CN105657969A - Rigid-flexible combined board and laminating method thereof - Google Patents
Rigid-flexible combined board and laminating method thereof Download PDFInfo
- Publication number
- CN105657969A CN105657969A CN201610074899.0A CN201610074899A CN105657969A CN 105657969 A CN105657969 A CN 105657969A CN 201610074899 A CN201610074899 A CN 201610074899A CN 105657969 A CN105657969 A CN 105657969A
- Authority
- CN
- China
- Prior art keywords
- rigid
- combined board
- compression method
- flex combined
- riveted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a laminating method of a rigid-flexible combined board. The laminating method comprises the following steps: stacking up a flexible plate, a cover film, an adhesive sheet and a rigid plate substrate and riveting to form a riveted structure; laminating release films and steel plates at two sides of the riveted structure respectively and laminating a hard silicon sheet between the release film and the steel plate, close to one side of the rigid plate substrate, to obtain a laminated structure; and pressing the laminated structure. According to the laminating method of the rigid-flexible combined board, during laminating, the hard silicon sheet is arranged at one side close to the rigid plate substrate, the purpose of pressure balance can be effectively realized, and the defects such as collapse due to unbalanced pressure, zigzag line, notch and the like can be overcome. The invention further provides a rigid-flexible combined board.
Description
Technical field
The present invention relates to wiring board techniques field, particularly relate to compression method and the rigid-flex combined board of a kind of rigid-flex combined board.
Background technology
Rigid-flex combined board is that soft board and combining of hardboard are formed the wiring board of single component. Rigid-flex combined board changes the design concept of traditional plane formula, expands 3 dimension space concepts of solid to, brings huge convenience to product design. Rigid-flex combined board has feature flexible, folding simultaneously. Therefore may be used for the custom circuit made, utilize free space substantially, and then reduce the space shared by whole system. The range of application of rigid-flex combined board includes: the numerous areas such as Aero-Space, advanced armarium, digital camera and high-quality MP3 player.
At present, in the bonding processes of rigid-flex combined board, when flex plate is bonded in plate surface either directly through pressing, can there is the phenomenon of rigid-flexible calmodulin binding domain CaM adhesion difference; Meanwhile, rigid-flexible can form collapse defect in conjunction with transitional region, processing procedure manufacturing process can produce the defects such as circuit Canis familiaris L. tooth, breach after rigid plate.
Summary of the invention
Based on this, it is necessary the problem that and follow-up rigid plate poor for the adhesion when flex plate is bonded in plate surface either directly through pressing produces defect, it is provided that a kind of adhesion is good and follow-up rigid plate is not likely to produce the compression method of rigid-flex combined board of defect.
The compression method of a kind of rigid-flex combined board, comprises the steps:
Flex plate, epiphragma, gluing sheet, rigid plate substrate layer are stacked and put and riveted formation riveted construction;
At both sides stacking mould release membrance and the steel plate of riveted construction, being also laminated with hard silica gel piece between mould release membrance and the steel plate of rigid plate substrate side, obtain stepped construction;
Described stepped construction is carried out stitching operation.
The compression method of above-mentioned rigid-flex combined board, in bonding processes, adopt hard silica gel piece near the side of rigid plate substrate, it is possible to effectively realize the purpose that pressure is balanced, thus solving because pressure is uneven, result in defect problems such as subsiding and then cause circuit Canis familiaris L. tooth, breach.
Wherein in an embodiment, in described riveted construction, every limit of described rigid plate substrate is respectively provided with hole, two riveted location.
Wherein in an embodiment, in described riveted construction, described epiphragma edge to the distance of the plated-through-hole in described rigid plate substrate more than 0.5mm.
Wherein in an embodiment, in described riveted construction, the width that described epiphragma extends over to described rigid plate substrate is 0.35mm��0.45mm.
Wherein in an embodiment, in described riveted construction, described gluing sheet inside contracts 0.2��0.3mm on described rigid plate substrate.
Wherein in an embodiment, the thickness of described hard silica gel piece is 1.2��1.6mm.
Wherein in an embodiment, in described stepped construction, the number of plies near the mould release membrance of described flex plate side is 3 layers.
Wherein in an embodiment, after obtaining stepped construction before described stitching operation, also include row's layer step; Described row's layer step, for 6 stepped constructions are arranged layer up and down, is then respectively placing 10 kraft paper up and down.
Wherein in an embodiment, described stitching operation includes the pre-pressing step, pressing step and the rear pressing step that are sequentially carried out; In described pre-pressing step, hot plate temperature is less than or equal to 130 DEG C, and pressure is less than 10Kg/cm2; In described pressing step, hot plate temperature is 190 DEG C, and pressure is 34Kg/cm2; In pressing step in the rear, hot plate temperature is 40 DEG C, and pressure is less than or equal to 34Kg/cm2.
Present invention also offers a kind of rigid-flex combined board.
A kind of rigid-flex combined board, described rigid-flex combined board is formed by compression method pressing provided by the present invention.
Above-mentioned rigid-flex combined board, owing to adopting the compression method pressing of the present invention to form, effectively prevent the defect problems such as circuit Canis familiaris L. tooth, breach.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the riveted construction of one embodiment of the invention.
Fig. 2 is the schematic diagram of the stepped construction of one embodiment of the invention.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated. Should be appreciated that specific embodiment described herein is only in order to explain the present invention, is not intended to limit the present invention.
The compression method of a kind of rigid-flex combined board, comprises the steps:
Flex plate, epiphragma, gluing sheet, rigid plate substrate layer are stacked and put and riveted formation riveted construction;
At both sides stacking mould release membrance and the steel plate of riveted construction, being also laminated with hard silica gel piece between mould release membrance and the steel plate of rigid plate substrate side, obtain stepped construction;
Described stepped construction is carried out stitching operation.
Specifically, the material of gluing sheet is preferably NO-flowPP, and rigid plate substrate is preferably made up of FR-4 material. Certainly, gluing sheet of the present invention is not limited thereto with the material of rigid plate substrate, it is also possible to be other material known in those skilled in the art.
Referring to Fig. 1, before riveted, generally also needing to carry out internal layer laser at rigid plate substrate 110 and cut blind slot 111, the degree of depth of blind slot 111 is about the half of rigid plate substrate 110 thickness, namely the rigid plate substrate 110 at blind slot 111 place residual thick about 1/2. So after pressing, laser is cut blind slot and is excised by residual thickness portion again, regional nature rigid plate substrate 110 main body between rigid plate substrate 110 blind slot is taken off, can realize rigid-flexible calmodulin binding domain CaM and uncap.
Wherein, the effect of riveted is, eliminates the diversity of material harmomegathus in bonding processes. The position of each layer in riveted construction can be made to be relatively fixed by riveted, it is to avoid drift.
Preferably, in riveted construction 100, every limit of rigid plate substrate 110 is respectively provided with hole, two riveted location (not shown).It is to say, rigid plate substrate 110 offers hole, eight riveted location, each limit, four limits has hole, two riveted location. Accordingly, on flex plate 120, also correspondence offers 8 hole (not shown). It is highly preferred that rigid plate substrate 110 selects diameter 3.175mm rivet (not shown) with the riveted joint of flex plate 120 in bonding processes. Hole, riveted location on rigid plate substrate 110 adopts the processing of CNC rig, selects and bores under the drill of 3.20mm. Considering the particularity of flex plate 120 material, the edges of boards of hole punching place on flex plate 120 need to retain copper, to increase intensity, it is prevented that collapses hole during riveted set PIN, causes off normal.
In riveted construction 100, epiphragma 130 covers the width (in Fig. 1 the distance shown in L2) of rigid plate substrate 110 and is preferably 0.35mm��0.45mm; It is more preferably 0.40mm. So can improve the bending number of times after rigid plate substrate 110 and flex plate 120 pressing.
In riveted construction 100, epiphragma 130 edge is preferably greater than 0.5mm to the distance of the plated-through-hole (not shown) in rigid plate substrate 110. So can improve the reliability of rigid-flex combined board.
In riveted construction 100, gluing sheet 140 inside contracts 0.2��0.3mm (in Fig. 1 the distance shown in L1) on rigid plate substrate 110; It is more preferably 0.25mm. So after pressing, adhesive layer 120 just flows to the edge of rigid substrates 110, too many adhesive layer material can't be made to overflow and cause excessive glue, and then avoid because of the glue performance impact to rigid-flex combined board of overflowing, it addition, the appearance looks elegant of rigid-flex combined board.
Wherein, the effect of stacking is, in follow-up bonding processes, to riveted construction with protection. Specifically, referring to Fig. 2, cover three layers mould release membrance 210 the side (just namely the upside in Fig. 2) of the flex plate 120 of riveted construction 100 is upper, on mould release membrance 210, then cover a steel plate 310. Wherein, the thickness of every layer of mould release membrance 200 is preferably 25um, and the Main Function of three layers mould release membrance 210 herein is cushioning effect. Cover one layer of mould release membrance 220 in the side (just namely the downside in Fig. 2) of the rigid plate substrate 110 of riveted construction 100, mould release membrance 220 covers hard silica gel plate 400, then again at hard silica gel plate 400 upper cover one steel plate 320. The Main Function of mould release membrance 220 herein is release effect. The thickness of hard silica gel plate 400 is preferably 1.2��1.6mm, and hard silica gel plate can effectively play the effect of counterpressure.
Obtaining after stepped construction before stitching operation, also including row's layer step; Row's layer step is specially arranges layer up and down by 6 stepped constructions, is then respectively placing 10 kraft paper up and down. So can promote the purpose of heating rate in bonding processes, and then can ensure that the curing degree of gluing sheet, thus the problem solving rigid-flexible calmodulin binding domain CaM plate bursting layering.
Wherein, stitching operation is typically in pressing machine to carry out, and by stitching operation, flex plate, epiphragma, gluing sheet, rigid plate substrate junction are combined.
Preferably, pre-pressing step, pressing step and the rear pressing step that stitching operation includes being sequentially carried out. In pre-pressing step, hot plate temperature is less than or equal to 130 DEG C, and pressure is less than 10Kg/cm2; In pressing step, hot plate temperature is 190 DEG C, and pressure is 34Kg/cm2; In rear pressing step, hot plate temperature is 40 DEG C, and pressure is less than or equal to 34Kg/cm2��
It is highly preferred that carry out stitching operation according to the formula of following table.
Adopt above-mentioned formula, it is possible to make the flex plate after pressing and rigid plate substrate junction higher with joint efforts, and then improve the performance of rigid-flex combined board.
The compression method of rigid-flex combined board provided by the present invention, in bonding processes, adopt hard silica gel piece near the side of rigid plate substrate, it is possible to effectively realize the purpose that pressure is balanced, thus solving because pressure is uneven, result in defect problems such as subsiding and then cause circuit Canis familiaris L. tooth, breach.
Present invention also offers a kind of rigid-flex combined board.
A kind of rigid-flex combined board, rigid-flex combined board is formed by compression method pressing provided by the present invention.
Above-mentioned rigid-flex combined board, owing to adopting the compression method pressing of the present invention to form, effectively prevent the defect problems such as circuit Canis familiaris L. tooth, breach.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics is absent from contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent. It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to making some deformation and improvement, these broadly fall into protection scope of the present invention. Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a compression method for rigid-flex combined board, comprises the steps:
Flex plate, epiphragma, gluing sheet, rigid plate substrate layer are stacked and put and riveted formation riveted construction;
At both sides stacking mould release membrance and the steel plate of riveted construction, being also laminated with hard silica gel piece between mould release membrance and the steel plate of rigid plate substrate side, obtain stepped construction;
Described stepped construction is carried out stitching operation.
2. the compression method of rigid-flex combined board according to claim 1, it is characterised in that in described riveted construction, every limit of described rigid plate substrate is provided with hole, two riveted location.
3. the compression method of rigid-flex combined board according to claim 1, it is characterised in that in described riveted construction, described epiphragma edge to the distance of the plated-through-hole in described rigid plate substrate more than 0.5mm.
4. the compression method of rigid-flex combined board according to claim 1, it is characterised in that in described riveted construction, the width that described epiphragma extends over to described rigid plate substrate is 0.35mm��0.45mm.
5. the compression method of rigid-flex combined board according to claim 1, it is characterised in that in described riveted construction, described gluing sheet inside contracts 0.2��0.3mm on described rigid plate substrate.
6. the compression method of rigid-flex combined board according to claim 1, it is characterised in that the thickness of described hard silica gel piece is 1.2��1.6mm.
7. the compression method of rigid-flex combined board according to claim 1, it is characterised in that in described stepped construction, the number of plies near the mould release membrance of described flex plate side is 3 layers.
8. the compression method of rigid-flex combined board according to claim 1, it is characterised in that after obtaining stepped construction before described stitching operation, also includes row's layer step; Described row's layer step, for 6 stepped constructions are arranged layer up and down, is then respectively placing 10 kraft paper up and down.
9. the compression method of rigid-flex combined board according to claim 1, it is characterised in that described stitching operation includes the pre-pressing step, pressing step and the rear pressing step that are sequentially carried out; In described pre-pressing step, hot plate temperature is less than or equal to 130 DEG C, and pressure is less than 10Kg/cm2; In described pressing step, hot plate temperature is 190 DEG C, and pressure is 34Kg/cm2; In pressing step in the rear, hot plate temperature is 40 DEG C, and pressure is less than or equal to 34Kg/cm2��
10. a rigid-flex combined board, it is characterised in that the compression method pressing of described rigid-flex combined board rigid-flex combined board described in any one of claim 1-9 forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610074899.0A CN105657969A (en) | 2016-02-02 | 2016-02-02 | Rigid-flexible combined board and laminating method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610074899.0A CN105657969A (en) | 2016-02-02 | 2016-02-02 | Rigid-flexible combined board and laminating method thereof |
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| CN105657969A true CN105657969A (en) | 2016-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610074899.0A Pending CN105657969A (en) | 2016-02-02 | 2016-02-02 | Rigid-flexible combined board and laminating method thereof |
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Cited By (6)
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| CN106851975A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board and preparation method thereof |
| CN109429443A (en) * | 2017-08-31 | 2019-03-05 | 鹏鼎控股(深圳)股份有限公司 | The production method of rigid-flexible circuit board |
| CN109840031A (en) * | 2018-12-28 | 2019-06-04 | 深圳莱宝高科技股份有限公司 | A kind of flexible base plate processing and treating method |
| CN110913586A (en) * | 2019-11-08 | 2020-03-24 | 通元科技(惠州)有限公司 | Manufacturing method of semi-flexible printed circuit board |
| WO2021035762A1 (en) * | 2019-08-31 | 2021-03-04 | 庆鼎精密电子（淮安）有限公司 | Circuit board having heat-dissipation structure and preparation method therefor |
| CN112888200A (en) * | 2021-01-21 | 2021-06-01 | 盐城维信电子有限公司 | Flexible circuit board processing method |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106851975A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board and preparation method thereof |
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| CN109840031A (en) * | 2018-12-28 | 2019-06-04 | 深圳莱宝高科技股份有限公司 | A kind of flexible base plate processing and treating method |
| WO2021035762A1 (en) * | 2019-08-31 | 2021-03-04 | 庆鼎精密电子（淮安）有限公司 | Circuit board having heat-dissipation structure and preparation method therefor |
| CN110913586A (en) * | 2019-11-08 | 2020-03-24 | 通元科技(惠州)有限公司 | Manufacturing method of semi-flexible printed circuit board |
| CN112888200A (en) * | 2021-01-21 | 2021-06-01 | 盐城维信电子有限公司 | Flexible circuit board processing method |
| CN112888200B (en) * | 2021-01-21 | 2023-03-14 | 盐城维信电子有限公司 | Flexible circuit board processing method |
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Application publication date: 20160608 |
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