CN103458619B - PCB dual platen production method - Google Patents
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- CN103458619B CN103458619B CN201310359629.0A CN201310359629A CN103458619B CN 103458619 B CN103458619 B CN 103458619B CN 201310359629 A CN201310359629 A CN 201310359629A CN 103458619 B CN103458619 B CN 103458619B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 230000009977 dual effect Effects 0.000 title abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 42
- 238000005498 polishing Methods 0.000 claims abstract description 26
- 238000005406 washing Methods 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims description 16
- 238000004140 cleaning Methods 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 230000002378 acidificating effect Effects 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000005516 engineering process Methods 0.000 claims description 9
- 239000003814 drug Substances 0.000 claims description 5
- 235000011194 food seasoning agent Nutrition 0.000 claims description 5
- 238000007602 hot air drying Methods 0.000 claims description 5
- 238000005554 pickling Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000003746 surface roughness Effects 0.000 description 4
- 238000010030 laminating Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Manufacturing Of Printed Circuit Boards (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a kind of PCB dual platen production method, comprise the following steps (1) nog plate；(2) upper film is given；(3) by after pcb board and film aligning, exposure-processed；(4) development；(5) finally by the most dried for pcb board washing, ejecting plate.Beneficial effects of the present invention: in this method, first carries out nog plate, and control strict to polishing scratch, it is ensured that the adhesive force on pcb board face, it is ensured that light-sensitive surface can fit tightly with pcb board to pcb board.
Description
Technical field
The present invention relates to a kind of PCB dual platen production method.
Background technology
Pcb board, also known as printed circuit board (PCB), printed substrate, is called for short printed board, with insulation board as base material, is cut into a scale
Very little, at least with a conductive pattern on it, and cloth porose (such as component hole, fastener hole, plated through-hole etc.), and realize electronics unit
Being connected with each other between device.Owing to this plate is to use electron printing to make, therefore it is referred to as " printing " circuit board.
Double-sided PCB board is a kind of pcb board critically important in circuit board, market has double-sided wiring board metal base pcb board,
Hi-Tg weight copper foil circuit plate, the flat double-sided wiring board wriggled, high-frequency PCB, mixing dielectric base high frequency double-sided wiring board
Deng, it is applicable to widely, and new high-tech industry is such as: telecommunications, power supply, computer, Industry Control, digital product, Science & Teaching Instrument,
Medical apparatus and instruments, automobile, aerospace defense etc..
The production technology of double-sided PCB board is more complicated than one side pcb board, particularly in the process of the light-sensitive surface of pcb board, existing
On some pcb boards, light-sensitive surface and pcb board laminating are not very tight, and when exposure imaging, effect is not fine.
Summary of the invention
It is an object of the invention to overcome the shortcoming and defect of above-mentioned prior art, it is provided that PCB dual platen production method,
Solve in the production of existing double-sided PCB board, light-sensitive surface and the PCB untight problem of laminating.
The purpose of the present invention is achieved through the following technical solutions: PCB dual platen production method, comprises the following steps:
(1) pcb board is carried out nog plate process；
(2) carrying out upper film process to pcb board, described upper film is processed as dry film press mold and processes or wet film printing treatment；
(3) by after pcb board and film aligning, it is exposed processing；
(4) pcb board in step (3) being carried out development treatment, described developer solution is 0.8%～1.2% concentration
Na2Co3, the temperature of developer solution is 28 DEG C～32 DEG C, and developer pressure is 1.2～2.5Kg/Cm2, developing time is 1-2min；
(5) finally by the most dried for pcb board washing, ejecting plate.
Further, in step (1), the nog plate of pcb board processes and includes following sub-step:
(1-1) use acidic liquid that pcb board carries out pickling, remove the oxide layer on pcb board surface, increase the table of pcb board
Surface roughness, the hydraulic pressure of the acidic liquid in cleaning process is 1.0-1.5kg/cm2；
(1-2) use polish-brush that pcb board is polished, and also use clear water that pcb board is carried out not during polishing
Disconnected cleaning, the hydraulic pressure in cleaning process is 1.5-2.5kg/cm2；
(1-3) pcb board carrying out hot air drying process, the temperature of described hot blast is 80-100 DEG C.
Further, in step (1-2) pcb board be circuit sink copper facing plate time, the PCB polishing scratch thickness that causes of polishing is by polish-brush
10-16mm,；Pcb board is welding resistance oil copper coin, and the polishing scratch thickness that PCB polishing is caused by polish-brush is 12-18mm.
Further, the dry film press mold described in step (2) processes and includes following sub-step:
A pcb board is preheating to 25-30 DEG C by ()；
Pcb board b step (a) is processed by () after is sent in film pressing device, is heated to by the pinch roller in film pressing device
100-120 DEG C, being covered on pcb board two sides by dry film by this pinch roller, wherein the pressure of pinch roller is 1.5-3.5kg/cm2, pressure
Film speed is 1.0-3.0m/min.
Further, the wet film printing treatment described in step (2) includes following sub-step:
(A) preparing the half tone mated with pcb board, employing is screen printed onto on the two sides of pcb board and all coats one layer of ink；
(B) being toasted by the pcb board that step (A) waits until, baking temperature is 70-78 DEG C, first carries out the front of pcb board
Baking 9-14min, then carry out the back side of pcb board toasting 15-20min, when the two sides of pcb board is toasted simultaneously, the time
For 25-35min, such pcb board i.e. forms one layer of light-sensitive surface.
Further, the exposure described in step (3) includes following sub-step:
(3-1) get out the film, and the film and pcb board are directed at, and the hand pressure film is allowed to fit tightly with pcb board；
(3-2) combination of pcb board and the film is placed in the exposure room of exposure machine, is provided with one in exposure room and puts plate
The combination of platform, pcb board and the film is i.e. put on pallet, and the temperature putting pallet table top is 18-24 DEG C；
(3-3) to carrying out evacuation in exposure room, when the vacuum of indoor to be exposed is more than 90Pa, to pcb board and the film
The surface of combination carries out wiping back and forth, squeezes out the air bag between the film and pcb board so that the film and pcb board more fit tightly；
(3-4) open Exposing Lamp to be exposed；
(3-5), after having exposed, take out pcb board and the combination of the film, pull down the film, pcb board is positioned over exposure region.
Further, step (5) includes following sub-step:
(5-1) rinse the development liquid medicine of residual on pcb board again with clear water, hydraulic pressure is 1.2-2.5Kg/Cm2。
(5-2) pcb board is carried out cold wind to blow, blow the globule on pcb board off；
(5-3) pcb board carrying out hot-air seasoning, the temperature of described hot blast is 45 DEG C～65 DEG C.
The invention has the beneficial effects as follows: in this method, first pcb board carried out nog plate, and control strict to polishing scratch, it is ensured that
Adhesive force on pcb board face, it is ensured that light-sensitive surface can fit tightly with pcb board.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is described in further detail, but the present invention is not limited only to following enforcement
Example:
[embodiment 1]
PCB dual platen production method, comprises the following steps:
(1) pcb board is carried out nog plate process；
(2) carrying out upper film process to pcb board, described upper film is processed as dry film press mold and processes or wet film printing treatment；
(3) by after pcb board and film aligning, it is exposed processing；
(4) pcb board in step (3) being carried out development treatment, described developer solution is the Na of 0.8-1.2% concentration2Co3,
The temperature of developer solution is 28-32 DEG C, and developer pressure is 1.2-2.5Kg/Cm2, developing time is 1-2min；
(5) finally by the most dried for pcb board washing, ejecting plate.
Further, in step (1), the nog plate of pcb board processes and includes following sub-step:
(1-1) use acidic liquid that pcb board carries out pickling, remove the oxide layer on pcb board surface, increase the table of pcb board
Surface roughness, the hydraulic pressure of the acidic liquid in cleaning process is 1.0-1.5kg/cm2；
(1-2) use polish-brush that pcb board is polished, and also use clear water that pcb board is carried out not during polishing
Disconnected cleaning, the hydraulic pressure in cleaning process is 1.5-2.5kg/cm2；
(1-3) pcb board carrying out hot air drying process, the temperature of described hot blast is 80-100 DEG C.
Further, in step (1-2) pcb board be circuit sink copper facing plate time, the PCB polishing scratch thickness that causes of polishing is by polish-brush
10mm,；Pcb board is welding resistance oil copper coin, and the polishing scratch thickness that PCB polishing is caused by polish-brush is 12mm.
Further, the dry film press mold described in step (2) processes and includes following sub-step:
A pcb board is preheating to 25 DEG C by ()；
Pcb board b step (a) is processed by () after is sent in film pressing device, and the pinch roller in film pressing device is heated to 100
DEG C, by this pinch roller, dry film is covered on pcb board two sides, wherein the pressure of pinch roller is 3.5kg/cm2, press mold speed is
2.0m/min。
Further, the wet film printing treatment described in step (2) includes following sub-step:
(A) preparing the half tone mated with pcb board, employing is screen printed onto on the two sides of pcb board and all coats one layer of ink；
(B) being toasted by the pcb board that step (A) waits until, baking temperature is 75 DEG C, first dries the front of pcb board
Roasting 12min, then carry out toasting 15min to the back side of pcb board, when toasting the two sides of pcb board, the time is 25min simultaneously,
So i.e. form one layer of light-sensitive surface on pcb board.
Further, the exposure described in step (3) includes following sub-step:
(3-1) get out the film, and the film and pcb board are directed at, and the hand pressure film is allowed to fit tightly with pcb board；
(3-2) combination of pcb board and the film is placed in the exposure room of exposure machine, is provided with one in exposure room and puts plate
The combination of platform, pcb board and the film is i.e. put on pallet, and the temperature putting pallet table top is 18 DEG C；
(3-3) to carrying out evacuation in exposure room, when the vacuum of indoor to be exposed is more than 90Pa, to pcb board and the film
The surface of combination carries out wiping back and forth, squeezes out the air bag between the film and pcb board so that the film and pcb board more fit tightly；
(3-4) open Exposing Lamp to be exposed；
(3-5), after having exposed, take out pcb board and the combination of the film, pull down the film, pcb board is positioned over exposure region.
Further, step (5) includes following sub-step:
(5-1) rinse the development liquid medicine of residual on pcb board again with clear water, hydraulic pressure is 1.2Kg/Cm2。
(5-2) pcb board is carried out cold wind to blow, blow the globule on pcb board off；
(5-3) pcb board carrying out hot-air seasoning, the temperature of described hot blast is 45 DEG C DEG C.
[embodiment 2]
PCB dual platen production method, comprises the following steps:
(1) pcb board is carried out nog plate process；
(2) carrying out upper film process to pcb board, described upper film is processed as dry film press mold and processes or wet film printing treatment；
(3) by after pcb board and film aligning, it is exposed processing；
(4) pcb board in step (3) being carried out development treatment, described developer solution is the Na of 1.2% concentration2Co3, development
The temperature of liquid is 28-32 DEG C, and developer pressure is 1.2-2.5Kg/Cm2, developing time is 2min；
(5) finally by the most dried for pcb board washing, ejecting plate.
Further, in step (1), the nog plate of pcb board processes and includes following sub-step:
(1-1) use acidic liquid that pcb board carries out pickling, remove the oxide layer on pcb board surface, increase the table of pcb board
Surface roughness, the hydraulic pressure of the acidic liquid in cleaning process is 1.5kg/cm2；
(1-2) use polish-brush that pcb board is polished, and also use clear water that pcb board is carried out not during polishing
Disconnected cleaning, the hydraulic pressure in cleaning process is 1.5-2.5kg/cm2；
(1-3) pcb board carrying out hot air drying process, the temperature of described hot blast is 90-100 DEG C.
Further, in step (1-2) pcb board be circuit sink copper facing plate time, the PCB polishing scratch thickness that causes of polishing is by polish-brush
16mm,；Pcb board is welding resistance oil copper coin, and the polishing scratch thickness that PCB polishing is caused by polish-brush is 18mm.
Further, the dry film press mold described in step (2) processes and includes following sub-step:
A pcb board is preheating to 30 DEG C by ()；
Pcb board b step (a) is processed by () after is sent in film pressing device, and the pinch roller in film pressing device is heated to 120
DEG C, by this pinch roller, dry film is covered on pcb board two sides, wherein the pressure of pinch roller is 3.5kg/cm2, press mold speed is
3.0m/min。
Further, the wet film printing treatment described in step (2) includes following sub-step:
(A) preparing the half tone mated with pcb board, employing is screen printed onto on the two sides of pcb board and all coats one layer of ink；
(B) being toasted by the pcb board that step (A) waits until, baking temperature is 75 DEG C, first dries the front of pcb board
Roasting 14min, then carry out toasting 20min to the back side of pcb board, when toasting the two sides of pcb board, the time is 35min simultaneously,
So i.e. form one layer of light-sensitive surface on pcb board.
Further, the exposure described in step (3) includes following sub-step:
(3-1) get out the film, and the film and pcb board are directed at, and the hand pressure film is allowed to fit tightly with pcb board；
(3-2) combination of pcb board and the film is placed in the exposure room of exposure machine, is provided with one in exposure room and puts plate
The combination of platform, pcb board and the film is i.e. put on pallet, and the temperature putting pallet table top is 18-24 DEG C；
(3-3) to carrying out evacuation in exposure room, when the vacuum of indoor to be exposed is more than 90Pa, to pcb board and the film
The surface of combination carries out wiping back and forth, squeezes out the air bag between the film and pcb board so that the film and pcb board more fit tightly；
(3-4) open Exposing Lamp to be exposed；
(3-5), after having exposed, take out pcb board and the combination of the film, pull down the film, pcb board is positioned over exposure region.
Further, step (5) includes following sub-step:
(5-1) rinse the development liquid medicine of residual on pcb board again with clear water, hydraulic pressure is 2.5Kg/Cm2。
(5-2) pcb board is carried out cold wind to blow, blow the globule on pcb board off；
(5-3) pcb board carrying out hot-air seasoning, the temperature of described hot blast is 45-65 DEG C.
[embodiment 3]
PCB dual platen production method, comprises the following steps:
(1) pcb board is carried out nog plate process；
(2) carrying out upper film process to pcb board, described upper film is processed as dry film press mold and processes or wet film printing treatment；
(3) by after pcb board and film aligning, it is exposed processing；
(4) pcb board in step (3) being carried out development treatment, described developer solution is the Na of 1% concentration2Co3, developer solution
Temperature be 30 DEG C, developer pressure is 2Kg/Cm2, developing time is 1.5min；
(5) finally by the most dried for pcb board washing, ejecting plate.
Further, in step (1), the nog plate of pcb board processes and includes following sub-step:
(1-1) use acidic liquid that pcb board carries out pickling, remove the oxide layer on pcb board surface, increase the table of pcb board
Surface roughness, the hydraulic pressure of the acidic liquid in cleaning process is 1.3kg/cm2；
(1-2) use polish-brush that pcb board is polished, and also use clear water that pcb board is carried out not during polishing
Disconnected cleaning, the hydraulic pressure in cleaning process is 1.5kg/cm2；
(1-3) pcb board carrying out hot air drying process, the temperature of described hot blast is 90 DEG C.
Further, in step (1-2) pcb board be circuit sink copper facing plate time, the PCB polishing scratch thickness that causes of polishing is by polish-brush
14mm,；Pcb board is welding resistance oil copper coin, and the polishing scratch thickness that PCB polishing is caused by polish-brush is 14mm.
Further, the dry film press mold described in step (2) processes and includes following sub-step:
A pcb board is preheating to 27 DEG C by ()；
Pcb board b step (a) is processed by () after is sent in film pressing device, is heated to by the pinch roller in film pressing device
100-120 DEG C, being covered on pcb board two sides by dry film by this pinch roller, wherein the pressure of pinch roller is 2kg/cm2, press mold speed
For 2m/min.
Further, the wet film printing treatment described in step (2) includes following sub-step:
(A) preparing the half tone mated with pcb board, employing is screen printed onto on the two sides of pcb board and all coats one layer of ink；
(B) being toasted by the pcb board that step (A) waits until, baking temperature is 75 DEG C, first dries the front of pcb board
Roasting 10min, then carry out toasting 18min to the back side of pcb board, when toasting the two sides of pcb board, the time is 30min simultaneously,
So i.e. form one layer of light-sensitive surface on pcb board.
Further, the exposure described in step (3) includes following sub-step:
(3-1) get out the film, and the film and pcb board are directed at, and the hand pressure film is allowed to fit tightly with pcb board；
(3-2) combination of pcb board and the film is placed in the exposure room of exposure machine, is provided with one in exposure room and puts plate
The combination of platform, pcb board and the film is i.e. put on pallet, and the temperature putting pallet table top is 18-24 DEG C；
(3-3) to carrying out evacuation in exposure room, when the vacuum of indoor to be exposed is more than 90Pa, to pcb board and the film
The surface of combination carries out wiping back and forth, squeezes out the air bag between the film and pcb board so that the film and pcb board more fit tightly；
(3-4) open Exposing Lamp to be exposed；
(3-5), after having exposed, take out pcb board and the combination of the film, pull down the film, pcb board is positioned over exposure region.
Further, step (5) includes following sub-step:
(5-1) rinse the development liquid medicine of residual on pcb board again with clear water, hydraulic pressure is 2Kg/Cm2。
(5-2) pcb board is carried out cold wind to blow, blow the globule on pcb board off；
(5-3) pcb board carrying out hot-air seasoning, the temperature of described hot blast is 55 DEG C.
Claims (7)
1. Double-side line production technology, it is characterised in that comprise the following steps:
(1) pcb board is carried out nog plate process；
(2) carrying out upper film process to pcb board, described upper film is processed as dry film press mold and processes or wet film printing treatment；
(3) by after pcb board and film aligning, it is exposed processing；
(4) pcb board in step (3) being carried out development treatment, described developer solution is the Na of 0.8%～1.2% concentration2Co3,
The temperature of developer solution is 25 DEG C～32 DEG C, and developer pressure is 1.2～2.5Kg/Cm2, developing time is 1-2min；
(5) finally by the most dried for pcb board washing, ejecting plate.
Double-side line production technology the most according to claim 1, it is characterised in that in step (1), the nog plate of pcb board processes
Including following sub-step:
(1-1) using acidic liquid that pcb board carries out pickling, remove the oxide layer on pcb board surface, the surface increasing pcb board is thick
Rugosity, the hydraulic pressure of the acidic liquid in cleaning process is 1.0-1.5kg/cm2；
(1-2) use polish-brush that pcb board is polished, and also use clear water that pcb board is carried out constantly during polishing
Cleaning, the hydraulic pressure in cleaning process is 1.5-2.5kg/cm2；
(1-3) pcb board carrying out hot air drying process, the temperature of described hot blast is 80-100 DEG C.
Double-side line production technology the most according to claim 2, it is characterised in that in step (1-2), pcb board is that circuit sinks
During copper facing plate, the polishing scratch thickness that PCB polishing is caused by polish-brush is 10-16mm,；Pcb board is welding resistance oil copper coin, and PCB is beaten by polish-brush
The polishing scratch thickness that mill causes is 12-18mm.
Double-side line production technology the most according to claim 1, it is characterised in that at the dry film press mold described in step (2)
Manage and include following sub-step:
A pcb board is preheating to 25-30 DEG C by ()；
Pcb board b step (a) is processed by () after is sent in film pressing device, and the pinch roller in film pressing device is heated to 100-120
DEG C, by this pinch roller, dry film is covered on pcb board two sides, wherein the pressure of pinch roller is 1.5-3.5kg/cm2, press mold speed is
1.0-3.0m/min。
Double-side line production technology the most according to claim 1, it is characterised in that at the wet film printing described in step (2)
Manage and include following sub-step:
(A) preparing the half tone mated with pcb board, employing is screen printed onto on the two sides of pcb board and all coats one layer of ink；
(B) being toasted by the pcb board that step (A) obtains, baking temperature is 70-80 DEG C, first toasts the front of pcb board
9-14min, then carry out the back side of pcb board toasting 15-20min, when toasting the two sides of pcb board, the time is 25-simultaneously
35min, such pcb board is i.e. formed one layer of light-sensitive surface.
Double-side line production technology the most according to claim 1, it is characterised in that the exposure described in step (3) include with
Lower sub-step:
(3-1) get out the film, and the film and pcb board are directed at, and the hand pressure film is allowed to fit tightly with pcb board；
(3-2) combination of pcb board and the film is placed in the exposure room of exposure machine, is provided with one in exposure room and puts pallet,
The combination of pcb board and the film is i.e. put on pallet, and the temperature putting pallet table top is 18-24 DEG C；
(3-3), to carrying out evacuation in exposure room, when the vacuum of indoor to be exposed is more than 90Pa, pcb board and the film are combined
Surface carry out wiping back and forth, squeeze out the air bag between the film and pcb board so that the film and pcb board more fit tightly；
(3-4) open Exposing Lamp to be exposed；
(3-5), after having exposed, take out pcb board and the combination of the film, pull down the film, pcb board is positioned over exposure region.
Double-side line production technology the most according to claim 1, it is characterised in that step (5) includes following sub-step:
(5-1) rinse the development liquid medicine of residual on pcb board again with clear water, hydraulic pressure is 1.2-2.5Kg/Cm2；
(5-2) pcb board is carried out cold wind to blow, blow the globule on pcb board off；
(5-3) pcb board carrying out hot-air seasoning, the temperature of described hot blast is 45 DEG C～65 DEG C.
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| CN103458619B true CN103458619B (en) | 2016-12-28 |
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| CN104614944B (en) * | 2015-01-15 | 2019-10-11 | 何忠亮 | A kind of negative pressure drying silk-screen manufacturing method of screen |
| CN105916305A (en) * | 2016-05-19 | 2016-08-31 | 湖北龙腾电子科技有限公司 | Method for preventing printing ink in jack of single-side-windowed jack panel of PCB from attaching to welding pad |
| CN106019861A (en) * | 2016-07-04 | 2016-10-12 | 奥士康精密电路（惠州）有限公司 | Method for quick developing of dry film |
| CN107072060A (en) * | 2017-05-25 | 2017-08-18 | 江门崇达电路技术有限公司 | A kind of method for solving thin plate circuit dog tooth |
| CN108646523A (en) * | 2018-05-14 | 2018-10-12 | 深圳市骏达光电股份有限公司 | Elargol circuit developing process |
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