CN210899877U

CN210899877U - Resistance welding flatting mill

Info

Publication number: CN210899877U
Application number: CN201921768614.9U
Authority: CN
Inventors: 岳嘉成
Original assignee: Shenzhen Hemei Jingyi Technology Co ltd
Current assignee: Shenzhen Hemei Jingyi Semiconductor Technology Co.,Ltd.
Priority date: 2019-10-21
Filing date: 2019-10-21
Publication date: 2020-06-30
Anticipated expiration: 2029-10-21

Abstract

The utility model relates to a hinder and weld flatting mill, it includes last press mold unit and pushes down the membrane unit, should go up press mold unit and should push down the membrane unit and set up simultaneously in the organism, press mold unit and should push down the membrane unit between form one and flatten the workspace on this, the workspace that should flatten has pan feeding mouth and discharge gate, should go up the press mold unit and send the membrane roller including last, go up and receive the membrane roller, go up press mold roller and upper heater, it is corresponding with this last press mold unit to push down the membrane unit, should push down the membrane unit and send the membrane roller down including, receive the membrane roller down, push down the membrane roller and lower heater down.

Description

Resistance welding flatting mill

Technical Field

The utility model relates to a hinder welds flatting mill, especially indicate a flatting mill that can flatten base plate surface ink layer in circuit board base plate manufacturing process.

Background

As is well known, IC packaging refers to a package for mounting a semiconductor integrated circuit chip, which not only plays a role in mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the package by wires through the contacts on the chip, which are connected to other devices by wires on a printed circuit board, thereby realizing the connection of an internal chip to an external circuit.

In order to realize the functions of the printed circuit board, the surface of the printed circuit board is provided with the ink layer, but the surface flatness of the ink layer manufactured by the traditional process cannot reach the optimum degree, and the flatness of the ink layer inevitably affects the product quality of a finished product, which is a main defect of the traditional technology.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical scheme who adopts does: the utility model provides a hinder welds flatting mill which characterized in that: including last press mold unit and push down the membrane unit, should go up press mold unit and should push down the membrane unit and set up simultaneously in the organism, form a workspace of flattening between this press mold unit and this push down the membrane unit, the workspace of should flattening has pan feeding mouth and discharge gate, this press mold unit is including sending the membrane roller on, go up and receive the membrane roller, go up press mold roller and upper heater, wherein, should go up and send the membrane roller setting in this pan feeding mouth top, should go up and receive the membrane roller setting in this discharge gate top, a plurality of this press mold roller on arrange and set up between this pan feeding mouth and this discharge gate, and simultaneously, a plurality of this upper heater also set up between this pan feeding mouth and this discharge gate.

The lower film pressing unit corresponds to the upper film pressing unit and comprises a lower film feeding roller, a lower film receiving roller, a lower film pressing roller and a lower heater, wherein the lower film feeding roller is arranged below the feeding port, the lower film receiving roller is arranged below the discharging port, the lower film pressing rollers are arranged between the feeding port and the discharging port, and meanwhile, the lower heaters are also arranged between the feeding port and the discharging port.

The lower film pressing rollers are correspondingly arranged right below the upper film pressing rollers one by one.

The utility model has the advantages that: the utility model discloses thereby flatten the action and make the surperficial printing ink face of semi-manufactured goods plate body more level and more smooth with the help of this last press mold unit and this press mold unit simultaneously about the semi-manufactured goods plate body printing ink respectively. Through this hinder and weld the flatting mill and can improve this last press mold unit and this press mold unit down and wait to press the contact nature that the semi-manufactured plate body is good and improve the homogeneity of semi-manufactured plate body atress when carrying out to hinder and flatten the operation to improve the planarization of semi-manufactured plate body printing ink face on the whole.

Drawings

Fig. 1 is the principle schematic diagram of the resistance welding flatting machine of the utility model.

Fig. 2 is the utility model discloses weld and hinder the structural schematic of last lamination film roller of flatting mill.

Detailed Description

A method for solder resist flattening of an IC package substrate comprises the following steps.

Firstly, placing the copper-clad laminated board in a board baking furnace for baking the board.

And step two, sequentially carrying out copper reduction operation, drilling operation, copper plating operation and line manufacturing operation on the copper-clad laminated plate subjected to plate baking in the step one to obtain a semi-finished plate body required by a resistance welding process.

And thirdly, in order to provide a good semi-finished plate body for the solder resist flattening operation, performing super-roughening operation and coating operation on the semi-finished plate body obtained in the second step, wherein the specific steps are as follows.

Step 1, performing AOI optical inspection on the semi-finished plate after the circuit manufacturing is finished. The step has the function of ensuring the integrity of the circuit layer in the semi-finished board body before the solder mask process is carried out on the semi-finished board body.

And 2, carrying out leveling operation before super-roughening operation on the semi-finished plate subjected to AOI optical inspection. The step has the function of removing slight oxides and dirt on the copper surface of the semi-finished plate body, and providing a clean copper surface for subsequent super-roughening operation, so that the quality of the super-roughening operation is ensured.

And 3, cleaning the semi-finished plate subjected to leveling operation by using clean water, and then finishing the super-roughening operation.

And 4, cleaning the semi-finished plate subjected to the super-roughening operation by using clean water, and then performing dust removal treatment on the surface of the semi-finished plate by using an automatic dust adhering machine in a dust-free workshop. The step has the effect of removing dust on the surface layer of the semi-finished product plate, so that the surface layer of the semi-finished product plate is clean enough, and the problem that printing ink covers dust to influence the operation quality of solder mask flattening during subsequent coating operation is avoided.

And 5, coating the semi-finished plate subjected to the dust removal operation in a dust-free workshop. The main function of this step is to cover the photosensitive ink on the both sides of semi-manufactured plate body circuit layer to play the effect of protection both sides circuit layer and be convenient for follow-up electroplating process go on.

And 6, performing solder mask flattening operation on the semi-finished plate body subjected to the coating operation in a dust-free workshop. The step has the effect of enabling the ink surface of the semi-finished plate body after coating operation to be smoother.

And 7, carrying out optical treatment on the semi-finished plate subjected to the solder mask flattening operation in a dust-free workshop.

The function of this step is to make the ink to be retained tightly cover the circuit layer.

And 8, developing the exposed semi-finished plate body, thereby stripping the unnecessary ink on the semi-finished plate body.

The solder resist flattening work is performed in step 6 of the above-described third step using a solder resist flattening machine including an upper film pressing unit 100 and a lower film pressing unit 200 as shown in fig. 1 to 2.

The upper film pressing unit 100 and the lower film pressing unit 200 are simultaneously disposed in the machine body 300, and a flattening working area is formed between the upper film pressing unit 100 and the lower film pressing unit 200, and the flattening working area has a feeding port 310 and a discharging port 320.

During operation, the semi-finished plate enters the flattening area from the feeding port 310 and then is discharged from the discharging port 320.

In the above process, the upper film pressing unit 100 and the lower film pressing unit 200 are respectively used to flatten the ink on the upper and lower surfaces of the semi-finished plate, so that the ink on the surface of the semi-finished plate is smoother.

Through this hinder and weld the flatting mill and can improve this upper pressure membrane unit 100 and this press down membrane unit 200 and wait to press the good contact nature of semi-manufactured goods plate body and improve the homogeneity of semi-manufactured goods plate body atress when carrying out to hinder and flatten the operation to improve the planarization of semi-manufactured goods plate body printing ink face on the whole.

The upper film pressing unit 100 includes an upper film feeding roller 10, an upper film receiving roller 20, an upper film pressing roller 30 and an upper heater 40, wherein the upper film feeding roller 10 is disposed above the feeding port 310, and the upper film receiving roller 20 is disposed above the discharging port 320.

The upper squeeze film rollers 30 are arranged between the material inlet 310 and the material outlet 320, and the upper heaters 40 are also arranged between the material inlet 310 and the material outlet 320.

This membrane unit 200 is pressed down and this membrane unit 100 is pressed on correspondingly, and this membrane unit 200 is pressed down includes send membrane roller 50, receive membrane roller 60, press membrane roller 70 and lower heater 80 down, and wherein, should send membrane roller 50 to set up in this pan feeding mouth 310 below down, should receive membrane roller 60 and set up in this discharge gate 320 below down.

The lower film-pressing rollers 70 are arranged between the material inlet 310 and the material outlet 320, and the lower heaters 80 are also arranged between the material inlet 310 and the material outlet 320.

The lower squeeze film rollers 70 are disposed directly below the upper squeeze film roller 30 in a one-to-one correspondence.

In practice, the upper heater 40 is disposed between any adjacent two of the upper nip rollers 30.

The lower heater 80 is disposed between any adjacent two of the lower pressure film rollers 70.

The upper heater 40 and the lower heater 80 are both heating fans including a fan and a heating wire, and heat generated by the heating wire is blown out by the fan.

Two ends of the flattened film 400 are respectively wound between the upper film feeding roller 10 and the upper film receiving roller 20, and between the lower film feeding roller 50 and the lower film receiving roller 60, wherein the upper film feeding roller 10 and the lower film feeding roller 50 gradually discharge materials, and the upper film receiving roller 20 and the lower film receiving roller 60 gradually receive materials.

In practical implementation, auxiliary rollers 91 are respectively disposed below the upper film feeding roller 10 and the upper film collecting roller 20.

Auxiliary rollers 92 are provided above the lower film feeding roller 50 and the lower film collecting roller 60, respectively.

The

auxiliary rollers

91 and 92 can keep the flat and tight film 400.

In specific implementation, the upper film pressing roller 30 and the lower film pressing roller 70 both include a rigid inner shaft 510 and a flexible outer sleeve 520, the flexible outer sleeve 520 is sleeved on the outer surface of the rigid inner shaft 510, protruding columns 511 are respectively disposed at two ends of the rigid inner shaft 510, the protruding columns 511 are inserted into the bearings 530, the bearings 530 are disposed in the sleeves 540, the sleeves 540 are disposed in the fixing frame 550, the adjusting screws 560 are disposed on the outer surface of the sleeves 540, and the fixing frame 550 is fixedly connected in the machine body 300.

In use, the gap between the upper lamination roller 30 and the lower lamination roller 70 is adjusted by adjusting the adjusting screw 560.

In practice, the diameter of the upper film roll 30 and the lower film roll 70 may be set to 78mm, the length thereof may be set to 760mm, and the thickness of the flexible outer cover 520 may be set to 3 mm.

When the solder resist flattening machine works, the upper film pressing roller 30 and the lower film pressing roller 70 are preheated firstly, and the solder resist flattening operation is carried out after the temperature of the upper film pressing roller and the lower film pressing roller is raised to be between 100 ℃ and 110 ℃. When the solder mask flattening operation is carried out, the flattening speed is 0.6m/min to 0.8m/min, and the flattening pressure is 6kg/cm²To 8kg/cm²。

In practice, the hardness of the surfaces of the upper film pressing roller 30 and the lower film pressing roller 70 is 70 degrees, the flexible outer sleeve 520 is made of silica gel, the rotating speed of the upper film pressing roller 30 and the lower film pressing roller 70 is controlled to be 0.6-0.8m/min, and the flattening film 400 is a PET release film with the thickness of 25 um.

Claims

1. The utility model provides a hinder welds flatting mill which characterized in that: comprises an upper film pressing unit and a lower film pressing unit which are arranged in a machine body at the same time, a flattening working area is formed between the upper film pressing unit and the lower film pressing unit, the flattening working area is provided with a feeding port and a discharging port,

the upper film pressing unit comprises an upper film feeding roller, an upper film collecting roller, an upper film pressing roller and an upper heater, wherein the upper film feeding roller is arranged above the material inlet, the upper film collecting roller is arranged above the material outlet, a plurality of upper film pressing rollers are arranged between the material inlet and the material outlet, and a plurality of upper heaters are also arranged between the material inlet and the material outlet,

the lower film pressing unit corresponds to the upper film pressing unit and comprises a lower film feeding roller, a lower film collecting roller, a lower film pressing roller and a lower heater, wherein the lower film feeding roller is arranged below the material inlet, the lower film collecting roller is arranged below the material outlet, a plurality of lower film pressing rollers are arranged between the material inlet and the material outlet, and a plurality of lower heaters are also arranged between the material inlet and the material outlet,

2. The solder resist leveler of claim 1, wherein: the upper heater is arranged between any two adjacent upper film pressing rollers, and the lower heater is arranged between any two adjacent lower film pressing rollers.

3. The solder resist leveler of claim 1, wherein: the upper heater and the lower heater are both heating fans, and each heating fan comprises a fan and a heating wire.

4. The solder resist leveler of claim 1, wherein: auxiliary rolling shafts are respectively arranged below the upper film feeding roller and the upper film collecting roller, and auxiliary rolling shafts are respectively arranged above the lower film feeding roller and the lower film collecting roller.

5. The solder resist leveler of claim 1, wherein: the upper film pressing roller and the lower film pressing roller comprise rigid inner shafts and flexible outer sleeves, the flexible outer sleeves are sleeved on the outer surfaces of the rigid inner shafts, protruding columns are arranged at two ends of the rigid inner shafts in a protruding mode respectively, the protruding columns are inserted into bearings, the bearings are arranged in sleeves, the sleeves are arranged in fixed frames, adjusting screws penetrate through the fixed frames, and the adjusting screws are arranged on the outer surfaces of the sleeves in a propping mode.

6. The solder resist leveler of claim 5, wherein: the fixing frame is fixedly connected in the machine body.