CN105722321B - The control method of film laminator, the control system of film laminator and film laminator - Google Patents
The control method of film laminator, the control system of film laminator and film laminator Download PDFInfo
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- CN105722321B CN105722321B CN201410727912.9A CN201410727912A CN105722321B CN 105722321 B CN105722321 B CN 105722321B CN 201410727912 A CN201410727912 A CN 201410727912A CN 105722321 B CN105722321 B CN 105722321B
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Abstract
The present invention provides a kind of control method of film laminator, a kind of control system of film laminator and a kind of film laminators, wherein the control method of film laminator, comprising: carries out press mold processing to the circuit board according to the thickness value selection press mold mode of measurer for thickness acquisition.According to the technical solution of the present invention, the circuit board for treating press mold carries out the press mold processing of intelligence, and avoids the case where sorting before press mold to circuit board, improves the press mold efficiency of circuit board, while also reducing the press mold cost of circuit board.
Description
Technical field
The present invention relates to film laminator technical fields, control method, a kind of film laminator in particular to a kind of film laminator
Control system and a kind of film laminator
Background technique
Currently, printed circuit board technology is also rapidly developed with the covering application of electronic product and the communication technology,
Main development course are as follows: traditional multilayer circuit board, high density interconnecting circuit board (HDI, High Density
Interconnector), random layer interconnects (ELIC, Every Layer interconnection) HDI plate, printed circuit board
Development trend just gradually develop to lighter, thinner, smaller direction.In current board application, thin plate circuit board
Development has become the market mainstream, so the craft precision of thin plate circuit board has become industry technology mark post.In circuit board figure line
In the manufacturing process of road, the production of inside and outside layer pattern route need to be carried out, wherein what is be affected to the precision of thin plate circuit board is thin
Plate press mold technique, specifically, press mold mainly carry out at preheating circuit board and dry film using the encapsulated rolling rumble high temperature of film laminator
Reason makes circuit board surface temperature reach press mold production temperature, and dry film is influenced after attaching circuit board surface by high temperature, and sufficiently release is dry
Membrane fluidity and stickiness, make dry film preferably play surface fitting and sealing of hole ability, carry out attachment and sealing of hole to circuit board.By
In thin plate copper-clad base plate thickness probably in 0.10mm, even up to 0.05mm, before the production of figure route, if using common
Press mold axis carries out press mold to thin plate circuit board, and it is impacted to will lead to copper-clad base plate planarization, needs using sheet panel top press mold axis pair
Thin plate circuit board carries out additional press mold processing to guarantee its precision and quality, and the circuit board of general thickness does not need thin plate press mold
Axis carries out press mold processing to it, can meet circuit board precision and quality requirement, this requires press mold worker every time it is right
Different press mold modes is set according to its thickness before circuit board film pressing to handle it, causes the life of circuit board film pressing process
Producing efficiency reduces.
Therefore, how to realize that film laminator corresponding press mold mode is arranged according to circuit plate thickness and then to different-thickness
Circuit board carries out intelligent press mold and is processed into technical problem urgently to be resolved.
Summary of the invention
The present invention is based at least one above-mentioned technical problem, proposes a kind of control program of new film laminator, leads to
The thickness value crossed on the leading portion of the permutation section apparatus of film laminator and measurer for thickness is set, and acquired according to measurer for thickness
It selects press mold mode to carry out press mold processing to the circuit board, realizes film laminator to the press mold mode of the circuit board of different-thickness
Intelligence setting, without carrying out artificial setting every time, improve the press mold efficiency of circuit board, while also reducing circuit board
Press mold cost.
In view of this, the invention proposes a kind of control methods of film laminator, comprising: according to measurer for thickness acquisition
Thickness value selects press mold mode to carry out press mold processing to the circuit board.
In the technical scheme, select press mold mode to the circuit by the thickness value acquired according to measurer for thickness
Plate carries out press mold processing, realizes film laminator and sets to the intelligence of the press mold mode of the circuit board of different-thickness, without each
Artificial setting is carried out, the press mold efficiency of circuit board is improved, while also reducing the press mold cost of circuit board.
In the above-mentioned technical solutions, it is preferable that the press mold mode includes: common press mold mode and thin plate press mold mode,
Wherein, common press mold mode includes that common press mold operation and thin plate press mold mode at least once are executed using common press mold axis
Thin plate at least once is executed including using common press mold axis to execute common press mold operation at least once, and using thin plate press mold axis
Press mold operation.
In the technical scheme, press mold processing is carried out to general thickness circuit board by common press mold mode, it is specifically, thin
Plate press mold axis is now in lifting position, is not contacted with the circuit board to press mold, reduces while guaranteeing press mold quality
Press mold cost, in addition, carrying out press mold processing to thin plate circuit board by thin plate press mold axis, specifically, thin plate press mold axis is at this time
Secondary envelope pressure is carried out to it using common press mold axis with after the circuit board of press mold carries out contact press mold in down position,
It further promotes circuit board and the compactness of dry film and the press mold quality of thin plate circuit board improves different thickness in terms of comprehensive
The press mold quality and press mold efficiency of the circuit board of degree.
In the above-mentioned technical solutions, it is preferable that the measurer for thickness includes infrared detector, ultrasonic detector, magnetic
One of property displacement detector, slippage resistive displacement detector, laser detector, vision displacement detector are a variety of any
Combination.
In the technical scheme, by the way that measurer for thickness is arranged, and selection infrared acquisition is determined according to measurement accuracy
Device, ultrasonic detector, magnetic displacement detector, slippage resistive displacement detector, laser detector, in vision displacement detector
One or more any combination more meets the demand of production, reduces unnecessary equipment cost, thereby reduces circuit board
Press mold cost.
In the above-mentioned technical solutions, it is preferable that select press mold mould in the thickness value acquired according to the measurer for thickness
Formula carries out the circuit board before press mold processing, comprising: receives the reference thickness value of user setting.
In the technical scheme, before carrying out press mold processing, by receiving the reference thickness value of user setting, pressure is provided
Film machine selects the reference standard of press mold mode, specifically, if user setting reference thickness value is 0.1mm, measurer for thickness
When the thickness value of acquisition is greater than 0.1mm, the press mold for carrying out general mode to circuit board is handled, the thickness of measurer for thickness acquisition
When value is less than or equal to 0.1mm, the press mold for carrying out thin plate mode to circuit board is handled.
In the above-mentioned technical solutions, it is preferable that press mold mode is selected according to the thickness value of measurer for thickness acquisition
The specific steps of press mold processing are carried out to the circuit board, comprising: judge the size of the thickness value Yu the reference thickness value；
When determining that the thickness value is greater than the reference thickness value, controls the circuit board and carried out at press mold using common press mold mode
Reason；And when determining that the thickness value is less than or equal to the reference thickness value, the circuit board is controlled using thin plate press mold
Mode carries out press mold processing.
In the technical scheme, by judging the size of the thickness value Yu the reference thickness value, film laminator is realized
Intelligence setting to the press mold mode of the circuit board of different-thickness, without carrying out artificial setting every time, improves circuit board
Press mold efficiency, while also reducing the press mold cost of circuit board.
According to another aspect of the present invention, it is also proposed that a kind of control system of film laminator, comprising: control unit is used for
Press mold processing is carried out to the circuit board according to the thickness value selection press mold mode of measurer for thickness acquisition.
In the technical scheme, select press mold mode to the circuit by the thickness value acquired according to measurer for thickness
Plate carries out press mold processing, realizes film laminator and sets to the intelligence of the press mold mode of the circuit board of different-thickness, without each
Artificial setting is carried out, the press mold efficiency of circuit board is improved, while also reducing the press mold cost of circuit board.
In the above-mentioned technical solutions, it is preferable that the press mold mode includes: common press mold mode and thin plate press mold mode,
Wherein, common press mold mode includes that common press mold operation and thin plate press mold mode at least once are executed using common press mold axis
Thin plate at least once is executed including using common press mold axis to execute common press mold operation at least once, and using thin plate press mold axis
Press mold operation.
In the technical scheme, press mold processing is carried out to general thickness circuit board by common press mold mode, it is specifically, thin
Plate press mold axis is now in lifting position, is not contacted with the circuit board to press mold, reduces while guaranteeing press mold quality
Press mold cost, in addition, carrying out press mold processing to thin plate circuit board by thin plate press mold axis, specifically, thin plate press mold axis is at this time
Secondary envelope pressure is carried out to it using common press mold axis with after the circuit board of press mold carries out contact press mold in down position,
It further promotes circuit board and the compactness of dry film and the press mold quality of thin plate circuit board improves different thickness in terms of comprehensive
The press mold quality and press mold efficiency of the circuit board of degree.
In the above-mentioned technical solutions, it is preferable that the measurer for thickness includes infrared detector, ultrasonic detector, magnetic
One of property displacement detector, slippage resistive displacement detector, laser detector, vision displacement detector are a variety of any
Combination.
In the technical scheme, by the way that measurer for thickness is arranged, and selection infrared acquisition is determined according to measurement accuracy
Device, ultrasonic detector, magnetic displacement detector, slippage resistive displacement detector, laser detector, in vision displacement detector
One or more any combination more meets the demand of production, reduces unnecessary equipment cost, thereby reduces circuit board
Press mold cost.
In the above-mentioned technical solutions, it is preferable that further include: receiving unit, for receiving the reference thickness value of user setting.
In the technical scheme, in the technical scheme, before carrying out press mold processing, by the reference for receiving user setting
Thickness value provides the reference standard of film laminator selection press mold mode, specifically, as user setting reference thickness value is
When the thickness value of 0.1mm, measurer for thickness acquisition are greater than 0.1mm, the press mold for carrying out general mode to circuit board is handled, thickness
When the thickness value of measuring device acquisition is less than or equal to 0.1mm, the press mold for carrying out thin plate mode to circuit board is handled.
In the above-mentioned technical solutions, it is preferable that further include: judging unit, for judging the thickness value and the reference
The size of thickness value；Described control unit is also used to, when determining that the thickness value is greater than the reference thickness value, described in control
Circuit board carries out press mold processing using common press mold mode；And it is also used to determining the thickness value less than or equal to the ginseng
When examining thickness value, the circuit board is controlled using thin plate press mold mode and carries out press mold processing.
In the technical scheme, in the technical scheme, by judging the big of the thickness value and the reference thickness value
It is small, it realizes film laminator and the intelligence of the press mold mode of the circuit board of different-thickness is set, without carrying out artificial set every time
It is fixed, the press mold efficiency of circuit board is improved, while also reducing the press mold cost of circuit board.
According to the third aspect of the invention we, it is also proposed that a kind of film laminator, comprising: measurer for thickness is arranged in described
The leading portion of the permutation section apparatus of film laminator, for testing the thickness value to press mold circuit board；It further include such as any of the above-described technology
The control system of film laminator described in scheme.
By above technical scheme, by the way that measurer for thickness is arranged on the leading portion of the permutation section apparatus of film laminator, and
Press mold processing is carried out to the circuit board according to the thickness value selection press mold mode of measurer for thickness acquisition, realizes film laminator
Intelligence setting to the press mold mode of the circuit board of different-thickness, without carrying out artificial setting every time, improves circuit board
Press mold efficiency, while also reducing the press mold cost of circuit board.
Detailed description of the invention
Fig. 1 shows the schematic flow diagram of the control method of film laminator according to an embodiment of the invention；
Fig. 2 shows the schematic block diagrams of the control system of film laminator according to an embodiment of the invention；
Fig. 3 shows the top view of film laminator according to an embodiment of the invention；
Fig. 4 shows the side view under the common press mold mode of film laminator according to an embodiment of the invention；
Fig. 5 shows the side view under the thin plate press mold mode of film laminator according to an embodiment of the invention.
Specific embodiment
To better understand the objects, features and advantages of the present invention, with reference to the accompanying drawing and specific real
Applying mode, the present invention is further described in detail.It should be noted that in the absence of conflict, the implementation of the application
Feature in example and embodiment can be combined with each other.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, still, the present invention may be used also
To be implemented using other than the one described here other modes, therefore, protection scope of the present invention is not by described below
Specific embodiment limitation.
Fig. 1 shows the schematic flow diagram of the control method of film laminator according to an embodiment of the invention.
As shown in Figure 1, the control method of film laminator according to an embodiment of the invention, comprising: it include: step 102,
Press mold processing is carried out to the circuit board according to the thickness value selection press mold mode of measurer for thickness acquisition.
In the technical scheme, select press mold mode to the circuit by the thickness value acquired according to measurer for thickness
Plate carries out press mold processing, realizes film laminator and sets to the intelligence of the press mold mode of the circuit board of different-thickness, without each
Artificial setting is carried out, the press mold efficiency of circuit board is improved, while also reducing the press mold cost of circuit board.
In the above-mentioned technical solutions, it is preferable that the press mold mode includes: common press mold mode and thin plate press mold mode,
Wherein, common press mold mode includes that common press mold operation and thin plate press mold mode at least once are executed using common press mold axis
Thin plate at least once is executed including using common press mold axis to execute common press mold operation at least once, and using thin plate press mold axis
Press mold operation.
In the technical scheme, press mold processing is carried out to general thickness circuit board by common press mold mode, it is specifically, thin
Plate press mold axis is now in lifting position, is not contacted with the circuit board to press mold, reduces while guaranteeing press mold quality
Press mold cost, in addition, carrying out press mold processing to thin plate circuit board by thin plate press mold axis, specifically, thin plate press mold axis is at this time
Secondary envelope pressure is carried out to it using common press mold axis with after the circuit board of press mold carries out contact press mold in down position,
It further promotes circuit board and the compactness of dry film and the press mold quality of thin plate circuit board improves different thickness in terms of comprehensive
The press mold quality and press mold efficiency of the circuit board of degree.
In the above-mentioned technical solutions, it is preferable that the measurer for thickness includes infrared detector, ultrasonic detector, magnetic
One of property displacement detector, slippage resistive displacement detector, laser detector, vision displacement detector are a variety of any
Combination.
In the technical scheme, by the way that measurer for thickness is arranged, and selection infrared acquisition is determined according to measurement accuracy
Device, ultrasonic detector, magnetic displacement detector, slippage resistive displacement detector, laser detector, in vision displacement detector
One or more any combination more meets the demand of production, reduces unnecessary equipment cost, thereby reduces circuit board
Press mold cost.
In the above-mentioned technical solutions, it is preferable that select press mold mould in the thickness value acquired according to the measurer for thickness
Formula carries out the circuit board before press mold processing, comprising: receives the reference thickness value of user setting.
In the technical scheme, before carrying out press mold processing, by receiving the reference thickness value of user setting, pressure is provided
Film machine selects the reference standard of press mold mode, specifically, if user setting reference thickness value is 0.1mm, measurer for thickness
When the thickness value of acquisition is greater than 0.1mm, the press mold for carrying out general mode to circuit board is handled, the thickness of measurer for thickness acquisition
When value is less than or equal to 0.1mm, the press mold for carrying out thin plate mode to circuit board is handled.
In the above-mentioned technical solutions, it is preferable that press mold mode is selected according to the thickness value of measurer for thickness acquisition
The specific steps of press mold processing are carried out to the circuit board, comprising: judge the size of the thickness value Yu the reference thickness value；
When determining that the thickness value is greater than the reference thickness value, controls the circuit board and carried out at press mold using common press mold mode
Reason；And when determining that the thickness value is less than or equal to the reference thickness value, the circuit board is controlled using thin plate press mold
Mode carries out press mold processing.
In the technical scheme, by judging the size of the thickness value Yu the reference thickness value, film laminator is realized
Intelligence setting to the press mold mode of the circuit board of different-thickness, without carrying out artificial setting every time, improves circuit board
Press mold efficiency, while also reducing the press mold cost of circuit board.
Fig. 2 shows the schematic block diagrams of the control system of film laminator according to an embodiment of the invention.
As shown in Fig. 2, the control system 200 of film laminator according to an embodiment of the invention, comprising: control unit
202, the thickness value selection press mold mode for being acquired according to the measurer for thickness carries out press mold processing to the circuit board.
In the technical scheme, select press mold mode to the circuit by the thickness value acquired according to measurer for thickness
Plate carries out press mold processing, realizes film laminator and sets to the intelligence of the press mold mode of the circuit board of different-thickness, without each
Artificial setting is carried out, the press mold efficiency of circuit board is improved, while also reducing the press mold cost of circuit board.
In the above-mentioned technical solutions, it is preferable that the press mold mode includes: common press mold mode and thin plate press mold mode,
Wherein, common press mold mode includes that common press mold operation and thin plate press mold mode at least once are executed using common press mold axis
Thin plate at least once is executed including using common press mold axis to execute common press mold operation at least once, and using thin plate press mold axis
Press mold operation.
In the technical scheme, press mold processing is carried out to general thickness circuit board by common press mold mode, it is specifically, thin
Membrane pressure film axis is now in lifting position, is not contacted with the circuit board to press mold, reduces while guaranteeing press mold quality
Press mold cost, in addition, carrying out press mold processing to thin plate circuit board by thin plate press mold axis, specifically, thin plate press mold axis is at this time
Secondary envelope pressure is carried out to it using common press mold axis with after the circuit board of press mold carries out contact press mold in down position,
It further promotes circuit board and the compactness of dry film and the press mold quality of thin plate circuit board improves different thickness in terms of comprehensive
The press mold quality and press mold efficiency of the circuit board of degree.
In the above-mentioned technical solutions, it is preferable that the measurer for thickness includes infrared detector, ultrasonic detector, magnetic
One of property displacement detector, slippage resistive displacement detector, laser detector, vision displacement detector are a variety of any
Combination.
In the technical scheme, by the way that measurer for thickness is arranged, and selection infrared acquisition is determined according to measurement accuracy
Device, ultrasonic detector, magnetic displacement detector, slippage resistive displacement detector, laser detector, in vision displacement detector
One or more any combination more meets the demand of production, reduces unnecessary equipment cost, thereby reduces circuit board
Press mold cost.
In the above-mentioned technical solutions, it is preferable that further include: receiving unit 204, for receiving the reference thickness of user setting
Value.
In the technical scheme, in the technical scheme, before carrying out press mold processing, by the reference for receiving user setting
Thickness value provides the reference standard of film laminator selection press mold mode, specifically, as user setting reference thickness value is
When the thickness value of 0.1mm, measurer for thickness acquisition are greater than 0.1mm, the press mold for carrying out general mode to circuit board is handled, thickness
When the thickness value of measuring device acquisition is less than or equal to 0.1mm, the press mold for carrying out thin plate mode to circuit board is handled.
In the above-mentioned technical solutions, it is preferable that further include: judging unit 206, for judging the thickness value and the ginseng
Examine the size of thickness value；Described control unit 202 is also used to, when determining that the thickness value is greater than the reference thickness value, control
It makes the circuit board and press mold processing is carried out using common press mold mode；And it is also used to be less than or equal in the judgement thickness value
When the reference thickness value, the circuit board is controlled using thin plate press mold mode and carries out press mold processing.
In the technical scheme, in the technical scheme, by judging the big of the thickness value and the reference thickness value
It is small, it realizes film laminator and the intelligence of the press mold mode of the circuit board of different-thickness is set, without carrying out artificial set every time
It is fixed, the press mold efficiency of circuit board is improved, while also reducing the press mold cost of circuit board.
Below with reference to Fig. 3 figure to Fig. 5, have to the structure and its control method of film laminator according to an embodiment of the present invention
Body explanation.
As shown in figure 3, film laminator framework 31 is used to fix the position of film laminator, the circuit board to press mold passes through live roller
38 are sent to plate thickness measuring device 37, and above-mentioned plate thickness measuring device 37 is set to the leading portion of arranging-in-row device 36, complete here to
The microetch and surface cleaning of the circuit board of press mold are handled, and the processing of further progress binding dust is completed whole with removing space of a whole page residue
The circuit board to press mold of column processing is transferred into preheating device 35, preheats before realizing press mold, is adopted according to plate thickness measuring device 37
The thickness value of the circuit board of collection selects common press mold mode or thin plate press mold mode, wherein common press mold mode is by commonly pressing
Film axis 32 implements press mold process, and thin plate press mold mode passes through 33 common implementing press mold mistake of common press mold axis 32 and thin plate press mold axis
Journey further promotes the compactness of circuit board and dry film and the press mold quality of thin plate circuit board.
As shown in figure 4, film laminator framework 41 is used to fix the position of film laminator under the common press mold mode of film laminator,
Circuit board to press mold is sent to plate thickness measuring device 47 by live roller 48, and above-mentioned plate thickness measuring device 47 is set to permutation
The leading portion of device 46 completes the microetch and surface cleaning processing of the circuit board to press mold here, and at further progress binding dust
Reason is to remove space of a whole page residue, and the circuit board to press mold for completing permutation processing is transferred into preheating device 45, before realizing press mold
The thickness value of preheating, the circuit board acquired according to plate thickness measuring device 47 selects common press mold mode or thin plate press mold mode,
In, common press mold mode implements press mold process by common press mold axis 42, and thin plate press mold mode passes through common press mold axis 42 and thin
43 common implementing press mold process of plate press mold axis, if user is before carrying out press mold processing, setting reference thickness is 0.1mm, then works as plate
When thick measured value is greater than reference thickness value 0.1mm, thick decision procedure determines that production plate is ordinary circuit board, press mold machine control system
Automatically common press mold mode is used, thin plate press mold axis 43 is in lifting position, is detached from working interface, is executed by common press mold axis 42
Press mold processing, above-mentioned common press mold axis 42 have been warmed up the preset temperature of processing to press mold before executing press mold processing.
As shown in figure 5, film laminator framework 51 is used to fix the position of film laminator under the thin plate press mold mode of film laminator,
Circuit board to press mold is sent to plate thickness measuring device 57 by live roller 58, and above-mentioned plate thickness measuring device 57 is set to permutation
The leading portion of device 56 completes the microetch and surface cleaning processing of the circuit board to press mold here, and at further progress binding dust
Reason is to remove space of a whole page residue, and the circuit board to press mold for completing permutation processing is transferred into preheating device 55, before realizing press mold
The thickness value of preheating, the circuit board acquired according to plate thickness measuring device 57 selects common press mold mode or thin plate press mold mode,
In, common press mold mode implements press mold process by common press mold axis 52, and thin plate press mold mode passes through common press mold axis 52 and thin
53 common implementing press mold process of plate press mold axis, if user is before carrying out press mold processing, setting reference thickness is 0.1mm, then works as plate
When thick measured value is greater than reference thickness value 0.1mm, thick decision procedure determines that production plate is ordinary circuit board, press mold machine control system
Automatically thin plate press mold mode is used, thin plate press mold axis 53 is in down position, press mold processing is executed jointly with common press mold axis 52,
Further promote the compactness of circuit board and dry film and the press mold quality of thin plate circuit board, above-mentioned thin plate press mold axis 53 and general
Logical press mold axis 52 has been warmed up the preset temperature of processing to press mold before executing press mold processing.
The technical scheme of the present invention has been explained in detail above with reference to the attached drawings, it is contemplated that how to realize film laminator according to circuit board
Thickness and the technical issues of corresponding press mold mode is set and then carries out intelligent press mold processing to the circuit board of different-thickness.Cause
This, the invention proposes a kind of control programs of new film laminator, by being arranged on the leading portion of the permutation section apparatus of film laminator
Measurer for thickness, and the circuit board is carried out at press mold according to the thickness value selection press mold mode of measurer for thickness acquisition
Reason realizes film laminator and sets to the intelligence of the press mold mode of the circuit board of different-thickness, without carrying out artificial set every time
It is fixed, the press mold efficiency of circuit board is improved, while also reducing the press mold cost of circuit board.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of control method of film laminator characterized by comprising
Press mold processing is carried out to the circuit board according to the thickness value selection press mold mode of measurer for thickness acquisition；
The press mold mode includes: common press mold mode and thin plate press mold mode；
Under the common press mold mode: thin plate press mold axis is now in lifting position, executes at least one using common press mold axis
Secondary common press mold operation, and
Under the thin plate press mold mode: the thin plate press mold axis is now in down position, with the circuit board to press mold
After carrying out contact press mold, secondary envelope pressure is carried out to the circuit board using the common press mold axis.
2. the control method of film laminator according to claim 1, which is characterized in that the measurer for thickness includes infrared
Detector, ultrasonic detector, magnetic displacement detector, slippage resistive displacement detector, laser detector, vision displacement detector
One of or a variety of any combination.
3. the control method of film laminator according to claim 1, which is characterized in that adopted according to the measurer for thickness
The thickness value selection press mold mode of collection carries out the circuit board before press mold processing, comprising:
Receive the reference thickness value of user setting.
4. the control method of film laminator according to claim 3, which is characterized in that acquired according to the measurer for thickness
Thickness value selection press mold mode to the circuit board carry out press mold processing specific steps, comprising:
Judge the size of the thickness value Yu the reference thickness value；
When determining that the thickness value is greater than the reference thickness value, control the circuit board using the common press mold mode into
The processing of row press mold；And
When determining that the thickness value is less than or equal to the reference thickness value, the circuit board is controlled using the thin plate press mold
Mode carries out press mold processing.
5. a kind of control system of film laminator characterized by comprising
Control unit, the thickness value selection press mold mode for being acquired according to the measurer for thickness carry out the circuit board
Press mold processing；
The press mold mode includes: common press mold mode and thin plate press mold mode；
Under the common press mold mode: thin plate press mold axis is now in lifting position, executes at least one using common press mold axis
Secondary common press mold operation, and
Under the thin plate press mold mode: the thin plate press mold axis is now in down position, with the circuit board to press mold
After carrying out contact press mold, secondary envelope pressure is carried out to the circuit board using the common press mold axis.
6. the control system of film laminator according to claim 5, which is characterized in that the measurer for thickness includes infrared
Detector, ultrasonic detector, magnetic displacement detector, slippage resistive displacement detector, laser detector, vision displacement detector
One of or a variety of any combination.
7. the control system of film laminator according to claim 5, which is characterized in that further include:
Receiving unit, for receiving the reference thickness value of user setting.
8. the control system of film laminator according to claim 7, which is characterized in that further include:
Judging unit, for judging the size of the thickness value Yu the reference thickness value；
Described control unit is also used to, and when determining that the thickness value is greater than the reference thickness value, is controlled the circuit board and is adopted
Press mold processing is carried out with the common press mold mode；And
It is also used to when determining that the thickness value is less than or equal to the reference thickness value, controls the circuit board using described thin
Plate press mold mode carries out press mold processing.
9. a kind of film laminator characterized by comprising
Measurer for thickness is arranged in the leading portion of the permutation section apparatus of the film laminator, for testing the thickness to press mold circuit board
Angle value；And
Common press mold axis and thin plate press mold axis；
The film laminator further include:
The control system of film laminator as described in any one of claim 5 to 8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410727912.9A CN105722321B (en) | 2014-12-03 | 2014-12-03 | The control method of film laminator, the control system of film laminator and film laminator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410727912.9A CN105722321B (en) | 2014-12-03 | 2014-12-03 | The control method of film laminator, the control system of film laminator and film laminator |
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| CN105722321A CN105722321A (en) | 2016-06-29 |
| CN105722321B true CN105722321B (en) | 2018-12-18 |
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| CN106871773B (en) * | 2017-02-14 | 2019-07-09 | 肇庆市嘉仪仪器有限公司 | A kind of non-contact thickness-measuring equipment and its measurement method online |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201563301U (en) * | 2009-12-10 | 2010-08-25 | 昆山市线路板厂 | Dry film laminating device for flexible circuit boards |
| CN102170756A (en) * | 2011-04-25 | 2011-08-31 | 衢州威盛精密电子科技有限公司 | Circuit board resin film evener and using method thereof |
| CN202271625U (en) * | 2011-09-22 | 2012-06-13 | 湖南维胜科技有限公司 | Dry film fit device for flexible circuit board |
| CN102883542A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Production method of substrate surface circuit diagraph |
| CN202702796U (en) * | 2012-08-09 | 2013-01-30 | 成都明天高新产业有限责任公司 | Improved laminator |
| CN103085439A (en) * | 2011-11-04 | 2013-05-08 | 株式会社明光商会 | Laminating device |
| CN203344460U (en) * | 2013-07-02 | 2013-12-18 | 长兴（广州）电子材料有限公司 | Wet pressing device with adjustable pressure |
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201563301U (en) * | 2009-12-10 | 2010-08-25 | 昆山市线路板厂 | Dry film laminating device for flexible circuit boards |
| CN102170756A (en) * | 2011-04-25 | 2011-08-31 | 衢州威盛精密电子科技有限公司 | Circuit board resin film evener and using method thereof |
| CN202271625U (en) * | 2011-09-22 | 2012-06-13 | 湖南维胜科技有限公司 | Dry film fit device for flexible circuit board |
| CN103085439A (en) * | 2011-11-04 | 2013-05-08 | 株式会社明光商会 | Laminating device |
| CN202702796U (en) * | 2012-08-09 | 2013-01-30 | 成都明天高新产业有限责任公司 | Improved laminator |
| CN102883542A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Production method of substrate surface circuit diagraph |
| CN203344460U (en) * | 2013-07-02 | 2013-12-18 | 长兴（广州）电子材料有限公司 | Wet pressing device with adjustable pressure |
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| CN105722321A (en) | 2016-06-29 |
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Effective date of registration: 20220623 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. |