CN112996260B - Printed circuit board manufacturing method based on 5G communication - Google Patents
Printed circuit board manufacturing method based on 5G communication Download PDFInfo
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- CN112996260B CN112996260B CN202110532939.2A CN202110532939A CN112996260B CN 112996260 B CN112996260 B CN 112996260B CN 202110532939 A CN202110532939 A CN 202110532939A CN 112996260 B CN112996260 B CN 112996260B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the technical field of circuit board manufacturing, and provides a manufacturing method of a printed circuit board based on 5G communication, wherein in the manufacturing of an inner layer circuit, cutting and micro-image processes are carried out according to a preset typesetting mode to obtain the inner layer circuit board; in the laminating process, a plurality of inner layer circuit boards which are pre-laminated are regularly pressed by adopting preheating and melting; the invention adopts the small-size pattern typesetting layout inner-layer circuit board, and can fully utilize the substrate material; the PCS which are mutually independent in pairs is arranged, and each PCS is matched with more than 8 micro-connection ends, so that higher supporting force is provided for the PCS, and the deformation of the PCS can be effectively prevented; a honeycomb copper foil is laid between every two array, and the size of the inner-layer circuit board is further solidified through internal acting force by utilizing the characteristics that the honeycomb copper foil contains more water chestnuts and is not easy to deform; thereby ensuring the dimensional stability, improving the uniformity of copper plating and the yield of products. The design is preheated and melted regularly, and a plurality of the inner layer circuit boards which are laminated in advance are pressed, so that the yield is high, and the production cost is correspondingly reduced.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing method of a printed circuit board based on 5G communication.
Background
With the advent of the 5G era and the development of high-performance, intelligent, and networked computers and information communication devices, it is necessary to transmit and process large-capacity information at higher speed. Therefore, the transmitted signals gradually tend to be high-frequency signals, and the requirements for high-frequency and high-speed signal processing and transmission for communication products are getting stricter. The PCB enterprise also puts new requirements on the raw materials of 5G products, and a large amount of low DK and high TG substrates such as PTFE/Rogers and the like are put into production. Although the substrate meets the requirement of 5G signal transmission, the following defects still exist:
1. the typesetting mode adopts the positive typesetting mode, the substrate material cannot be fully and reasonably utilized, and the PCS is in co-location micro-connection, so that the dimensional stability is poor;
2. the method for reducing the transmission loss can solve the problem of mechanical performance of products by increasing the roughness of the board surface to obtain higher copper foil adhesive force, but the skin effect of signals becomes more and more serious, and the impedance matching degree of 5G communication HDI cannot be met due to signal loss caused by standing wave, reflection and the like, and the manufactured substrate is metalized and has poor plasticity of strength;
3. the process riveting and rivet pressing modes have the defects that fine lines cannot be manufactured due to deviation generated by punching, a single-point hot melting supporting surface is very small, and the deviation of the sliding plate due to the fact that the supporting force cannot counteract the twisting force generated by pressing easily occurs.
Disclosure of Invention
The invention provides a manufacturing method of a printed circuit board based on 5G communication, which solves the technical problems of low manufacturing efficiency, high cost, poor size stability, contradiction between reduction of transmission loss and improvement of adhesive force and low pressing efficiency of the existing substrate.
In order to solve the technical problems, the invention provides a method for manufacturing a printed circuit board based on 5G communication, which comprises the steps of inner-layer circuit manufacturing, laminating process, drilling process, copper deposition electroplating process, outer-layer circuit manufacturing, wet film process, surface process and post process;
in the inner layer circuit manufacturing, cutting and micro-lithography processes are carried out according to a preset typesetting mode to obtain an inner layer circuit board; in the laminating process, a plurality of the inner layer circuit boards which are pre-laminated are regularly pressed by adopting preheating and melting.
In a further embodiment, the preset typesetting mode is a small-size pattern typesetting, and specifically comprises: each PCS in the inner-layer circuit board at least comprises 8 micro-connection ends, every two PCS are mutually independent, and honeycomb-shaped copper foil is laid between every two array;
the PCS is the minimum unit of a circuit area in the inner-layer circuit board, the PCS forms one array, and the arrays form the inner-layer circuit board.
The basic scheme adopts small-size pattern typesetting layout of the inner circuit board, and substrate materials can be fully utilized; the PCS which are mutually independent in pairs is arranged, and each PCS is matched with more than 8 micro-connection ends, so that higher supporting force is provided for the PCS, and the deformation of the PCS can be effectively prevented; a honeycomb copper foil is laid between every two array, and the size of the inner-layer circuit board is further solidified through internal acting force by utilizing the characteristics that the honeycomb copper foil contains more water chestnuts and is not easy to deform; thereby ensuring the dimensional stability, improving the uniformity of copper plating and the yield of products.
In a further embodiment, the regularly pressing and pre-laminating the plurality of inner layer circuit boards by using the pre-heating melting method comprises:
A. carrying out plasma degumming on the inner layer circuit boards to be pressed;
B. superposing the PP film, the copper foil and the inner layer circuit board subjected to blackening treatment, and carrying out hot melting on four sides in advance by adopting a hot melting machine;
C. and after x-ray confirmation, carrying out full-edge hot melting on the structure to be pressed after the previous hot melting to obtain the multilayer circuit board.
According to the scheme, single-point hot melting is firstly carried out on the overlapped PP film, the copper foil and the inner-layer circuit board subjected to blackening treatment so as to complete the basic fixation of the whole PCB; the layer deviation condition can be effectively detected through X-ray confirmation, and the rejection due to pressing irreversibility is reduced; the four sides are fixed through the four sides hot melting afterwards, the slide off normal position is prevented, the bigger fixed edge of cover face is realized to provide higher support surface to the shearing resistance, thereby can improve the preparation fineness of circuit (improve the circuit precision promptly), further improve the product yields.
In a further embodiment, in the inner layer circuit manufacturing, a substrate comprises a substrate material layer and a copper foil layer, and a coupling agent covers between the substrate material layer and the copper foil layer; in the laminating process, the coupling agent covers the inner layer circuit boards; the coupling agent is phenol ring halogen-containing resin.
The scheme adopts the phenol ring resin containing halogen as the coupling agent, so as to fix the combination structure between the substrate material layer and the copper foil layer and between the inner circuit boards, and utilize the coupling agent to generate a molecular bridge to improve the coupling coordination of the board surface, improve the interface action between inorganic matters and organic matters, reduce the roughness of the board surface, reduce the transmission loss and simultaneously improve the binding force between the combination surfaces, thereby greatly improving the performance of the composite material.
In a further embodiment, in the inner layer circuit fabrication, a dry film is coated on the substrate coated with the uniform water film by using a wet pasting; the water film contains the coupling agent.
This scheme design includes the water film cooperation wet process pad pasting of coupling agent for the resin layer of dry film possesses the coupling nature, lies in water, copper face and forms the weak chemistry cohesion similar to the hydrogen bond at the in-process of press mold, thereby ensures that the dry film can not damaged, the circuit does not have dog tooth, deckle edge developing, etching in-process.
In a further embodiment, in the wet film process, the multilayer circuit board is subjected to assembly welding coverage by using a preset coating; the preset coating comprises LowDk/Df ink, a rectifying agent and a coupling agent.
In a further embodiment, in the inner layer circuit manufacturing and the outer layer circuit manufacturing, chemical pretreatment is carried out by adopting preset spray pressure and preset linear speed, and pollutants on a copper surface are removed to increase the roughness of the copper surface; wherein, the preset spraying pressure and the preset linear speed are both 80% of the conventional spraying pressure and the conventional linear speed.
In addition, the direct distance between the conveying roller and the conveying roller is controlled within 2 mm.
This scheme is through reducing to spout pressure, line speed, reduces the distance between the conveying gyro wheel, and the transportation stability of a high inlayer circuit board or multilayer circuit board to reduce the cardboard risk.
In a further embodiment, in the inner layer circuit fabrication and the outer layer circuit fabrication, comprising: and DES connection, namely standing the board to be subjected to image transfer for at least 30min, placing the inner layer circuit board or the multilayer circuit board in a mode that the independent circuit faces downwards, and controlling the etching factor to be not less than 4 to carry out DES connection.
In a further embodiment, the substrate material layer is filled with a filler, which is a silicon-based complex.
According to the scheme, the filling agent (silicon complex compound) is added into the substrate material layer, and the stability and the dispersibility of the silicon complex compound are utilized, so that the strength of a PCB product can be effectively improved, and the production efficiency and the use durability of the product are improved.
Drawings
Fig. 1 is a work flow chart of a method for manufacturing a printed circuit board based on 5G communication according to an embodiment of the present invention;
FIG. 2 is a layout diagram of a small-size pattern layout according to an embodiment of the present invention;
FIG. 3 is a flowchart illustrating a process of fabricating the inner layer circuit of FIG. 1 according to an embodiment of the present invention;
FIG. 4 is a flowchart illustrating operation of the lamination process of FIG. 1 according to an embodiment of the present invention;
fig. 5 is a flowchart of the operation of the outer layer circuit fabrication in fig. 1 according to an embodiment of the present invention.
Wherein, 1-PCS, 2-array and 3-micro-connection terminal.
Detailed Description
The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, which are given solely for the purpose of illustration and are not to be construed as limitations of the invention, including the drawings which are incorporated herein by reference and for illustration only and are not to be construed as limitations of the invention, since many variations thereof are possible without departing from the spirit and scope of the invention.
The method for manufacturing the printed wiring board based on the 5G communication, as shown in fig. 1, includes the following steps; inner layer circuit manufacturing, laminating process, drilling process, copper deposition electroplating process, outer layer circuit manufacturing, wet film process, surface process and post-process;
in the inner layer circuit manufacturing, referring to fig. 2 and fig. 3, the cutting and the photolithography processes are performed according to the preset typesetting mode to obtain the inner layer circuit board. The process edge of the inner layer circuit board is not less than 10nm, and an impedance strip is arranged on the process edge.
In this embodiment, the preset typesetting mode is a small-size pattern typesetting, which specifically includes: each PCS in the inner-layer circuit board at least comprises 8 micro-connection ends, every two PCS are mutually independent, and a honeycomb-shaped copper foil is laid between every two array; wherein, PCS adopts irregular compact sequencing;
PCS is a measurement unit, namely the abbreviation of pieces, which means one piece.
The PCS is the minimum unit of a circuit area in the inner-layer circuit board, a plurality of PCS form an array, and a plurality of arrays form the inner-layer circuit board.
The embodiment of the invention adopts the small-size pattern typesetting layout inner-layer circuit board, and can fully utilize the substrate material; the PCS which are mutually independent in pairs is arranged, and each PCS is matched with more than 8 micro-connection ends, so that higher supporting force is provided for the PCS, and the deformation of the PCS can be effectively prevented; a honeycomb copper foil is laid between every two array, and the size of the inner-layer circuit board is further solidified through internal acting force by utilizing the characteristics that the honeycomb copper foil contains more water chestnuts and is not easy to deform; thereby ensuring the dimensional stability, improving the uniformity of copper plating and the yield of products. The design preheats the rule of melting, and the lamination is a plurality of inlayer circuit boards that coincide in advance, and the yields is high, manufacturing cost also corresponding reduction.
In this embodiment, in the inner layer circuit fabrication:
in the cutting process, the substrate (copper clad laminate) comprises a substrate material layer and a copper foil layer, and a coupling agent covers between the substrate material layer and the copper foil layer. In the film pressing process, a dry film is covered on the substrate coated with the uniform water film by adopting a wet film pasting method; wherein, the water film contains a coupling agent.
This embodiment design includes the water film cooperation wet process pad pasting of coupling agent for the resin layer of dry film possesses the coupling nature, lies in water, the copper face forms between the weakening chemical bonding force of hydrogen bond and van der waals' force at the in-process of press mold, thereby the guarantee dry film is developing, the etching in-process, the dry film limit can not be damaged, the circuit does not have dog tooth, deckle edge, still can be through using thinner dry film (20 um) simultaneously, make the circuit more meticulous (reach 30/30um circuit level).
In this embodiment, the substrate material layer is filled with a filler, which is a silicon-based complex.
In the embodiment, the filler (silicon complex) is added into the substrate material layer, and the stability and the dispersibility of the silicon complex are utilized, so that the strength of the PCB product can be effectively improved, and the production efficiency and the use durability of the product can be improved.
In the lamination process, referring to fig. 4, the pre-laminated inner layer circuit boards are laminated by using a pre-hot melting rule, which includes:
A. carrying out plasma degumming on the inner layer circuit boards to be laminated;
B. superposing the PP film, the copper foil and the inner-layer circuit board subjected to blackening treatment, and carrying out hot melting on four sides in advance by adopting a hot melting machine;
C. and after x-ray confirmation, carrying out full-edge hot melting on the structure to be pressed after the previous hot melting to obtain the multilayer circuit board.
The PP film is consistent with the inner layer circuit board in model, so that the harmomegathus consistency of the laminated PP and the base plate is ensured; the glue content can be selected according to the residual copper rate of each layer of a specific product; in addition, the coupling agent is added to ensure that the PP has good adhesion with the circuit/copper foil; it should be noted that the vent hole locations are not pre-fusible.
In the embodiment, the superposed PP film, the copper foil and the inner layer circuit board subjected to blackening treatment are subjected to single-point hot melting to complete the basic fixation of the whole PCB; the layer deviation condition can be effectively detected through X-ray confirmation, and the rejection due to pressing irreversibility is reduced; the four sides are fixed through the four sides hot melting afterwards, the slide off normal position is prevented, the bigger fixed edge of cover face is realized to provide higher support surface to the shearing resistance, thereby can improve the preparation fineness of circuit (improve the circuit precision promptly), further improve the product yields.
Wherein, the coupling agent covers between the inner layer circuit boards.
In this embodiment, the coupling agent is a phenol ring halogen-containing resin.
In the embodiment, the phenol ring halogen-containing resin is used as a coupling agent to fix the bonding structures between the substrate material layer and the copper foil layer and between the inner layer circuit boards, and the coupling coordination property of the board surface is improved by utilizing the 'molecular bridge' generated by the coupling agent, so that the interface action between an inorganic substance and an organic substance is improved, the roughness of the board surface is reduced, the transmission loss is reduced, and meanwhile, the bonding force between the bonding surfaces is also improved, and the performance of the composite material is greatly improved.
In the present embodiment, referring to fig. 3 and 5, in the inner layer circuit fabrication and the outer layer circuit fabrication:
chemical pretreatment is carried out by adopting preset spray pressure and preset linear speed, so that pollutants on the copper surface are removed, and the roughness of the copper surface is increased; wherein the preset spraying pressure and the preset linear speed are both 80% of the conventional spraying pressure and the conventional linear speed.
In addition, the direct distance between the conveying roller and the conveying roller is controlled within 2 mm.
This embodiment is through reducing to spout pressure, linear speed, reduces the distance between the conveying roller, but the transportation stability of a high inlayer circuit board or multilayer circuit board to reduce the cardboard risk.
In the DES connection test, a board needing image transfer is kept still for at least 30min, an inner layer circuit board or a multilayer circuit board is placed in a mode that an independent circuit faces downwards, and DES connection is carried out by controlling an etching factor to be not less than 4.
The DES link is abbreviated as DEVELOPING (deviloping), ETCHING (ETCHING), and Stripping (STRIP).
The etching factor is the ratio of the etching depth to the lateral etching in the production process of the etching type metal lead frame; the etching factor = etching line thickness/[ upper line width-lower line width)/2 ].
In the present embodiment, aoi (automatic Optical inspection) is automatic Optical inspection. When the circuit board is automatically detected, the machine automatically scans the multilayer circuit board through the camera, acquires images, compares the tested welding spots with qualified parameters in the database, inspects the defects on the circuit board through image processing, and displays/marks the defects through a display or an automatic mark. Wherein, the inner layer AOI and the outer layer AOI are respectively used for automatic optical detection of the inner layer circuit board and the outer layer circuit board (multilayer circuit board).
In the copper deposition electroplating process of the embodiment, plasma is added for removing glue before electroplating to increase the hole filling property of the product; a pulse plating VCP line is selected, a plating accompanying plate which is about 20mm larger than a product to be plated is selected, the short edge of a chuck clamp adopts the parameters of low current and long-time plating, the plating uniformity can be controlled at 95%, and the hole surface copper conversion rate is 98%.
In this embodiment, in the wet film process, the multilayer circuit board is subjected to assembly welding coverage by using a predetermined coating. The pre-set coating comprises LowDk/Df ink, a rectifying agent and a coupling agent, for example, 2-3 ml of rectifying agent and coupling agent are added into 1 kg of LowDk/Df ink, and the pre-set coating is obtained by mixing.
DK in the circuit board is a dielectric constant, so LOW Dk is a LOW dielectric constant; df in the circuit board is the dielectric loss factor, so LOW Df is the LOW dielectric loss factor.
In the post-process, the test was carried out according to the IPC-2 standard.
In conclusion, the invention effectively improves the adhesion of the circuit and the solder resist, reduces the circuit burrs and further solves the problems of poor impedance stability and serious signal skin effect by adopting a plurality of aspects of material selection (coupling agent, LowDk/Df printing ink), engineering data optimization (small-size pattern typesetting), field process improvement and the like.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (8)
1. A printed wiring board manufacturing method based on 5G communication comprises inner layer circuit manufacturing, laminating process, drilling process, copper deposition electroplating process, outer layer circuit manufacturing, wet film process, surface process and post process, and is characterized in that:
in the inner layer circuit manufacturing, cutting and micro-lithography processes are carried out according to a preset typesetting mode to obtain an inner layer circuit board; in the laminating process, a plurality of pre-laminated inner layer circuit boards are regularly pressed by adopting preheating and melting;
the preset typesetting mode is small-size pattern typesetting, and specifically comprises the following steps: each inner layer circuit board at least comprises 8 micro-connection ends, every two inner layer circuit boards are mutually independent, and honeycomb-shaped copper foils are laid between every two inner layer circuit boards;
the block is the minimum unit of a circuit area in the inner-layer circuit board, a plurality of blocks form one arrangement, and a plurality of arrangements form the inner-layer circuit board.
2. The method for manufacturing a printed wiring board based on 5G communication according to claim 1, wherein the step of regularly laminating the pre-laminated inner layer circuit boards by using the pre-heating fuse comprises the following steps:
A. carrying out plasma degumming on the inner layer circuit boards to be pressed;
B. superposing the PP film, the copper foil and the inner layer circuit board subjected to blackening treatment, and carrying out hot melting on four sides in advance by adopting a hot melting machine;
C. and after x-ray confirmation, carrying out full-edge hot melting on the structure to be pressed after the previous hot melting to obtain the multilayer circuit board.
3. A method for manufacturing a printed wiring board based on 5G communication according to claim 1, wherein: in the inner layer circuit manufacturing, a substrate comprises a substrate material layer and a copper foil layer, and a coupling agent covers between the substrate material layer and the copper foil layer; in the laminating process, the coupling agent covers the inner layer circuit boards; the coupling agent is phenol ring halogen-containing resin.
4. A method for manufacturing a printed wiring board based on 5G communication according to claim 3, wherein: in the inner layer circuit manufacturing, a dry film is covered on the substrate coated with the uniform water film by adopting a wet film pasting method; the water film contains the coupling agent.
5. A method for manufacturing a printed wiring board based on 5G communication according to claim 1, wherein: in the wet film process, a preset coating is adopted to carry out assembly welding covering on the multilayer circuit board; the preset coating comprises LowDk/Df ink, a rectifying agent and a coupling agent.
6. A method for manufacturing a printed wiring board based on 5G communication according to claim 1, wherein: in the inner layer circuit manufacturing and the outer layer circuit manufacturing, chemical pretreatment is carried out by adopting preset spray pressure and preset linear speed, and pollutants on a copper surface are removed to increase the roughness of the copper surface; wherein, the preset spraying pressure and the preset linear speed are both 80% of the conventional spraying pressure and the conventional linear speed.
7. The method for manufacturing a printed wiring board based on 5G communication according to claim 1, wherein in the manufacturing of the inner layer circuit and the manufacturing of the outer layer circuit, the method comprises the following steps: and DES connection, namely standing the board to be subjected to image transfer for at least 30min, placing the inner layer circuit board or the multilayer circuit board in a mode that the independent circuit faces downwards, and controlling the etching factor to be not less than 4 to carry out DES connection.
8. The manufacturing method of the printed circuit board based on the 5G communication as claimed in claim 4, wherein: the substrate material layer is filled with a filler, and the filler is a silicon complex.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110532939.2A CN112996260B (en) | 2021-05-17 | 2021-05-17 | Printed circuit board manufacturing method based on 5G communication |
| PCT/CN2021/129226 WO2022242054A1 (en) | 2021-05-17 | 2021-11-08 | Printed circuit board manufacturing method based on 5g communication |
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| CN202110532939.2A CN112996260B (en) | 2021-05-17 | 2021-05-17 | Printed circuit board manufacturing method based on 5G communication |
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| CN112996260B true CN112996260B (en) | 2021-07-27 |
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| US5073456A (en) * | 1989-12-05 | 1991-12-17 | E. I. Du Pont De Nemours And Company | Multilayer printed circuit board formation |
| JP2001177204A (en) * | 1999-12-15 | 2001-06-29 | Mitsui Mining & Smelting Co Ltd | Surface-treated copper foil and method of manufacturing the same |
| EP1274289A1 (en) * | 2001-07-02 | 2003-01-08 | Alcatel | HDI circuit board and manufacturing method of an HDI circuit board |
| CN101636046B (en) * | 2008-07-24 | 2011-07-13 | 比亚迪股份有限公司 | Method for processing multilayer flexible circuit board |
| CN103068160B (en) * | 2012-12-25 | 2015-09-09 | 广东欧珀移动通信有限公司 | A kind of split type circuit board |
| CN205847722U (en) * | 2016-08-09 | 2016-12-28 | 胜宏科技（惠州）股份有限公司 | A kind of composing structure of the edges of boards burr that fractures after anti-wiring board unit V CUT residual |
| US10104759B2 (en) * | 2016-11-29 | 2018-10-16 | Nxp Usa, Inc. | Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof |
| CN109587975B (en) * | 2018-11-23 | 2021-10-12 | 深圳崇达多层线路板有限公司 | Method for improving lamination fusion position gummosis |
| CN210958963U (en) * | 2019-03-28 | 2020-07-07 | 华为技术有限公司 | Copper foil and substrate for PCB production |
| CN112996260B (en) * | 2021-05-17 | 2021-07-27 | 智恩电子(大亚湾)有限公司 | Printed circuit board manufacturing method based on 5G communication |
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