: in the prepressing units of gained, between per two adjacent prepressing units, a bonding sheet is set and carry out superimposed, to form a lamination unit;
Step 6: described lamination unit is carried out disposable pressing to form a multilayered rigidity and flexibility combined circuit plate.
Below, will do further explanation through concrete embodiment, yet embodiment only being giving an example of alternative embodiment of the present invention, its disclosed characteristic only is used for explanation and sets forth technical scheme of the present invention, and is not used in qualification protection scope of the present invention.
Description of drawings
Fig. 1 is the flow chart of the present invention's multilayered rigidity and flexibility combined circuit plate compression method.
Fig. 2 a is the grouping of nine layers of rigid-flexible combined circuit plate, superimposed sketch map.
Fig. 2 b is the grouping of 14 layers of rigid-flexible combined circuit plate, superimposed sketch map.
Fig. 2 c is the grouping of 16 layers of rigid-flexible combined circuit plate, superimposed sketch map.
Fig. 3 a is the sketch map that in nine layers of rigid-flexible combined circuit plate compression method prepressing units is overlapped into lamination unit.
Fig. 3 b is the sketch map that in 14 layers of rigid-flexible combined circuit plate compression method prepressing units is overlapped into lamination unit.
Fig. 3 c is the sketch map that in 16 layers of rigid-flexible combined circuit plate compression method prepressing units is overlapped into lamination unit.
Embodiment
According to claim of the present invention and the disclosed content of specification, technical scheme of the present invention literary composition specific as follows is said.
Embodiment one
As shown in Figure 1, the compression method of multilayered rigidity and flexibility combined circuit plate according to the invention may further comprise the steps:
Step 1: the circuit board set B that will have at least six circuit board A is that a unit divides into groups with per three circuit boards; To form at least two grouped element C; Wherein, this circuit board set B comprises at least one rigid circuit board 10 and at least one flexible electric circuit board 20;
Step 2: between the described adjacent two circuit board A with each described grouped element C a bonding sheet 30 is set and carry out superimposed, to form a superimposed cells D;
Step 3: each described superimposed cells D is carried out vacation press; Thereby the air to get rid of in each described superimposed cells D between two blocks of adjacent circuit plates forms a false unit E of pressure; Wherein, in vacation pressure process, used press fit device is press fit device commonly used;
Step 4: each described false unit E that presses is carried out precompressed to form a prepressing units F, and wherein, in the precompressed process, used press fit device is press fit device commonly used;
Step 5: as shown in Figure 3 between per two adjacent prepressing units F in the prepressing units F of gained, a bonding sheet 30 is set and carry out superimposed, to form a lamination unit G;
Step 6: described lamination unit G is carried out disposable pressing to form a multilayered rigidity and flexibility combined circuit plate H, and wherein, in disposable pressing process, used press fit device is press fit device commonly used.
What deserves to be mentioned is; In the grouping process of described step 1; When the number of the circuit board A that ifs circuit plate set B is had is three integral multiple more than two times; And when the number of described rigid circuit board 10 is at least two, preferably two rigid circuit boards 10 and a flexible electric circuit board 20 is divided into one and consists of a described grouped element C of branch, secondly with two flexible electric circuit boards 20 and a rigid circuit board; Or three rigid circuit boards 10, or three flexible electric circuit boards 20 are divided into one and consist of a described grouped element C; The number of the circuit board A that ifs circuit plate set B is had is more than three the integral multiple more than two times during two circuit board A; And when the number of described rigid circuit board 10 is at least two; At first two rigid circuit boards 10 and a flexible electric circuit board 20 are divided into one and consist of a described grouped element C of branch; Secondly with two flexible electric circuit boards 20 and a rigid circuit board; Or three rigid circuit boards 10, or three flexible electric circuit boards 20 are divided into one and consist of a described grouped element C, once more remaining two circuit board A are divided into one and consist of a grouped element C; The number of the circuit board A that ifs circuit plate set B is had is more than three the integral multiple more than two times during a circuit board A; And when the number of described rigid circuit board 10 is at least two; At first two rigid circuit boards 10 and a flexible electric circuit board 20 are divided into one and consist of a described grouped element C of branch; Secondly with two flexible electric circuit boards 20 and a rigid circuit board; Or three rigid circuit boards 10, or three flexible electric circuit boards 20 are divided into one and consist of a described grouped element C, once more with a remaining circuit board A directly as a prepressing units F.
According to above group technology, preferably, described step 1 further may further comprise the steps:
Step 1.1: in described circuit board set B, pick out two rigid circuit boards 10 and a flexible electric circuit board 20 successively, form described grouped element C respectively;
Step 1.2: in the remaining circuit board set B of step 1.1, pick out three rigid circuit boards 10 or three flexible electric circuit boards 20 or a rigid circuit board 10 and two flexible electric circuit boards 20 successively, form described grouped element C respectively;
Step 1.3: the number that detects the remaining circuit board of step 1.2; If remain two circuit board A; Remaining two circuit board A are divided into one consist of a grouped element, if remain a circuit board A, then with a remaining circuit board directly as a prepressing units F.
What deserves to be mentioned is, in the lamination process of described step 2, if described superimposed unit C is made up of two rigid circuit boards 10 and a flexible electric circuit board 20, with the both sides of described two rigid circuit board 10 double teams at described flexible electric circuit board 20; If described superimposed unit C is made up of a rigid circuit board 10 and two flexible electric circuit boards 20, described rigid circuit board 10 is arranged on a side of described two flexible electric circuit boards.
What deserves to be mentioned is that in the described step 3 vacation of each described superimposed cells D being pressed is under normal temperature condition, at 3～5KG/CM
2Pressure conditions under carry out; Said circuit board A plate face is fully contacted with described bonding sheet 30, thereby can get rid of the air between two plates in the said adjacent superimposed cells D, prevent the generation of bubble; But two adjacent plates do not bond together through described bonding sheet 30 simultaneously; There is the not positive situation of flaggy contraposition to occur if find described superimposed cells D this moment, can easily two adjacent circuit boards be separated from each other, change bonding sheet 30 wherein; Again precompressed once more after superimposed so can reduce because of the flaggy contraposition probability of occurrence of waste just not.
What deserves to be mentioned is that the precompressed to each described false pressure unit E in the described step 4 is under 140～160 degrees centigrade temperature conditions, at 20～25KG/CM
2Pressure conditions under carry out.Under 140～160 degrees centigrade temperature conditions, described bonding sheet 30 tentatively melts, thus, and at 20～25KG/CM
2Pressure conditions under, can make adjacent circuit board through described bonding sheet 30 preliminary bonding together, if this moment find that described prepressing units F has the phenomenon of layering; Can carry out precompressed once more to eliminate lamination to it; Even some described prepressing units F are waste products, before carrying out the disposable pressing of step 6, can it be picked out; Thereby make final percent defective reduce, also reduced production cost.
What deserves to be mentioned is; Carry out the prepressing units F of gained superimposed in step 5 to form in the lamination unit G process; With skin is that the prepressing units F of rigid circuit board 10 is positioned over the outer outside of flexible electric circuit board 20 that is; So that the outermost layer at the two ends of described lamination unit G is rigid circuit board 20, thereby make described lamination unit G in the pressing process of step 6, because the outermost rigid circuit board in two ends is difficult for taking place deformation; Thereby guaranteed that whole described lamination unit G is stressed evenly, thereby reduced not these two problem odds just of layering and flaggy contraposition.
What deserves to be mentioned is, to the disposable pressing of described lamination unit G, be under 160～180 degrees centigrade temperature conditions, at 10-20KG/CM in the described step 6
2Pressure conditions under carry out.Under 160～180 degrees centigrade temperature conditions, described bonding sheet 30 melts fully, thus, and at 30-40KG/CM
2Pressure conditions under, adjacent circuit board is bonded together through described bonding sheet 30 fully.
What deserves to be mentioned is that described bonding sheet 30 is preferably the thermosetting film, is to be processed by epoxy resin or acrylic acid resin material.
Embodiment two
Existing have six rigid circuit boards 10 and three flexible electric circuit boards 20 are example with the circuit board set B, and the compression method of multilayered rigidity and flexibility combined circuit plate according to the invention may further comprise the steps:
Step 1: will have six rigid circuit boards 10 and three flexible electric circuit board 20 circuit board set B are that a unit divides into groups with per three circuit boards; To form three grouped element C; Wherein, Shown in Fig. 2 a, each described grouped element C comprises two rigid circuit boards 10 and a flexible electric circuit board 20;
Step 2 a: bonding sheet 30 is set and carries out superimposed between the described adjacent two circuit board A with each described grouped element C; To form a superimposed cells D; Shown in Fig. 2 a, the described flexible electric circuit board 20 of each piece all is clipped in the middle by two adjacent rigid circuit boards 20;
Step 3: each described superimposed cells D is carried out vacation press, thereby form a false unit E of pressure with the air of getting rid of in each described superimposed cells D between two blocks of adjacent circuit plates;
Step 4: each described false unit E that presses is carried out precompressed to form a prepressing units F;
Step 5: shown in Fig. 3 a, in three prepressing units F of gained, between per two adjacent prepressing units F, a bonding sheet 30 is set and carry out superimposed, to form a lamination unit G;
Step 6: described lamination unit G is carried out disposable pressing to form one nine layers rigid-flexible combined circuit plate H.
Embodiment three
Existing have nine rigid circuit boards 10 and five flexible electric circuit boards 20 are example with the circuit board set B, and the compression method of multilayered rigidity and flexibility combined circuit plate according to the invention may further comprise the steps:
Step 1: will have nine rigid circuit boards 10 and five flexible electric circuit board 20 circuit board set B are that a unit divides into groups with per three circuit boards; To form five grouped element C; Shown in Fig. 2 b; Wherein, be made up of two rigid circuit boards 10 and a flexible electric circuit board 20 four described grouped element C, a described grouped element C is made up of a rigid circuit board 10 and a flexible electric circuit board 20;
Step 2 a: bonding sheet 30 is set and carries out superimposed between the described adjacent two circuit board A with each described grouped element C; To form a superimposed cells D; Shown in Fig. 2 b; Wherein, the described flexible electric circuit board 20 of each piece all is clipped in the middle by two adjacent rigid circuit boards 10;
Step 3: each described superimposed cells D is carried out vacation press, thereby form a false unit E of pressure with the air of getting rid of in each described superimposed cells D between two blocks of adjacent circuit plates;
Step 4: each described false unit E that presses is carried out precompressed to form a prepressing units F;
Step 5: shown in Fig. 3 b, in five prepressing units F of gained, between per two adjacent prepressing units F, a bonding sheet 30 is set and carry out superimposed, to form a lamination unit G;
Step 6: described lamination unit G is carried out disposable pressing to form one 14 layers rigid-flexible combined circuit plate H.
Embodiment four
Existing have nine rigid circuit boards 10 and seven flexible electric circuit boards 20 are example with the circuit board set B, and the compression method of multilayered rigidity and flexibility combined circuit plate according to the invention may further comprise the steps:
Step 1: will have nine rigid circuit boards 10 and seven flexible electric circuit board 20 circuit board set B are that a unit divides into groups with per three circuit boards; To form five grouped element C and a prepressing units F; Shown in Fig. 2 c, wherein, form by two rigid circuit boards 10 and a flexible electric circuit board 20 by four described grouped element C; A described grouped element C is made up of three flexible electric circuit boards 20, and described prepressing units C is made up of a flexible electric circuit board 20;
Step 2: shown in Fig. 2 c, between the described adjacent two circuit board A with each described grouped element C a bonding sheet 30 is set and carry out superimposed, to form a superimposed cells D;
Step 3: each described superimposed cells D is carried out vacation press, thereby form a false unit E of pressure with the air of getting rid of in each described superimposed cells D between two blocks of adjacent circuit plates;
Step 4: each described false unit E that presses is carried out precompressed to form a prepressing units F;
Step 5: shown in Fig. 3 c, in six prepressing units F of gained, between per two adjacent prepressing units F, a bonding sheet 30 is set and carry out superimposed, to form a lamination unit G;
Step 6: described lamination unit G is carried out disposable pressing to form one 16 layers rigid-flexible combined circuit plate H.
Foregoing is giving an example of specific embodiment of the present invention, for the wherein not equipment of detailed description and structure, is to be understood that to taking existing common apparatus in this area and universal method to implement.
The above embodiment of the present invention is merely the usefulness that technical scheme of the present invention is described simultaneously, is merely enumerating of technical scheme of the present invention, is not limited to technical scheme of the present invention and protection range thereof.Adopt equivalent technologies means, equivalent apparatus etc. the improvement of claims of the present invention and the disclosed technical scheme of specification will be understood that it is not exceed this reality invention claims and the disclosed scope of specification.
Claims (5)
1. the compression method of a multilayered rigidity and flexibility combined circuit plate is characterized in that may further comprise the steps:
Step 1: the circuit board set that will have at least six circuit boards is that a unit divides into groups with per three circuit boards, and to form at least two grouped elements, wherein, this circuit board set comprises at least one rigid circuit board and at least one flexible electric circuit board;
Step 2: between adjacent two circuit boards with each described grouped element a bonding sheet is set and carry out superimposed, to form a superimposed unit;
Step 3: each described superimposed unit is carried out vacation press; Thereby the air to get rid of in each described superimposed unit between two blocks of adjacent circuit plates forms a false unit of pressing; Wherein, It is under normal temperature condition that the vacation of each described superimposed unit is pressed, and under the pressure conditions of 3～5KG/CM2, carries out;
Step 4: each described false unit of pressing is carried out precompressed to form a prepressing units, and wherein, the precompressed of each described false pressure unit is under 140～160 degrees centigrade temperature conditions, under the pressure conditions of 20～25KG/CM2, carries out;
Step 5: in the prepressing units of gained, between per two adjacent prepressing units, a bonding sheet is set and carry out superimposed, to form a lamination unit;
Step 6: described lamination unit is carried out disposable pressing to form a multilayered rigidity and flexibility combined circuit plate; Wherein, Disposable pressing to described lamination unit is under 160～180 degrees centigrade temperature conditions, under the pressure conditions of 30～40KG/CM2, carries out.
2. the compression method of multilayered rigidity and flexibility combined circuit plate as claimed in claim 1; It is characterized in that, in the grouping process of described step 1, when the number of the circuit board that ifs circuit plate set is had is three integral multiple more than two times; And when the number of described rigid circuit board is at least two; Choose two rigid circuit boards and a flexible electric circuit board at first successively and be divided into one and consist of a described grouped element, if also have remaining circuit board, again with remaining circuit board by two flexible electric circuit boards and a rigid circuit board; Or three rigid circuit boards, or three flexible electric circuit boards are divided into one and consist of a described grouped element; The number of the circuit board that ifs circuit plate set is had is more than three the integral multiple more than two times during a circuit board; And when the number of described rigid circuit board is at least two; Choosing two rigid circuit boards and a flexible electric circuit board at first successively is divided into one and consists of a described grouped element; If also surplus at least four circuit boards are chosen two flexible electric circuit boards and a rigid circuit board more successively, or three rigid circuit boards; Or three flexible electric circuit boards are divided into one and consist of a described grouped element, at last with a remaining circuit board directly as a prepressing units; The number of the circuit board that ifs circuit plate set is had is more than three the integral multiple more than two times during two circuit boards; And when the number of described rigid circuit board is at least two; Choosing two rigid circuit boards and a flexible electric circuit board at first successively is divided into one and consists of a described grouped element; If also surplus at least five circuit boards are chosen two flexible electric circuit boards and a rigid circuit board more successively, or three rigid circuit boards; Or three flexible electric circuit boards are divided into one and consist of a described grouped element, at last remaining two circuit boards are divided into one and consist of a grouped element.
3. the compression method of multilayered rigidity and flexibility combined circuit plate as claimed in claim 1 is characterized in that, described step 1 further may further comprise the steps:
Step 1.1: in described circuit board set, pick out two rigid circuit boards and a flexible electric circuit board successively, form described grouped element respectively;
Step 1.2: in the set of the remaining circuit board of step 1.1, pick out three rigid circuit boards or three flexible electric circuit boards or a rigid circuit board and two flexible electric circuit boards successively, form described grouped element respectively;
Step 1.3: the number that detects the remaining circuit board of step 1.2; If remain two circuit boards; Remaining two circuit boards are divided into one consist of a grouped element, if remain a circuit board, then with a remaining circuit board directly as a prepressing units.
4. the compression method of multilayered rigidity and flexibility combined circuit plate as claimed in claim 1; It is characterized in that; In the grouping process of said step 1; If described superimposed unit is made up of two rigid circuit boards and a flexible electric circuit board, with the both sides of described two rigid circuit board double teams at described flexible electric circuit board; If described superimposed unit is made up of a rigid circuit board and two flexible electric circuit boards, described rigid circuit board is arranged on a side of described two flexible electric circuit boards.
5. the compression method of multilayered rigidity and flexibility combined circuit plate as claimed in claim 1 is characterized in that described bonding sheet is the thermosetting film, is to be processed by epoxy resin or acrylic acid resin material.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105539443A CN102164463B (en) | 2010-11-17 | 2010-11-17 | Method for pressing multi-layer rigid-flexible combined circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010105539443A CN102164463B (en) | 2010-11-17 | 2010-11-17 | Method for pressing multi-layer rigid-flexible combined circuit board |
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| CN102164463A CN102164463A (en) | 2011-08-24 |
| CN102164463B true CN102164463B (en) | 2012-11-07 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104168727B (en) * | 2014-08-22 | 2017-08-08 | 广州杰赛科技股份有限公司 | Multi-layer PCB board pressing plate manufacture method |
| CN105307387B (en) * | 2015-09-16 | 2018-04-03 | 深圳市景旺电子股份有限公司 | A kind of high multilayered rigidity and flexibility combined impedance plate of large scale and preparation method thereof |
| CN113371524B (en) * | 2021-06-30 | 2022-02-15 | 崴思新材料泰州有限公司 | Multilayer sticky tape coincide coiling machine |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2679972Y (en) * | 2003-12-16 | 2005-02-16 | 上海华仕德电路技术有限公司 | Rigid/floexible multilayer board |
| CN201252686Y (en) * | 2008-08-12 | 2009-06-03 | 北京中庆微数字设备开发有限公司 | PCB composite board used for an LED |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06140728A (en) * | 1992-10-26 | 1994-05-20 | Nippon Avionics Co Ltd | Flexible and rigid printed wiring board and its manufacture |
| DE102005012404B4 (en) * | 2005-03-17 | 2007-05-03 | Siemens Ag | circuit board |
| JP2007129153A (en) * | 2005-11-07 | 2007-05-24 | Cmk Corp | Rigid-flex multilayer printed wiring board |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2679972Y (en) * | 2003-12-16 | 2005-02-16 | 上海华仕德电路技术有限公司 | Rigid/floexible multilayer board |
| CN201252686Y (en) * | 2008-08-12 | 2009-06-03 | 北京中庆微数字设备开发有限公司 | PCB composite board used for an LED |
Non-Patent Citations (2)
| Title |
|---|
| JP特开平2007-129153A 2007.05.24 |
| JP特开平6-140728A 1994.05.20 |
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