CN106686897A - Printed board processing method - Google Patents
Printed board processing method Download PDFInfo
- Publication number
- CN106686897A CN106686897A CN201710077647.8A CN201710077647A CN106686897A CN 106686897 A CN106686897 A CN 106686897A CN 201710077647 A CN201710077647 A CN 201710077647A CN 106686897 A CN106686897 A CN 106686897A
- Authority
- CN
- China
- Prior art keywords
- printed board
- lamination
- temperature pyrolysis
- processing method
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a printed board processing method. The method includes steps of bonding two core boards together through high-temperature pyrolysis glue; then respectively etching required circuit images on non-bonding faces of two core boards; then accumulating and laminating the non-bonding faces of two core boards bonded together through overlaying of a prepreg, and forming a composite printed board; then making the high-temperature pyrolysis glue loss cohesiveness under a preset temperature, and thereby separating two core boards of the composite printed board, and respectively forming the core boards with overlapped accumulation layer: first and second laminating boards; at last, performing the post-processing on the first and second laminating boards respectively, and acquiring the printed boards required. The printed board processing method shall bond the core boards and then perform the image transfer; the thinnest core board can reach less than 5 miu m; the high-temperature pyrolysis glue losing the viscosity at the preset temperature is used as the initial bonding material, thus the material is free from layering and air bubble, and other problems during the image transfer and other intermediate processes; the asymmetrical lamination is converted to symmetrical lamination, thus the warping risk is reduced.
Description
Technical field
The present invention relates to printed board processing technique field, particularly relates to a kind of printed board processing method.
Background technology
As electronic product develops to light, thin, little direction, the production and manufacture to printed circuit board it is also proposed higher
Require.Existing printed board is typically processed to meet light, thin, little requirement using following three kinds of modes：The first, two
Individual central layer is processed respectively, and the thickness of central layer is limited, it is impossible to did thin central layer, and press only presses 1 sheet laminate per lamination, raw
Produce efficiency low；Second, the adhesive layer of centre is done using thermoplastic or thermosetting material, lamination completes a point plate, not only complex process, and
Fraction defective is higher；The third, realizes multilamellar and is laminated together using carrier copper foil, and consumables cost is high, and cannot reuse.
The content of the invention
In order to overcome drawbacks described above, the invention provides a kind of printed board processing method, solves figure transfer process central layer
Thickness cannot accomplish very thin technical problem, and can be effectively improved warpage caused by odd number laminate or asymmetric laminating technology
Problem, improve production efficiency reduces manufacturing cost.
The technical scheme that adopted to solve its technical problem of the present invention is：
A kind of printed board processing method, comprises the following steps：
Step 1, central layer, prepreg, lamination and preset temperature needed for preparing loses the high temperature pyrolysis glue of caking property, its
In, the lamination is copper foil layer or central layer；
Step 2, is fit together two central layers with high temperature pyrolysis glue；
Step 3, will respectively etch the line pattern of needs on the non-binding face of fit together two central layers；
Step 4, the product that will be needed by the folded structure of prepreg respectively on the non-binding face of fit together two central layers
Layer is simultaneously laminated, and forms compound printed board；
Step 5, caking property is lost by the high temperature pyrolysis glue under preset temperature, so as to by the two of the compound printed board
Individual central layer separates, and the central layer containing folded structure lamination is formed respectively：First laminate and the second laminate；
Step 6, by first laminate and the second laminate rear processing procedure is carried out respectively, obtains the printed board for needing.
As a further improvement on the present invention, the lamination contains one or more layers copper foil layer.
As a further improvement on the present invention, in the step 2, the thickness of the high temperature pyrolysis glue be 20um~
80um。
As a further improvement on the present invention, in the step 1, microsphere expansion agent is contained in the high temperature pyrolysis glue,
Extender is a kind of foam powder, and foaming and intumescing extruding is started when high temperature molecule is run into and then the strand of high temperature pyrolysis glue is destroyed
Structure so as to lose caking property, so, high temperature pyrolysis glue will not say that glue residua, in the PI faces of Copper Foil, causes foreign body when decomposing.
The invention has the beneficial effects as follows：
1. fit together carrying out figure and shift the first two central layer, this addresses the problem figure transfer process central layer thick
Degree cannot accomplish very thin problem, and core thickness can accomplish ＜ 5um；
2. two panels central layer carries out figure transfer and process for pressing simultaneously, reduces the waste of supplies, improves equipment
Utilization rate and production efficiency；
3. replace the carrier copper foil in traditional handicraft using pyrolysis glue, greatly save production cost；
4. can decompose it in bonding processes automatic classifying or again given temperature using pyrolysis glue, point plate technique letter
Single, production efficiency is high；
5. warpage issues caused by odd number laminate or asymmetric laminating technology can be effectively improved.
Description of the drawings
Fig. 1 is structural representation after present invention pressing；
Fig. 2 separates rear structural representation for the present invention.
1st, 4 --- central layer 2,5 --- prepregs
3rd, 6 --- lamination 7 --- high temperature pyrolysis glue
8 --- the first laminate 9 --- second laminates
Specific embodiment
With reference to accompanying drawing, the present invention is elaborated, but protection scope of the present invention is not limited to following embodiments, i.e., in every case
The simple equivalence changes made with scope of the present invention patent and description and modification, are all still belonged to patent of the present invention and are contained
Within the scope of lid.
Refering to Fig. 1-2, a kind of printed board processing method is comprised the following steps：
Step 1, central layer 1,4, prepreg 2,5, lamination 3,6 and preset temperature needed for preparing lose the high warm of caking property
Dispergation 7, wherein, the lamination is copper foil layer or central layer；
Step 2, is fit together two central layers 1,4 with high temperature pyrolysis glue；
Step 3, will respectively etch the line pattern of needs on the non-binding face of fit together two central layers；
Step 4, by what is needed by the folded structure of prepreg 2,5 respectively on the non-binding face of fit together two central layers
Lamination 3,6 is simultaneously laminated, and forms compound printed board (referring to Fig. 1)；
Step 5, caking property is lost by the high temperature pyrolysis glue under preset temperature, so as to by the two of the compound printed board
Individual central layer separates, and the central layer containing folded structure lamination is formed respectively：First laminate 8 and the second laminate 9 (referring to Fig. 2)；
Step 6, by the laminate 9 of first laminate 8 and second rear processing procedure is carried out respectively, obtains the printed board for needing.
Wherein, the lamination contains one or more layers copper foil layer；In the step 2, the thickness of the high temperature pyrolysis glue
For 20um~80um；In the step 1, microsphere expansion agent is contained in the high temperature pyrolysis glue, extender is a kind of foam powder,
Start foaming and intumescing extruding when high temperature molecule is run into and then destroy the molecular chain structure of high temperature pyrolysis glue so as to lose bonding
Property, so, high temperature pyrolysis glue will not say glue residua in the PI faces of Copper Foil when decomposing, and cause foreign body.
As can be seen here, the printed board processing method carries out again figure transfer by central layer of first fitting, and most thin central layer can do
To ＜ 5um；Using the high temperature pyrolysis glue of caking property is lost in preset temperature as initial laminated material, it is ensured that figure transfer etc.
The problems such as being not in layering, bubble in pilot process；Preset temperature loses the high temperature pyrolysis glue of caking property and can select on demand
In bonding processes automatic classifying, or suitable temperature is given after lamination decomposes it；Asymmetric pressing is converted to into symmetrical pressing, drop
Low warpage risk.
Claims (4)
1. a kind of printed board processing method, it is characterised in that comprise the following steps：
Step 1, central layer, prepreg, lamination and preset temperature needed for preparing loses the high temperature pyrolysis glue of caking property, wherein, institute
Lamination is stated for copper foil layer or central layer；
Step 2, is fit together two central layers with high temperature pyrolysis glue；
Step 3, will respectively etch the line pattern of needs on the non-binding face of fit together two central layers；
Step 4, by the lamination for passing through the folded structure needs of prepreg on the non-binding face of fit together two central layers respectively simultaneously
Lamination, forms compound printed board；
Step 5, caking property is lost by the high temperature pyrolysis glue under preset temperature, so as to by two cores of the compound printed board
Plate separates, and the central layer containing folded structure lamination is formed respectively：First laminate and the second laminate；
Step 6, by first laminate and the second laminate rear processing procedure is carried out respectively, obtains the printed board for needing.
2. printed board processing method according to claim 1, it is characterised in that：The lamination contains one or more layers Copper Foil
Layer.
3. printed board processing method according to claim 1, it is characterised in that：In the step 2, the high temperature pyrolysis
The thickness of glue is 20um~80um.
4. printed board processing method according to claim 1, it is characterised in that：In the step 1, the high temperature pyrolysis
Contain microsphere expansion agent in glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710077647.8A CN106686897A (en) | 2017-02-14 | 2017-02-14 | Printed board processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710077647.8A CN106686897A (en) | 2017-02-14 | 2017-02-14 | Printed board processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106686897A true CN106686897A (en) | 2017-05-17 |
Family
ID=58861601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710077647.8A Pending CN106686897A (en) | 2017-02-14 | 2017-02-14 | Printed board processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106686897A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114080119A (en) * | 2020-08-18 | 2022-02-22 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN114980580A (en) * | 2022-06-24 | 2022-08-30 | 湖北金禄科技有限公司 | 5G communication circuit board and back-to-back stacked circuit board production and processing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102186316A (en) * | 2011-05-14 | 2011-09-14 | 汕头超声印制板（二厂）有限公司 | Method for manufacturing any-layer printed circuit board |
| US20140231123A1 (en) * | 2011-10-31 | 2014-08-21 | Kuraray Co., Ltd. | Thermoplastic liquid crystal polymer film, and laminate and circuit board using same |
| CN205883722U (en) * | 2016-06-29 | 2017-01-11 | 上达电子（深圳）股份有限公司 | Carrier film and be used for making circuit board blank structure of flexible circuit board |
-
2017
- 2017-02-14 CN CN201710077647.8A patent/CN106686897A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102186316A (en) * | 2011-05-14 | 2011-09-14 | 汕头超声印制板（二厂）有限公司 | Method for manufacturing any-layer printed circuit board |
| US20140231123A1 (en) * | 2011-10-31 | 2014-08-21 | Kuraray Co., Ltd. | Thermoplastic liquid crystal polymer film, and laminate and circuit board using same |
| CN205883722U (en) * | 2016-06-29 | 2017-01-11 | 上达电子（深圳）股份有限公司 | Carrier film and be used for making circuit board blank structure of flexible circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114080119A (en) * | 2020-08-18 | 2022-02-22 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN114980580A (en) * | 2022-06-24 | 2022-08-30 | 湖北金禄科技有限公司 | 5G communication circuit board and back-to-back stacked circuit board production and processing method |
| CN114980580B (en) * | 2022-06-24 | 2023-12-19 | 湖北金禄科技有限公司 | Production and processing method of 5G communication circuit board and back-to-back stacked circuit board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170517 |