CN103281856A - Metal carrier plate combined structure capable of being cyclically utilized - Google Patents
Metal carrier plate combined structure capable of being cyclically utilized Download PDFInfo
- Publication number
- CN103281856A CN103281856A CN201310163383XA CN201310163383A CN103281856A CN 103281856 A CN103281856 A CN 103281856A CN 201310163383X A CN201310163383X A CN 201310163383XA CN 201310163383 A CN201310163383 A CN 201310163383A CN 103281856 A CN103281856 A CN 103281856A
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- China
- Prior art keywords
- sensitive adhesive
- pressure sensitive
- carrier plate
- metal carrier
- support plate
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Abstract
The invention provides a metal carrier plate combined structure capable of being cyclically utilized. The metal carrier plate combined structure comprises a pressure sensitive adhesive carrier, wherein placing holes and structure positioning holes are formed in the pressure sensitive adhesive carrier, reinforcing sheets are arranged in the placing holes, a layer of metal carrier plate is pasted on the pressure sensitive adhesive carrier, and through holes are formed in the metal carrier plate in positions corresponding to the structure positioning holes of the pressure sensitive adhesive carrier. By adopting the mode, the metal carrier plate combined structure capable of being cyclically utilized is provided, the metal carrier plate is adopted to be compounded onto the pressure sensitive adhesive carrier, and the processing quality can be improved. Meanwhile, the metal carrier plate can be recycled and reutilized, and the cost is saved, the placing precision and the pasting efficiency can also be improved, so the production cost is reduced.
Description
Technical field
The present invention relates to flexible circuit board production, particularly relate to a kind of metal support plate combining structure that can be recycled.
Background technology
In present adagio production technology, fitting in the location of reinforcing chip becomes an indispensable part.Reinforcing chip needs reinforcing chip is swung in the correspondence position on the adagio in the applying process, carries out the craft heating then and fits, and has reached processing purpose.In the existing production technology, reinforcing chip is difficult to accurate localization and arranges, and so just be easy to generate the quality accident in the course of processing, and the production efficiency under this mode is low.Simultaneously, the support plate of common material damages easily, in case damage then need to make again, and the cost of manufacture height, be difficult to increase economic efficiency.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of metal support plate combining structure that can be recycled, and it is reasonable in design, and is simple in structure, and the metal support plate can reuse, and saves cost.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts provides a kind of metal support plate combining structure that can be recycled, and comprises the pressure sensitive adhesive carrier; Described pressure sensitive adhesive carrier is provided with putting hole and structure location hole, in the described putting hole reinforcing chip is housed; Be fitted with the layer of metal support plate on the described pressure sensitive adhesive carrier, the structure position of positioning hole of corresponding pressure sensitive adhesive carrier is provided with through hole on the metal support plate.
Preferably, described putting hole is arc or square through hole.
The invention has the beneficial effects as follows: a kind of metal support plate combining structure that can be recycled is provided, adopts the metal support plate to be compound on the pressure sensitive adhesive carrier, can improve crudy.Simultaneously, the recyclable recycling of metal support plate had both been saved cost, can improve again and put precision and promote applying efficient, thereby reduce production costs.
Description of drawings
Fig. 1 is the principle schematic of a kind of metal support plate combining structure that can be recycled of the present invention;
Fig. 2 is the cross sectional representation of a kind of metal support plate combining structure that can be recycled of the present invention;
The mark of each parts is as follows in the accompanying drawing: 1, pressure sensitive adhesive carrier; 2, putting hole; 3, structure location hole; 4, reinforcing chip; 5, metal support plate.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
See also accompanying drawing 1 and Fig. 2, the embodiment of the invention comprises:
A kind of metal support plate combining structure that can be recycled comprises pressure sensitive adhesive carrier 1; Described pressure sensitive adhesive carrier 1 is provided with putting hole 2 and structure location hole 3, in the described putting hole 2 reinforcing chip 4 is housed; Described pressure sensitive adhesive carries and is fitted with layer of metal support plate 5 on 1 body, and structure location hole 3 positions of corresponding pressure sensitive adhesive carrier 1 are provided with through hole on the metal support plate 5.Described putting hole 2 is arc or square through hole.
The invention provides a kind of metal support plate combining structure that can be recycled, adopt the metal support plate to be compound on the pressure sensitive adhesive carrier, can improve crudy.Simultaneously, the recyclable recycling of metal support plate had both been saved cost, can improve again and put precision and promote applying efficient, thereby reduce production costs.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes description of the present invention to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (2)
1. a metal support plate combining structure that can be recycled comprises pressure sensitive adhesive carrier (1); Described pressure sensitive adhesive carrier (1) is provided with putting hole (2) and structure location hole (3), and reinforcing chip (4) is housed in the described putting hole (2); It is characterized in that: be fitted with layer of metal support plate (5) on the described pressure sensitive adhesive carrier (1), structure location hole (3) position that metal support plate (5) is gone up corresponding pressure sensitive adhesive carrier (1) is provided with through hole.
2. a kind of metal support plate combining structure that can be recycled according to claim 1, it is characterized in that: described putting hole (2) is arc or square through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310163383XA CN103281856A (en) | 2013-05-07 | 2013-05-07 | Metal carrier plate combined structure capable of being cyclically utilized |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310163383XA CN103281856A (en) | 2013-05-07 | 2013-05-07 | Metal carrier plate combined structure capable of being cyclically utilized |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103281856A true CN103281856A (en) | 2013-09-04 |
Family
ID=49064252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310163383XA Pending CN103281856A (en) | 2013-05-07 | 2013-05-07 | Metal carrier plate combined structure capable of being cyclically utilized |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103281856A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103747620A (en) * | 2013-12-31 | 2014-04-23 | 苏州米达思精密电子有限公司 | Preparation method of local binderless reinforce panel |
| CN104411097A (en) * | 2014-11-28 | 2015-03-11 | 苏州米达思精密电子有限公司 | Reinforcing piece carrying plate |
| CN105578713A (en) * | 2015-12-11 | 2016-05-11 | 苏州米达思精密电子有限公司 | Manufacturing method of hole-carrying reinforcing sheet support plate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5263243A (en) * | 1992-01-28 | 1993-11-23 | Nec Corporation | Method for producing multilayer printed wiring boards |
| CN102458052A (en) * | 2010-10-28 | 2012-05-16 | 比亚迪股份有限公司 | Reinforcing and gluing method of flexible circuit board |
| CN202721899U (en) * | 2012-06-27 | 2013-02-06 | 淳华科技(昆山)有限公司 | Flexible printed circuit board reinforcing sheet bonding device |
| CN103009629A (en) * | 2012-12-28 | 2013-04-03 | 苏州米达思精密电子有限公司 | Device of thin-material small-sized reinforced steel sheet adhering buffer press-fit structure |
| CN203279337U (en) * | 2013-05-07 | 2013-11-06 | 苏州米达思精密电子有限公司 | Recyclable metal support-plate combination structure |
-
2013
- 2013-05-07 CN CN201310163383XA patent/CN103281856A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5263243A (en) * | 1992-01-28 | 1993-11-23 | Nec Corporation | Method for producing multilayer printed wiring boards |
| CN102458052A (en) * | 2010-10-28 | 2012-05-16 | 比亚迪股份有限公司 | Reinforcing and gluing method of flexible circuit board |
| CN202721899U (en) * | 2012-06-27 | 2013-02-06 | 淳华科技(昆山)有限公司 | Flexible printed circuit board reinforcing sheet bonding device |
| CN103009629A (en) * | 2012-12-28 | 2013-04-03 | 苏州米达思精密电子有限公司 | Device of thin-material small-sized reinforced steel sheet adhering buffer press-fit structure |
| CN203279337U (en) * | 2013-05-07 | 2013-11-06 | 苏州米达思精密电子有限公司 | Recyclable metal support-plate combination structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103747620A (en) * | 2013-12-31 | 2014-04-23 | 苏州米达思精密电子有限公司 | Preparation method of local binderless reinforce panel |
| CN103747620B (en) * | 2013-12-31 | 2018-09-11 | 苏州中拓专利运营管理有限公司 | A kind of preparation method of reinforcing chip of the part without glue |
| CN104411097A (en) * | 2014-11-28 | 2015-03-11 | 苏州米达思精密电子有限公司 | Reinforcing piece carrying plate |
| CN105578713A (en) * | 2015-12-11 | 2016-05-11 | 苏州米达思精密电子有限公司 | Manufacturing method of hole-carrying reinforcing sheet support plate |
| CN105578713B (en) * | 2015-12-11 | 2018-05-15 | 苏州中拓专利运营管理有限公司 | A kind of production method of reinforcing chip support plate with holes |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130904 |
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| RJ01 | Rejection of invention patent application after publication |