CN202634900U - Pressing device for multilayer flex-rigid printed circuit board - Google Patents
Pressing device for multilayer flex-rigid printed circuit board Download PDFInfo
- Publication number
- CN202634900U CN202634900U CN 201220248791 CN201220248791U CN202634900U CN 202634900 U CN202634900 U CN 202634900U CN 201220248791 CN201220248791 CN 201220248791 CN 201220248791 U CN201220248791 U CN 201220248791U CN 202634900 U CN202634900 U CN 202634900U
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- rigid printed
- multilayer flex
- pressing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model relates to a multilayer flex-rigid printed circuit board, and particularly to a pressing device for the multilayer flex-rigid printed circuit board. The pressing device comprises a multilayer flex-rigid printed circuit board body, a release liner, positioning rivets and a steel board for pressing, wherein the positioning rivets penetrate into the multilayer flex-rigid printed circuit board body; the release liner is pasted on the outer surface of the multilayer flex-rigid printed circuit board body; and a buffer protective layer is arranged between the outer surface of the release liner and the steel board. The pressing device for the multilayer flex-rigid printed circuit board, provided by the utility model has the advantages that the structural design is reasonable, and the rivets are not deformed basically when being pressed, thereby ensuring that multilayer flex-rigid printed circuit boards are not misplaced when being pressed, and increasing pressing precision. The circuit boards can be checked conveniently, and alignment errors among the multilayer flex-rigid printed circuit boards can be controlled within plus or minus 0.1 mm.
Description
Technical field
The utility model relates to a kind of multilayered rigidity and flexibility printed circuit board, specifically relates to the press fit device of this kind printed circuit board.
Background technology
The multilayered rigidity and flexibility printed circuit board is meant by the pressing of alternately putting together of hard and soft printed circuit board and forms that the multilayered rigidity and flexibility printed circuit board is when pressing, and quilting rivet directly clashes into steel plate and causes quilting rivet to deform; Cause when pressing, misplacing between the printed circuit board after the quilting rivet distortion; And when verification, all be to utilize the ducted body of rivet to carry out the Aligning degree of verification printed circuit board, if rivet has been out of shape; Verify error is big, and error is all between ± 0.15mm.
Summary of the invention
Therefore, the purpose of the utility model is to provide a kind of press fit device that when compacting multilayered rigidity and flexibility printed circuit board, can guarantee non-wiping between the plate body, as to be convenient to verification multilayered rigidity and flexibility printed circuit board.
The purpose of the utility model is to realize like this.
A kind of press fit device of multilayered rigidity and flexibility printed circuit board; Comprise the steel plate that multilayered rigidity and flexibility printed circuit board plate body, mould release membrance, quilting rivet and pressing are used; Quilting rivet penetrates in the multilayered rigidity and flexibility printed circuit board plate body; Mould release membrance is attached to the outer surface of multilayered rigidity and flexibility printed circuit board plate body, is provided with the buffer protection layer between said mould release membrance outer surface and the steel plate.
The utility model reasonable in design; Rivet is indeformable basically in pressing process; Guaranteed well when pressing, not misplace between the multilayered rigidity and flexibility printed circuit board; Improve bonding accurcy, also make things convenient for verification, can be in ± 0.1mm the ERROR CONTROL of Aligning degree between the multilayered rigidity and flexibility printed circuit board.
Fig. 1 is the hierarchy sketch map of the utility model.
Embodiment
Below in conjunction with accompanying drawing the utility model is done further to detail.
Embodiment, in conjunction with Fig. 1, a kind of press fit device of multilayered rigidity and flexibility printed circuit board comprises multilayered rigidity and flexibility printed circuit board plate body 1, mould release membrance 2, quilting rivet 3, silica gel buffer protection layer 4, top layer mould release membrance 5, steel plate 6, brown paper 7.Be through multilayered rigidity and flexibility printed circuit board plate body 1 together with quilting rivet 3 earlier; Be attached to multilayered rigidity and flexibility printed circuit board plate body 1 surface to mould release membrance 2 again; Be placed on mould release membrance 2 surfaces to silica gel buffer protection layer 4 again; Paste top layer mould release membrance 5 on silica gel buffer protection layer 4 surface again, and then be placed on pressing between the steel plate 6 to the multilayered rigidity and flexibility printed circuit board plate body of accomplishing above-mentioned operation, stick brown paper 7 at steel plate 6 outer surfaces.
Claims (1)
1. the press fit device of a multilayered rigidity and flexibility printed circuit board; Comprise the steel plate that multilayered rigidity and flexibility printed circuit board plate body, mould release membrance, quilting rivet and pressing are used; Quilting rivet penetrates in the multilayered rigidity and flexibility printed circuit board plate body; Mould release membrance is attached to the outer surface of multilayered rigidity and flexibility printed circuit board plate body, it is characterized in that: be provided with the buffer protection layer between said mould release membrance outer surface and the steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220248791 CN202634900U (en) | 2012-05-30 | 2012-05-30 | Pressing device for multilayer flex-rigid printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220248791 CN202634900U (en) | 2012-05-30 | 2012-05-30 | Pressing device for multilayer flex-rigid printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202634900U true CN202634900U (en) | 2012-12-26 |
Family
ID=47388032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220248791 Expired - Fee Related CN202634900U (en) | 2012-05-30 | 2012-05-30 | Pressing device for multilayer flex-rigid printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202634900U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470264A (en) * | 2014-10-31 | 2015-03-25 | 镇江华印电路板有限公司 | Milled board stacking structure of rigid-flexible printed circuit board |
| CN105657969A (en) * | 2016-02-02 | 2016-06-08 | 深圳市仁创艺电子有限公司 | Rigid-flexible combined board and laminating method thereof |
-
2012
- 2012-05-30 CN CN 201220248791 patent/CN202634900U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470264A (en) * | 2014-10-31 | 2015-03-25 | 镇江华印电路板有限公司 | Milled board stacking structure of rigid-flexible printed circuit board |
| CN105657969A (en) * | 2016-02-02 | 2016-06-08 | 深圳市仁创艺电子有限公司 | Rigid-flexible combined board and laminating method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20200530 |