CN117956680A - Circuit board conductor circuit and manufacturing method thereof - Google Patents
Circuit board conductor circuit and manufacturing method thereof Download PDFInfo
- Publication number
- CN117956680A CN117956680A CN202410107524.4A CN202410107524A CN117956680A CN 117956680 A CN117956680 A CN 117956680A CN 202410107524 A CN202410107524 A CN 202410107524A CN 117956680 A CN117956680 A CN 117956680A
- Authority
- CN
- China
- Prior art keywords
- insulating film
- circuit
- adhesive layer
- conductor
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000012790 adhesive layer Substances 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000011888 foil Substances 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000003698 laser cutting Methods 0.000 claims abstract description 19
- 238000005530 etching Methods 0.000 claims abstract description 15
- 238000009413 insulation Methods 0.000 claims abstract description 6
- 238000010329 laser etching Methods 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000002699 waste material Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 15
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000003475 lamination Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a circuit board conductor circuit and a manufacturing method thereof, wherein the circuit board conductor circuit comprises a base material and an insulating film attached to the top surface of the base material, and the insulating film and the base material are bonded together through an adhesive layer; the insulation film is provided with a pattern opening which is matched with the circuit structure, the pattern opening is communicated with the adhesive layer on the bottom surface of the insulation film, the pattern opening is provided with a conductor circuit, and the bottom surface of the conductor circuit is adhered with the adhesive layer. The circuit board conductor circuit and the manufacturing method thereof have the advantages that the processing procedure is simpler, the manufacturing cost is reduced, and the laser cutting and etching mode is more environment-friendly than the traditional etching mode; meanwhile, compared with the traditional printed circuit technology, the metal conductor foil graph of the circuit manufactured by the method is more refined, has good conductivity and good electrical property, can facilitate welding of solder paste, has strong weldability, ensures the application range and has strong adaptability.
Description
Technical Field
The invention relates to circuit board processing, in particular to a circuit board conductor circuit and a manufacturing method thereof.
Background
The circuit board is also called a circuit board and can be divided into a single-sided board, a double-sided board and a multi-layer circuit board, wherein the circuit board is provided with conductive circuits, and the circuit board circuits on the market are basically manufactured by adopting etching and printing modes at present.
The etching method is characterized in that the etching method is mainly used for etching the circuit board in a chemical mode, copper foil except the conductive circuit is removed by using etching liquid, the manufacturing cost is high, the etching liquid is usually concentrated sulfuric acid, the environment is not protected, the etching process is extremely complicated, the raw material use cost is relatively high, and the etching method is not advantageous in cost when the circuit board is manufactured simply.
The printed circuit board is manufactured by adopting slurry screen printing, the circuit board manufactured by the method has poor circuit conductive performance, and no method is available for welding solder paste on a printed conductor, so that the application range is greatly influenced.
Disclosure of Invention
The invention aims to solve the technical problem of providing a circuit board conductor circuit which has simple working procedure and low manufacturing cost and can ensure the conductivity and a manufacturing method thereof.
In order to solve the technical problems, the invention is realized by the following technical scheme:
The circuit board conductor circuit comprises a substrate and an insulating film attached to the top surface of the substrate, wherein the insulating film and the substrate are adhered together through an adhesive layer; the insulation film is provided with a pattern opening which is matched with the circuit structure, the pattern opening is communicated with the adhesive layer on the bottom surface of the insulation film, the pattern opening is provided with a conductor circuit, and the bottom surface of the conductor circuit is adhered with the adhesive layer.
Further, the conductor lines are made of metal conductor foil.
Further, the base material is an insulating plate.
Further, the base material is a metal plate.
Further, the thickness of the base material is 10 um-5000 um.
A method for manufacturing a conductor circuit of a circuit board comprises the following steps:
step S1, attaching an adhesive layer and an insulating film on one surface of a base material, namely attaching the insulating film on the base material through the adhesive layer;
S2, cutting and etching the insulating film and the base material which are bonded together in a laser cutting and laser etching mode, locally opening the insulating film according to the circuit structure and exposing the adhesive layer on the bottom surface of the insulating film, wherein the pattern opening formed on the insulating film is communicated with the adhesive layer;
Step S3, placing a layer of metal conductor foil on the product with the opening etched by laser cutting, namely on the insulating film, performing lamination operation by adopting a lamination machine, and simultaneously bonding the adhesive layer with the upper layer of metal conductor foil through the laser processed pattern opening on the insulating film under the conditions of pressure and temperature by adding temperature;
S4, performing laser cutting again by using a laser machine, and cutting the surface of the metal conductor foil along the path of the laser opening in the step S2 during laser cutting;
And S5, removing redundant waste materials on the metal conductor foil after laser cutting, and reserving a part consistent with the pattern opening, wherein the part forms a complete conductor circuit.
Compared with the prior art, the invention has the following advantages: the circuit board conductor circuit and the manufacturing method thereof have the advantages that the processing procedure is simpler, the manufacturing cost is reduced, and the laser cutting and etching mode is more environment-friendly than the traditional etching mode; meanwhile, compared with the traditional printed circuit technology, the metal conductor foil graph of the circuit manufactured by the method is more refined, has good conductivity and good electrical property, can facilitate welding of solder paste, has strong weldability, ensures the application range and has strong adaptability.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a circuit board conductor circuit and a manufacturing method thereof according to the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. In the description of the embodiments of the present invention, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate an azimuth or a positional relationship based on that shown in the drawings, or an azimuth or a positional relationship in which the product of the present invention is conventionally put when used, it is merely for convenience of describing the present invention and simplifying the description, and it does not indicate or imply that the apparatus or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," and the like, if any, do not denote a requirement that the component be absolutely horizontal or vertical, but rather may be slightly inclined. As "horizontal" merely means that its orientation is more horizontal than "vertical" and does not mean that the structure or component must be entirely horizontal, but may be slightly inclined.
In the description of the embodiments of the present invention, "plurality" means at least 2.
In the description of the embodiments of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Example 1
The embodiment discloses a circuit board conductor circuit and a manufacturing method thereof, the circuit board conductor circuit comprises a substrate 300 and an insulating film 100 attached to the top surface of the substrate 300, wherein the substrate 300 can be an insulating plate or a metal plate, the substrate 300 is not limited in material, the thickness of the substrate is between 10um and 5000um, the insulating film 100 and the substrate 300 are adhered together through a glue layer 200, a composite material with a glue layer coated on the bottom surface of the insulating film 100 in advance can be arranged between the glue layer 200 and the insulating film 100, or the glue layer 200 and the insulating film 100 are independently and sequentially coated and attached on the substrate 100, the glue layer 200 is a double-sided adhesive, and the composition and the material of the glue layer 200 are not limited; the insulating film 100 is provided with a pattern opening 1001 which is matched with a circuit structure, the pattern opening 1001 is communicated with the adhesive layer 200 on the bottom surface of the insulating film 100, the adhesive layer 200 can overflow into the pattern opening 1001, the pattern opening 1001 is provided with a conductor circuit 4001, the conductor circuit 4001 is consistent with the pattern opening 1001 in shape and is made of a metal conductor foil 400, and the bottom surface of the conductor circuit 4001 is adhered with the adhesive layer 200 overflowed into the pattern opening 1001.
Referring to fig. 1 of the specification, the method for manufacturing the conductor circuit of the circuit board comprises the following steps:
step S1, an adhesive layer 200 and an insulating film 100 are attached on one surface of a base material 300, namely, the insulating film 100 is attached on the base material 300 through the adhesive layer 200;
Step S2, cutting and etching the insulating film 100 and the base material 300 which are bonded together in a laser cutting and laser etching mode, placing the insulating film 100 upwards, locally opening the insulating film 100 according to a circuit structure and exposing the adhesive layer 200 on the bottom surface of the insulating film 100, forming a pattern opening 1001 which is matched with the circuit structure on the insulating film 100, wherein the formed pattern opening 1001 is communicated with the adhesive layer 200;
Step S3, a layer of metal conductor foil 400 is placed on the product of which the etching is finished by laser cutting, namely, the insulating film 100, a lamination machine is adopted to carry out lamination operation, and meanwhile, the temperature is added, and the adhesive layer 200 is bonded with the upper layer of metal conductor foil 400 through the pattern opening 1001 of the insulating film 100 which is processed by laser under the condition of [ bc1 ]; the glue layer 200 cannot ensure that 100% of the glue layer is filled in the laser-machined pattern opening 1001, and when the lamination machine performs lamination on the metal conductor foil 400, the metal conductor foil 400 may also sink in the pattern opening 1001 to adhere to the glue layer 200 overflowed into the pattern opening 1001;
Step S4, performing laser cutting on the laminated product again by using a laser cutting machine, and cutting the surface of the metal conductor foil 400 along the path of the laser opening in the step S2 during laser cutting;
In step S5, the unnecessary waste material on the metal conductor foil 400 is removed after the laser cutting, that is, the portion of the metal conductor foil 400 except for the pattern opening 1001 is removed, and the portion corresponding to the pattern opening 1001 remains, and the complete conductor line 4001 is formed.
The circuit board conductor circuit and the manufacturing method thereof have the advantages that the processing procedure is simpler, the manufacturing cost is reduced, and the laser cutting and etching mode is more environment-friendly than the traditional etching mode; meanwhile, compared with the traditional printed circuit technology, the metal conductor foil graph of the circuit manufactured by the method is more refined, has good conductivity and good electrical property, can facilitate welding of solder paste, has strong weldability, ensures the application range and has strong adaptability.
It is emphasized that: the above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The circuit board conductor circuit is characterized by comprising a base material (300) and an insulating film (100) attached to the top surface of the base material (300), wherein the insulating film (100) and the base material (300) are adhered together through an adhesive layer (200); the insulation film (100) is provided with a pattern opening (1001) which is matched with the circuit structure, the pattern opening (1001) is communicated with the adhesive layer (200) on the bottom surface of the insulation film (100), the pattern opening (1001) is provided with a conductor circuit (4001), and the bottom surface of the conductor circuit (4001) is adhered with the adhesive layer (200).
2. A wiring board conductor line according to claim 1, characterized in that the conductor line (4001) is made of a metal conductor foil (400).
3. A wiring board conductor trace according to claim 1, wherein the substrate (300) is an insulating sheet material.
4. The circuit board conductor trace of claim 1, wherein the substrate (300) is a sheet metal.
5. The circuit board conductor trace according to claim 1, wherein the substrate (300) has a thickness of 10um to 5000um.
6. A method of manufacturing a circuit board conductor circuit as defined in claim 1, comprising the steps of:
step S1, an adhesive layer (200) and an insulating film (100) are attached to one surface of a base material (300), namely, the insulating film (100) is attached to the base material (300) through the adhesive layer (200);
S2, cutting and etching the insulating film (100) and the base material (300) which are bonded together in a laser cutting and laser etching mode, and locally opening the insulating film (100) according to a circuit structure and exposing a glue layer (200) on the bottom surface of the insulating film (100), wherein a pattern opening (1001) formed on the insulating film (100) is communicated with the glue layer (200);
step S3, placing a layer of metal conductor foil (400) on the insulating film (100) which is the product with the opening etched by laser cutting, laminating by a laminating machine, and bonding the adhesive layer (200) with the upper layer of metal conductor foil (400) through the laser processed pattern opening (1001) on the insulating film (100) under the conditions of pressure and temperature by adding temperature;
s4, performing laser cutting again by using a laser machine, and cutting the surface of the metal conductor foil (400) along the path of the laser opening in the step S2 during laser cutting;
And S5, removing redundant waste on the metal conductor foil (400) after laser cutting, and reserving a part consistent with the pattern opening (1001), wherein the part forms a complete conductor line (4001).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410107524.4A CN117956680A (en) | 2024-01-25 | 2024-01-25 | Circuit board conductor circuit and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410107524.4A CN117956680A (en) | 2024-01-25 | 2024-01-25 | Circuit board conductor circuit and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117956680A true CN117956680A (en) | 2024-04-30 |
Family
ID=90793904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410107524.4A Pending CN117956680A (en) | 2024-01-25 | 2024-01-25 | Circuit board conductor circuit and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117956680A (en) |
-
2024
- 2024-01-25 CN CN202410107524.4A patent/CN117956680A/en active Pending
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