KR20060115224A - Method for manufacturing of flexible printed circuit board with multi-layer - Google Patents

Method for manufacturing of flexible printed circuit board with multi-layer Download PDF

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KR20060115224A
KR20060115224A KR1020050037633A KR20050037633A KR20060115224A KR 20060115224 A KR20060115224 A KR 20060115224A KR 1020050037633 A KR1020050037633 A KR 1020050037633A KR 20050037633 A KR20050037633 A KR 20050037633A KR 20060115224 A KR20060115224 A KR 20060115224A
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South Korea
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circuit board
rivet
coverlay
manufacturing
applying heat
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KR1020050037633A
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Korean (ko)
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KR100736156B1 (en
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김석수
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주식회사 에스지컴
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards

Abstract

A method for manufacturing a multi-layered flexible printed circuit board is provided to prevent mismatching of layers and shorten a manufacturing time by simultaneously heating coverlays, copper thin films, and bonding sheets. After plural rivets(101) are disposed, the rivets are inserted in a coverlay(111) and a copper thin film(112), and the coverlay and the copper thin film are layered and heated to form a lower layer(110). After the rivets are inserted in a bonding sheet, a coverlay and a copper thin film are layered and heated to form an intermediate layer(120). After the rivets are inserted in a bonding sheet, a copper thin film and a coverlay are layered and heated to form an upper layer(130). The laminated layers(140) are heated and bonded.

Description

다층연성회로기판의 제조방법{METHOD FOR MANUFACTURING OF FLEXIBLE PRINTED CIRCUIT BOARD WITH MULTI-LAYER} METHODS FOR MANUFACTURING OF FLEXIBLE PRINTED CIRCUIT BOARD WITH MULTI-LAYER

도 1 은 종래 다층연성회로기판의 제조방법을 나타내는 공정도. 1 is a process chart showing a manufacturing method of a conventional multilayer flexible circuit board.

도 2 는 본 발명에 따른 다층연성회로기판의 제조방법을 나타내는 공정도.2 is a process chart showing a method of manufacturing a multilayer flexible printed circuit board according to the present invention.

*도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

101 : 리벳 110 : 저층101: rivet 110: low rise

111,121,131 : 커버레이 112,122,132 : 동박111,121,131: Coverlay 112,122,132: Copper foil

113,123,133 : 본딩 시트 120 : 중간층113,123,133: bonding sheet 120: intermediate layer

130 : 상층 140 : 적층체 130: upper layer 140: laminate

본 발명은 연성회로기판에 관한 것으로서, 특히 커버레이, 동박, 및 본딩 시트가 리벳에 반복적으로 끼워져 적층되면서 열이 가해져서 임시 가접된 후 한번에 열과 압력이 동시에 가해져서 완전히 접합되는 다층연성회로기판의 제조방법에 관 한 것이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board, and in particular, a coverlay, a copper foil, and a bonding sheet are repeatedly inserted into a rivet and laminated, and are temporarily applied by heat, and then are temporarily bonded to each other. It is about the manufacturing method.

일반적으로, 연성회로기판(FPCB: Flexible Printed Circuit Board)은 전자기기에서 공간의 제약이 따르면서 굴곡이 많은 부위에 전기적으로 두 구간을 연결시키기 위한 일종의 커넥터로서 사용되는데, 여러층의 동박이 적층되는 다층구조로 도 제작되고 있다. In general, a flexible printed circuit board (FPCB) is used as a kind of connector for electrically connecting two sections to a bent portion due to space limitations in an electronic device. It is also manufactured as a structure.

도 1 은 종래 다층연성회로기판의 제조방법을 나타내는 공정도이다. 도 1 에 도시된 바와 같이, 다층연성회로기판의 제조시 각각의 커버레이(11)(21)(31), 및 동박(12)(22)(32)이 적층되는 커버레이·동박 적층 단계(S10)와, 이렇게 적층되어 이루어진 각각의 상층(10), 중간층(20), 및 저층(30)에 소정의 열이 가해져서 임시적인 가접이 실시된 후, 핫 프레스 과정인 소정의 열과 압력이 가해져서 완전한 접합이 실시되는 제 1 가접·접합 단계(S20)를 거치게 된다. 1 is a process chart showing a manufacturing method of a conventional multilayer flexible circuit board. As shown in FIG. 1, in the manufacture of the multilayer flexible circuit board, each coverlay 11, 21, 31, and a coverlay / copper lamination step of laminating the copper foils 12, 22, 32 ( S10), and each of the upper layer 10, the intermediate layer 20, and the lower layer 30, which are stacked in this way, is subjected to temporary heat by applying a predetermined heat and then applying a predetermined heat and pressure, which is a hot pressing process. The first temporary joining and joining step (S20) where the complete bonding is performed is performed.

이어서, 상기 상층(10)의 저면으로 본딩 시트(13)가 적층되고, 중간층(20)의 저면으로 본딩 시트(23)가 적층되는 본딩 시트 적층 단계(S30)와, 이렇게 적층된 상층(10), 본딩 시트(13), 중간층(20), 본딩 시트(23), 및 저층(30)이 순차적으로 겹겹이 적층된 후 소정의 열이 가해져서 임시적인 가접이 실시된 후, 핫 프레스 과정인 열과 압력이 가해져서 완전한 접합이 실시되는 제 2 가접·접합 단계(S40)를 거쳐서 완성된다. Subsequently, a bonding sheet stacking step S30 in which the bonding sheet 13 is stacked on the bottom surface of the upper layer 10, and the bonding sheet 23 is stacked on the bottom surface of the intermediate layer 20, and the stacked upper layer 10 is thus stacked. After the bonding sheet 13, the intermediate layer 20, the bonding sheet 23, and the bottom layer 30 are sequentially stacked in a stack, predetermined heat is applied, and temporary temporary welding is performed. This is completed and completed through the second temporary joining / joining step (S40) where complete bonding is performed.

그런데, 상술한 다층연성회로기판의 제조방법은 각각의 커버레이(11)(21)(31), 및 동박(12)(22)(32)을 적층하고 가접·접합하여 상층(10), 중간층(20), 및 저층(30)을 제조한 후, 이들(10)(20)(30) 모두를 순차적으로 적층하여 또다시 가접·접합함에 따라 이들(10)(20)(30)의 상이한 수축·팽창율로 인하여 층간의 부정합이 발생되는 문제점이 있었다. 또한, 이처럼 여러 복잡한 과정을 거치게 됨에 따라 많은 작업 시간이 소요되어 생산비가 증가되는 문제점이 있었다. However, in the above-described method of manufacturing a multilayer flexible printed circuit board, each of the coverlays 11, 21, 31, and copper foils 12, 22, and 32 are laminated, temporally bonded and bonded to each other, the upper layer 10 and the intermediate layer. (20) and the bottom layer 30, and then all of these (10) (20) (30) are sequentially stacked and again temporary welded and bonded again, the different shrinkage of these (10) (20) (30) • There was a problem that mismatch between layers occurred due to the expansion rate. In addition, there is a problem that the production cost is increased due to a lot of work time as it goes through several complex processes.

이에 본 발명은 상기와 같은 문제점을 해결하기 위한 것으로서, 리벳에 커버레이, 동박, 및 본딩 시트를 반복적으로 끼워 적층하면서 열을 가하여 가접한 후 한번에 열과 압력을 동시에 가하여 접합하는 다층연성회로기판의 제조방법을 제공하는데 그 목적이 있다. Accordingly, the present invention is to solve the above problems, the manufacture of a multi-layer flexible circuit board bonded by applying heat and pressure at the same time after applying the heat and pressure at the same time by repeatedly applying the heat laminating the coverlay, copper foil, and bonding sheet to the rivet. The purpose is to provide a method.

상기와 같은 목적을 달성하기 위하여 본 발명에 따른 다층연성회로기판의 제조방법은, 복수개의 리벳을 배치하는 리벳 배치 단계와, 상기 리벳에 커버레이 및 동박을 순차적으로 끼워 적층하고 열을 가하여 가접하는 저층 적층·가접 단계와, 상기 리벳에 연속하여 본딩 시트를 끼워 적층하고 열을 가하여 가접한 후 커버레이 및 동박, 또는 동박 및 커버레이를 순차적으로 끼워 적층하고 열을 가하여 가접하는 중간층 적층·가접 단계와, 상기 리벳에 연속하여 본딩 시트를 끼워 적층하고 열을 가하여 가접한 후 동박 및 커버레이를 순차적으로 끼워 적층하고 열을 가하여 가접하는 상층 적층·가접 단계와, 상기 적층·가접된 적층체에 열과 압력을 가하여 접합하는 적층체 접합 단계를 포함하여 이루어진 것을 특징으로 한다. In order to achieve the above object, a method of manufacturing a multilayer flexible circuit board according to the present invention includes a rivet arrangement step of arranging a plurality of rivets, and a coverlay and a copper foil are sequentially inserted into the rivets to be laminated and welded by applying heat. Low-layer lamination / adhesion step and intermediate layer lamination / adhesion step by laminating the bonding sheet in succession to the rivet and applying heat to weld, then laminating coverlay and copper foil or copper foil and coverlay sequentially and laminating by applying heat. And laminating and bonding the bonding sheets in succession to the rivets and applying heat to each other, and then laminating and welding the copper foils and coverlays sequentially and applying heat to weld the upper layer lamination and welding step, and It is characterized by comprising a laminate bonding step of bonding by applying pressure.

여기서, 상기 중간층 적층·가접 단계는 여러번 반복 실시될 수 있고, 상기 리벳은 일종의 PVC 재질로서 직경이 2.0~3.17 정도이면 적당하다. 그리고, 상기 적층·가접 단계의 가열 조건은 100±20℃ 정도이면 적당하고, 상기 적층체 접합 단계의 가열 조건은 150~190℃이고, 가압 조건은 30~75kgf/㎠이며, 이에 따른 가열·가압 시간은 50~180분이면 적당하다. Here, the intermediate layer lamination and contact step may be repeated several times, the rivet is a kind of PVC material is suitable if the diameter is about 2.0 to 3.17. And, the heating conditions of the lamination and welding step is suitable if it is about 100 ± 20 ℃, the heating conditions of the laminate bonding step is 150 ~ 190 ℃, pressurization conditions are 30 ~ 75kgf / ㎠, heating and pressure accordingly 50 to 180 minutes is appropriate.

이하, 첨부된 도면을 참조하여 본 발명을 상세히 설명하기로 한다.Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.

도 2 는 본 발명에 따른 다층연성회로기판의 제조방법을 나타내는 공정도이다. 도 2 에 도시된 바와 같이, 다층연성회로기판의 제조시, 먼저 복수개의 리벳(101)을 배치한 후, 상기 리벳(101)에 커버레이(111) 및 동박(112)을 순차적으로 끼워 적층하여 이루어진 저층(110)에 소정의 열을 가하여 가접한다(S11O,S120). 여기서, 상기 리벳(101)은 일종의 PVC 재질로서 특별한 제한은 없지만 직경이 2.0~3.17 정도이면 적당하다. 2 is a process chart showing a method of manufacturing a multilayer flexible printed circuit board according to the present invention. As shown in FIG. 2, in the manufacture of the multilayer flexible circuit board, first, a plurality of rivets 101 are disposed, and then the coverlay 111 and the copper foil 112 are sequentially stacked on the rivets 101 to be laminated. Predetermined heat is applied to the bottom layer 110 formed therein (S110, S120). Here, the rivet 101 is a kind of PVC material, but is not particularly limited if the diameter is about 2.0 ~ 3.17.

상기 커버레이(111)는 통상적으로 폴리이미드 계열이 사용되고, 상기 동박(112)은 통상적으로 동박적층판(CCL)이 사용된다. 이 때, 상기 리벳(101)에 끼워지는 상기 커버레이(111), 및 동박(112) 상에 형성된 복수개의 홀은 소정의 위치를 잡아주는 역할을 한다. The coverlay 111 is typically used a polyimide series, the copper foil 112 is typically a copper clad laminate (CCL) is used. At this time, the coverlay 111 to be fitted to the rivet 101, and the plurality of holes formed on the copper foil 112 serves to hold a predetermined position.

본 실시예에서는 4 개의 리벳(101)을 4 곳의 모서리에 배치한 형태로 설명하였으나, 특별한 제한이 있지는 않으며 필요에 따라 복수개의 리벳(101)을 다양한 형태로 배치할 수 있음은 물론이다. In the present embodiment has been described in the form of four rivets 101 arranged in four corners, there is no particular limitation, it is a matter of course that a plurality of rivets 101 can be arranged in various forms as necessary.

이어서, 상기 리벳(101)에 연속하여 본딩 시트(123)를 끼워 적층하고 열을 가하여 가접한 후 동박(122) 및 커버레이(121) 또는 커버레이(121) 및 동박(122)을순차적으로 끼워 적층하여 이루어진 중간층(120)에 소정의 열을 가하여 가접한다(S130). 여기서, 상기 본딩 시트(123)는 일종의 양면 접착 테이프가 사용될 수 있다. 이 때, 상기 S130 단계는 다층 구조의 연성회로기판을 형성하기 위해 반복 실시될 수 있다. 예컨대, 6 회 이내에서 자유롭게 반복 실시될 수 있다. Subsequently, the bonding sheets 123 are stacked in succession to the rivets 101 and laminated to each other by applying heat. Then, the copper foils 122 and the coverlays 121 or the coverlays 121 and the copper foils 122 are sequentially inserted. A predetermined heat is applied to the intermediate layer 120 formed by stacking to be in contact (S130). Here, the bonding sheet 123 may be used a kind of double-sided adhesive tape. At this time, the step S130 may be repeated to form a flexible circuit board of a multi-layer structure. For example, it can be freely repeated within six times.

이어서, 상기 리벳(101)에 연속하여 본딩 시트(133)를 끼워 적층하고 열을 가하여 가접한 후 동박(132) 및 커버레이(131)를 순차적으로 끼워 적층하여 이루어진 상층(130)에 소정의 열을 가하여 가접한다(S140). 여기서의 가열 조건은 100±20℃ 정도이면 적당하다. Subsequently, the bonding sheet 133 is sequentially stacked on the rivet 101 to be laminated, and heat is applied to the rivet 101, and then the copper foil 132 and the coverlay 131 are sequentially sandwiched and stacked in a predetermined row. Applicable by adding (S140). Heating conditions here are suitable in about 100 +/- 20 degreeC.

마지막으로, 상기 저층(110), 본딩 시트(123), 중간층(120), 본딩 시트(133), 및 상층(130)이 순차적으로 적층·가접되어 이루어진 적층체(140)에 소정의 열과 압력을 가하여 완전히 접합한다(S150). 즉, 리벳(101)이 열에 녹아 버린 상태로 다층연성회로기판이 완성된다. 여기서의 가열 조건은 150~190℃ 정도이면 적당하고, 가압 조건은 30~75kgf/㎠ 정도이면 적당하고, 이러한 조건 하에서 가열·가 압 시간은 50~180분 정도이면 적당하다. Finally, a predetermined heat and pressure is applied to the laminate 140 formed by sequentially stacking and adhering the low layer 110, the bonding sheet 123, the intermediate layer 120, the bonding sheet 133, and the upper layer 130. It is completely bonded by applying (S150). In other words, the multilayer flexible circuit board is completed with the rivet 101 melted in the heat. Heating conditions here are suitable as long as it is about 150-190 degreeC, pressurization conditions are suitable as about 30-75 kgf / cm <2>, and a heating and a pressurization time are suitable when it is about 50-180 minutes under such conditions.

한편, 본 발명에 따른 다층연성회로기판의 제조방법을 한정된 실시예에 따라 설명하였지만, 본 발명의 범위는 특정한 실시예에 한정되는 것은 아니며, 본 발명과 관련하여 통상의 지식을 가진자에게 자명한 범위내에서 여러 가지의 대안, 수정 및 변경하여 실시할 수 있다. On the other hand, the method of manufacturing a multilayer flexible circuit board according to the present invention has been described according to a limited embodiment, but the scope of the present invention is not limited to a specific embodiment, it will be apparent to those skilled in the art in connection with the present invention. Various alternatives, modifications, and changes can be made within the scope.

본 발명에 따르면, 리벳에 커버레이, 동박, 및 본딩 시트를 반복적으로 끼워 적층하면서 가접한 후 한번에 동시 접합하여 다층연성회로기판을 제조함으로써 부정합의 발생을 차단하면서 작업 시간을 단축하여 생산비를 절감할 수 있다. According to the present invention, a coverlay, a copper foil, and a bonding sheet are repeatedly inserted into a rivet and laminated, and then bonded together at the same time to manufacture a multi-layer flexible circuit board, thereby reducing the production time by preventing the occurrence of mismatch and reducing the production cost. Can be.

Claims (6)

복수개의 리벳을 배치하는 리벳 배치 단계와; A rivet arrangement step of arranging a plurality of rivets; 상기 리벳에 커버레이 및 동박을 순차적으로 끼워 적층하고 열을 가하여 가접하는 저층 적층·가접 단계와; A low-layer lamination / welding step of laminating a coverlay and a copper foil sequentially on the rivet and applying heat to weld the rivet; 상기 리벳에 연속하여 본딩 시트를 끼워 적층하고 열을 가하여 가접한 후 커버레이 및 동박, 또는 동박 및 커버레이를 순차적으로 끼워 적층하고 열을 가하여 가접하는 중간층 적층·가접 단계와; An intermediate layer lamination / welding step of laminating a bonding sheet in succession to the rivet and applying heat to weld the cover sheet and copper foil, or by interposing and laminating the copper foil and coverlay sequentially and applying heat; 상기 리벳에 연속하여 본딩 시트를 끼워 적층하고 열을 가하여 가접한 후 동박 및 커버레이를 순차적으로 끼워 적층하고 열을 가하여 가접하는 상층 적층·가접 단계와; An upper layer lamination / welding step of laminating a bonding sheet in succession to the rivet and applying heat to weld the sheet, then laminating copper foil and coverlay sequentially and applying heat to weld the sheet; 상기 적층·가접된 적층체에 열과 압력을 가하여 접합하는 적층체 접합 단계를 포함하여 이루어진 것을 특징으로 하는 다층연성회로기판의 제조방법. And a laminate bonding step of joining the laminated and welded laminates by applying heat and pressure to each other. 제 1 항에 있어서, The method of claim 1, 상기 중간층 적층·가접 단계가 반복 실시되는 것을 특징으로 하는 다층연성회로기판의 제조방법. The method of manufacturing a multi-layer flexible circuit board, wherein the intermediate layer lamination / adhesion step is repeated. 제 1 항에 있어서, The method of claim 1, 상기 리벳이 PVC 재질인 것을 특징으로 하는 다층연성회로기판의 제조방법. The rivet is a method of manufacturing a multi-layer flexible circuit board, characterized in that the PVC material. 제 1 항에 있어서, The method of claim 1, 상기 본딩 시트가 양면 접착 테이프인 것을 특징으로 하는 다층연성회로기판의 제조방법. The bonding sheet is a double-sided adhesive tape manufacturing method of the multilayer flexible circuit board. 제 1 항에 있어서, The method of claim 1, 상기 적층·가접 단계의 가열 조건이 100±20℃인 것을 특징으로 하는 다층연성회로기판의 제조방법.특징으로 하는 다층연성회로기판의 제조방법. A method for producing a multilayer flexible printed circuit board, characterized in that the heating condition of the lamination and welding step is 100 ± 20 ° C. 제 1 항에 있어서, The method of claim 1, 상기 적층체 접합 단계의 가열 조건이 150~190℃이고, 가압 조건이 30~75kgf/㎠이며, 가열·가압 시간이 50~180분인 것을 특징으로 하는 다층연성회로기판의 제조방법. The method of manufacturing a multilayer flexible circuit board, wherein the heating conditions of the laminate bonding step are 150 to 190 ° C, pressurization conditions are 30 to 75 kgf / cm 2, and heating and pressing time are 50 to 180 minutes.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100884067B1 (en) * 2007-07-16 2009-02-19 김창수 Method for attaching cover lay for flexible printed circuit board
KR101368043B1 (en) * 2012-08-30 2014-02-27 (주)인터플렉스 Structure of double-sided flexible printed circuit board
KR101490353B1 (en) * 2013-10-02 2015-02-11 대덕전자 주식회사 Method of manufacturing a printed circuit board
KR101654020B1 (en) 2015-11-12 2016-09-05 일신전자 주식회사 Method for manufacturing a multi-layer FPCB of fine aligned
CN115633464A (en) * 2022-12-19 2023-01-20 浙江万正电子科技股份有限公司 Manufacturing method of circuit board with thick copper foil

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190657A (en) * 2000-12-21 2002-07-05 Sony Chem Corp Flexible wiring board and its manufacturing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100884067B1 (en) * 2007-07-16 2009-02-19 김창수 Method for attaching cover lay for flexible printed circuit board
KR101368043B1 (en) * 2012-08-30 2014-02-27 (주)인터플렉스 Structure of double-sided flexible printed circuit board
KR101490353B1 (en) * 2013-10-02 2015-02-11 대덕전자 주식회사 Method of manufacturing a printed circuit board
KR101654020B1 (en) 2015-11-12 2016-09-05 일신전자 주식회사 Method for manufacturing a multi-layer FPCB of fine aligned
CN115633464A (en) * 2022-12-19 2023-01-20 浙江万正电子科技股份有限公司 Manufacturing method of circuit board with thick copper foil

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