CN105722321A - Laminator control method, laminator control system and laminator - Google Patents
Laminator control method, laminator control system and laminator Download PDFInfo
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Abstract
本发明提供了一种压膜机的控制方法、一种压膜机的控制系统和一种压膜机，其中，压膜机的控制方法，包括：根据厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理。通过本发明的技术方案，对待压膜的电路板进行智能的压膜处理，而避免了在压膜前对电路板进行分选的情况，提高了电路板的压膜效率，同时也降低了电路板的压膜成本。
The present invention provides a method for controlling a laminator, a control system for a laminator, and a laminator, wherein the method for controlling a laminator includes: selecting a film laminator according to a thickness value collected by a thickness measuring device mode to carry out lamination processing on the circuit board. Through the technical scheme of the present invention, the circuit board to be laminated is intelligently laminated, avoiding the situation of sorting the circuit board before laminating, improving the laminating efficiency of the circuit board, and reducing the circuit board cost. The lamination cost of the board.
Description
技术领域technical field
本发明涉及压膜机技术领域，具体而言，涉及一种压膜机的控制方法、一种压膜机的控制系统和一种压膜机.The present invention relates to the technical field of laminators, in particular, to a control method of a laminator, a control system of a laminator, and a laminator.
背景技术Background technique
目前，随着电子产品和通信技术的覆盖应用，印制电路板技术也得到快速发展，其主要发展历程为：传统的多层电路板、高密度互联电路板(HDI，HighDensityInterconnector)、任意层互联(ELIC，EveryLayerinterconnection)HDI板，印制电路板的发展趋势正逐步向更轻、更薄、更小的方向发展。在当前的电路板应用中，薄板电路板的发展已成为市场主流，故而薄板电路板的工艺精度已成为行业技术标杆。在电路板图形线路制作过程中，需进行内外层图形线路的制作，其中对薄板电路板的精度影响较大的是薄板压膜工艺，具体地，压膜主要是利用压膜机的包胶滚辘高温对电路板和干膜进行预热处理，使电路板表面温度达成压膜生产温度，干膜贴附电路板表面后受高温影响，充分释放干膜流动性和贴合性，使干膜更好的发挥表面贴合和封孔能力，对电路板进行附着和封孔。由于薄板的覆铜基板厚度大概在0.10mm，甚至达到0.05mm，在图形线路制作前，如果采用普通压膜轴对薄板电路板进行压膜，会导致覆铜基板平整性受影响，需要采用薄板板压膜轴对薄板电路板进行额外压膜处理以保证其精度和质量，而普通厚度的电路板不需要薄板压膜轴对其进行压膜处理，即可满足电路板的精度和质量要求，这就要求在压膜工人在每次对电路板压膜前根据其厚度设定不同的压膜模式对其进行处理，造成了电路板压膜过程的生产效率降低。At present, with the coverage and application of electronic products and communication technology, printed circuit board technology has also developed rapidly. Its main development process is: traditional multilayer circuit board, high density interconnect (ELIC, EveryLayerinterconnection) HDI boards, the development trend of printed circuit boards is gradually developing in the direction of lighter, thinner and smaller. In the current application of circuit boards, the development of thin circuit boards has become the mainstream of the market, so the process precision of thin circuit boards has become the technical benchmark of the industry. In the process of making circuit board graphic lines, it is necessary to make inner and outer layer graphic lines. Among them, the thin plate lamination process has a greater impact on the accuracy of the thin circuit board. The high temperature of the reel preheats the circuit board and the dry film, so that the surface temperature of the circuit board reaches the lamination production temperature. Make better use of surface bonding and hole sealing capabilities, and attach and seal circuit boards. Since the thickness of the copper-clad substrate of the thin plate is about 0.10mm, or even 0.05mm, if the ordinary lamination shaft is used to laminate the thin-plate circuit board before the graphic circuit is made, the flatness of the copper-clad substrate will be affected, and a thin plate is required. The plate lamination shaft performs additional lamination processing on the thin circuit board to ensure its accuracy and quality, while the circuit board of ordinary thickness does not need the lamination process of the thin plate lamination shaft to meet the accuracy and quality requirements of the circuit board. This requires the lamination workers to set different lamination modes according to the thickness of the circuit board before each lamination, which reduces the production efficiency of the circuit board lamination process.
因此，如何实现压膜机根据电路板厚度而设置相应的压膜模式进而对不同厚度的电路板进行智能压膜加工成为亟待解决的技术问题。Therefore, how to implement the lamination machine to set the corresponding lamination mode according to the thickness of the circuit board and then perform intelligent lamination processing on the circuit boards with different thicknesses has become an urgent technical problem to be solved.
发明内容Contents of the invention
本发明正是基于上述技术问题至少之一，提出了一种新的压膜机的控制方案，通过在压膜机的整列段装置的前段上设置厚度测量装置，并根据厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理，实现了压膜机对不同厚度的电路板的压膜模式的智能设定，而不必每次进行人工的设定，提高了电路板的压膜效率，同时也降低了电路板的压膜成本。Based on at least one of the above-mentioned technical problems, the present invention proposes a new control scheme for a film laminating machine, by setting a thickness measuring device on the front section of the alignment device of the film laminating machine, and according to the thickness collected by the thickness measuring device Value select lamination mode to carry out lamination process on the circuit board, realizing the intelligent setting of the lamination mode of the circuit board with different thicknesses by the laminator, without having to manually set each time, which improves the reliability of the circuit board. The lamination efficiency is improved, and the lamination cost of the circuit board is also reduced.
有鉴于此，本发明提出了一种压膜机的控制方法，包括：根据厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理。In view of this, the present invention proposes a method for controlling a lamination machine, comprising: selecting a lamination mode according to a thickness value collected by a thickness measuring device to perform lamination processing on the circuit board.
在该技术方案中，通过根据厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理，实现了压膜机对不同厚度的电路板的压膜模式的智能设定，而不必每次进行人工的设定，提高了电路板的压膜效率，同时也降低了电路板的压膜成本。In this technical solution, by selecting the lamination mode according to the thickness value collected by the thickness measuring device to perform lamination processing on the circuit board, the intelligent setting of the lamination mode of the circuit board with different thicknesses by the laminator is realized, and It is not necessary to perform manual setting every time, which improves the lamination efficiency of the circuit board and reduces the lamination cost of the circuit board.
在上述技术方案中，优选地，所述压膜模式包括：普通压膜模式和薄板压膜模式，其中，普通压膜模式包括使用普通压膜轴执行至少一次普通压膜操作，以及薄板压膜模式包括使用普通压膜轴执行至少一次普通压膜操作，以及使用薄板压膜轴执行至少一次薄板压膜操作。In the above technical solution, preferably, the lamination mode includes: a common lamination mode and a thin plate lamination mode, wherein the common lamination mode includes using a common lamination shaft to perform at least one common lamination operation, and a thin plate lamination mode Modes include performing at least one normal lamination operation with a normal lamination spindle and performing at least one sheet lamination operation with a sheet lamination spindle.
在该技术方案中，通过普通压膜模式对普通厚度电路板进行压膜处理，具体地，薄板压膜轴此时处于上升位置，不与待压膜的电路板进行接触，在保证压膜质量的同时降低了压膜成本，另外，通过薄板压膜轴对薄板电路板进行压膜处理，具体地，薄板压膜轴此时处于下降位置，与待压膜的电路板进行接触压膜后，再经过普通压膜轴对其进行二次封压，进一步提升电路板与干膜的贴合度以及薄板电路板的压膜品质，综合而言，提升了不同厚度的电路板的压膜质量和压膜效率。In this technical solution, the ordinary thickness circuit board is laminated through the ordinary lamination mode. Specifically, the lamination axis of the thin plate is at the rising position at this time, and does not contact the circuit board to be laminated, so as to ensure the lamination quality. At the same time, the film lamination cost is reduced. In addition, the thin plate circuit board is laminated through the thin plate film lamination shaft. Specifically, the thin plate film lamination shaft is in the lowered position at this time. After contacting the circuit board to be laminated, Then it is sealed and pressed by the ordinary lamination shaft to further improve the adhesion between the circuit board and the dry film and the lamination quality of the thin circuit board. In general, the lamination quality and Lamination efficiency.
在上述技术方案中，优选地，所述厚度测量装置包括红外探测器、超声探测器、磁性位移探测器、滑差电阻位移探测器、激光探测器、视觉位移探测器中的一种或多种的任意组合。In the above technical solution, preferably, the thickness measuring device includes one or more of an infrared detector, an ultrasonic detector, a magnetic displacement detector, a slip resistance displacement detector, a laser detector, and a visual displacement detector any combination of .
在该技术方案中，通过设置厚度测量装置，并根据测量精度来确定选择红外探测器、超声探测器、磁性位移探测器、滑差电阻位移探测器、激光探测器、视觉位移探测器中的一种或多种的任意组合，更符合生产的需求，降低不必要的设备成本，进而降低了电路板的压膜成本。In this technical scheme, by setting the thickness measuring device, and according to the measurement accuracy, one of infrared detectors, ultrasonic detectors, magnetic displacement detectors, slip resistance displacement detectors, laser detectors, and visual displacement detectors is selected. Any combination of one or more types is more in line with production needs, reducing unnecessary equipment costs, and thus reducing the cost of lamination of circuit boards.
在上述技术方案中，优选地，在根据所述厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理之前，包括：接收用户设置的参考厚度值。In the above technical solution, preferably, before selecting a lamination mode according to the thickness value collected by the thickness measuring device to perform lamination processing on the circuit board, it includes: receiving a reference thickness value set by a user.
在该技术方案中，在进行压膜处理前，通过接收用户设置的参考厚度值，提供了压膜机选择压膜模式的参照标准，具体地，如用户设置了参考厚度值为0.1mm，厚度测量装置采集的厚度值大于0.1mm时，对电路板进行普通模式的压膜处理，厚度测量装置采集的厚度值小于或等于0.1mm时，对电路板进行薄板模式的压膜处理。In this technical solution, before lamination processing, by receiving the reference thickness value set by the user, a reference standard for the laminator to select the lamination mode is provided. Specifically, if the user sets the reference thickness value to 0.1mm, the thickness When the thickness value collected by the measuring device is greater than 0.1 mm, the circuit board is subjected to lamination processing in normal mode, and when the thickness value collected by the thickness measuring device is less than or equal to 0.1 mm, the circuit board is subjected to lamination processing in thin plate mode.
在上述技术方案中，优选地，根据所述厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理的具体步骤，包括：判断所述厚度值与所述参考厚度值的大小；在判定所述厚度值大于所述参考厚度值时，控制所述电路板采用普通压膜模式进行压膜处理；以及在判定所述厚度值小于或等于所述参考厚度值时，控制所述电路板采用薄板压膜模式进行压膜处理。In the above technical solution, preferably, the specific step of selecting a lamination mode to perform lamination processing on the circuit board according to the thickness value collected by the thickness measuring device includes: judging the difference between the thickness value and the reference thickness value size; when it is determined that the thickness value is greater than the reference thickness value, control the circuit board to adopt the normal lamination mode for lamination processing; and when it is determined that the thickness value is less than or equal to the reference thickness value, control the The above-mentioned circuit board adopts thin plate lamination mode to carry out lamination process.
在该技术方案中，通过判断所述厚度值与所述参考厚度值的大小，实现了压膜机对不同厚度的电路板的压膜模式的智能设定，而不必每次进行人工的设定，提高了电路板的压膜效率，同时也降低了电路板的压膜成本。In this technical solution, by judging the size of the thickness value and the reference thickness value, the intelligent setting of the film laminating mode of the circuit board with different thicknesses by the film laminating machine is realized, without manual setting every time , which improves the lamination efficiency of the circuit board and reduces the lamination cost of the circuit board.
根据本发明的另一方面，还提出了一种压膜机的控制系统，包括：控制单元，用于根据所述厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理。According to another aspect of the present invention, a control system of a film laminating machine is also proposed, including: a control unit, which is used to select a lamination mode according to the thickness value collected by the thickness measuring device to perform lamination processing on the circuit board .
在该技术方案中，通过根据厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理，实现了压膜机对不同厚度的电路板的压膜模式的智能设定，而不必每次进行人工的设定，提高了电路板的压膜效率，同时也降低了电路板的压膜成本。In this technical solution, by selecting the lamination mode according to the thickness value collected by the thickness measuring device to perform lamination processing on the circuit board, the intelligent setting of the lamination mode of the circuit board with different thicknesses by the laminator is realized, and It is not necessary to perform manual setting every time, which improves the lamination efficiency of the circuit board and reduces the lamination cost of the circuit board.
在上述技术方案中，优选地，所述压膜模式包括：普通压膜模式和薄板压膜模式，其中，普通压膜模式包括使用普通压膜轴执行至少一次普通压膜操作，以及薄板压膜模式包括使用普通压膜轴执行至少一次普通压膜操作，以及使用薄板压膜轴执行至少一次薄板压膜操作。In the above technical solution, preferably, the lamination mode includes: a common lamination mode and a thin plate lamination mode, wherein the common lamination mode includes using a common lamination shaft to perform at least one common lamination operation, and a thin plate lamination mode Modes include performing at least one normal lamination operation with a normal lamination spindle and performing at least one sheet lamination operation with a sheet lamination spindle.
在该技术方案中，通过普通压膜模式对普通厚度电路板进行压膜处理，具体地，薄板压膜轴此时处于上升位置，不与待压膜的电路板进行接触，在保证压膜质量的同时降低了压膜成本，另外，通过薄板压膜轴对薄板电路板进行压膜处理，具体地，薄板压膜轴此时处于下降位置，与待压膜的电路板进行接触压膜后，再经过普通压膜轴对其进行二次封压，进一步提升电路板与干膜的贴合度以及薄板电路板的压膜品质，综合而言，提升了不同厚度的电路板的压膜质量和压膜效率。In this technical solution, the ordinary thickness circuit board is laminated through the ordinary lamination mode. Specifically, the lamination axis of the thin plate is at the rising position at this time, and does not contact the circuit board to be laminated, so as to ensure the lamination quality. At the same time, the film lamination cost is reduced. In addition, the thin plate circuit board is laminated through the thin plate film lamination shaft. Specifically, the thin plate film lamination shaft is in the lowered position at this time. After contacting the circuit board to be laminated, Then it is sealed and pressed by the ordinary lamination shaft to further improve the adhesion between the circuit board and the dry film and the lamination quality of the thin circuit board. In general, the lamination quality and Lamination efficiency.
在上述技术方案中，优选地，所述厚度测量装置包括红外探测器、超声探测器、磁性位移探测器、滑差电阻位移探测器、激光探测器、视觉位移探测器中的一种或多种的任意组合。In the above technical solution, preferably, the thickness measuring device includes one or more of an infrared detector, an ultrasonic detector, a magnetic displacement detector, a slip resistance displacement detector, a laser detector, and a visual displacement detector any combination of .
在该技术方案中，通过设置厚度测量装置，并根据测量精度来确定选择红外探测器、超声探测器、磁性位移探测器、滑差电阻位移探测器、激光探测器、视觉位移探测器中的一种或多种的任意组合，更符合生产的需求，降低不必要的设备成本，进而降低了电路板的压膜成本。In this technical scheme, by setting the thickness measuring device, and according to the measurement accuracy, one of infrared detectors, ultrasonic detectors, magnetic displacement detectors, slip resistance displacement detectors, laser detectors, and visual displacement detectors is selected. Any combination of one or more types is more in line with production needs, reducing unnecessary equipment costs, and thus reducing the cost of lamination of circuit boards.
在上述技术方案中，优选地，还包括：接收单元，用于接收用户设置的参考厚度值。In the above technical solution, preferably, further comprising: a receiving unit, configured to receive the reference thickness value set by the user.
在该技术方案中，在该技术方案中，在进行压膜处理前，通过接收用户设置的参考厚度值，提供了压膜机选择压膜模式的参照标准，具体地，如用户设置了参考厚度值为0.1mm，厚度测量装置采集的厚度值大于0.1mm时，对电路板进行普通模式的压膜处理，厚度测量装置采集的厚度值小于或等于0.1mm时，对电路板进行薄板模式的压膜处理。In this technical solution, before carrying out the lamination process, by receiving the reference thickness value set by the user, a reference standard for the laminator to select the lamination mode is provided, specifically, if the user sets the reference thickness When the value is 0.1mm, when the thickness value collected by the thickness measuring device is greater than 0.1mm, the circuit board is laminated in the normal mode; when the thickness value collected by the thickness measuring device is less than or equal to 0.1mm, the circuit board is laminated in the thin plate mode Membrane treatment.
在上述技术方案中，优选地，还包括：判断单元，用于判断所述厚度值与所述参考厚度值的大小；所述控制单元还用于，在判定所述厚度值大于所述参考厚度值时，控制所述电路板采用普通压膜模式进行压膜处理；以及还用于在判定所述厚度值小于或等于所述参考厚度值时，控制所述电路板采用薄板压膜模式进行压膜处理。In the above technical solution, preferably, further comprising: a judging unit for judging the size of the thickness value and the reference thickness value; the control unit is also used for judging that the thickness value is greater than the reference thickness value, control the circuit board to use the normal film lamination mode for lamination processing; Membrane treatment.
在该技术方案中，在该技术方案中，通过判断所述厚度值与所述参考厚度值的大小，实现了压膜机对不同厚度的电路板的压膜模式的智能设定，而不必每次进行人工的设定，提高了电路板的压膜效率，同时也降低了电路板的压膜成本。In this technical solution, in this technical solution, by judging the size of the thickness value and the reference thickness value, the intelligent setting of the film laminating mode of the circuit board with different thicknesses by the film laminating machine is realized, without having to Manual setting is performed once, which improves the lamination efficiency of the circuit board and reduces the lamination cost of the circuit board.
根据本发明的第三方面，还提出了一种压膜机，包括：厚度测量装置，布置在所述压膜机的整列段装置的前段，用于测试待压膜电路板的厚度值；还包括如上述任一项技术方案所述的压膜机的控制系统。According to the third aspect of the present invention, a film laminating machine is also proposed, including: a thickness measuring device, arranged in the front section of the line-up device of the film laminating machine, for testing the thickness value of the circuit board to be laminated; It includes the control system of the laminating machine described in any one of the technical solutions above.
通过以上技术方案，通过在压膜机的整列段装置的前段上设置厚度测量装置，并根据厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理，实现了压膜机对不同厚度的电路板的压膜模式的智能设定，而不必每次进行人工的设定，提高了电路板的压膜效率，同时也降低了电路板的压膜成本。Through the above technical scheme, by setting a thickness measuring device on the front section of the alignment section device of the laminating machine, and selecting the lamination mode according to the thickness value collected by the thickness measuring device to perform lamination processing on the circuit board, the laminating machine is realized. The intelligent setting of lamination modes for circuit boards with different thicknesses does not need to be manually set every time, which improves the lamination efficiency of circuit boards and reduces the lamination cost of circuit boards.
附图说明Description of drawings
图1示出了根据本发明的一个实施例的压膜机的控制方法的示意流程图；Fig. 1 shows a schematic flow chart of a control method of a laminator according to an embodiment of the present invention;
图2示出了根据本发明的一个实施例的压膜机的控制系统的示意框图；Fig. 2 shows a schematic block diagram of a control system of a laminator according to an embodiment of the present invention;
图3示出了根据本发明的一个实施例的压膜机的俯视图；Figure 3 shows a top view of a film laminating machine according to an embodiment of the present invention;
图4示出了根据本发明的一个实施例的压膜机的普通压膜模式下的侧视图；Figure 4 shows a side view of a film laminating machine in a normal film lamination mode according to an embodiment of the present invention;
图5示出了根据本发明的一个实施例的压膜机的薄板压膜模式下的侧视图。Fig. 5 shows a side view of a film laminator in a sheet lamination mode according to an embodiment of the present invention.
具体实施方式detailed description
为了能够更清楚地理解本发明的上述目的、特征和优点，下面结合附图和具体实施方式对本发明进行进一步的详细描述。需要说明的是，在不冲突的情况下，本申请的实施例及实施例中的特征可以相互组合。In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.
在下面的描述中阐述了很多具体细节以便于充分理解本发明，但是，本发明还可以采用其他不同于在此描述的其他方式来实施，因此，本发明的保护范围并不受下面公开的具体实施例的限制。In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.
图1示出了根据本发明的一个实施例的压膜机的控制方法的示意流程图。Fig. 1 shows a schematic flowchart of a method for controlling a film laminator according to an embodiment of the present invention.
如图1所示，根据本发明的一个实施例的压膜机的控制方法，包括：包括：步骤102，根据厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理。As shown in FIG. 1 , the method for controlling a laminator according to an embodiment of the present invention includes: step 102 , selecting a lamination mode to perform lamination processing on the circuit board according to the thickness value collected by the thickness measuring device.
在该技术方案中，通过根据厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理，实现了压膜机对不同厚度的电路板的压膜模式的智能设定，而不必每次进行人工的设定，提高了电路板的压膜效率，同时也降低了电路板的压膜成本。In this technical solution, by selecting the lamination mode according to the thickness value collected by the thickness measuring device to perform lamination processing on the circuit board, the intelligent setting of the lamination mode of the circuit board with different thicknesses by the laminator is realized, and It is not necessary to perform manual setting every time, which improves the lamination efficiency of the circuit board and reduces the lamination cost of the circuit board.
在上述技术方案中，优选地，所述压膜模式包括：普通压膜模式和薄板压膜模式，其中，普通压膜模式包括使用普通压膜轴执行至少一次普通压膜操作，以及薄板压膜模式包括使用普通压膜轴执行至少一次普通压膜操作，以及使用薄板压膜轴执行至少一次薄板压膜操作。In the above technical solution, preferably, the lamination mode includes: a common lamination mode and a thin plate lamination mode, wherein the common lamination mode includes using a common lamination shaft to perform at least one common lamination operation, and a thin plate lamination mode Modes include performing at least one normal lamination operation with a normal lamination spindle and performing at least one sheet lamination operation with a sheet lamination spindle.
在该技术方案中，通过普通压膜模式对普通厚度电路板进行压膜处理，具体地，薄板压膜轴此时处于上升位置，不与待压膜的电路板进行接触，在保证压膜质量的同时降低了压膜成本，另外，通过薄板压膜轴对薄板电路板进行压膜处理，具体地，薄板压膜轴此时处于下降位置，与待压膜的电路板进行接触压膜后，再经过普通压膜轴对其进行二次封压，进一步提升电路板与干膜的贴合度以及薄板电路板的压膜品质，综合而言，提升了不同厚度的电路板的压膜质量和压膜效率。In this technical solution, the ordinary thickness circuit board is laminated through the ordinary lamination mode. Specifically, the lamination axis of the thin plate is at the rising position at this time, and does not contact the circuit board to be laminated, so as to ensure the lamination quality. At the same time, the film lamination cost is reduced. In addition, the thin plate circuit board is laminated through the thin plate film lamination shaft. Specifically, the thin plate film lamination shaft is in the lowered position at this time. After contacting the circuit board to be laminated, Then it is sealed and pressed by the ordinary lamination shaft to further improve the adhesion between the circuit board and the dry film and the lamination quality of the thin circuit board. In general, the lamination quality and Lamination efficiency.
在上述技术方案中，优选地，所述厚度测量装置包括红外探测器、超声探测器、磁性位移探测器、滑差电阻位移探测器、激光探测器、视觉位移探测器中的一种或多种的任意组合。In the above technical solution, preferably, the thickness measuring device includes one or more of an infrared detector, an ultrasonic detector, a magnetic displacement detector, a slip resistance displacement detector, a laser detector, and a visual displacement detector any combination of .
在该技术方案中，通过设置厚度测量装置，并根据测量精度来确定选择红外探测器、超声探测器、磁性位移探测器、滑差电阻位移探测器、激光探测器、视觉位移探测器中的一种或多种的任意组合，更符合生产的需求，降低不必要的设备成本，进而降低了电路板的压膜成本。In this technical scheme, by setting the thickness measuring device, and according to the measurement accuracy, one of infrared detectors, ultrasonic detectors, magnetic displacement detectors, slip resistance displacement detectors, laser detectors, and visual displacement detectors is selected. Any combination of one or more types is more in line with production needs, reducing unnecessary equipment costs, and thus reducing the cost of lamination of circuit boards.
在上述技术方案中，优选地，在根据所述厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理之前，包括：接收用户设置的参考厚度值。In the above technical solution, preferably, before selecting a lamination mode according to the thickness value collected by the thickness measuring device to perform lamination processing on the circuit board, it includes: receiving a reference thickness value set by a user.
在该技术方案中，在进行压膜处理前，通过接收用户设置的参考厚度值，提供了压膜机选择压膜模式的参照标准，具体地，如用户设置了参考厚度值为0.1mm，厚度测量装置采集的厚度值大于0.1mm时，对电路板进行普通模式的压膜处理，厚度测量装置采集的厚度值小于或等于0.1mm时，对电路板进行薄板模式的压膜处理。In this technical solution, before lamination processing, by receiving the reference thickness value set by the user, a reference standard for the laminator to select the lamination mode is provided. Specifically, if the user sets the reference thickness value to 0.1mm, the thickness When the thickness value collected by the measuring device is greater than 0.1 mm, the circuit board is subjected to lamination processing in normal mode, and when the thickness value collected by the thickness measuring device is less than or equal to 0.1 mm, the circuit board is subjected to lamination processing in thin plate mode.
在上述技术方案中，优选地，根据所述厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理的具体步骤，包括：判断所述厚度值与所述参考厚度值的大小；在判定所述厚度值大于所述参考厚度值时，控制所述电路板采用普通压膜模式进行压膜处理；以及在判定所述厚度值小于或等于所述参考厚度值时，控制所述电路板采用薄板压膜模式进行压膜处理。In the above technical solution, preferably, the specific step of selecting a lamination mode to perform lamination processing on the circuit board according to the thickness value collected by the thickness measuring device includes: judging the difference between the thickness value and the reference thickness value size; when it is determined that the thickness value is greater than the reference thickness value, control the circuit board to adopt the normal lamination mode for lamination processing; and when it is determined that the thickness value is less than or equal to the reference thickness value, control the The above-mentioned circuit board adopts thin plate lamination mode to carry out lamination process.
在该技术方案中，通过判断所述厚度值与所述参考厚度值的大小，实现了压膜机对不同厚度的电路板的压膜模式的智能设定，而不必每次进行人工的设定，提高了电路板的压膜效率，同时也降低了电路板的压膜成本。In this technical solution, by judging the size of the thickness value and the reference thickness value, the intelligent setting of the film laminating mode of the circuit board with different thicknesses by the film laminating machine is realized, without manual setting every time , which improves the lamination efficiency of the circuit board and reduces the lamination cost of the circuit board.
图2示出了根据本发明的一个实施例的压膜机的控制系统的示意框图。Fig. 2 shows a schematic block diagram of a control system of a film laminator according to an embodiment of the present invention.
如图2所示，根据本发明的一个实施例的压膜机的控制系统200，包括：控制单元202，用于根据所述厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理。As shown in Fig. 2, the control system 200 of the film laminating machine according to an embodiment of the present invention includes: a control unit 202, which is used to select a film laminating mode according to the thickness value collected by the thickness measuring device to carry out the process on the circuit board. Lamination treatment.
在该技术方案中，通过根据厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理，实现了压膜机对不同厚度的电路板的压膜模式的智能设定，而不必每次进行人工的设定，提高了电路板的压膜效率，同时也降低了电路板的压膜成本。In this technical solution, by selecting the lamination mode according to the thickness value collected by the thickness measuring device to perform lamination processing on the circuit board, the intelligent setting of the lamination mode of the circuit board with different thicknesses by the laminator is realized, and It is not necessary to perform manual setting every time, which improves the lamination efficiency of the circuit board and reduces the lamination cost of the circuit board.
在上述技术方案中，优选地，所述压膜模式包括：普通压膜模式和薄板压膜模式，其中，普通压膜模式包括使用普通压膜轴执行至少一次普通压膜操作，以及薄板压膜模式包括使用普通压膜轴执行至少一次普通压膜操作，以及使用薄板压膜轴执行至少一次薄板压膜操作。In the above technical solution, preferably, the lamination mode includes: a common lamination mode and a thin plate lamination mode, wherein the common lamination mode includes using a common lamination shaft to perform at least one common lamination operation, and a thin plate lamination mode Modes include performing at least one normal lamination operation with a normal lamination spindle and performing at least one sheet lamination operation with a sheet lamination spindle.
在该技术方案中，通过普通压膜模式对普通厚度电路板进行压膜处理，具体地，薄膜压膜轴此时处于上升位置，不与待压膜的电路板进行接触，在保证压膜质量的同时降低了压膜成本，另外，通过薄板压膜轴对薄板电路板进行压膜处理，具体地，薄板压膜轴此时处于下降位置，与待压膜的电路板进行接触压膜后，再经过普通压膜轴对其进行二次封压，进一步提升电路板与干膜的贴合度以及薄板电路板的压膜品质，综合而言，提升了不同厚度的电路板的压膜质量和压膜效率。In this technical solution, the ordinary thickness circuit board is laminated through the ordinary lamination mode. Specifically, the film lamination axis is in the rising position at this time, and does not contact the circuit board to be laminated, so as to ensure the lamination quality. At the same time, the film lamination cost is reduced. In addition, the thin plate circuit board is laminated through the thin plate film lamination shaft. Specifically, the thin plate film lamination shaft is in the lowered position at this time. After contacting the circuit board to be laminated, Then it is sealed and pressed by the ordinary lamination shaft to further improve the adhesion between the circuit board and the dry film and the lamination quality of the thin circuit board. In general, the lamination quality and Lamination efficiency.
在上述技术方案中，优选地，所述厚度测量装置包括红外探测器、超声探测器、磁性位移探测器、滑差电阻位移探测器、激光探测器、视觉位移探测器中的一种或多种的任意组合。In the above technical solution, preferably, the thickness measuring device includes one or more of an infrared detector, an ultrasonic detector, a magnetic displacement detector, a slip resistance displacement detector, a laser detector, and a visual displacement detector any combination of .
在该技术方案中，通过设置厚度测量装置，并根据测量精度来确定选择红外探测器、超声探测器、磁性位移探测器、滑差电阻位移探测器、激光探测器、视觉位移探测器中的一种或多种的任意组合，更符合生产的需求，降低不必要的设备成本，进而降低了电路板的压膜成本。In this technical scheme, by setting the thickness measuring device, and according to the measurement accuracy, one of infrared detectors, ultrasonic detectors, magnetic displacement detectors, slip resistance displacement detectors, laser detectors, and visual displacement detectors is selected. Any combination of one or more types is more in line with production needs, reducing unnecessary equipment costs, and thus reducing the cost of lamination of circuit boards.
在上述技术方案中，优选地，还包括：接收单元204，用于接收用户设置的参考厚度值。In the above technical solution, preferably, further comprising: a receiving unit 204, configured to receive a reference thickness value set by a user.
在该技术方案中，在该技术方案中，在进行压膜处理前，通过接收用户设置的参考厚度值，提供了压膜机选择压膜模式的参照标准，具体地，如用户设置了参考厚度值为0.1mm，厚度测量装置采集的厚度值大于0.1mm时，对电路板进行普通模式的压膜处理，厚度测量装置采集的厚度值小于或等于0.1mm时，对电路板进行薄板模式的压膜处理。In this technical solution, before carrying out the lamination process, by receiving the reference thickness value set by the user, a reference standard for the laminator to select the lamination mode is provided, specifically, if the user sets the reference thickness When the value is 0.1mm, when the thickness value collected by the thickness measuring device is greater than 0.1mm, the circuit board is laminated in the normal mode; when the thickness value collected by the thickness measuring device is less than or equal to 0.1mm, the circuit board is laminated in the thin plate mode Membrane treatment.
在上述技术方案中，优选地，还包括：判断单元206，用于判断所述厚度值与所述参考厚度值的大小；所述控制单元202还用于，在判定所述厚度值大于所述参考厚度值时，控制所述电路板采用普通压膜模式进行压膜处理；以及还用于在判定所述厚度值小于或等于所述参考厚度值时，控制所述电路板采用薄板压膜模式进行压膜处理。In the above technical solution, preferably, further comprising: a judging unit 206 for judging the size of the thickness value and the reference thickness value; the control unit 202 is also used for judging that the thickness value is greater than the When the reference thickness value is used, the circuit board is controlled to adopt a normal lamination mode for lamination processing; and it is also used to control the circuit board to adopt a thin plate lamination mode when it is determined that the thickness value is less than or equal to the reference thickness value Carry out lamination treatment.
在该技术方案中，在该技术方案中，通过判断所述厚度值与所述参考厚度值的大小，实现了压膜机对不同厚度的电路板的压膜模式的智能设定，而不必每次进行人工的设定，提高了电路板的压膜效率，同时也降低了电路板的压膜成本。In this technical solution, in this technical solution, by judging the size of the thickness value and the reference thickness value, the intelligent setting of the film laminating mode of the circuit board with different thicknesses by the film laminating machine is realized, without having to Manual setting is performed once, which improves the lamination efficiency of the circuit board and reduces the lamination cost of the circuit board.
下面结合图3图至图5，对根据本发明实施例的压膜机的结构及其控制方法进行具体说明。The structure and control method of the film laminator according to the embodiment of the present invention will be specifically described below with reference to FIG. 3 to FIG. 5 .
如图3所示，压膜机框体31用于固定压膜机的位置，待压膜的电路板经过传动滚轮38传送至板厚测量装置37，上述板厚测量装置37设置于整列装置36的前段，在此处完成待压膜的电路板的微蚀和表面清洁处理，并进一步进行粘尘处理以去除版面残留物，完成整列处理的待压膜的电路板被传送至预热装置35，实现压膜前预热，根据板厚测量装置37采集的电路板的厚度值选择普通压膜模式或薄板压膜模式，其中，普通压膜模式通过普通压膜轴32实施压膜过程，薄板压膜模式通过普通压膜轴32和薄板压膜轴33共同实施压膜过程，进一步提升电路板与干膜的贴合度以及薄板电路板的压膜品质。As shown in Figure 3, the laminator frame 31 is used to fix the position of the laminator, and the circuit board to be laminated is sent to the plate thickness measuring device 37 through the transmission roller 38, and the above plate thickness measuring device 37 is arranged on the alignment device 36 In the front section, the micro-etching and surface cleaning treatment of the circuit board to be laminated is completed here, and the dust sticking treatment is further carried out to remove the residue on the layout, and the circuit board to be laminated that has been processed in a row is sent to the preheating device 35 , to realize preheating before lamination, and select the common lamination mode or the thin plate lamination mode according to the thickness value of the circuit board collected by the board thickness measuring device 37, wherein, the common lamination mode implements the lamination process through the common lamination shaft 32, and the thin plate In the lamination mode, the common lamination shaft 32 and the sheet lamination shaft 33 jointly implement the lamination process, further improving the adhesion between the circuit board and the dry film and the lamination quality of the thin circuit board.
如图4所示，在压膜机的普通压膜模式下，压膜机框体41用于固定压膜机的位置，待压膜的电路板经过传动滚轮48传送至板厚测量装置47，上述板厚测量装置47设置于整列装置46的前段，在此处完成待压膜的电路板的微蚀和表面清洁处理，并进一步进行粘尘处理以去除版面残留物，完成整列处理的待压膜的电路板被传送至预热装置45，实现压膜前预热，根据板厚测量装置47采集的电路板的厚度值选择普通压膜模式或薄板压膜模式，其中，普通压膜模式通过普通压膜轴42实施压膜过程，薄板压膜模式通过普通压膜轴42和薄板压膜轴43共同实施压膜过程，如用户在进行压膜处理前，设置参考厚度为0.1mm，则当板厚测量值大于参考厚度值0.1mm时，厚判定程序判定生产板为普通电路板，压膜机控制系统自动采用普通压膜模式，薄板压膜轴43处于上升位置，脱离工作界面，由普通压膜轴42执行压膜处理，上述的普通压膜轴42在执行压膜处理前，已经预热处理至压膜的预设温度。As shown in FIG. 4 , under the normal film lamination mode of the film laminator, the film laminator frame 41 is used to fix the position of the film laminator, and the circuit board to be laminated is sent to the plate thickness measuring device 47 through the transmission roller 48, The above-mentioned board thickness measuring device 47 is arranged in the front section of the alignment device 46, where the micro-etching and surface cleaning treatment of the circuit board to be laminated is completed, and the sticky dust treatment is further carried out to remove the layout residue, and the alignment processing is completed. The circuit board of the film is sent to the preheating device 45 to realize preheating before lamination, and the normal lamination mode or thin plate lamination mode is selected according to the thickness value of the circuit board collected by the plate thickness measuring device 47, wherein the common lamination mode passes The ordinary lamination shaft 42 implements the lamination process, and the thin-plate lamination mode implements the lamination process through the common lamination shaft 42 and the thin-plate lamination shaft 43. If the user sets the reference thickness to 0.1mm before performing the lamination process, then when When the board thickness measurement value is greater than the reference thickness value of 0.1mm, the thickness judgment program determines that the production board is a common circuit board, and the control system of the laminating machine automatically adopts the normal lamination mode. The lamination shaft 42 performs the lamination process, and the above-mentioned common lamination shaft 42 has been preheated to a preset temperature for lamination before performing the lamination process.
如图5所示，在压膜机的薄板压膜模式下，压膜机框体51用于固定压膜机的位置，待压膜的电路板经过传动滚轮58传送至板厚测量装置57，上述板厚测量装置57设置于整列装置56的前段，在此处完成待压膜的电路板的微蚀和表面清洁处理，并进一步进行粘尘处理以去除版面残留物，完成整列处理的待压膜的电路板被传送至预热装置55，实现压膜前预热，根据板厚测量装置57采集的电路板的厚度值选择普通压膜模式或薄板压膜模式，其中，普通压膜模式通过普通压膜轴52实施压膜过程，薄板压膜模式通过普通压膜轴52和薄板压膜轴53共同实施压膜过程，如用户在进行压膜处理前，设置参考厚度为0.1mm，则当板厚测量值大于参考厚度值0.1mm时，厚判定程序判定生产板为普通电路板，压膜机控制系统自动采用薄板压膜模式，薄板压膜轴53处于下降位置，与普通压膜轴52共同执行压膜处理，进一步提升电路板与干膜的贴合度以及薄板电路板的压膜品质，上述的薄板压膜轴53和普通压膜轴52在执行压膜处理前，已经预热处理至压膜的预设温度。As shown in FIG. 5 , in the sheet lamination mode of the laminator, the laminator frame 51 is used to fix the position of the laminator, and the circuit board to be laminated is sent to the plate thickness measuring device 57 through the transmission roller 58 , The above board thickness measuring device 57 is arranged at the front section of the alignment device 56, where the micro-etching and surface cleaning treatment of the circuit board to be laminated is completed, and further dust sticking treatment is performed to remove the residue on the layout, and the alignment processing is completed. The circuit board of the film is sent to the preheating device 55 to realize preheating before lamination, and the normal lamination mode or thin plate lamination mode is selected according to the thickness value of the circuit board collected by the plate thickness measuring device 57, wherein the common lamination mode is passed The ordinary lamination shaft 52 implements the lamination process, and the thin-plate lamination mode implements the lamination process through the common lamination shaft 52 and the thin-plate lamination shaft 53. If the user sets the reference thickness to 0.1mm before performing the lamination process, then when When the board thickness measurement value is greater than the reference thickness value of 0.1mm, the thickness determination program determines that the production board is an ordinary circuit board, and the laminating machine control system automatically adopts the thin plate lamination mode, and the thin plate lamination shaft 53 is in the downward position, which is different from the ordinary lamination shaft 52. Carry out lamination processing together to further improve the adhesion between the circuit board and the dry film and the lamination quality of the thin board circuit board. The above-mentioned thin board lamination shaft 53 and ordinary lamination shaft 52 have been preheated before performing the lamination process. to the preset temperature of the lamination.
以上结合附图详细说明了本发明的技术方案，考虑到如何实现压膜机根据电路板厚度而设置相应的压膜模式进而对不同厚度的电路板进行智能压膜加工的技术问题。因此，本发明提出了一种新的压膜机的控制方案，通过在压膜机的整列段装置的前段上设置厚度测量装置，并根据厚度测量装置采集的厚度值选择压膜模式对所述电路板进行压膜处理，实现了压膜机对不同厚度的电路板的压膜模式的智能设定，而不必每次进行人工的设定，提高了电路板的压膜效率，同时也降低了电路板的压膜成本。The technical solution of the present invention has been described in detail above in conjunction with the accompanying drawings, considering the technical problem of how to realize the lamination machine to set the corresponding lamination mode according to the thickness of the circuit board and then perform intelligent lamination processing for circuit boards with different thicknesses. Therefore, the present invention proposes a new control scheme of a film laminating machine, by setting a thickness measuring device on the front section of the line-up section device of the film laminating machine, and selecting a film lamination mode according to the thickness value collected by the thickness measuring device. The lamination process of the circuit board realizes the intelligent setting of the film lamination mode of the circuit board with different thickness by the laminator, without manual setting every time, which improves the film lamination efficiency of the circuit board and reduces the Lamination cost of circuit boards.
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.
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