CN112053977A - Surface treatment and drying integrated equipment for chip processing - Google Patents
Surface treatment and drying integrated equipment for chip processing Download PDFInfo
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- CN112053977A CN112053977A CN202010972447.0A CN202010972447A CN112053977A CN 112053977 A CN112053977 A CN 112053977A CN 202010972447 A CN202010972447 A CN 202010972447A CN 112053977 A CN112053977 A CN 112053977A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Abstract
The invention discloses surface treatment and drying integrated equipment for chip processing, which comprises a base, a sliding assembly, an S-shaped water pipe assembly, a sorting box and a control box, wherein the drying assembly, an auxiliary cooling box and the sorting box are fixed on the upper side of the base, the drying assembly is positioned on the left side of the auxiliary cooling box, the auxiliary cooling box is positioned on the left side of the sorting box, a filtering assembly is fixed on the upper side of the drying assembly, the sliding assembly is used for sealing a feed port on the left side of the drying box and a discharge port on the right side of the drying box, the S-shaped water pipe assembly comprises a water pipe, a water inlet and a water outlet, a second manipulator is fixed on the upper side inside the sorting box, and a second conveying belt penetrates. This chip processing is with surface treatment integration equipment of drying is provided with stoving subassembly and sliding assembly, and electric heating wire and the air heater stoving work simultaneously in the stoving subassembly, sliding assembly inner sealing plate can carry out supplementary seal to stoving case left side feed inlet and right side discharge gate, and it spills over to reduce the hot-air.
Description
Technical Field
The invention relates to the technical field of chips, in particular to surface treatment and drying integrated equipment for chip processing.
Background
The chip is a general term for semiconductor device products, and is fabricated by using a single crystal silicon wafer (or III-V group, such as gallium arsenide) as a base layer, fabricating MOSFET or BJT components using photolithography, doping, CMP, and other techniques, and fabricating conductive lines using thin film and CMP techniques. The main process technologies can be divided into the following categories: photolithography, etching, diffusion, film formation, planarization, and metallization.
The aluminium oxide and the glycerine mixed protection layer that present chip surface dissolved need dry to it, and general drying device stoving is inhomogeneous inefficiency, and the unnecessary steam that produces when drying does not retrieve it and recycles, causes the wasting of resources, and chip after the stoving simultaneously is not to its auxiliary cooling, if the higher later stage processing that influences of temperature, does not handle it when the unqualified chip appearance appears at last, if screening after the later stage processing is accomplished, the loss is great.
Disclosure of Invention
The invention aims to provide surface treatment and drying integrated equipment for chip processing, which aims to solve the problems that the existing mixed protective layer of aluminum oxide and glycerin dissolved on the surface of a chip, which is proposed in the background art, needs to be dried, a common drying device is uneven in drying and low in efficiency, excessive hot gas generated in drying is not recycled, the dried chip is not subjected to auxiliary cooling, and finally the unqualified chip is not treated when the appearance of the chip is unqualified.
In order to achieve the purpose, the invention provides the following technical scheme: a surface treatment and drying integrated device for chip processing comprises a base, a sliding component, an S-shaped water pipe component, a sorting box and a control box,
the drying assembly, the auxiliary cooling box and the sorting box are fixed on the upper side of the base, the drying assembly is located on the left side of the auxiliary cooling box, the auxiliary cooling box is located on the left side of the sorting box, and the filtering assembly is fixed on the upper side of the drying assembly;
the sliding assembly is used for sealing a left side feeding hole and a right side discharging hole of the drying box and is fixed on the left outer wall and the right outer wall of the drying box;
the S-shaped water pipe assembly comprises a water pipe, a water inlet and a water outlet, one end of the water pipe is communicated with the water inlet, and the other end of the water pipe is communicated with the water outlet;
the inside upside of letter sorting case is fixed with the second manipulator, and second manipulator downside is fixed with the centre gripping subassembly, the letter sorting case rear side runs through there is the second conveyer belt.
Preferably, the drying assembly comprises a drying box, an electric heating wire and an air heater, the electric heating wire is fixed on the inner wall of the drying box, and the air heater penetrates through the upper side of the drying box.
Preferably, be fixed with temperature sensor on the stoving case left side inner wall, and the stoving case is linked together through first gas-supply pipe and first storage box, and first storage box is linked together through second gas-supply pipe and second storage box simultaneously, the blast pipe has been run through on the second storage box right side.
Preferably, the stoving incasement runs through first conveyer belt, and first conveyer belt is located the third conveyer belt left side, and the third conveyer belt runs through auxiliary cooling case and letter sorting incasement portion simultaneously, the inside upside of auxiliary cooling case runs through there is the heat dissipation fan, and the inside upside of auxiliary cooling case is fixed with first manipulator, and first manipulator downside is fixed with the information input camera simultaneously.
Preferably, filtering component includes air-supply line, solid fixed ring and filter screen, the air-supply line is fixed at the subassembly upside of drying, and air-supply line upside threaded connection has solid fixed ring, and threaded connection has the filter screen on the solid fixed ring simultaneously.
Preferably, the sliding assembly comprises a fixed block, a hydraulic cylinder, a fixed plate, a sealing plate, a slide and a temperature sensor, the hydraulic cylinder is fixed on the upper side of the fixed block, the fixed plate is fixed on the hydraulic cylinder through a piston rod, one end of the fixed plate is fixed on the sealing plate, the sealing plate is connected with the slide in a sliding mode, and the slide is arranged on the left outer wall and the right outer wall of the drying box.
Preferably, the centre gripping subassembly includes U-shaped fixed plate, electric telescopic handle, fixed plate, spring axle and grip block, be fixed with electric telescopic handle on the U-shaped fixed plate, and electric telescopic handle one end is fixed with the fixed plate, and fixed plate one side is fixed with the spring axle simultaneously, spring axle one end is fixed with the grip block.
Preferably, the fixed plate and the clamping plate form a telescopic structure through a spring shaft, and a rubber anti-skid pad is fixed on the clamping plate.
Preferably, the control box is fixed at the front side of the drying box.
Compared with the prior art, the invention has the beneficial effects that: the surface treatment and drying integrated equipment for chip processing,
(1) the electric heating wire and the air heater in the drying assembly can be dried simultaneously, so that the drying efficiency is improved, when the electric heating wire or the air heater breaks down, the drying operation can be continued, the normal operation of the whole operation is ensured, the practicability is improved, the sealing plate in the sliding assembly can be used for carrying out auxiliary sealing on a left side feeding port and a right side discharging port of the drying box, the overflow of hot air can be reduced, and the drying quality is ensured;
(2) the water heating device is provided with the first storage box and the second storage box, redundant hot air enters the first storage box and the second storage box, so that tap water in the water pipe can be heated, water heated by the water pipe can be used as domestic hot water, and the redundant hot air is recycled, so that resource waste is reduced;
(3) an auxiliary cooling box is arranged, and a heat dissipation fan in the auxiliary cooling box carries out heat dissipation treatment on the dried chip, so that the influence on the later processing quality due to overhigh temperature of the chip is avoided;
(4) be provided with the centre gripping subassembly, the grip block can carry out the centre gripping to the chip of different width under electric telescopic handle's additional action, just so can remove appearance or other unqualified chips to the second conveyer belt on, remove it to required position through the second conveyer belt to handle it, thereby play separation work, ensure later stage chip processingquality.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a rear view of the present invention;
FIG. 3 is a schematic top view of the present invention;
FIG. 4 is a left side view of the present invention;
FIG. 5 is a schematic diagram of the right-view structure of the present invention;
FIG. 6 is a schematic view of the drying assembly and the filtering assembly of the present invention;
FIG. 7 is an enlarged view of the structure at A in FIG. 1 according to the present invention;
FIG. 8 is an enlarged view of the structure at B in FIG. 1 according to the present invention.
In the figure: 1. a base, 2, a drying assembly, 201, a drying box, 202, an electric heating wire, 203, a hot air blower, 3, a filtering assembly, 301, an air inlet pipe, 302, a fixing ring, 303, a filtering net, 4, a sliding assembly, 401, a fixing block, 402, a hydraulic cylinder, 403, a fixing plate, 404, a sealing plate, 405, a slideway, 5, a temperature sensor, 6, a first air pipe, 7, a first storage box, 8, an S-shaped water pipe assembly, 801, a water pipe, 802, a water inlet, 803, a water outlet, 9, a second air pipe, 10, a second storage box, 11, an exhaust pipe, 12, a first conveying belt, 13, an auxiliary cooling box, 14, a sorting box, 15, a heat dissipation fan, 16, a first mechanical arm, 17, an information recording camera, 18, a second mechanical arm, 19, a clamping assembly, 1901, a U-shaped fixing plate, 1902, an electric telescopic rod, 1903, a fixing plate, 1904, a spring shaft, 1905, 20. a second conveyor belt 21, a third conveyor belt 22 and a control box.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-8, the present invention provides a technical solution: a surface treatment and drying integrated device for chip processing is disclosed, as shown in figure 1 and figure 6, a base 1, a drying component 2, an auxiliary cooling box 13 and a sorting box 14 are fixed on the upper side of the base 1, the drying component 2 is positioned on the left side of the auxiliary cooling box 13, the auxiliary cooling box 13 is positioned on the left side of the sorting box 14, a filtering component 3 is fixed on the upper side of the drying component 2, the drying component 2 comprises a drying box 201, an electric heating wire 202 and a hot air blower 203, the electric heating wire 202 is fixed on the inner wall of the drying box 201, the hot air blower 203 penetrates through the upper side of the drying box 201, the filtering component 3 comprises an air inlet pipe 301, a fixing ring 302 and a filtering net 303, the air inlet pipe 301 is fixed on the upper side of the drying component 2, the fixing ring 302 is in threaded connection with the upper side of the air inlet pipe 301, the filtering net 303 is in threaded connection with the, filter screen 303 is provided with two-layerly, and the grid density of upper filter screen 303 is greater than the grid density of lower floor's filter screen 303, the setting of two-layer filter screen 303 can filter the dust more thoroughly, avoid the dust adhesion on the chip surface, influence later stage processingquality, when air heater 203 breaks down, electric heating wire 202 can use, ensure that stoving work normally goes on, inside intensification time can be shortened simultaneously with air heater 203 to same electric heating wire 202, improve drying efficiency.
As shown in fig. 1, 4 and 7, the sliding assembly 4 is used for sealing a left inlet and a right outlet of the drying box 201, and the sliding assembly 4 is fixed on left and right outer walls of the drying box 201; the sliding assembly 4 comprises a fixed block 401, a hydraulic cylinder 402, a fixed plate 403, a sealing plate 404, a slideway 405 and a temperature sensor 5, the hydraulic cylinder 402 is fixed on the upper side of the fixed block 401, the fixed plate 403 is fixed on the hydraulic cylinder 402 through a piston rod, one end of the fixed plate 403 is fixed on the sealing plate 404, the slideway 405 is connected with the sealing plate 404 in a sliding manner, the slideway 405 is arranged on the left outer wall and the right outer wall of the drying box 201, the sealing plate 404 slides downwards in the slideway 405 under the auxiliary action of the hydraulic cylinder 402, so that the sealing plate 404 can perform auxiliary sealing on the left inlet and the right outlet of the drying box 201, the hot air loss is reduced, the temperature in the drying box 201 can be monitored by the temperature sensor 5, the influence of the chip processing quality caused by overhigh temperature or overlow temperature is avoided, the S-shaped water pipe assembly 8 comprises a, meanwhile, the other end of the water pipe 801 is communicated with the water outlet 803, the inner wall of the left side of the drying box 201 is fixedly provided with the temperature sensor 5, the drying box 201 is communicated with the first storage box 7 through the first air pipe 6, the first storage box 7 is communicated with the second storage box 10 through the second air pipe 9, the exhaust pipe 11 penetrates through the right side of the second storage box 10, redundant hot air in the drying box 201 enters the first storage box 7 through the first air pipe 6, the water pipe 801 is arranged in the first storage box 7, so that the hot air in the first storage box 7 can heat the water pipe 801, the hot air in the first storage box 7 enters the second storage box 10 through the second air pipe 9, tap water in the water pipe 801 in the second storage box 10 can be heated, and the redundant hot air in the drying box 201 can be recycled through operation, the waste of resources is avoided.
As shown in fig. 1, 2, 3, 5 and 8, a second manipulator 18 is fixed on the upper side inside the sorting box 14, a clamping assembly 19 is fixed on the lower side of the second manipulator 18, a second conveyor belt 20 penetrates through the rear side of the sorting box 14, the clamping assembly 19 includes a U-shaped fixing plate 1901, an electric telescopic rod 1902, a fixing plate 1903, a spring shaft 1904 and a clamping plate 1905, the electric telescopic rod 1902 is fixed on the U-shaped fixing plate 1901, the fixing plate 1903 is fixed on one end of the electric telescopic rod 1902, the spring shaft 1904 is fixed on one side of the fixing plate 1903, the clamping plate 1905 is fixed on one end of the spring shaft 1904, the fixing plate 1903 and the clamping plate 1905 form a telescopic structure through the spring shaft 1904, a rubber pad is fixed on the clamping plate 1905, and a control box 22 is fixed on the front side of the drying box. The drying box 201 is internally penetrated with a first conveyor belt 12, the first conveyor belt 12 is positioned on the left side of a third conveyor belt 21, the third conveyor belt 21 penetrates through the auxiliary cooling box 13 and the sorting box 14, the upper side inside the auxiliary cooling box 13 is penetrated with a heat dissipation fan 15, the upper side inside the auxiliary cooling box 13 is fixed with a first manipulator 16, the lower side of the first manipulator 16 is fixed with an information recording camera 17, the first conveyor belt 12, the second conveyor belt 20 and the third conveyor belt 21 are all connected with a time relay in a control mode and can move intermittently, the chips after being dried and heated can be subjected to auxiliary cooling treatment under the auxiliary action of the heat dissipation fan 15, hot air generated during cooling is discharged through a rear air outlet, the information recording camera 17 can take photos at multiple angles under the auxiliary action of the first manipulator 16, and finally the camera 17 transmits the information and photos to a control box 22, if appearance or other unqualified chips appear, clamping assembly 19 moves to required position under the effect of second manipulator 18, and clamping plate 1905 moves relatively under the effect of electric telescopic handle 1902, and clamping plate 1905 carries out the centre gripping to unqualified chip at last, moves it to second conveyer belt 20 on at last, and the later stage of being convenient for is handled, ensures later stage chip processingquality.
The working principle is as follows: when the integrated surface treatment and drying device for chip processing is used, an external power supply is switched on, chips are manually placed on the first conveyor belt 12 on the upper side of the base 1, the electric heating wire 202, the hot air blower 203, the hydraulic cylinder 402, the first conveyor belt 12, the second conveyor belt 20 and the third conveyor belt 21 are started under the action of the control box 22, the chips are moved to the third conveyor belt 21 in the drying box 201 under the action of the first conveyor belt 12, the chips are moved to a required position under the auxiliary action of the third conveyor belt 21, the fixing plate 403 moves downwards under the auxiliary action of the hydraulic cylinder 402 on the fixing block 401, the fixing plate 403 moves downwards to drive the sealing plate 404 to relatively move to the required position in the slide track 405, the chips are dried under the auxiliary action of the electric heating wire 202 and the hot air blower 203, and when the required temperature is reached, the temperature sensor 5 transmits information to the control box 22, when the control box 22 closes the electric heating wire 202 or the air heater 203, the energy saving effect can be achieved, when the air heater 203 is started, natural wind is filtered through the filter screen 303 on the fixing ring 302, filtered air enters the air heater 203 through the air inlet pipe 301 to be heated, the dustproof effect is achieved, water is stored inside the water pipe 801 through the water inlet 802, redundant hot air enters the first storage box 7 through the first air conveying pipe 6, the water pipe 801 inside the first storage box 7 can be heated, hot air inside the first storage box 7 enters the second storage box 10 through the second air conveying pipe 9, tap water inside the water pipe 801 inside the second storage box 10 can be heated, finally the hot air is discharged through the exhaust pipe 11, the heated hot water is discharged through the water outlet 803, the hot water can be used for domestic water, and redundant hot air inside the drying box 201 can be recycled through operation, the waste of resources is avoided, the dried chip moves to the third conveyor belt 21 in the auxiliary cooling box 13 under the action of the first conveyor belt 12, the temperature can be reduced under the auxiliary action of the heat dissipation fan 15, the information recording camera 17 moves to the upper side of the chip under the auxiliary action of the first manipulator 16, so that the chip can be shot at multiple angles, finally the information is transmitted to the control box 22, the chip is detected under the action of the control box 22, when unqualified chips appear, when the chip is moved to the inside of the sorting box 14 by the third conveyor belt 21, the clamping assembly 19 is driven to move to the lower side of the unqualified chip under the auxiliary action of the second manipulator 18, the fixing plate 1903 moves relatively under the auxiliary action of the electric telescopic rod 1902 on the U-shaped fixing plate 1901, the fixing plate 1903 moves relatively through the clamping plate 1905 on the spring shaft 1904, in this way, the unqualified chips can be clamped and finally moved to the second conveyor belt 20 under the assistance of the second manipulator 18, so that the chips can be uniformly processed at a later stage, and the qualified chips are moved to the next processing point for processing under the assistance of the third conveyor belt 21, which is not described in detail in the present specification and belongs to the prior art known to those skilled in the art.
The terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for simplicity of description only and are not intended to indicate or imply that the referenced devices or elements must be in a particular orientation, constructed and operative in a particular orientation, and are not to be considered limiting of the claimed invention.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (9)
1. The utility model provides a chip processing is with surface treatment integration equipment of drying, includes base (1), slip subassembly (4), S-shaped water pipe subassembly (8), letter sorting case (14) and control box (22), its characterized in that:
the drying device comprises a base (1), wherein a drying component (2), an auxiliary cooling box (13) and a sorting box (14) are fixed on the upper side of the base (1), the drying component (2) is positioned on the left side of the auxiliary cooling box (13), the auxiliary cooling box (13) is positioned on the left side of the sorting box (14), and a filtering component (3) is fixed on the upper side of the drying component (2);
the sliding assembly (4) is used for sealing a left side feeding hole and a right side discharging hole of the drying box (201), and the sliding assembly (4) is fixed on the left outer wall and the right outer wall of the drying box (201);
the S-shaped water pipe assembly (8), the S-shaped water pipe assembly (8) comprises a water pipe (801), a water inlet (802) and a water outlet (803), one end of the water pipe (801) is communicated with the water inlet (802), and the other end of the water pipe (801) is communicated with the water outlet (803);
the sorting box (14), the inside upside of sorting box (14) is fixed with second manipulator (18), and second manipulator (18) downside is fixed with centre gripping subassembly (19), sorting box (14) rear side runs through has second conveyer belt (20).
2. The integrated surface treatment and drying device for chip processing according to claim 1, wherein the device comprises: drying assembly (2) are including stoving case (201), electric heating wire (202) and air heater (203), be fixed with electric heating wire (202) on stoving case (201) inner wall, and stoving case (201) upside runs through there is air heater (203).
3. The integrated surface treatment and drying device for chip processing according to claim 2, wherein the device comprises: drying case (201) left side inner wall is last to be fixed with temperature sensor (5), and drying case (201) is linked together through first gas-supply pipe (6) and first storage box (7), and first storage box (7) are linked together through second gas-supply pipe (9) and second storage box (10) simultaneously, blast pipe (11) have been run through on second storage box (10) right side.
4. The integrated surface treatment and drying device for chip processing according to claim 2, wherein the device comprises: run through in stoving case (201) and have first conveyer belt (12), and first conveyer belt (12) are located third conveyer belt (21) left side, and inside auxiliary cooling case (13) and letter sorting case (14) are run through in third conveyer belt (21) simultaneously, the inside upside of auxiliary cooling case (13) runs through has heat dissipation fan (15), and the inside upside of auxiliary cooling case (13) is fixed with first manipulator (16), and first manipulator (16) downside is fixed with information input camera (17) simultaneously.
5. The integrated surface treatment and drying device for chip processing according to claim 1, wherein the device comprises: filtration module (3) include air-supply line (301), solid fixed ring (302) and filter screen (303), air-supply line (301) are fixed at stoving subassembly (2) upside, and air-supply line (301) upside threaded connection has solid fixed ring (302), and threaded connection has filter screen (303) on solid fixed ring (302) simultaneously.
6. The integrated surface treatment and drying device for chip processing according to claim 1, wherein the device comprises: the sliding assembly (4) comprises a fixing block (401), a hydraulic cylinder (402), a fixing plate (403), a sealing plate (404), a slide way (405) and a temperature sensor (5), the hydraulic cylinder (402) is fixed on the upper side of the fixing block (401), the fixing plate (403) is fixed on the hydraulic cylinder (402) through a piston rod, one end of the fixing plate (403) is fixed on the sealing plate (404), the sealing plate (404) is connected with the slide way (405) in a sliding mode, and the slide way (405) is arranged on the left outer wall and the right outer wall of the drying box (201) simultaneously.
7. The integrated surface treatment and drying device for chip processing according to claim 1, wherein the device comprises: the clamping assembly (19) comprises a U-shaped fixing plate (1901), an electric telescopic rod (1902), a fixing plate (1903), a spring shaft (1904) and a clamping plate (1905), the electric telescopic rod (1902) is fixed on the U-shaped fixing plate (1901), one end of the electric telescopic rod (1902) is fixed with the fixing plate (1903), the spring shaft (1904) is fixed on one side of the fixing plate (1903), and the clamping plate (1905) is fixed on one end of the spring shaft (1904).
8. The integrated surface treatment and drying device for chip processing according to claim 7, wherein the device comprises: the fixed plate (1903) and the clamping plate (1905) form a telescopic structure through a spring shaft (1904), and a rubber anti-slip pad is fixed on the clamping plate (1905).
9. The integrated surface treatment and drying device for chip processing according to claim 1, wherein the device comprises: the control box (22) is fixed on the front side of the drying box (201).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010972447.0A CN112053977A (en) | 2020-09-16 | 2020-09-16 | Surface treatment and drying integrated equipment for chip processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010972447.0A CN112053977A (en) | 2020-09-16 | 2020-09-16 | Surface treatment and drying integrated equipment for chip processing |
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| CN112053977A true CN112053977A (en) | 2020-12-08 |
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| CN202010972447.0A Withdrawn CN112053977A (en) | 2020-09-16 | 2020-09-16 | Surface treatment and drying integrated equipment for chip processing |
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| CN112848439A (en) * | 2021-01-04 | 2021-05-28 | 许胜强 | Production process of antibacterial medical gloves |
| CN112934584A (en) * | 2021-01-26 | 2021-06-11 | 徐州中辉光伏科技有限公司 | Solar photovoltaic film coating device capable of cleaning |
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2020
- 2020-09-16 CN CN202010972447.0A patent/CN112053977A/en not_active Withdrawn
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112848439A (en) * | 2021-01-04 | 2021-05-28 | 许胜强 | Production process of antibacterial medical gloves |
| CN112660566A (en) * | 2021-01-07 | 2021-04-16 | 衢州霞辉科技有限公司 | Welding rod heating and heat preserving box and using method thereof |
| CN112934584A (en) * | 2021-01-26 | 2021-06-11 | 徐州中辉光伏科技有限公司 | Solar photovoltaic film coating device capable of cleaning |
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